REG1117-33 [ETC]

800mA and 1A Low Dropout (LDO) Positive Regulator 1.8V. 2.5V. 2.85V. 3.3V. 5V. and Adj ; 800毫安和1A低压降( LDO )稳压器正1.8V 。 2.5V 。 2.85V 。 3.3V 。 5V 。并调\n
REG1117-33
型号: REG1117-33
厂家: ETC    ETC
描述:

800mA and 1A Low Dropout (LDO) Positive Regulator 1.8V. 2.5V. 2.85V. 3.3V. 5V. and Adj
800毫安和1A低压降( LDO )稳压器正1.8V 。 2.5V 。 2.85V 。 3.3V 。 5V 。并调\n

稳压器
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REG1117  
REG1117A  
R
E
G
1
1
1
7
SBVS001B – OCTOBER 2001  
800mA and 1A Low Dropout Positive Regulator  
1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable  
DESCRIPTION  
FEATURES  
The REG1117 is a family of easy-to-use three-terminal  
voltage regulators. The family includes a variety of fixed-  
and adjustable-voltage versions, two currents (800mA and  
1A) and two package types (SOT-223 and DDPAK). See the  
chart below for available options.  
FIXED AND ADJUSTABLE VERSIONS  
2.85V MODEL FOR SCSI-2 ACTIVE TERMINATION  
OUTPUT CURRENT:  
REG1117: 800mA max  
REG1117A: 1A max  
Output voltage of the adjustable versions is set with two  
external resistors. The REG1117’s low dropout voltage  
allows its use with as little as 1V input-output voltage  
differential.  
OUTPUT TOLERANCE: ±1% max  
DROPOUT VOLTAGE:  
REG1117: 1.2V max at IO = 800mA  
REG1117A: 1.3V max at IO = 1A  
Laser trimming assures excellent output voltage accuracy  
without adjustment. An NPN output stage allows output  
stage drive to contribute to the load current for maximum  
efficiency.  
INTERNAL CURRENT LIMIT  
THERMAL OVERLOAD PROTECTION  
SOT-223 AND DDPAK SURFACE-MOUNT PACKAGES  
800mA  
SOT-223  
1A  
APPLICATIONS  
SCSI-2 ACTIVE TERMINATION  
VOLTAGE  
1.8V  
DDPAK  
SOT-223  
DDPAK  
2.5V  
HAND-HELD DATA COLLECTION DEVICES  
HIGH EFFICIENCY LINEAR REGULATORS  
BATTERY POWERED INSTRUMENTATION  
2.85V  
3.3V  
5V  
BATTERY MANAGEMENT CIRCUITS FOR  
Adj.  
NOTEBOOK AND PALMTOP PCs  
CORE VOLTAGE SUPPLY: FPGA, PLD, DSP, CPU  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1992, Burr-Brown Corporation  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
www.ti.com  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
PACKAGE-LEAD DESIGNATOR  
PACKAGE  
MARKING  
ORDERING  
NUMBER  
TRANSPORT  
MEDIA, QUANTITY  
PRODUCT  
V
O /IO  
800mA Output  
REG1117-2.85  
2.85/800mA  
"/"  
SOT223-3  
DCY  
DCY  
KTT  
DCY  
DCY  
0°C to +125°C  
BB11172  
REG1117-2.85  
REG1117-2.85  
Rails, 80  
"
"
"
"
Tape and Reel, 2500  
REG1117-3.3  
3.3/800mA  
"/"  
SOT223-3  
0°C to +125°C  
BB11174  
REG1117-3.3  
REG1117-3.3  
Rails, 80  
"
"
"
"
Tape and Reel, 2500  
REG1117F-3.3  
3.3/800mA  
"/"  
DDPAK-3  
0°C to +125°C  
BB1117F4  
REG1117F-3.3  
REG1117F-3.3  
Rails, 49  
"
"
"
"
Tape and Reel, 500  
REG1117-5  
5V/800mA  
"/"  
SOT223-3  
0°C to +125°C  
BB11175  
REG1117-5  
REG1117-5  
Rails, 80  
"
"
"
"
Tape and Reel, 2500  
REG1117  
Adj./800mA  
"/"  
SOT223-3  
0°C to +125°C  
BB1117  
REG1117  
REG1117  
Rails, 80  
"
"
"
"
Tape and Reel, 2500  
1A Output  
REG1117A-1.8  
1.8V/1A  
"/"  
SOT223-3  
DCY  
KTT  
DCY  
KTT  
KTT  
DCY  
KTT  
0°C to +125°C  
R111718  
REG1117A-1.8  
REG1117A-1.8  
Rails, 80  
"
"
"
"
Tape and Reel, 2500  
REG1117FA-1.8  
1.8/1A  
"/"  
DDPAK-3  
0°C to +125°C  
REG1117FA1.8  
REG1117FA-1.8  
REG1117FA-1.8  
Rails, 49  
"
"
"
"
Tape and Reel, 500  
REG1117A-2.5  
2.5/1A  
"/"  
SOT223-3  
0°C to +125°C  
R111725  
REG1117A-2.5  
REG1117A-2.5  
Rails, 80  
"
"
"
"
Tape and Reel, 2500  
REG1117FA-2.5  
2.5/1A  
"/"  
DDPAK-3  
0°C to +125°C  
REG1117FA2.5  
REG1117FA-2.5  
REG1117FA-2.5  
Rails, 49  
"
"
"
"
Tape and Reel, 500  
REG1117FA-5  
5/1A  
"/"  
DDPAK-3  
0°C to +125°C  
REG1117FA5.0  
REG1117FA-5.0  
REG1117FA-5.0  
Rails, 49  
"
"
"
"
Tape and Reel, 500  
REG1117A  
Adj./1A  
"/"  
SOT223-3  
0°C to +125°C  
BB1117A  
REG1117A  
REG1117A  
Rails, 80  
"
"
"
"
Tape and Reel, 2500  
REG1117FA  
Adj./1A  
"/"  
DDPAK-3  
0°C to +125°C  
REG1117FA  
REG1117FA  
REG1117FA  
Rails, 49  
"
"
"
"
Tape and Reel, 500  
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
This integrated circuit can be damaged by ESD. Texas Instru-  
ments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling  
and installation procedures can cause damage.  
Power Dissipation ........................................................... Internally Limited  
Input Voltage ........................................................................................ 15V  
Operating Junction Temperature Range............................. 0°C to +125°C  
Storage Temperature Range .......................................... –65°C to +150°C  
Lead Temperature (soldering, 10s)(2) ............................................ +300°C  
NOTE:(1)Stressesabovetheseratingsmaycausepermanentdamage. (2)See  
“Soldering Methods.”  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
CONNECTION DIAGRAM  
Front View  
Plastic DDPAK  
Plastic SOT-223  
Tab is  
VOUT  
Tab is VOUT  
Ground VOUT  
(Adj.)(1)  
VIN  
Ground VOUT  
(Adj.)(1)  
VIN  
NOTE: (1) Adjustable-Voltage Model.  
REG1117, REG1117A  
2
SBVS001B  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
At TJ = +25°C, unless otherwise noted.  
REG1117, REG1117A  
TYP  
PARAMETER  
CONDITIONS  
MIN  
MAX  
UNITS  
OUTPUT VOLTAGE  
REG1117-2.85  
See Note 1  
IO = 10mA, VIN = 4.85V  
O = 0 to 800mA, VIN = 4.05 to 10V  
2.820  
2.790  
2.85  
2.85  
2.880  
2.910  
V
V
I
REG1117-3.3  
See Note 1  
IO = 10mA, VIN = 5.3V  
O = 0 to 800mA, VIN = 4.8 to 10V  
3.270  
3.240  
3.30  
3.30  
3.330  
3.360  
V
V
I
REG1117-5  
See Note 1  
IO = 10mA, VIN = 7V  
O = 0 to 800mA, VIN = 6.5 to 10V  
4.950  
4.900  
5.00  
5.00  
5.050  
5.100  
V
V
I
REG1117A-1.8  
See Note 1  
IO = 10mA, VIN = 3.8V  
O = 0 to 1A, VIN = 3.8V to 10V  
1.782  
1.764  
1.8  
1.8  
1.818  
1.836  
V
V
I
REG1117A-2.5  
See Note 1  
IO = 10mA, VIN = 4.5V  
O = 0 to 1A, VIN = 4.5V to 10V  
2.475  
2.450  
2.5  
2.5  
2.525  
2.550  
V
V
I
REG1117A-5  
See Note 1  
IO = 10mA, VIN = 7V  
O = 0 to 1A, VIN = 7V to 10V  
4.950  
4.900  
5.0  
5.0  
5.050  
5.100  
V
V
I
REFERENCE VOLTAGE  
REG1117 (Adjustable)  
See Note 1  
I
O = 10mA, VIN VO = 2V  
1.238  
1.225  
1.250  
1.250  
1.262  
1.280  
V
V
I
O = 10 to 800mA, VIN VO = 1.4 to 10V  
REG1117A (Adjustable)  
See Note 1  
IO = 10mA, VIN VO = 2V  
O = 10mA to 1A, VIN VO = 1.4 to 10V  
1.238  
1.225  
1.250  
1.250  
1.262  
1.280  
V
V
I
LINE REGULATION  
REG1117-2.85(1)  
IO = 0, VIN = 4.25 to 10V  
IO = 0, VIN = 4.8 to 10V  
IO = 0, VIN = 6.5 to 15V  
1
2
3
0.1  
0.1  
1
7
7
10  
0.4  
0.4  
7
mV  
mV  
mV  
%
REG1117-3.3(1)  
REG1117-5(1)  
REG1117 (Adjustable)(1)  
REG1117A (Adjustable)(1)  
REG1117A-1.8(1)  
REG1117A-2.5(1)  
REG1117A-5.0(1)  
IO = 10mA, VIN VO = 1.5 to 13.75V  
IO = 10mA, VIN VO = 1.5 to 13.75V  
IO = 0, VIN = 3.8V to 10V  
%
mV  
mV  
mV  
IO = 0, VIN = 4.5V to 10V  
IO = 0, VIN = 7V to 15V  
1
3
7
10  
LOAD REGULATION  
REG1117-2.85(1)  
REG1117-3.3(1)  
IO = 0 to 800mA, VIN = 4.25V  
IO = 0 to 800mA, VIN = 4.8V  
IO = 0 to 800mA, VIN = 6.5V  
IO = 10 to 800mA, VIN VO = 3V  
IO = 10mA to 1A, VIN VO = 3V  
2
3
3
0.1  
0.1  
2
10  
12  
15  
0.4  
0.4  
10  
10  
15  
mV  
mV  
mV  
%
REG1117-5(1)  
REG1117 (Adjustable)(1)(2)  
REG1117A (Adjustable)(1)(2)  
REG1117A-1.8  
REG1117A-2.5  
REG1117A-5  
%
IO = 0 to 1A, VIN = 3.8V  
IO = 0 to 1A, VIN = 4.5V  
IO = 0 to 1A, VIN = 7.0V  
mV  
mV  
mV  
2
3
DROPOUT VOLTAGE(3)  
All Models(1)  
IO = 100mA  
1.00  
1.05  
1.10  
1.2  
1.10  
1.15  
1.20  
1.30  
1.55  
V
V
V
V
V
See Note 1  
REG1117 Models(1)  
REG1117A  
IO = 500mA  
IO = 800mA  
I
I
O = 1A  
O = 1A  
See Note 1  
1.2  
CURRENT LIMIT  
REG1117 Models  
REG1117A  
VIN VO = 5V  
IN VO = 5V  
800  
1000  
950  
1250  
1200  
1600  
mA  
mA  
V
MINIMUM LOAD CURRENT  
Adjustable Models(1)(2)  
VIN VO = 13.75V  
1.7  
5
mA  
QUIESCENT CURRENT  
Fixed-Voltage Models(1)  
VIN VO = 5V  
4
10  
mA  
Adjust Pin Current(1)(2)  
IO = 10mA, VIN VO = 1.4 to 10V  
IO = 10mA to 800mA, VIN VO = 1.4 to 10V  
IO = 10mA to 1A, VIN VO = 1.4 to 10V  
50  
0.5  
0.5  
120  
5
5
µA  
µA  
µA  
vs Load Current, REG1117(1)  
vs Load Current, REG1117A(1)  
THERMAL REGULATION  
All Models(4)  
30ms Pulse  
0.01  
62  
0.1  
%/W  
dB  
RIPPLE REJECTION  
All Models  
f = 120Hz, VIN VOUT = 3V + 1Vp-p Ripple  
TEMPERATURE DRIFT  
Fixed-Voltage Models  
Adjustable Models  
TJ = 0°C to +125°C  
TJ = 0°C to +125°C  
0.5  
2
%
%
REG1117, REG1117A  
3
SBVS001B  
www.ti.com  
ELECTRICAL CHARACTERISTICS (Cont.)  
At TJ = +25°C, unless otherwise noted.  
REG1117, REG1117A  
TYP  
PARAMETER  
CONDITIONS  
MIN  
MAX  
UNITS  
%
LONG-TERM STABILITY  
All Models  
T
A = +125°C, 1000Hr  
f = 10Hz to 10kHz  
0.3  
OUTPUT NOISE  
rms Noise, All Models  
0.003  
%
THERMAL RESISTANCE  
Operating Junction Temperature Range  
Storage Range  
0
65  
+125  
+150  
°C  
°C  
Thermal Resistance, θJC  
(Junction-to-Case at Tab)  
3-Lead SOT-223 Surface-Mount  
3-Lead DDPAK Surface-Mount  
15  
2
3
°C/W  
°C/W  
°C/W  
f > 50Hz  
dc  
Thermal Resistance, θJA  
(Junction-to-Case at Tab)  
No Heat Sink  
3-Lead DDPAK Surface-Mount  
65  
°C/W  
NOTES: (1) Specification applies over the full operating Junction temperature range, 0°C to +125°C. (2) REG1117 and REG1117A adjustable versions require a  
minimum load current for ±3% regulation. (3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.  
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN VO  
=
1.4V (Reading taken 10ms after pulse).  
SIMPLIFIED SCHEMATIC  
VIN  
+
Current  
Limit  
Thermal  
Limit  
VOUT  
10X  
(Substrate)  
Ground (Fixed-Voltage Models)  
Adj. (Adjustable-Voltage Model)  
REG1117, REG1117A  
4
SBVS001B  
www.ti.com  
TYPICAL CHARACTERISTICS  
At TJ = +25°C, all models, unless otherwise specified.  
LOAD REGULATION  
(∆ILOAD = 800mA)  
SHORT-CIRCUIT CURRENT vs TEMPERATURE  
1400  
1
0
1300  
REG1117-2.85  
REG1117A-1.8  
1  
2  
3  
4  
5  
6  
7  
REG1117A  
1200  
1100  
REG1117 Models  
1000  
REG1117-5  
900  
800  
50  
25  
0
25  
50  
75  
100  
100  
100  
50  
25  
0
25  
50  
75  
100  
Temperature (°C)  
Temperature (°C)  
LINE REGULATION vs TEMPERATURE  
RIPPLE REJECTION vs FREQUENCY  
6
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
IOUT = 100mA  
RIPPLE = 1.0Vp-p  
5
4
V
VIN = 6.5V to 15V  
REG1117-5  
3
2
1
REG1117-1.8  
0
V
IN = 3.8V to 10V  
1  
2  
50  
25  
0
25  
Temperature (°C)  
50  
75  
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
OUTPUT VOLTAGE vs TEMPERATURE  
QUIESCENT CURRENT vs TEMPERATURE  
Fixed-Voltage Models  
2.0  
1.0  
8
7
6
5
4
3
2
1
0
IO = 10mA  
0
1.0  
2.0  
50  
25  
0
25  
50  
75  
50  
25  
0
25  
50  
75  
100  
Temperature (°C)  
Temperature (°C)  
REG1117, REG1117A  
5
SBVS001B  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At TJ = +25°C, all models, unless otherwise specified.  
LINE TRANSIENT RESPONSE  
LOAD TRANSIENT RESPONSE  
60  
40  
CIN = 1µF  
OUT = 10µF Tantalum  
IOUT = 0.1A  
0.1  
0
C
20  
0.1  
0
20  
40  
5.25  
4.25  
3.25  
CIN = 10µF  
0.5  
0
C
OUT = 10µF  
Tantalum  
IN = 4.25V  
Preload = 0.1A  
V
0.5  
0
20  
40 60  
80 100 120 140 160 180 200  
Time (µs)  
0
20  
40  
Time (µs)  
60  
80  
100  
APPLICATIONS INFORMATION  
Figure 1 shows the basic hookup diagram for fixed-voltage  
models. All models require an output capacitor for proper  
operation and to improve high frequency load regulation. A  
10µF tantalum capacitor is recommended. Aluminum elec-  
trolytic types of 50µF or greater can also be used. A high  
quality capacitor should be used to assure that the ESR  
(Effective Series Resistance) is less than 0.5.  
VIN  
VO  
REG1117  
10µF  
+
+ 10µF  
Tantalum  
Tantalum  
Figure 2 shows a hookup diagram for the adjustable voltage  
model. Resistor values are shown for some commonly used  
output voltages. Values for other voltages can be calculated  
from the equation shown in Figure 2. For best load regula-  
tion, connect R1 close to the output pin and R2 close to the  
ground side of the load as shown.  
FIGURE 1. Fixed-Voltage Model—Basic Connections.  
VIN  
VO  
3
2
REG1117  
(Adj)  
VOUT (V)  
R1 ()(2)  
R2 ()(2)  
1.25  
1.5  
2.1  
2.85  
3
3.3  
5
10  
Open  
750  
158  
169  
137  
115  
113  
113  
Short  
147  
107  
215  
191  
187  
340  
787  
C
C1  
+
+
2
R1 + R2  
R1  
R1  
R2  
10µF  
10µF  
VO  
=
(1.25V) + (50µA) (R2)  
1
Load  
(1)  
C3  
+
This term is negligible with  
proper choice of valuessee  
table at right.  
10µF  
NOTE: (1) C3 optional. Improves high-frequency line rejection. (2) Resistors are standard 1% values.  
FIGURE 2. Adjustable-Voltage Model—Basic Connections.  
REG1117, REG1117A  
6
SBVS001B  
www.ti.com  
THERMAL CONSIDERATIONS  
until the device’s thermal shutdown is activated. If this  
occurs at more than 40°C above the maximum expected  
ambient temperature, then the TJ will be less than 125°C  
during normal operation.  
The REG1117 has current limit and thermal shutdown  
circuits that protect it from overload. The thermal shutdown  
activates at approximately TJ = 165°C. For continuous op-  
eration, however, the junction temperature should not be  
allowed to exceed 125°C. Any tendency to activate the  
thermal shutdown in normal use is an indication of an  
inadequate heat sink or excessive power dissipation. The  
power dissipation is equal to:  
The internal protection circuitry of the REG1117 was de-  
signed to protect against overload conditions. It was not  
intended to replace proper heat sinking. Continuously run-  
ning the REG1117 into thermal shutdown will degrade  
reliability.  
PD = (VIN – VOUT) IOUT  
The junction temperature can be calculated by:  
TJ = TA + PD (θJA)  
LAYOUT CONSIDERATIONS  
The DDPAK (REG1117F-3.3 and REG1117FA) is a sur-  
face-mount power package that has excellent thermal char-  
acteristics. For best thermal performance, its mounting tab  
should be soldered directly to a circuit board copper area, as  
shown in Figure 3. Increasing the copper area improves heat  
dissipation. Figure 4 shows typical thermal resistance from  
junction-to-ambient as a function of the copper area.  
where TA is the ambient temperature, and  
θJA is the junction-to-ambient thermal resistance  
A simple experiment will determine whether the maximum  
recommended junction temperature is exceeded in an actual  
circuit board and mounting configuration: Increase the am-  
bient temperature above that expected in normal operation  
(1)  
3-Lead DDPAK  
0.51  
All measurements  
in inches.  
0.155  
0.05  
0.10  
NOTE: (1) For improved thermal performance increase  
footprint area. See Figure 4, Thermal Resistance vs  
Circuit Board Copper Area.  
FIGURE 3. DDPAK Thermal Resistance versus Circuit Board Copper Area.  
THERMAL RESISTANCE vs  
CIRCUIT BOARD COPPER AREA  
60  
Circuit Board Copper Area  
REG1117F  
50  
40  
30  
20  
10  
DDPAK Surface Mount Package  
1oz copper  
θ
REG1117F  
DDPAK Surface-Mount Package  
0
1
2
3
4
5
Copper Area (inches2)  
FIGURE 4. DDPAK Thermal Resistance versus Circuit Board Copper Area.  
REG1117, REG1117A  
7
SBVS001B  
www.ti.com  
TOPSIDE(1) BACKSIDE  
SOT-223  
The SOT-223 package derives heat sinking from conduction  
through its copper leads, especially the large mounting tab.  
These must be soldered to a circuit board with a substantial  
amount of copper remaining, as shown in Figure 5. Circuit  
board traces connecting the tab and the leads should be made  
as large as practical. The mounting tab of both packages is  
TOTAL PC BOARD  
AREA  
COPPER  
AREA  
COPPER  
AREA  
THERMAL RESISTANCE  
JUNCTION-TO-AMBIENT  
2500mm2  
2500mm2  
2500mm2  
2500mm2  
2500mm2  
1600mm2  
2500mm2  
2500mm2  
1600mm2  
900mm2  
2500mm2  
1250mm2  
950mm2  
2500mm2  
1800mm2  
600mm2  
1250mm2  
915mm2  
600mm2  
340mm2  
340mm2  
2500mm2  
46°C/W  
47°C/W  
49°C/W  
51°C/W  
53°C/W  
55°C/W  
58°C/W  
59°C/W  
67°C/W  
72°C/W  
85°C/W  
2500mm2  
2500mm2  
0
electrically connected to VOUT  
.
0
1600mm2  
0
0
Total Area: 50 x 50mm  
35 x 17 mm  
0
900mm2  
0
900mm2  
NOTE: (1) Tab is attached to the topside copper.  
TABLE I.  
16 x 10 mm  
16 x 10 mm  
INSPEC Abstract Number: B91007604, C91012627  
Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω  
Packages.” The Proceedings of SMTCON. Surface Mount  
TechnologyConferenceandExposition:CompetitiveSurface  
Mount Technology, April 3-6, 1990, Atlantic City, NJ, USA.  
Abstract Publisher: IC Manage, 1990, Chicago, IL, USA.  
Without back-side copper: θJA 59°C/W  
With solid back-side copper: θJA 49°C/W  
FIGURE 5. SOT-223 Circuit Board Layout Example.  
Other nearby circuit traces, including those on the back side  
of the circuit board, help conduct heat away from the device,  
even though they may not be electrically connected. Make  
all nearby copper traces as wide as possible and leave only  
narrow gaps between traces.  
MAXIMUM POWER DISSIPATION  
vs AMBIENT TEMPERATURE  
6
θ
= 27°C/W  
(4in one oz copper  
mounting pad)  
PD = (TJ (max) TA) /θJA  
TJ (max) = 150°C  
JA  
2
5
4
3
2
1
0
Table I shows approximate values of θJA for various circuit  
board and copper areas for the SOT-223 package. Nearby  
heat dissipating components, circuit board mounting condi-  
tions, and ventilation can dramatically affect the actual θJA.  
Proper heat sinking significantly increases the maximum  
power dissipation at a given ambient temperature, as shown  
in Figure 6.  
DDPAK  
SOT-223  
θ
= 46°C/W  
(2500mm topside and  
backside copper)  
JA  
2
θ
= 65°C/W  
JA  
(no heat sink)  
θ
= 85°C/W  
(340mm topside copper,  
no backside copper)  
JA  
2
0
25  
50  
75  
100  
125  
SOLDERING METHODS  
Ambient Temperature (°C)  
Both REG1117 packages are suitable for infrared reflow and  
vapor-phase reflow soldering techniques. The high rate of  
temperature change that occurs with wave soldering, or hand  
soldering can damage the REG1117.  
FIGURE 6. Maximum Power Dissipation versus Ambient  
Temperature.  
REG1117, REG1117A  
8
SBVS001B  
www.ti.com  
TERMPWR  
TERMPWR  
5V  
5V  
2.85V  
110Ω  
110Ω  
110Ω  
110Ω  
2.85V  
1N5817  
1N5817  
REG1117-2.85  
REG1117-2.85  
10µF  
10µF  
10µF  
10µF  
(Up to 27 Lines)  
FIGURE 7. SCSI Active Termination Configuration.  
REG1117-5  
REG1117-5  
In  
Out  
In  
Out  
VIN > 12V  
10µF  
5V to 10V  
100µF  
VIN > 9.0V  
10µF  
7.5V  
+
+
+
+
GND  
GND  
100µF  
2.5VOUT  
+
10µF  
1kΩ  
REF1004-2.5  
FIGURE 8. Adjusting Output of Fixed Voltage Models.  
FIGURE 9. Regulator with Reference.  
REG1117-5  
5.2V Line  
5.0V Battery  
VIN  
In  
Out  
+
GND  
10µF  
50Ω  
1kΩ  
REG1117-5  
In  
Out  
GND  
+
+
6.5V  
10µF  
100µF  
FIGURE 10. Battery Backed-Up Regulated Supply.  
REG1117-5  
VIN  
In  
Out  
+
+
GND  
10µF  
100µF  
VOUT = 5V  
Floating Input  
FIGURE 11. Low Dropout Negative Supply.  
REG1117, REG1117A  
9
SBVS001B  
www.ti.com  
PACKAGE DRAWINGS  
DCY (R-PDSO-G4)  
MPDS094 APRIL 2001  
PLASTIC SMALL-OUTLINE  
0.264 (6,70)  
0.248 (6,30)  
0.124 (3,15)  
0.116 (2,95)  
0.146 (3,70)  
0.130 (3,30)  
0.287 (7,30)  
0.264 (6,70)  
0.041 (1,05)  
0.033 (0,85)  
0.0905 (2,30) NOM  
0.181 (4,60)  
NOM  
0.067 (1,70)  
0.060 (1,50)  
0.051 (1,30)  
0.043 (1,09)  
0.014 (0,36)  
0.010 (0,25)  
10° MAX  
0.004 (0,10)  
0.0008 (0,02)  
0.033 (0,84)  
0.026 (0,66)  
0.012 (0,30) MIN  
4202506/A 03/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
REG1117, REG1117A  
10  
SBVS001B  
www.ti.com  
PACKAGE DRAWINGS  
KTT (R-PSFM-G3)  
MPSF006A SEPTEMBER 1999 REVISED SEPTEMBER 2000  
PLASTIC FLANGE-MOUNT  
0.170 (4,31)  
0.180 (4,57)  
0.396 (10,05)  
0.406 (10,31)  
0.055 (1,40)  
0.066 (1,68)  
0.045 (1,14)  
0.055 (1,40)  
0.098 (2,49)  
0.108 (2,74)  
0.326 (8,28)  
0.336 (8,53)  
0.000 (0,00)  
0.010 (0,25)  
0.580 (14,73)  
0.620 (15,75)  
0.026 (0,66)  
0.036 (0,91)  
0.100 (2,54)  
0.010 (0,25)  
0.017 (0,43)  
0.023 (0,58)  
0.090 (2,29)  
0.110 (2,79)  
0° 8°  
4200577-2/B 09/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).  
REG1117, REG1117A  
11  
SBVS001B  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
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and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
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and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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Copyright 2001, Texas Instruments Incorporated  

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