REG1117-33 [ETC]
800mA and 1A Low Dropout (LDO) Positive Regulator 1.8V. 2.5V. 2.85V. 3.3V. 5V. and Adj ; 800毫安和1A低压降( LDO )稳压器正1.8V 。 2.5V 。 2.85V 。 3.3V 。 5V 。并调\n型号: | REG1117-33 |
厂家: | ETC |
描述: | 800mA and 1A Low Dropout (LDO) Positive Regulator 1.8V. 2.5V. 2.85V. 3.3V. 5V. and Adj
|
文件: | 总12页 (文件大小:385K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
REG1117
REG1117A
R
E
G
1
1
1
7
SBVS001B – OCTOBER 2001
800mA and 1A Low Dropout Positive Regulator
1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable
DESCRIPTION
FEATURES
The REG1117 is a family of easy-to-use three-terminal
voltage regulators. The family includes a variety of fixed-
and adjustable-voltage versions, two currents (800mA and
1A) and two package types (SOT-223 and DDPAK). See the
chart below for available options.
ꢀ FIXED AND ADJUSTABLE VERSIONS
ꢀ 2.85V MODEL FOR SCSI-2 ACTIVE TERMINATION
ꢀ OUTPUT CURRENT:
REG1117: 800mA max
REG1117A: 1A max
Output voltage of the adjustable versions is set with two
external resistors. The REG1117’s low dropout voltage
allows its use with as little as 1V input-output voltage
differential.
ꢀ OUTPUT TOLERANCE: ±1% max
ꢀ DROPOUT VOLTAGE:
REG1117: 1.2V max at IO = 800mA
REG1117A: 1.3V max at IO = 1A
Laser trimming assures excellent output voltage accuracy
without adjustment. An NPN output stage allows output
stage drive to contribute to the load current for maximum
efficiency.
ꢀ INTERNAL CURRENT LIMIT
ꢀ THERMAL OVERLOAD PROTECTION
ꢀ
SOT-223 AND DDPAK SURFACE-MOUNT PACKAGES
800mA
SOT-223
1A
APPLICATIONS
ꢀ SCSI-2 ACTIVE TERMINATION
VOLTAGE
1.8V
DDPAK
SOT-223
DDPAK
ꢀ
ꢀ
ꢀ
ꢀ
2.5V
ꢀ HAND-HELD DATA COLLECTION DEVICES
ꢀ HIGH EFFICIENCY LINEAR REGULATORS
ꢀ BATTERY POWERED INSTRUMENTATION
2.85V
3.3V
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
5V
ꢀ
ꢀ
ꢀ BATTERY MANAGEMENT CIRCUITS FOR
Adj.
ꢀ
NOTEBOOK AND PALMTOP PCs
ꢀ CORE VOLTAGE SUPPLY: FPGA, PLD, DSP, CPU
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1992, Burr-Brown Corporation
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
PACKAGE-LEAD DESIGNATOR
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
V
O /IO
800mA Output
REG1117-2.85
2.85/800mA
"/"
SOT223-3
DCY
DCY
KTT
DCY
DCY
0°C to +125°C
BB11172
REG1117-2.85
REG1117-2.85
Rails, 80
"
"
"
"
Tape and Reel, 2500
REG1117-3.3
3.3/800mA
"/"
SOT223-3
0°C to +125°C
BB11174
REG1117-3.3
REG1117-3.3
Rails, 80
"
"
"
"
Tape and Reel, 2500
REG1117F-3.3
3.3/800mA
"/"
DDPAK-3
0°C to +125°C
BB1117F4
REG1117F-3.3
REG1117F-3.3
Rails, 49
"
"
"
"
Tape and Reel, 500
REG1117-5
5V/800mA
"/"
SOT223-3
0°C to +125°C
BB11175
REG1117-5
REG1117-5
Rails, 80
"
"
"
"
Tape and Reel, 2500
REG1117
Adj./800mA
"/"
SOT223-3
0°C to +125°C
BB1117
REG1117
REG1117
Rails, 80
"
"
"
"
Tape and Reel, 2500
1A Output
REG1117A-1.8
1.8V/1A
"/"
SOT223-3
DCY
KTT
DCY
KTT
KTT
DCY
KTT
0°C to +125°C
R111718
REG1117A-1.8
REG1117A-1.8
Rails, 80
"
"
"
"
Tape and Reel, 2500
REG1117FA-1.8
1.8/1A
"/"
DDPAK-3
0°C to +125°C
REG1117FA1.8
REG1117FA-1.8
REG1117FA-1.8
Rails, 49
"
"
"
"
Tape and Reel, 500
REG1117A-2.5
2.5/1A
"/"
SOT223-3
0°C to +125°C
R111725
REG1117A-2.5
REG1117A-2.5
Rails, 80
"
"
"
"
Tape and Reel, 2500
REG1117FA-2.5
2.5/1A
"/"
DDPAK-3
0°C to +125°C
REG1117FA2.5
REG1117FA-2.5
REG1117FA-2.5
Rails, 49
"
"
"
"
Tape and Reel, 500
REG1117FA-5
5/1A
"/"
DDPAK-3
0°C to +125°C
REG1117FA5.0
REG1117FA-5.0
REG1117FA-5.0
Rails, 49
"
"
"
"
Tape and Reel, 500
REG1117A
Adj./1A
"/"
SOT223-3
0°C to +125°C
BB1117A
REG1117A
REG1117A
Rails, 80
"
"
"
"
Tape and Reel, 2500
REG1117FA
Adj./1A
"/"
DDPAK-3
0°C to +125°C
REG1117FA
REG1117FA
REG1117FA
Rails, 49
"
"
"
"
Tape and Reel, 500
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
Power Dissipation ........................................................... Internally Limited
Input Voltage ........................................................................................ 15V
Operating Junction Temperature Range............................. 0°C to +125°C
Storage Temperature Range .......................................... –65°C to +150°C
Lead Temperature (soldering, 10s)(2) ............................................ +300°C
NOTE:(1)Stressesabovetheseratingsmaycausepermanentdamage. (2)See
“Soldering Methods.”
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
CONNECTION DIAGRAM
Front View
Plastic DDPAK
Plastic SOT-223
Tab is
VOUT
Tab is VOUT
Ground VOUT
(Adj.)(1)
VIN
Ground VOUT
(Adj.)(1)
VIN
NOTE: (1) Adjustable-Voltage Model.
REG1117, REG1117A
2
SBVS001B
www.ti.com
ELECTRICAL CHARACTERISTICS
At TJ = +25°C, unless otherwise noted.
REG1117, REG1117A
TYP
PARAMETER
CONDITIONS
MIN
MAX
UNITS
OUTPUT VOLTAGE
REG1117-2.85
See Note 1
IO = 10mA, VIN = 4.85V
O = 0 to 800mA, VIN = 4.05 to 10V
2.820
2.790
2.85
2.85
2.880
2.910
V
V
I
REG1117-3.3
See Note 1
IO = 10mA, VIN = 5.3V
O = 0 to 800mA, VIN = 4.8 to 10V
3.270
3.240
3.30
3.30
3.330
3.360
V
V
I
REG1117-5
See Note 1
IO = 10mA, VIN = 7V
O = 0 to 800mA, VIN = 6.5 to 10V
4.950
4.900
5.00
5.00
5.050
5.100
V
V
I
REG1117A-1.8
See Note 1
IO = 10mA, VIN = 3.8V
O = 0 to 1A, VIN = 3.8V to 10V
1.782
1.764
1.8
1.8
1.818
1.836
V
V
I
REG1117A-2.5
See Note 1
IO = 10mA, VIN = 4.5V
O = 0 to 1A, VIN = 4.5V to 10V
2.475
2.450
2.5
2.5
2.525
2.550
V
V
I
REG1117A-5
See Note 1
IO = 10mA, VIN = 7V
O = 0 to 1A, VIN = 7V to 10V
4.950
4.900
5.0
5.0
5.050
5.100
V
V
I
REFERENCE VOLTAGE
REG1117 (Adjustable)
See Note 1
I
O = 10mA, VIN – VO = 2V
1.238
1.225
1.250
1.250
1.262
1.280
V
V
I
O = 10 to 800mA, VIN – VO = 1.4 to 10V
REG1117A (Adjustable)
See Note 1
IO = 10mA, VIN – VO = 2V
O = 10mA to 1A, VIN – VO = 1.4 to 10V
1.238
1.225
1.250
1.250
1.262
1.280
V
V
I
LINE REGULATION
REG1117-2.85(1)
IO = 0, VIN = 4.25 to 10V
IO = 0, VIN = 4.8 to 10V
IO = 0, VIN = 6.5 to 15V
1
2
3
0.1
0.1
1
7
7
10
0.4
0.4
7
mV
mV
mV
%
REG1117-3.3(1)
REG1117-5(1)
REG1117 (Adjustable)(1)
REG1117A (Adjustable)(1)
REG1117A-1.8(1)
REG1117A-2.5(1)
REG1117A-5.0(1)
IO = 10mA, VIN – VO = 1.5 to 13.75V
IO = 10mA, VIN – VO = 1.5 to 13.75V
IO = 0, VIN = 3.8V to 10V
%
mV
mV
mV
IO = 0, VIN = 4.5V to 10V
IO = 0, VIN = 7V to 15V
1
3
7
10
LOAD REGULATION
REG1117-2.85(1)
REG1117-3.3(1)
IO = 0 to 800mA, VIN = 4.25V
IO = 0 to 800mA, VIN = 4.8V
IO = 0 to 800mA, VIN = 6.5V
IO = 10 to 800mA, VIN – VO = 3V
IO = 10mA to 1A, VIN – VO = 3V
2
3
3
0.1
0.1
2
10
12
15
0.4
0.4
10
10
15
mV
mV
mV
%
REG1117-5(1)
REG1117 (Adjustable)(1)(2)
REG1117A (Adjustable)(1)(2)
REG1117A-1.8
REG1117A-2.5
REG1117A-5
%
IO = 0 to 1A, VIN = 3.8V
IO = 0 to 1A, VIN = 4.5V
IO = 0 to 1A, VIN = 7.0V
mV
mV
mV
2
3
DROPOUT VOLTAGE(3)
All Models(1)
IO = 100mA
1.00
1.05
1.10
1.2
1.10
1.15
1.20
1.30
1.55
V
V
V
V
V
See Note 1
REG1117 Models(1)
REG1117A
IO = 500mA
IO = 800mA
I
I
O = 1A
O = 1A
See Note 1
1.2
CURRENT LIMIT
REG1117 Models
REG1117A
VIN – VO = 5V
IN – VO = 5V
800
1000
950
1250
1200
1600
mA
mA
V
MINIMUM LOAD CURRENT
Adjustable Models(1)(2)
VIN – VO = 13.75V
1.7
5
mA
QUIESCENT CURRENT
Fixed-Voltage Models(1)
VIN – VO = 5V
4
10
mA
Adjust Pin Current(1)(2)
IO = 10mA, VIN – VO = 1.4 to 10V
IO = 10mA to 800mA, VIN – VO = 1.4 to 10V
IO = 10mA to 1A, VIN – VO = 1.4 to 10V
50
0.5
0.5
120
5
5
µA
µA
µA
vs Load Current, REG1117(1)
vs Load Current, REG1117A(1)
THERMAL REGULATION
All Models(4)
30ms Pulse
0.01
62
0.1
%/W
dB
RIPPLE REJECTION
All Models
f = 120Hz, VIN – VOUT = 3V + 1Vp-p Ripple
TEMPERATURE DRIFT
Fixed-Voltage Models
Adjustable Models
TJ = 0°C to +125°C
TJ = 0°C to +125°C
0.5
2
%
%
REG1117, REG1117A
3
SBVS001B
www.ti.com
ELECTRICAL CHARACTERISTICS (Cont.)
At TJ = +25°C, unless otherwise noted.
REG1117, REG1117A
TYP
PARAMETER
CONDITIONS
MIN
MAX
UNITS
%
LONG-TERM STABILITY
All Models
T
A = +125°C, 1000Hr
f = 10Hz to 10kHz
0.3
OUTPUT NOISE
rms Noise, All Models
0.003
%
THERMAL RESISTANCE
Operating Junction Temperature Range
Storage Range
0
–65
+125
+150
°C
°C
Thermal Resistance, θJC
(Junction-to-Case at Tab)
3-Lead SOT-223 Surface-Mount
3-Lead DDPAK Surface-Mount
15
2
3
°C/W
°C/W
°C/W
f > 50Hz
dc
Thermal Resistance, θJA
(Junction-to-Case at Tab)
No Heat Sink
3-Lead DDPAK Surface-Mount
65
°C/W
NOTES: (1) Specification applies over the full operating Junction temperature range, 0°C to +125°C. (2) REG1117 and REG1117A adjustable versions require a
minimum load current for ±3% regulation. (3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN – VO
=
1.4V (Reading taken 10ms after pulse).
SIMPLIFIED SCHEMATIC
VIN
+
Current
Limit
Thermal
Limit
VOUT
10X
(Substrate)
Ground (Fixed-Voltage Models)
Adj. (Adjustable-Voltage Model)
REG1117, REG1117A
4
SBVS001B
www.ti.com
TYPICAL CHARACTERISTICS
At TJ = +25°C, all models, unless otherwise specified.
LOAD REGULATION
(∆ILOAD = 800mA)
SHORT-CIRCUIT CURRENT vs TEMPERATURE
1400
1
0
1300
REG1117-2.85
REG1117A-1.8
–1
–2
–3
–4
–5
–6
–7
REG1117A
1200
1100
REG1117 Models
1000
REG1117-5
900
800
–50
–25
0
25
50
75
100
100
100
–50
–25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
LINE REGULATION vs TEMPERATURE
RIPPLE REJECTION vs FREQUENCY
6
100
90
80
70
60
50
40
30
20
10
0
IOUT = 100mA
RIPPLE = 1.0Vp-p
5
4
V
VIN = 6.5V to 15V
REG1117-5
3
2
1
REG1117-1.8
0
V
IN = 3.8V to 10V
–1
–2
–50
–25
0
25
Temperature (°C)
50
75
10
100
1k
10k
100k
Frequency (Hz)
OUTPUT VOLTAGE vs TEMPERATURE
QUIESCENT CURRENT vs TEMPERATURE
Fixed-Voltage Models
2.0
1.0
8
7
6
5
4
3
2
1
0
IO = 10mA
0
–1.0
–2.0
–50
–25
0
25
50
75
–50
–25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
REG1117, REG1117A
5
SBVS001B
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TJ = +25°C, all models, unless otherwise specified.
LINE TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
60
40
CIN = 1µF
OUT = 10µF Tantalum
IOUT = 0.1A
0.1
0
C
20
–0.1
0
–20
–40
5.25
4.25
3.25
CIN = 10µF
0.5
0
C
OUT = 10µF
Tantalum
IN = 4.25V
Preload = 0.1A
V
–0.5
0
20
40 60
80 100 120 140 160 180 200
Time (µs)
0
20
40
Time (µs)
60
80
100
APPLICATIONS INFORMATION
Figure 1 shows the basic hookup diagram for fixed-voltage
models. All models require an output capacitor for proper
operation and to improve high frequency load regulation. A
10µF tantalum capacitor is recommended. Aluminum elec-
trolytic types of 50µF or greater can also be used. A high
quality capacitor should be used to assure that the ESR
(Effective Series Resistance) is less than 0.5Ω.
VIN
VO
REG1117
10µF
+
+ 10µF
Tantalum
Tantalum
Figure 2 shows a hookup diagram for the adjustable voltage
model. Resistor values are shown for some commonly used
output voltages. Values for other voltages can be calculated
from the equation shown in Figure 2. For best load regula-
tion, connect R1 close to the output pin and R2 close to the
ground side of the load as shown.
FIGURE 1. Fixed-Voltage Model—Basic Connections.
VIN
VO
3
2
REG1117
(Adj)
VOUT (V)
R1 (Ω)(2)
R2 (Ω)(2)
1.25
1.5
2.1
2.85
3
3.3
5
10
Open
750
158
169
137
115
113
113
Short
147
107
215
191
187
340
787
C
C1
+
+
2
R1 + R2
R1
R1
R2
10µF
10µF
VO
=
• (1.25V) + (50µA) (R2)
1
Load
(1)
C3
+
This term is negligible with
proper choice of values—see
table at right.
10µF
NOTE: (1) C3 optional. Improves high-frequency line rejection. (2) Resistors are standard 1% values.
FIGURE 2. Adjustable-Voltage Model—Basic Connections.
REG1117, REG1117A
6
SBVS001B
www.ti.com
THERMAL CONSIDERATIONS
until the device’s thermal shutdown is activated. If this
occurs at more than 40°C above the maximum expected
ambient temperature, then the TJ will be less than 125°C
during normal operation.
The REG1117 has current limit and thermal shutdown
circuits that protect it from overload. The thermal shutdown
activates at approximately TJ = 165°C. For continuous op-
eration, however, the junction temperature should not be
allowed to exceed 125°C. Any tendency to activate the
thermal shutdown in normal use is an indication of an
inadequate heat sink or excessive power dissipation. The
power dissipation is equal to:
The internal protection circuitry of the REG1117 was de-
signed to protect against overload conditions. It was not
intended to replace proper heat sinking. Continuously run-
ning the REG1117 into thermal shutdown will degrade
reliability.
PD = (VIN – VOUT) IOUT
The junction temperature can be calculated by:
TJ = TA + PD (θJA)
LAYOUT CONSIDERATIONS
The DDPAK (REG1117F-3.3 and REG1117FA) is a sur-
face-mount power package that has excellent thermal char-
acteristics. For best thermal performance, its mounting tab
should be soldered directly to a circuit board copper area, as
shown in Figure 3. Increasing the copper area improves heat
dissipation. Figure 4 shows typical thermal resistance from
junction-to-ambient as a function of the copper area.
where TA is the ambient temperature, and
θJA is the junction-to-ambient thermal resistance
A simple experiment will determine whether the maximum
recommended junction temperature is exceeded in an actual
circuit board and mounting configuration: Increase the am-
bient temperature above that expected in normal operation
(1)
3-Lead DDPAK
0.51
All measurements
in inches.
0.155
0.05
0.10
NOTE: (1) For improved thermal performance increase
footprint area. See Figure 4, “Thermal Resistance vs
Circuit Board Copper Area”.
FIGURE 3. DDPAK Thermal Resistance versus Circuit Board Copper Area.
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
60
Circuit Board Copper Area
REG1117F
50
40
30
20
10
DDPAK Surface Mount Package
1oz copper
θ
REG1117F
DDPAK Surface-Mount Package
0
1
2
3
4
5
Copper Area (inches2)
FIGURE 4. DDPAK Thermal Resistance versus Circuit Board Copper Area.
REG1117, REG1117A
7
SBVS001B
www.ti.com
TOPSIDE(1) BACKSIDE
SOT-223
The SOT-223 package derives heat sinking from conduction
through its copper leads, especially the large mounting tab.
These must be soldered to a circuit board with a substantial
amount of copper remaining, as shown in Figure 5. Circuit
board traces connecting the tab and the leads should be made
as large as practical. The mounting tab of both packages is
TOTAL PC BOARD
AREA
COPPER
AREA
COPPER
AREA
THERMAL RESISTANCE
JUNCTION-TO-AMBIENT
2500mm2
2500mm2
2500mm2
2500mm2
2500mm2
1600mm2
2500mm2
2500mm2
1600mm2
900mm2
2500mm2
1250mm2
950mm2
2500mm2
1800mm2
600mm2
1250mm2
915mm2
600mm2
340mm2
340mm2
2500mm2
46°C/W
47°C/W
49°C/W
51°C/W
53°C/W
55°C/W
58°C/W
59°C/W
67°C/W
72°C/W
85°C/W
2500mm2
2500mm2
0
electrically connected to VOUT
.
0
1600mm2
0
0
Total Area: 50 x 50mm
35 x 17 mm
0
900mm2
0
900mm2
NOTE: (1) Tab is attached to the topside copper.
TABLE I.
16 x 10 mm
16 x 10 mm
INSPEC Abstract Number: B91007604, C91012627
Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω
Packages.” The Proceedings of SMTCON. Surface Mount
TechnologyConferenceandExposition:CompetitiveSurface
Mount Technology, April 3-6, 1990, Atlantic City, NJ, USA.
Abstract Publisher: IC Manage, 1990, Chicago, IL, USA.
Without back-side copper: θJA ≈ 59°C/W
With solid back-side copper: θJA ≈ 49°C/W
FIGURE 5. SOT-223 Circuit Board Layout Example.
Other nearby circuit traces, including those on the back side
of the circuit board, help conduct heat away from the device,
even though they may not be electrically connected. Make
all nearby copper traces as wide as possible and leave only
narrow gaps between traces.
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
6
θ
= 27°C/W
(4in one oz copper
mounting pad)
PD = (TJ (max) – TA) /θJA
TJ (max) = 150°C
JA
2
5
4
3
2
1
0
Table I shows approximate values of θJA for various circuit
board and copper areas for the SOT-223 package. Nearby
heat dissipating components, circuit board mounting condi-
tions, and ventilation can dramatically affect the actual θJA.
Proper heat sinking significantly increases the maximum
power dissipation at a given ambient temperature, as shown
in Figure 6.
DDPAK
SOT-223
θ
= 46°C/W
(2500mm topside and
backside copper)
JA
2
θ
= 65°C/W
JA
(no heat sink)
θ
= 85°C/W
(340mm topside copper,
no backside copper)
JA
2
0
25
50
75
100
125
SOLDERING METHODS
Ambient Temperature (°C)
Both REG1117 packages are suitable for infrared reflow and
vapor-phase reflow soldering techniques. The high rate of
temperature change that occurs with wave soldering, or hand
soldering can damage the REG1117.
FIGURE 6. Maximum Power Dissipation versus Ambient
Temperature.
REG1117, REG1117A
8
SBVS001B
www.ti.com
TERMPWR
TERMPWR
5V
5V
2.85V
110Ω
110Ω
110Ω
110Ω
2.85V
1N5817
1N5817
REG1117-2.85
REG1117-2.85
10µF
10µF
10µF
10µF
(Up to 27 Lines)
FIGURE 7. SCSI Active Termination Configuration.
REG1117-5
REG1117-5
In
Out
In
Out
VIN > 12V
10µF
5V to 10V
100µF
VIN > 9.0V
10µF
7.5V
+
+
+
+
GND
GND
100µF
2.5VOUT
+
10µF
1kΩ
REF1004-2.5
FIGURE 8. Adjusting Output of Fixed Voltage Models.
FIGURE 9. Regulator with Reference.
REG1117-5
5.2V Line
5.0V Battery
VIN
In
Out
+
GND
10µF
50Ω
1kΩ
REG1117-5
In
Out
GND
+
+
6.5V
10µF
100µF
FIGURE 10. Battery Backed-Up Regulated Supply.
REG1117-5
VIN
In
Out
+
+
GND
10µF
100µF
VOUT = –5V
Floating Input
FIGURE 11. Low Dropout Negative Supply.
REG1117, REG1117A
9
SBVS001B
www.ti.com
PACKAGE DRAWINGS
DCY (R-PDSO-G4)
MPDS094 – APRIL 2001
PLASTIC SMALL-OUTLINE
0.264 (6,70)
0.248 (6,30)
0.124 (3,15)
0.116 (2,95)
0.146 (3,70)
0.130 (3,30)
0.287 (7,30)
0.264 (6,70)
0.041 (1,05)
0.033 (0,85)
0.0905 (2,30) NOM
0.181 (4,60)
NOM
0.067 (1,70)
0.060 (1,50)
0.051 (1,30)
0.043 (1,09)
0.014 (0,36)
0.010 (0,25)
10° MAX
0.004 (0,10)
0.0008 (0,02)
0.033 (0,84)
0.026 (0,66)
0.012 (0,30) MIN
4202506/A 03/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
REG1117, REG1117A
10
SBVS001B
www.ti.com
PACKAGE DRAWINGS
KTT (R-PSFM-G3)
MPSF006A – SEPTEMBER 1999 – REVISED SEPTEMBER 2000
PLASTIC FLANGE-MOUNT
0.170 (4,31)
0.180 (4,57)
0.396 (10,05)
0.406 (10,31)
0.055 (1,40)
0.066 (1,68)
0.045 (1,14)
0.055 (1,40)
0.098 (2,49)
0.108 (2,74)
0.326 (8,28)
0.336 (8,53)
0.000 (0,00)
0.010 (0,25)
0.580 (14,73)
0.620 (15,75)
0.026 (0,66)
0.036 (0,91)
0.100 (2,54)
0.010 (0,25)
0.017 (0,43)
0.023 (0,58)
0.090 (2,29)
0.110 (2,79)
0° – 8°
4200577-2/B 09/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).
REG1117, REG1117A
11
SBVS001B
www.ti.com
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Copyright 2001, Texas Instruments Incorporated
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