QL16X24B-XPF100M/883C [ETC]
FPGA ; FPGA产品将打型号: | QL16X24B-XPF100M/883C |
厂家: | ETC |
描述: | FPGA
|
文件: | 总10页 (文件大小:620K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
QL16x24B
pASIC® 1 Family
Very-High-Speed CMOS FPGA
Rev C
pASIC
HIGHLIGHTS
Very High Speed – ViaLink metal-to-metal programmable–via
antifuse technology, allows counter speeds over 150 MHz and logic
cell delays of under 2 ns.
High Usable Density – A 16-by-24 array of 384 logic cells
provides 4,000 usable ASIC gates (7,000 PLD gates) in 84-pin
PLCC, 100-pin and 144-pin TQFP, 144-pin CPGA and 160-pin
CQFP packages.
…4,000
usable ASIC gates,
122 I/O pins
Low-Power, High-Output Drive – Standby current typically 2 mA.
A 16-bit counter operating at 100 MHz consumes less than 50 mA.
Minimum IOL of 12 mA and IOH of 8 mA
4
Low-Cost, Easy-to-Use Design Tools – Designs entered and
simulated using QuickLogic's new QuickWorks development
environment, or with third-party CAE tools including Viewlogic,
Synopsys, Mentor, Cadence and Veribest. Fast, fully automatic place
and route on PC and workstation platforms using QuickLogic
software.
QL16x24B
Block Diagram
384 Logic Cells
=
Up to 114 prog. I/O cells, 6 Input high-drive cells, 2 Input/Clk (high-drive) cells
4-21
QL16x24B
The QL16x24B is a member of the pASIC 1 Family of very-high-speed
CMOS user-programmable ASIC devices. The 384 logic cell field-
programmable gate array (FPGA) offers 4,000 usable ASIC gates
(equivalent to 7,000 PLD gates) of high-performance general-purpose
logic in 84-pin PLCC, 100-pin and 144-pin TQFP, 144-pin CPGA, and
160-pin CQFP.
PRODUCT
SUMMARY
Low-impedance, metal-to-metal, ViaLink interconnect technology
provides nonvolatile custom logic capable of operating above 150 MHz.
Logic cell delays under 2 ns, combined with input delays of under 1.5 ns
and output delays under 3 ns, permit high-density programmable devices
to be used with today’s fastest microprocessors and DSPs.
Designs can be entered using QuickLogic’s QuickWorks Toolkit or most
populart third-party CAE tools. QuickWorks combines Verilog/VHDL
design entry and simulation tools with device-specific place & route and
programming software. Ample on-chip routing channels allow fast, fully
automatic place and route of designs using up to 100% of the logic and
I/O cells, while maintaining fixed pin-outs.
FEATURES
Total of 122 I/O pins
– 114 Bidirectional Input/Output pins
– 6 Dedicated Input/High-Drive pins
– 2 Clock/Dedicated input pins with fanout-independent, low-skew
clock networks
Input + logic cell + output delays under 6 ns
Chip-to-chip operating frequencies up to 110 MHz
Internal state machine frequencies up to 150 MHz
Clock skew < 0.5 ns
Input hysteresis provides high noise immunity
Built-in scan path permits 100% factory testing of logic and I/O cells
and functional testing with Automatic Test Vector Generation
(ATVG) software after programming
Packages are 84-pin PLCC, 100-pin and 144-pin TQFP, 144-pin
CPGA, and 160-pin CQFP
84-pin PLCC compatible with QL12x16B
100-pin TQFP compatible with QL8x12B and QL12x16B
144-pin TQFP compatible with QL24x32B
0.65µ CMOS process with ViaLink programming technology
4-22
QL16x24B
Pinout
Diagram
84-pin PLCC
4
Pinout
Diagram
100-pin TQFP
4-23
QL16x24B
Pinout Diagram
144-pin TQFP
4-24
QL16x24B
Pinout Diagram
144-pin CPGA
M
4
4-25
QL16x24B
CPGA 144 Function/Connector Table
PIN
A2
FUNC
IO
PIN
B15
C14
D13
C15
D14
E13
D15
E14
E15
F13
F14
F15
G15
C13
G14
H15
H14
G13
H13
J15
FUNC
IO
PIN
R14
P13
N12
R13
P12
R12
N13
P11
R11
N10
P10
R10
R9
FUNC
IO
PIN
P1
FUNC
IO
B3
IO
IO
IO
N2
M3
N1
M2
L3
M1
L2
L1
K3
K2
K1
J1
IO
C4
IO
IO
IO
IO
A3
IO
IO
IO
IO
B4
IO
IO
IO
IO
A4
IO
VCC
IO
IO
VCC
IO
C3
VCC
IO
VCC
IO
B5
IO
IO
A5
IO
IO
IO
IO
C6
IO
IO
IO
IO
B6
IO
IO
IO
IO
A6
IO
IO
IO
IO
A7
IO
IO
IO
IO
B7
IO
GND
IO
P9
IO
N3
J2
GND
IO
C5
GND
IO
N11
R8
GND
IO
A8
IO
H1
H2
J3
IO
B8
I/(SCLK)
I/CLK/(SM)
VCC
I/(P)
I
IO
P8
I/(SI)
I/CLK
VCC
I
IO
C8
GND
IO
N8
N9
R7
GND
IO
C7
H3
G1
G2
G3
F1
A9
IO
IO
B9
J14
IO
P7
I/(SO)
VCC
IO
IO
C11
A10
A11
B10
A12
B11
C10
A13
C9
VCC
IO
J13
VCC
IO
N5
R6
VCC
IO
K15
L15
K14
M15
L14
K13
N15
L13
M14
P15
N14
M13
R15
P14
IO
IO
R5
IO
E1
F2
IO
IO
IO
P6
IO
IO
IO
IO
R4
IO
D1
E2
F3
IO
IO
IO
P5
IO
IO
IO
IO
N6
R3
IO
IO
IO
IO
IO
C1
E3
D2
B1
C2
D3
A1
B2
IO
GND
IO
GND
IO
N7
P4
GND
IO
GND
IO
B12
A14
B13
C12
A15
B14
IO
IO
R2
IO
IO
IO
IO
P3
IO
IO
IO
IO
N4
R1
IO
IO
IO
IO
IO
IO
IO
nc
P2
IO
nc
4-26
QL16x24B
Pinout Daigram
160-pin CQFP
4
4-27
QL16x24B
ABSOLUTE MAXIMUM RATINGS
Supply Voltage................................. –0.5 to 7.0V
Input Voltage....................... –0.5 to VCC +0.5V
ESD Pad Protection.................................. ±2000V
DC Input Current...................................... ±20 mA
Latch-up Immunity................................. ±200 mA
Storage Temperature .......–65°C to + 150°C
Lead Temperature ...................................300°C
OPERATING RANGE
Symbol
Parameter
Military
Industrial
Commercial Unit
Min
4.5
-55
Max
5.5
Min
4.5
-40
Max
5.5
85
Min
4.75
0
Max
5.25
70
VCC
TA
TC
Supply Voltage
Ambient Temperature
Case Temperature
V
°C
°C
125
-X Speed Grade
0.4
0.4
0.4
0.4
2.75
1.67
1.43
1.35
0.46
0.46
0.46
0.46
2.55
1.55
1.33
1.25
K
Delay Factor
-0 Speed Grade
-1 Speed Grade
-2 Speed Grade
0.39
0.39
1.82
1.56
DC CHARACTERISTICS over operating range
Symbol
Parameter
Conditions
Min
Max Unit
VIH
VIL
Input HIGH Voltage
Input LOW Voltage
2.0
V
0.8
V
V
V
V
V
V
IOH = -4 mA
IOH = -8 mA
IOH = -10 µA
IOL = 12 mA*
IOL = 10 µA
3.7
2.4
VCC-0.1
VOH
VOL
Output HIGH Voltage
Output LOW Voltage
0.4
0.1
10
10
10
II
IOZ
CI
Input Leakage Current
3-State Output Leakage Current
Input Capacitance [1]
VI = VCC or GND
VI = VCC or GND
-10
-10
µA
µA
pF
IOS
Output Short Circuit Current [2]
VO = GND
VO = VCC
VI, VIO = VCC or GND
-10
30
-80
140
10
mA
mA
mA
ICC
D.C. Supply Current [3]
*IOL = 12 mA for commercial range only. IOL = 8 mA for the industrial and military ranges.
Notes:
[1] Capacitance is sample tested only. CI = 20 pF max on I/(SI).
[2] Only one output at a time. Duration should not exceed 30 seconds.
[3] Commercial temperature grade only. Maximum Icc for industrial grade is 15mA and for military grade is
20 mA. For AC conditions use the formula described in the Section 9 — Power vs Operating Frequency.
[4] Stated timing for worst case Propagation Delay over process variation at VCC = 5.0V and TA = 25°C.
Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified
in the Operating Range.
[5] These limits are derived from a representative selection of the slowest paths through the pASIC logic cell
including net delays. Worst case delay values for specific paths should be determined from timing analysis
of your particular design .
4-28
QL16x24B
AC CHARACTERISTICS at VCC = 5V, TA = 25°C (K = 1.00)
Logic Cell
Propagation Delays (ns)
Fanout
Symbol
Parameter
1
2
3
4
8
tPD
tSU
tH
tCLK
tCWHI
tCWLO
tSET
tRESET
tSW
Combinatorial Delay [5]
Setup Time [5]
Hold Time
Clock to Q Delay
Clock High Time
Clock Low Time
Set Delay
Reset Delay
Set Width
1.7
2.1
0.0
1.0
2.0
2.0
1.7
1.5
1.9
1.8
2.2
2.1
0.0
1.5
2.0
2.0
2.2
1.9
1.9
1.8
2.6
2.1
0.0
1.9
2.0
2.0
2.6
2.2
1.9
1.8
3.2
2.1
0.0
2.6
2.0
2.0
3.2
2.7
1.9
1.8
5.3
2.1
0.0
4.7
2.0
2.0
5.3
4.4
1.9
1.8
tRW
Reset Width
4
Input Cells
Symbol
Propagation Delays (ns) [4]
Parameter
1
2
3
4
6
8
tIN
High Drive Input Delay [6]
High Drive Input, Inverting Delay [6]
Input Delay (bidirectional pad)
Clock Buffer Delay [7]
2.8
3.0
1.4
2.7
2.0
2.0
2.9
3.1
1.9
2.8
2.0
2.0
3.0
3.2
2.2
2.9
2.0
2.0
3.1
3.3
2.9
3.0
2.0
2.0
4.0
4.1
4.7
3.1
2.0
2.0
5.3
5.7
6.5
3.3
2.0
2.0
tINI
tIO
tGCK
tGCKHI
tGCKLO
Clock Buffer Min High [7]
Clock Buffer Min Low [7]
Output Cell
Symbol
Propagation Delays (ns) [4]
Output Load Capacitance (pF)
Parameter
30
50
3.4
3.7
4.9
4.2
75
4.2
4.7
6.1
5.0
100
5.0
5.6
7.3
5.8
150
6.7
7.6
9.7
7.3
tOUTLH
tOUTHL
tPZH
tPZL
tPHZ
Output Delay Low to High
Output Delay High to Low
Output Delay Tri-state to High
Output Delay Tri-state to Low
Output Delay High to Tri-state [8]
Output Delay Low to Tri-state [8]
2.7
2.8
4.0
3.6
2.9
3.3
tPLZ
Notes:
[6] See High Drive Buffer Table for more information.
[7] Clock buffer fanout refers to the maximum number of flip flops per half column. The number of half
columns used does not affect clock buffer delay.
[8] The following loads are used for tPXZ:
tPHZ
1KΩ
5 pF
1KΩ
tPLZ
5 pF
4-29
QL16x24B
High Drive Buffer
Symbol
Clock Drivers
Wired Together
Propagation Delays (ns) [4]
Parameter
Fanout
48
12
5.3
24
6.7
4.5
72
96
1
2
3
4
1
2
3
4
tIN
High Drive Input Delay
6.6
5.3
6.2
5.4
7.2
6.2
5.7
7.2
4.6
tINI
High Drive Input,
Inverting Delay
6.8
5.5
6.4
5.6
7.4
6.4
AC Performance
Propagation delays depend on routing, fanout, load capacitance, supply voltage, junction temperature,
and process variation. The AC Characteristics are a design guide to provide initial timing estimates at
nominal conditions. Worst case estimates are obtained when nominal propagation delays are multiplied
by the appropriate Delay Factor, K, as specified in the Delay Factor table (Operating Range). The
effects of voltage and temperature variation are illustrated in the graphs on page 4-47, K Factor versus
Voltage and Temperature. The pASIC Development Tools incorporate data sheet AC Characteristics
into the QDIF database for pre-place-and-route timing analysis. The SpDE Delay Modeler extracts
specific timing parameters for precise path analysis or simulation results following place and route.
QL 16x24B - 1 PF144 C
ORDERING
INFORMATION
QuickLogic
pASIC device
Operating Range
C = Commercial
I = Industrial
M = Military
M/883C = MIL STD 883
pASIC device part number
B = 0.65 micron CMOS
Package Code
PL84 = 84-pin PLCC
PF100 = 100-pin TQFP
PF144 = 144-pin TQFP
CG144 = 144-pin CPGA
CF160 = 160-pin CQFP
Speed Grade
X = quick
0 = fast
1 = faster
2 = fastest
4-30
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