PDM31584SA20TITR [ETC]

256 X 16 CMOS 3.3V STATIC RAM; 256× 16的3.3V CMOS静态RAM
PDM31584SA20TITR
型号: PDM31584SA20TITR
厂家: ETC    ETC
描述:

256 X 16 CMOS 3.3V STATIC RAM
256× 16的3.3V CMOS静态RAM

文件: 总9页 (文件大小:284K)
中文:  中文翻译
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PDM31564  
PRELIMINARY  
256K x 16 CMOS  
3.3V Static RAM  
1
2
Features  
Description  
High-speed access times  
- Com’l: 8, 10, 12, 15, and 20 ns  
- Ind: 12, 15, and 20 ns  
Low power operation (typical)  
- PDM31564SA  
The PDM31564 is a high-performance CMOS static  
RAM organized as 262,144 x 16 bits. The PDM31564  
features low power dissipation using chip enable  
(CE) and has an output enable input (OE) for fast  
memory access. Byte access is supported by upper  
and lower byte controls.  
Active: 300 mW  
Standby: 25mW  
The PDM31564 operates from a single 3.3V power  
supply and all inputs and outputs are fully TTL-  
compatible.  
3
High-density 256K x 16 architecture  
3.3V (±0.3V) power supply  
Fully static operation  
TTL-compatible inputs and outputs  
Output buffer controls: OE  
Data byte controls: LB, UB  
Packages:  
The PDM31564 is available in a 44-pin 400-mil plas-  
tic SOJ and a plastic TSOP package for high-density  
surface assembly and is suitable for use in high-  
speed applications requiring high-speed storage.  
4
5
Plastic SOJ (400 mil) - SO  
Plastic TSOP (II) - T  
6
Functional Block Diagram  
Vcc  
8
Vss  
A8 - A0  
Memory  
Cell  
Array  
256 x 128 x 32  
512 x 256 x 32  
9
Data  
Input/  
Output  
Buffer  
I/O15-I/O0  
Sense Amp  
10  
11  
12  
Column  
Decoder  
WE  
OE  
UB  
LB  
Control  
Logic  
Column  
Address  
Buffer  
Clock  
Generator  
CE  
A17 - A9  
Rev. 1.2 - 3/31/98  
1
PRELIMINARY  
PDM31564  
Pin Configuration  
SOJ  
TSOP (II)  
A4  
A3  
44  
43  
42  
41  
40  
39  
38  
37  
A5  
1
A4  
A3  
44  
43  
42  
41  
40  
39  
38  
37  
A5  
1
2
3
4
5
6
7
8
2
A6  
A6  
A2  
A7  
3
A2  
A7  
A1  
OE  
4
A1  
OE  
A0  
UB  
5
A0  
UB  
CE  
LB  
6
CE  
LB  
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
Vss  
I/O4  
I/O15  
I/O14  
7
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
Vss  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A17  
A16  
A15  
A14  
A13  
I/O15  
I/O14  
I/O13  
I/O12  
Vss  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
8
36 I/O13  
35 I/O12  
9
36  
35  
34  
33  
32  
31  
30  
29  
9
10  
11  
12  
13  
10  
11  
12  
13  
14  
34  
33  
32  
31  
30  
29  
Vss  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
I/O5 14  
I/O6  
15  
15  
16  
17  
18  
I/O7  
16  
WE  
17  
28  
27  
26  
25  
28  
27  
26  
25  
24  
23  
A17  
A16  
A15  
A14  
A13  
18  
A8  
A8  
A9  
19  
20  
21  
22  
A9  
19  
20  
21  
22  
A10  
A10  
A11  
A12  
24 A11  
A12  
23  
Pin Description  
Name  
Description  
A17-A0  
I/O15-I/O0  
CE  
Address Inputs  
Data Inputs  
Chip Enable Input  
Write Enable Input  
Output Enable Input  
Data Byte Control Inputs  
No Connect  
WE  
OE  
LB, UB  
NC  
V
Ground  
ss  
V
Power (+3.3V)  
CC  
Capacitance (T = +25°C, f = 1.0 MHz)  
A
Symbol  
Parameter  
Conditions  
Max.  
Unit  
C
C
Input Capacitance  
Output Capacitance  
V
= V  
SS  
6
8
pF  
pF  
IN  
IN  
V
= V  
SS  
I/O  
I/O  
NOTE: This parameter is determined by device characterization, but is not production tested.  
2
Rev. 1.2 - 3/31/98  
PRELIMINARY  
PDM31564  
Operating Mode  
Mode  
CE  
OE  
WE  
LB  
UB  
I/O7-I/O0  
I/O15-I/O8  
Power  
1
2
Read  
L
L
H
L
H
L
L
L
Output  
High Impedance  
Output  
Output  
Output  
I
I
I
I
I
I
I
I
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
H
L
High Impedance  
Input  
Write  
L
X
L
L
Input  
H
L
L
High Impedance  
Input  
Input  
H
x
High Impedance  
High Impedance  
High Impedance  
High Impedance  
Output Disable  
Standby  
L
L
H
X
X
H
X
X
X
H
X
High Impedance  
High Impedance  
High Impedance  
3
H
X
H
I
SB  
NOTE: H = V , L = V , X = DON’T CARE  
IH  
IL  
4
(1)  
Absolute Maximum Ratings  
Symbol  
Rating  
Com’l.  
Ind.  
Unit  
5
V
Terminal Voltage with Respect to V  
Temperature Under Bias  
Storage Temperature  
–0.5 to +4.6  
–55 to +125  
–55 to +125  
1.5  
–0.5 to +4.6  
–65 to +135  
–65 to +150  
1.5  
V
°C  
°C  
W
TERM  
BIAS  
STG  
SS  
T
T
6
P
Power Dissipation  
T
I
DC Output Current  
50  
50  
mA  
°C  
OUT  
(2)  
T
Maximum Junction Temperature  
125  
145  
j
NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated in the  
operational sections of this specification is not implied. Exposure to absolute maxi-  
mum rating conditions for extended periods may affect reliability.  
8
2. Appropriate thermal calculations should be performed in all cases and specifically for  
those where the chosen package has a large thermal resistance (e.g., TSOP). The  
calculation should be of the form: T = T + P * θ where T is the ambient tempera-  
j
a
ja  
a
ture, P is average operating power and θ the thermal resistance of the package. For  
ja  
9
this product, use the following θ values:  
ja  
o
SOJ: 59 C/W  
o
TSOP: 87 C/W  
10  
11  
12  
Recommended DC Operating Conditions  
Symbol  
Description  
Min.  
Typ.  
Max.  
Unit  
V
V
Supply Voltage  
3.0  
0
3.3  
0
3.6  
0
V
V
CC  
SS  
Supply Voltage  
Industrial  
Ambient Temperature  
Ambient Temperature  
–40  
0
25  
25  
85  
70  
°C  
°C  
Commercial  
Rev. 1.2 - 3/31/98  
3
PRELIMINARY  
PDM31564  
DC Electrical Characteristics (V = 3.3V ± 0.3V)  
CC  
Symbol  
Parameter  
Test Conditions  
Min.  
Max.  
Unit  
I
Input Leakage Current  
V
= Max., V = Vss to V  
Com’l/  
Ind.  
–5  
5
µA  
LI  
CC  
IN  
CC  
I
Output Leakage Current  
V
= Max.,  
Com’l/  
Ind.  
–5  
5
µA  
LO  
CC  
CE = V , V  
= Vss to V  
CC  
IH OUT  
(1)  
V
V
Input Low Voltage  
Input High Voltage  
–0.3  
2.2  
0.8  
V
V
IL  
Vcc +  
0.3  
IH  
V
V
Output Low Voltage  
Output High Voltage  
I
I
= 8 mA, V = Min.  
0.4  
V
V
OL  
OL  
CC  
= –4 mA, V = Min.  
2.4  
OH  
OH  
CC  
NOTE: 1. V (min) = –3.0V for pulse width less than 20 ns.  
IL  
Power Supply Characteristics  
-8  
-10  
-12  
-15  
-20  
Symbol Parameter  
Operating Current  
CE = V  
Com’l Com’l Com’l Ind. Com’l Ind. Com’l Ind. Unit  
I
220  
210  
200  
210  
190  
200  
185  
195  
mA  
CC  
IL  
f = f  
= 1/t  
RC  
MAX  
V
= Max.  
= 0 mA  
CC  
I
OUT  
I
Standby Current  
CE = V  
50  
10  
45  
10  
40  
10  
45  
15  
35  
10  
40  
15  
30  
10  
35  
15  
mA  
mA  
SB  
IH  
f = f  
= 1/t  
RC  
MAX  
V
= Max.  
CC  
I
Full Standby Current  
SB1  
CE V – 0.2V  
CC  
f = 0  
V
V
= Max.,  
CC  
V – 0.2V or 0.2V  
IN  
CC  
NOTES: All values are maximum guaranteed values.  
4
Rev. 1.2 - 3/31/98  
PRELIMINARY  
PDM31564  
AC Test Conditions  
Input pulse levels  
V
to 3.0V  
SS  
1
2
Input rise and fall times  
Input timing reference levels  
Output reference levels  
Output load  
2.5 NS  
1.5V  
1.5V  
See Figures 1 and 2  
3
4
+3.3V  
5
+3.3V  
317  
317  
DOUT  
351Ω  
DOUT  
351Ω  
6
30 pF  
5 pF  
Figure 2. Output Load Equivalent  
(for t , t , t , t  
Figure 1. Output Load  
LZCE HZCE LZWE HZWE,  
t
, t  
, t  
, t  
)
LZBE HZBE LZOE HZOE  
8
9
10  
11  
12  
Rev. 1.2 - 3/31/98  
5
PRELIMINARY  
PDM31564  
Read Timing Diagram  
t
RC  
ADDRESSES  
t
AA  
t
t
OH  
ACE  
CE  
OE  
t
(1)  
AOE  
t
HZCE  
t
(1)  
t
BA  
HZOE  
(1)  
UB, LB  
(1)  
t
LZBE  
t
HZBE  
(1)  
t
LZOE  
(1)  
t
LZCE  
D
OUT  
Output Data Valid  
AC Electrical Characteristics  
Description  
READ Cycle  
-8*  
-10*  
Max Min  
–12  
–15  
Max Min  
–20  
Symbol Min  
Max Min  
Max Min  
Max Unit  
READ cycle time  
t
8
4
0
3
0
8
8
5
4
4
4
4
10  
4
0
3
0
10  
10  
6
12  
4
12  
12  
7
15  
15  
15  
8
20  
4
20  
20  
9
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
Address access time  
Chip enable access time  
Byte access time  
t
4
AA  
t
ACE  
t
BA  
Output hold from address change  
t
8
9
9
OH  
(1)  
Byte disable to output in low-Z  
t
0
0
0
LZBE  
HZBE  
(1)  
Byte enable to output in high-Z  
t
5
4
4
5
(1)  
Chip enable to output in low-Z  
t
6
7
8
LZCE  
HZCE  
(1, 2)  
Chip disable to output high-Z  
t
5
0
0
0
Output enable access time  
t
5
6
7
10  
6
AOE  
(1)  
Output enable to output in low-Z  
t
5
6
LZOE  
HZOE  
(1, 2)  
Output disable to output in high-Z  
t
5
* V = 3.3V +5%  
CC  
6
Rev. 1.2 - 3/31/98  
PRELIMINARY  
PDM31564  
Write Cycle 1 Timing Diagram (WE Controlled)  
t
WC  
1
2
ADDRESSES  
t
AW  
t
t
t
AH  
AS  
WP  
WE  
CE  
t
CW  
3
t
BW  
UB, LB  
4
(1)  
(1)  
t
t
LZWE  
HZWE  
High Impedance  
(3)  
(4)  
D
OUT  
t
t
5
DS  
DH  
D
IN  
Data Stable  
6
Write Cycle 2 Timing Diagram (CE Controlled)  
t
WC  
ADDRESSES  
t
AW  
t
AS  
t
t
AH  
WP  
8
WE  
CE  
t
CW  
9
t
BW  
UB, LB  
(1)  
(1)  
10  
11  
12  
t
t
HZWE  
LZBE  
(1)  
t
LZCE  
High Impedance  
D
OUT  
t
t
DH  
DS  
D
IN  
Data Stable  
Rev. 1.2 - 3/31/98  
7
PRELIMINARY  
PDM31564  
Write Cycle 3 Timing Diagram (UB, LB Controlled)  
t
WC  
ADDRESSES  
t
AW  
t
AS  
t
t
AH  
WP  
WE  
CE  
t
CW  
t
BW  
UB, LB  
(1)  
(1)  
t
t
LZCE  
(1)  
HZWE  
t
LZBE  
High Impedance  
D
OUT  
t
t
DH  
DS  
D
IN  
Data Stable  
AC Electrical Characteristics  
Description  
-8*  
-10*  
-12  
-15  
-20  
WRITE Cycle  
Sym Min. Max Min. Max Min. Max. Min. Max. Min. Max. Unit  
WRITE cycle time  
t
t
8
7
6
10  
8
6
12  
10  
10  
10  
0
7
15  
11  
11  
12  
0
8
20  
13  
13  
13  
0
9
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WC  
Chip enable to end of write  
Address valid to end of write  
Byte pulse width  
CW  
t
7
8
AW  
t
7
8
BW  
Address setup time  
Address hold from end of write  
Write pulse width  
t
0
0
AS  
AH  
WP  
t
0
0
0
0
0
t
t
7
8
8
9
10  
9
Data setup time  
t
5
6
7
8
DS  
DH  
Data hold time  
0
0
0
0
0
(1, 3, 4)  
Byte disable to output in low Z  
t
0
0
0
0
0
LZBE  
HZBE  
(1, 3, 4)  
Byte enable to output in high Z  
t
(1, 3, 4)  
Output disable to output in low Z  
t
0
6
0
6
0
7
0
7
0
8
ns  
ns  
LZOE  
(1, 3, 4)  
Output enable to output in high Z  
t
t
HZOE  
(1,3, 4)  
Write disable to output in low Z  
0
6
0
6
0
7
0
7
0
9
ns  
ns  
LZWE  
HZWE  
(1, 3, 4)  
Write enable to output in high Z  
t
* V = 3.3v +5%  
CC  
8
Rev. 1.2 - 3/31/98  
PRELIMINARY  
PDM31564  
NOTES:  
1. Parameter is determined by device characterization and is not production tested. See Figure 2 for load conditions.  
2. If the CE LOW transition occurs coincident with or after the WE LOW transition, outputs remain in a high imped-  
ance state.  
3. If the CE HIGH transition occurs coincident with or after the WE HIGH transition, outputs remain in a high imped-  
ance state.  
1
2
4. If OE is HIGH during a write cycle, the outputs are in a high-impedance state during this period.  
3
4
5
Ordering Information  
XXXXX  
X
XX  
X
X
X
Speed  
Device Type Power  
Package  
Type  
Process  
Temp. Range  
Preferred  
Shipping  
Container  
6
Blank Tubes  
TR  
TY  
Tape & Reel  
Tray  
Blank  
Commercial (0° to +70°C)  
Industrial (–40°C to +85°C)  
Automotive (–40°C to +105°C)  
I
A
SO  
T
44-pin 400-mil Plastic SOJ  
44-pin Plastic TSOP (II)  
8
8
10  
12  
15  
20  
Commercial Only  
Commercial Only  
9
SA  
Standard Power  
10  
11  
12  
PDM31564 - (256Kx16) Static RAM  
Faster Memories for a FasterWorld ™  
Rev. 1.2 - 3/31/98  
9

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