RL3264-9-R002-FNH [ETC]

金属薄膜电阻;
RL3264-9-R002-FNH
型号: RL3264-9-R002-FNH
厂家: ETC    ETC
描述:

金属薄膜电阻

文件: 总7页 (文件大小:82K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DOCUMENT : SR990000NH  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 1 OF 7  
2W, 2512, L Type Low Resistance Chip Resistor (Lead free / Halogen Free)  
1. Scope  
This specification applies to 3.2mm x 6.4mm size 2W, fixed metal foil current sensing resistors used  
in electronic equipment.  
2. Type Designation  
RL–3264 – 9 □□□□ –  
NH  
(4)  
(1)  
(2)  
(3)  
Where  
(1) Series No.  
(2) Resistance value :  
For example :  
Four digits of number  
R002 = 2m  
3R25m = 3.25mΩ  
(3) Tolerance :  
Refer to paragraph 4-1  
(4) NH = Sn plating ( Lead free / Halogen free)  
3. Dimensions and schematic  
L
Dimensions (mm)  
3264  
Code  
Letter  
W
L
6.35 0.25  
3.20 0.20  
W
t
(1m)  
(2m)  
2.50 0.15  
1.90 0.15  
a
a
a
t
(3.25m) 2.0 0.15  
(1m)  
(2m)  
0.70 0.15  
0.65 0.15  
(3.25m) 0.50 0.15  
Figure 1. Construction and Dimensions  
DOCUMENT : SR990000NH  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 2 OF 7  
4. Specification:  
Characteristics  
Feature  
Power Ratings*  
Resistance Value  
2W  
1~2m,3.25mΩ  
(1m)  
200ppm/℃  
100ppm/℃  
50ppm/℃  
Temperature Coefficient of Resistance  
Operation Temperature Range  
(2m)  
(3.25m)  
-55~ +170℃  
Resistance Tolerance  
Insulation Resistance  
Maximum Working Voltage (V)  
Note * :  
1%(F) , 2%(G) , 5%(J)  
Over 100MΩ  
( P*R)1/2  
Power ratings is based on continuous full load operation at rated ambient temperature of 70. For  
resistors operated at ambient temperature in excess of 70, the maximum load shall be derated in  
accordance with the following curve.  
100  
0
-55  
70  
170  
AMBIENT TEMPERATURE(  
)
Figure 2.Power Temperature Derating Curve  
DOCUMENT : SR990000NH  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 3 OF 7  
5. Reliability Performance  
Test Item  
Condition of Test  
Requirements  
Short Time Overload  
2.5 x Rated power for 5 seconds  
Refer to JIS C 5201-1 4.13  
R : (0.5%+0.0005)  
Without significant damage  
by flashover ( spark,  
arching ), burning or  
breakdown etc.  
Thermal Shock  
-55 ~1501,000 cycles, 15 min at each R(0.5% + 0.0005)  
extreme condition  
Without distinct damage in  
appearance  
Refer to JIS C 5201-1 4.19  
Low Temperature Storage  
Kept at -55, 1,000 hours  
R(0.5% + 0.0005)  
Without distinct damage in  
appearance  
Refer to JIS C 5201-1 4.23.4  
Resistance to Soldering Heat Dipped into solder at 270  
5for 20 1 seconds  
R(0.5% + 0.0005)  
Without distinct damage in  
appearance  
Refer to JIS C 5201-1 4.18  
Load Life  
Rated voltage for 1.5hours followed by a R(1.0% + 0.0005)  
pause 0.5hour at 70 3℃  
Cycle repeated 1,000 hours  
Refer to JIS C 5201-1 4.25  
Without distinct damage in  
appearance  
Damp Heat with Load  
40 2with relative humidity 90% to R(0.5% + 0.0005)  
95%. Without distinct damage in  
D.C. rated voltage for 1.5 hours ON 30 appearance  
minutes OFF.  
Cycle repeated 1,000 hours  
Refer to JIS C 5201-1 4.24  
High Temperature Exposure Kept at 170for 1,000 hours  
R(1.0% + 0.0005)  
Without distinct damage in  
appearance  
Refer to JIS C 5201-1 4.23.2  
Solderability  
Temperature of Solder : 245 5℃  
Immersion Duration : 3 0.5 second  
Refer to JIS C 5201-1 4.17  
Uniform coating of solder  
cover minimum of 95%  
surface being immersed  
DOCUMENT : SR990000NH  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 4 OF 7  
Test Item  
Condition of Test  
Requirements  
Mechanical Shock  
100 G’s for 6milliseconds. 5 pulses  
Refer to JIS C 5201-1 4.21  
R(0.5% + 0.0005)  
Without mechanical damage  
such as break  
Substrate Bending  
Glass-Epoxy board thickness : 1.6mm  
Bending width : 2mm  
R(0.5% + 0.0005)  
Without mechanical damage  
such as break  
Between the fulcrums : 90mm  
Refer to JIS C 5201-1 4.33  
DOCUMENT : SR990000NH  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 5 OF 7  
6. Recommended Solder Pad Dimensions  
L
D
W
L
D
W
3264  
4.00 8.00  
3.35  
Cu Trace  
Sensing Trace  
Note : We recommend there is no circuit design between pads to avoid circuit short  
DOCUMENT : SR990000NH  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 6 OF 7  
7. Packaging  
7-1 Dimensions  
7-1-1 Tape packaging dimensions  
+0.1  
-0.0  
1.5  
Feed forward hole  
0.3 max.  
4.0 0.1  
2.0 0.05  
1.75 0.10  
1.5 0.1  
5.50 0.05  
12.0 0.3  
B
Cavity  
1.5 max.  
A
4.0 0.1  
Pulling direction  
Unit : mm  
A = 3.40 0.20  
B = 6.70 0.20  
7-1-2 Reel dimensions  
2.0 0.5  
0
13.0 0.5  
0
.
4
178.0 2.0  
60.2 0.5  
13.2 1.5  
16.0 0.2  
Unit : mm  
DOCUMENT : SR990000NH  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 7 OF 7  
7-2 Peel Strength of Top Cover Tape  
The peel speed shall be about 300mm/min.  
The peel force of top cover tape shall between 0.1 to 0.7N  
Top Cover Tape  
0.1N~0.7N  
165~180  
7-3 Number of Taping  
2,000 pieces / reel  
7-4 Label marking  
The following items shall be marked on the reel.  
(1) Type designation  
(2) Quantity  
(3) Manufacturing date code  
(4) Manufacturer’s name  
(5) The country of origin  

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