PH230 [ETC]
InGaP HBT High Range IF Amplifier; 的InGaP HBT大范围的中频放大器
| 型号： | PH230 |
| 厂家： | 
ETC |
| 描述： | InGaP HBT High Range IF Amplifier |
| 文件： | 总5页 (文件大小：363K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PH230
High Linearity InGaP HBT Amplifier
Functional Diagram
Features
Applications
1500MHz - 3000MHz
16.3 dB Gain at 2.3GHz
+22.5 dBm P1dB
Mobile Infrastructure
4
PCS, WCDMA, WiBro
W-LAN / ISM
3
2
+39 dBm Output IP3
Single Voltage Supply
Lead-free / Green / RoHS-
compliant SOT-89 Package
RFID / Fixed Wireless
1
Function
RF IN
Pin No.
1
RF OUT / Bias
Ground
3
2,4
Description
The PH230 is a high performance InGaP HBT MMIC Amplifier and high linearity driver amplifier in a high quality
SOT-89 package. The device features excellent Input and output return loss, highly linear performance. The
device can be easily matched to obtain optimum power and linearity. The product is targeted for use as driver
amplifier for wireless infrastructure applications. The PH230 operates from a single +5 voltage supply and have
an internal active bias. All devices are 100% RF and DC tested
Specifications
Symbol
Parameters
Gain
Units
dB
Freq.
Min.
Typ.
Max.
1900 MHz
2300 MHz
2550 MHz
17.2
16.3
15.5
S21
1900 MHz
2300 MHz
2550 MHz
-16
-15
-20
S11
S22
Input Return Loss
Output Return Loss
dB
dB
1900 MHz
2300 MHz
2550 MHz
-12
-11
-8
1900 MHz
2300 MHz
2550 MHz
22.5
22.0
21.5
Output Power @1dB
compression
P1dB
OIP3
NF
dBm
dBm
dB
1900 MHz
2300 MHz
2550 MHz
38
39
39
Output Third Order
intercept
1900 MHz
2300 MHz
2550 MHz
3.2
3.1
3.4
Noise Figure
V / I
Rth
Tj
Device voltage / current
Thermal Resistance
V/mA
°C/W
°C
5/82
106
128
Junction Temperature
Test Conditions : T=25°C, Supply Voltage=+5V, 50ohm System, OIP3 measured with two tones at an output power of +5dBm/tone separated by 1MHz.
http://www.prewell.com
December 2005
1
PH230
High Linearity InGaP HBT Amplifier
1900 MHz Application Circuit
Frequency
1900 MHz
17.4 dB
-18 dB
-13 dB
+23 dBm
+39 dBm
3.2dB
+5 V
S21 : Gain
S11 : Input Return Loss
S22 : Output Return Loss
Output P1dB
1uF
82pF
100nH
Output IP3 @5dBm
Noise Figure
RF IN
RF OUT
15pF
82pF
50Ω/5mm
Supply Voltage
5 V
1.5pF
3.0pF
Current
82 mA
Gain vs. Frequency
Input Return Loss
Output Return Loss
20
18
16
14
12
10
0
-5
0
-5
-10
-15
-20
-10
-15
-20
-25
+25oC
-40oC
+85oC
+25oC
-40oC
+85oC
+25oC
-40oC
+85oC
-25
1800
1800
1850
1900
1950
2000
1850
1900
1950
2000
1800
1850
1900
1950
2000
Freqency(MHz)
Frequency(MHz)
Frequency(MHz)
P1dB vs. Frequency
Noise Figure vs. Frequency
28
24
20
16
12
6
5
4
3
2
1
+25oC
-40oC
+85oC
+25oC
0
1800
1850
1900
1950
2000
1800
1850
1900
1950
2000
Frequency(MHz)
Frequency(MHz)
Output IP3 vs. Frequency
OIP3 vs. Temperature
Freq=1900MHz, +5dBm/tone
+5dBm/tone, +25oC
45
40
35
30
44
40
36
32
28
+25oC
-40oC
+85oC
25
1800
-40
-20
0
20
40
60
80
1850
1900
1950
2000
Temperature(oC)
Freuquency(MHz)
http://www.prewell.com
December 2005
2
PH230
High Linearity InGaP HBT Amplifier
2300 MHz Application Circuit
Frequency
2300 MHz
16.2 dB
-16 dB
+5 V
1uF
S21 : Gain
S11 : Input Return Loss
S22 : Output Return Loss
Output P1dB
-14 dB
82pF
100nH
+22.4 dBm
+39 dBm
3.1dB
RF IN
RF OUT
Output IP3 @5dBm
Noise Figure
5.6pF
82pF
50Ω/5mm
0.75pF
2.2pF
Supply Voltage
5 V
Current
82 mA
Gain vs. Frequency
Output Return Loss
Input Return Loss
0
-5
20
18
16
14
12
10
0
-5
-10
-15
-20
-25
-10
-15
-20
-25
+25oC
-40oC
+85oC
+25oC
-40oC
+85oC
+25oC
-40oC
+85oC
2200
2250
2300
2350
2400
2200
2250
2300
2350
2400
2200
2250
2300
2350
2400
Frequency(MHz)
Frequency(MHz)
Frequency(MHz)
Noise Figure vs. Frequency
P1dB vs. Frequency
6
5
4
3
2
1
28
24
20
16
12
+25oC
-40oC
+85oC
+25oC
0
2200
2200
2250
2300
2350
2400
2250
2300
2350
2400
Frequency(MHz)
Frequency(MHz)
OIP3 vs. Temperature
Freq=2300MHz, +5dBm/tone
Output IP3 vs. Frequency
+5dBm/tone, +25oC
44
40
36
32
28
44
40
36
32
28
+25oC
-40oC
+85oC
-40
-20
0
20
40
60
80
2200
2250
2300
2350
2400
Temperature(oC)
Frequency(MHz)
http://www.prewell.com
December 2005
3
PH230
High Linearity InGaP HBT Amplifier
2500/2600 MHz Application Circuit
+ 5 V
Frequency
2550 MHz
15.6 dB
-22 dB
1uF
S21 : Gain
S11 : Input Return Loss
S22 : Output Return Loss
Output P1dB
-9 dB
82pF
22nH
+21.5 dBm
+39 dBm
3.4 dB
RF IN
RF OUT
Output IP3 @5dBm
Noise Figure
20pF
50Ω/5mm
0.75pF
Supply Voltage
5 V
0.75pF
1.5pF
1.2pF
Current
82 mA
Input Return Loss
Output Return Loss
Gain vs. Frequency
20
18
16
14
12
10
0
0
-5
-10
-20
-30
-40
-10
+25oC
+25oC
-40oC
+85oC
+25oC
-40oC
+85oC
-15
-40oC
+85oC
-20
2500
2500
2525
2550
2575
2600
2525
2550
2575
2600
2500
2525
2550
2575
2600
Frequency(MHz)
Frequency(MHz)
Frequency(MHz)
Noise Figure vs. Frequency
P1dB vs. Frequency
6
5
4
3
2
1
28
24
20
16
12
+25oC
-40oC
+85oC
+25oC
0
2500
2525
2550
2575
2600
2500
2525
2550
2575
2600
Frequency(MHz)
Frequency(MHz)
OIP3 vs. Temperature
Freq=2550MHz, +5dBm/tone
Output IP3 vs. Frequency
+5dBm/tone, +25oC
44
40
36
32
28
45
40
35
+25oC
-40oC
+85oC
30
-40
-20
0
20
40
60
80
2500
2525
2550
2575
2600
Temperature(oC)
Frequency(MHz)
http://www.prewell.com
December 2005
4
PH230
High Linearity InGaP HBT Amplifier
Absolute Maximum Ratings
Parameter
Rating
Unit
V
Supply Voltage
Supply Current
+6
150
mA
dBm
°C
RF Power Input
10
Storage Temperature
Ambient Operating Temperature
-55 to +125
-40 to +85
°C
Operation of this device above any of these parameters may cause permanent damage.
Lead-free /RoHS Compliant / Green SOT-89 Package Outline
ESD / MSL Ratings
1. ESD sensitive device.
Observe Handling Precautions.
2. ESD Rating : Class 1C(Passes at 1000V min.)
Human Body Model (HBM), JESD22-A114
3. ESD Rating : Class IV (Passes at 1000V min.)
Charged Device Model (CDM), JESD22-C101
4. MSL (Moisture Sensitive Level) Rating : Level 3
at +260°C Convection reflow, J-STD-020
Evaluation Board Layout (4x4)
Mounting Instructions
1. Use a large ground pad area with many plated
through-holes as shown.
2. We recommend 1 oz copper minimum.
3. Measurement for our data sheet was made on
0.8mm thick FR-4 Board.
4. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
5. RF trace width depends on the board material and
construction.
6. Add mounting screws near the part to fasten the
board to a heatsink.
http://www.prewell.com
December 2005
5
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