RXM-900-HP3-PPO [ETC]

HP3 SERIES RECEIVER MODULE DATA; HP3系列接收器模块数据
RXM-900-HP3-PPO
型号: RXM-900-HP3-PPO
厂家: ETC    ETC
描述:

HP3 SERIES RECEIVER MODULE DATA
HP3系列接收器模块数据

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HIGH-PERFORMANCE  
RF MODULE  
RXM-900-HP3-xxx  
WIRELESS MADE SIMPLE ®  
HP3 SERIES RECEIVER MODULE DATA GUIDE  
DESCRIPTION  
1.940"  
The HP3 RF receiver module offers complete  
compatibility and numerous enhancements  
over previous generations. The HP3 is  
HP SERIES RF RECEIVER  
0.780"  
RXM-900-HP3-SP*  
LOT 10000  
designed for the cost-effective, high-  
Pin Spacing: 0.1"  
performance wireless transfer of analog or  
0.236"  
digital information in the popular 902-928MHz  
SIP Style  
band. All HP3 Series modules feature eight  
1.950"  
parallel selectable channels, but versions are  
also available which add serial selection of 100  
channels. To ensure reliable performance, the  
HP SERIES RF RECEIVER  
0.750"  
RXM-900-HP3-SP*  
LOT 10000  
receiver employs FM / FSK demodulation and  
0.190"  
an advanced dual-conversion microprocessor-  
controlled synthesized architecture. The  
receiver is pin- and footprint-compatible with all  
SMD Style  
Figure 1: Package Dimensions  
previous generations, but its overall physical size has been reduced. Both SMD and  
pinned packages are available. When paired with an HP3 transmitter, a reliable link  
is created for transferring analog and digital information up to 1,000 feet. (under  
optimal conditions). As with all Linx modules, the HP3 requires no tuning or additional  
RF components (except an antenna), making integration straightforward even for  
engineers without prior RF experience.  
FEATURES  
APPLICATIONS INCLUDE  
„ Wireless Networks / Data Transfer  
„ Wireless Analog / Audio  
„ Home / Industrial Automation  
„ Remote Access / Control  
„ Remote Monitoring / Telemetry  
„ Long-Range RFID  
„ 8 parallel / 100 serial (PS Versions)  
user-selectable channels  
„ FM / FSK demodulation for outstanding  
performance and noise immunity  
„ Exceptional sensitivity (-100dBm typical)  
„ Wide-range analog capability including  
audio (50Hz to 28kHz)  
„ RSSI and Power-down lines  
„ Precision frequency  
„ MIDI Links  
„ Voice / Music / Intercom Links  
ORDERING INFORMATION  
synthesized architecture  
„ No external RF  
PART #  
DESCRIPTION  
components required  
„ Compatible with previous  
HP Series modules  
RXM-900-HP3-PPO  
HP3 Receiver (SIP 8 CH only)  
RXM-900-HP3-PPS  
HP3 Receiver (SIP 8p / 100s CH)  
HP3 Receiver (SMD 8 CH only)  
HP3 Receiver (SMD 8p / 100s CH)  
HP3 Development Kit (Pinned Pkg.)  
HP3 Development Kit (Pinned Pkg.)  
HP3 Development Kit (SMD Pkg.)  
HP3 Development Kit (SMD Pkg.)  
RXM-900-HP3-SPO  
„ High data rate  
RXM-900-HP3-SPS  
(up to 56kbps)  
„ Wide supply range  
(2.8 to 13.0VDC)  
„ Direct serial interface  
„ Pinned and SMD packages  
„ Wide temperature range  
(-30°C to +85°C)  
MDEV-900-HP3-PPS-USB  
MDEV-900-HP3-PPS-RS232  
MDEV-900-HP3-SPS-USB  
MDEV-900-HP3-SPS-RS232  
Receivers are supplied in tubes of 10 pcs.  
Revised 1/28/08  
ELECTRICAL SPECIFICATIONS  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Designation  
Min.  
Typical  
Max.  
Units  
Notes  
Supply Voltage VCC  
-0.3  
to  
to  
to  
to  
+18.0  
VCC  
+85  
VDC  
VDC  
°C  
POWER SUPPLY  
Operating Voltage  
Supply Current  
Any Input or Output Pin  
Operating Temperature  
Storage Temperature  
Soldering Temperature  
-0.3  
-30  
-45  
VCC  
ICC  
2.8  
16.0  
3.0  
19.0  
5.6  
13.0  
21.0  
10.0  
VDC  
mA  
µA  
1
2
+85  
°C  
+260°C for 10 seconds  
Power-Down Current  
RECEIVE SECTION  
Receive Frequency Range  
Center Frequency Accuracy  
Channel Spacing  
First IF Frequency  
Second IF Frequency  
Noise Bandwidth  
Data Rate  
IPDN  
*NOTE* Exceeding any of the limits of this section may lead to permanent  
damage to the device. Furthermore, extended operation at these maximum  
ratings may reduce the life of this device.  
FC  
902.62  
-50  
927.62  
MHz  
kHz  
kHz  
MHz  
MHz  
kHz  
bps  
3
+50  
250  
34.7  
10.7  
280  
3
4
4
4
5
PERFORMANCE DATA  
N3DB  
These performance parameters  
are based on module operation at  
25°C from a 3.0VDC supply unless  
ANT  
GND  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
100  
50  
0.8  
56,000  
28,000  
2.0  
Analog / Audio Bandwidth  
Analog / Audio Output Level  
Data Output:  
Hz  
GND  
GND  
GND  
GND  
1.1  
VAC  
otherwise  
illustrates  
necessary  
noted.  
the  
for  
Figure  
connections  
testing and  
2
GND  
GND  
NC  
CS0  
Logic Low  
0.0  
0.5  
VCC  
VDC  
VDC  
6
6
Logic High  
VCC-0.3  
PC  
PC  
PC  
operation. It is recommended all  
ground pins be connected to the  
ground plane. The pins marked NC  
have no electrical connection.  
CS1 / SS CLOCK  
CS2 / SS DATA  
PDN  
Output Impedance  
Data Output Source Current  
Receiver Sensitivity  
RSSI:  
17  
kohms  
230  
-100  
µA  
7
5VDC  
PC  
RSSI  
MODE  
VCC  
-94  
-107  
dBm  
8,9  
AUDIO  
DATA  
Dynamic Range  
60  
70  
24  
80  
dB  
mV/dB  
V
4
4
4
4
Figure 2: Test / Basic Application Circuit  
Gain  
Voltage With No Carrier  
Spurious Emissions  
Interference Rejection:  
1.6  
TYPICAL PERFORMANCE GRAPHS  
-57  
dBm  
F
F
1MHz  
5MHz  
54  
57  
dB  
dB  
4
4
3.0  
C
PDN  
C
2.5  
ANTENNA PORT  
RF Input Impedance  
TIMING  
ROUT  
50  
Ω
4
2.0  
1
RX DATA  
Receiver Turn-On Time:  
via VCC  
1.5  
T4  
T3  
T2  
7.0  
3.0  
1.5  
20  
mSec  
mSec  
mSec  
mSec  
4
4
4
4
2
1.0  
-110  
via PDN  
-100  
-90  
-80  
-70  
-60  
-50  
-40  
RF INPUT (dBm)  
Channel Change Time  
Max time between transitions  
ENVIRONMENTAL  
Operating Temperature Range  
CH1 1.00V  
CH2 2.00V  
500uS  
Delta 1.920mS  
T
1
Figure 3: RX Enabled to Valid Data  
Figure 4: Receiver RSSI  
10-6  
-30  
+85  
°C  
4
Table 1: HP3 Series Receiver Specifications  
10-5  
Notes  
BER  
10-4  
1. Over the entire operating voltage range.  
2. With the PDN pin low.  
3. Serial mode.  
4. Characterized, but not tested.  
5. With 1kHz sine wave @ 115kHz transmitter deviation  
6. No load.  
7. With 1V output drop.  
8. For 10-5 @ 9,600bps.  
10-3  
-92 -93 -94 -95 -96 -97 -98 -99 -100 -101 -102  
1
PIN (dBm)  
CH1 500mV  
1mS  
Delta 4.080mS  
Figure 5: Worst Case RSSI Response Time  
Figure 6: BER vs. Input Power (typical)  
Page 3  
9. At specified center frequency.  
Page 2  
PIN ASSIGNMENTS  
PIN DESCRIPTIONS  
Pinned Receiver  
Surface-Mount Receiver  
Pin #  
Name  
Equivalent Circuit  
Description  
RF In  
1
2
3
4
5
6
7
8
9
ANT  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
NC  
NC 36  
NC 35  
NC 34  
NC 33  
NC 32  
NC 31  
NC 30  
NC 29  
NC 28  
NC 27  
NC 26  
NC 25  
NC 24  
NC 23  
1
ANT  
50-ohm RF Input  
50Ω  
2-8  
GND  
NC  
Analog Ground  
No Connection  
9
10 CS0  
25k  
10  
11  
12  
CS0  
Channel Select 0  
11 CS1 / SS CLOCK  
12 CS2 / SS DATA  
13 PDN  
µ
CS0  
CS1  
CS2  
14 RSSI  
Channel Select 1 /  
Serial Select Clock  
CS1 /  
SS CLOCK  
25k  
15 MODE  
NC  
NC  
NC  
NC  
22  
21  
20  
19  
µ
16 VCC  
17 AUDIO  
18 DATA  
Channel Select 2 /  
Serial Select Data  
CS2 /  
SS DATA  
25k  
µ
Figure 7: HP3 Series Receiver Pinout  
VCC  
470k  
Pin # Name  
Description  
Power Down  
(Active Low)  
13  
14  
PDN  
PDN  
1
2-8  
9
ANT  
GND  
NC  
50-ohm RF Input  
Analog Ground  
No Connection  
Channel Select 0  
RSSI  
10  
CS0  
Received Signal  
Strength Indicator  
RSSI  
Channel Select 1 / Serial Select Clock. Channel Select 1  
when in parallel channel selection mode, clock input for  
serial channel selection mode.  
CS1 / SS  
CLOCK  
11  
12  
13  
14  
15  
Channel Select 1 / Serial Select Data. Channel Select 2  
when in parallel channel selection mode, data input for  
serial channel selection mode.  
Power Down. Pulling this line low will place the receiver  
into a low-current state. The module will not be able to  
receive a signal in this state.  
Received Signal Strength Indicator. This line will supply an  
analog voltage that is proportional to the strength of the  
received signal.  
CS2 / SS  
DATA  
25k  
15  
16  
MODE  
VCC  
Mode Select  
µ
VCC  
Voltage Input 2.8-13V  
PDN  
RSSI  
1VP-P Analog Output  
17  
AUDIO  
Mode Select. GND for parallel channel selection, VCC for  
serial channel selection  
MODE  
4.7k  
18  
DATA  
NC  
Digital Data Output  
No Connection  
VCC  
16  
17  
Supply Voltage  
AUDIO  
Recovered Analog Output  
19-36  
SMD Only  
Digital Data Output. This line will output the demodulated  
digital data.  
18  
DATA  
NC  
Figure 8: Pin Functions and Equivalent Circuits  
19-36  
No Connection (SMD only)  
Page 4  
Page 5  
THEORY OF OPERATION  
POWER-UP SEQUENCE  
The HP3 is a high-performance multi-channel, dual-conversion superhet  
receiver capable of recovering both analog (FM) and digital (FSK) information  
from a matching HP Series transmitter. FM / FSK modulation offers significant  
advantages over AM or OOK modulation methods, including increased noise  
immunity and the receiver’s ability to capture in the presence of multiple signals.  
This is especially helpful in crowded bands, like that in which the HP3 operates.  
As previously mentioned, the HP3 is controlled  
by an on-board microprocessor. When power  
is applied, the microprocessor executes the  
receiver start-up sequence, after which the  
receiver is ready to receive valid data.  
POWER ON  
Squelch Data  
Output Pin  
Parallel Mode  
Serial Mode  
Determine Mode  
Read Channel  
Selection Inputs  
Program Freq. Synth  
To Default CH. 50  
The adjacent figure shows the start-up  
sequence. This sequence is executed when  
power is applied to the VCC line or when the  
MODE  
CS0  
Program Frequency  
Synthesizer  
Crystal Oscillator  
Begins to Operate  
24MHz  
Crystal  
PLL  
Channel  
Select  
4MHz  
Int. Osc.  
RSSI  
CS1  
CS2  
PDN line is taken high.  
{
10.7MHz  
Crystal Oscillator  
Begins to Work  
Ready for  
Serial Data Input  
BPF  
On power-up, the microprocessor reads the  
external channel selection lines and sets the  
frequency synthesizer to the appropriate  
channel. Once the frequency synthesizer has  
stabilized, the receiver is ready to accept data.  
Digital  
Data  
VCO  
Quad  
Determine Squelch  
State Data Output Pin  
Determine Squelch  
State Data Output Pin  
Analog  
Data  
IF  
Amp  
34.7M  
BPF  
SAW BPF  
Cycle Here Until More  
Data Input  
or Mode Change  
Cycle Here Until  
Channel  
or Mode Change  
LNA  
10.7M  
BPF  
10.7M  
Discriminator  
Limiter  
Figure 10: Start-Up Sequence  
Figure 9: HP3 Series Receiver Block Diagram  
POWER SUPPLY  
The single-ended RF port is matched to 50-ohms to support commonly available  
antennas, such as those manufactured by Linx. The RF signal coming in from  
the antenna is filtered by a Surface Acoustic Wave (SAW) filter to attenuate  
unwanted RF energy. A SAW filter provides significantly higher performance  
than other filter types, such as an LC bandpass filter.  
The HP3 incorporates a precision, low-dropout  
regulator on-board, which allows operation over an  
input voltage range of 2.8 to 13 volts DC. Despite this  
regulator, it is still important to provide a supply that  
is free of noise. Power supply noise can significantly  
affect the receiver sensitivity; therefore, providing a  
clean power supply for the module should be a high  
priority during design.  
Vcc TO  
MODULE  
10Ω  
Vcc IN  
+
10μF  
Once filtered, the signal is amplified by a Low Noise Amplifier (LNA) to increase  
the receiver sensitivity and lower the overall noise figure of the receiver. After the  
LNA, the signal is mixed with a synthesized local oscillator operating 34.7MHz  
below the incoming transmission frequency to produce the first Intermediate  
Frequency (IF).  
Figure 11: Supply Filter  
A 10Ω resistor in series with the supply followed by a  
10µF tantalum capacitor from VCC to ground will help in cases where the quality  
The second conversion and FM demodulation is achieved by a high-  
performance IF strip that mixes the 34.7MHz first conversion frequency with  
24.0MHz from a precision crystal oscillator. The resulting second IF of 10.7MHz  
is then highly amplified in preparation for demodulation.  
of supply power is poor. This filter should be placed close to the module’s supply  
lines. These values may need to be adjusted depending on the noise present on  
the supply line.  
USING THE PDN PIN  
A quadrature demodulator is used to recover the baseband signal from the  
carrier. The demodulated waveform is filtered, after which it closely resembles  
the original signal. The signal is routed to the analog output pin and the data  
slicer stage, which provides squared digital output via the data output pin. A key  
feature of the HP3 is the transparency of its digital output, which does not impose  
balancing or duty-cycle requirements within a range of 100bps to 56kbps.  
The Power Down (PDN) line can be used to power down the receiver without the  
need for an external switch. This line has an internal pull-up, so when it is held  
high or simply left floating, the module will be active.  
When the PDN line is pulled to ground, the receiver will enter into a low-current  
(<10µA) power-down mode. During this time the receiver is off and cannot  
perform any function. It may be useful to note that the startup time coming out  
An on-board microcontroller manages receiver functions and greatly simplifies  
user interface. The microcontroller reads the channel selection lines and  
programs the on-board synthesizer. This frees the designer from complex  
programming requirements and allows for manual or software channel selection.  
The microcontroller also monitors incoming signal strength and squelches the  
data output when the signal is not strong enough for accurate data detection.  
of power-down will be slightly less than when applying VCC  
.
The PDN line allows easy control of the receiver state from external  
components, like a microcontroller. By periodically activating the receiver,  
checking for data, then powering down, the receiver’s average current  
consumption can be greatly reduced, saving power in battery-operated  
applications.  
Page 6  
Page 7  
THE DATA OUTPUT  
TIMING CONSIDERATIONS  
The DATA line outputs recovered digital data. It is an open collector output with  
an internal 4.7kΩ pull-up. When an RF transmission is not present, or when the  
received signal strength is too low to ensure proper demodulation, the data  
output is squelched continuous high. This feature supports direct operation with  
UARTs, which require their input to be continuously high. An HP3 transmitter and  
receiver can be directly connected between two UARTs without the need for  
buffering or logical inversion. It should be noted that the squelch level is set just  
over the receiver’s internal noise threshold. Any external RF activity above that  
threshold will “break squelch” and produce hashing on the line. While the DATA  
line will be reliably squelched in low-noise environments, the designer should  
always plan for the potential of hashing.  
There are four major timing considerations to be aware of when designing with  
the HP3 Series receiver. These are shown in the table below.  
Parameter  
Description  
Max.  
20.0mS  
1.5mS  
3.0mS  
7.0mS  
T1  
T2  
T3  
T4  
Time between DATA output transitions  
Channel change time (time to valid data)  
Receiver turn-on time via PDN  
Receiver turn-on time via VCC  
T1 is the maximum amount of time that can elapse without a data transition. Data  
must always be considered in both the analog and the digital domain. Because  
the data stream is asynchronous and no particular format is imposed, it is  
possible for the data to meet the receiver’s data rate requirement yet violate the  
analog frequency requirements. For example, if a 255 (0FF hex) were sent  
continuously, the receiver would view the data as a DC level. It would hold that  
level until a transition was required to meet the minimum frequency specification.  
If no transition occurred, data integrity could not be guaranteed. While no  
particular structure or balancing requirement is imposed, the designer must  
ensure that both analog and digital signals meet the transition specification.  
AUDIO OUTPUT  
The HP3 Series is optimized for the transmission of serial data; however, it can  
also be used very effectively to send a variety of analog signals, including audio.  
The ability of the HP3 to send combinations of audio and data opens new areas  
of opportunity for creative design.  
The analog output of the AUDIO line is valid from 50 Hz to 28 kHz, providing an  
AC signal of about 1V peak-to-peak. This is a high impedance output and not  
suitable for directly driving low-impedance loads, such as a speaker. In  
applications where a low impedance load is to be driven, a buffer circuit should  
always be used. For example, in the case of a speaker, a simple op-amp circuit  
such as the one shown below can be used to act as an impedance converter.  
T2 is the worst-case time needed for a powered-up module to switch between  
channels after a valid channel selection. This time does not include external  
overhead for loading a desired channel in the serial channel-selection mode.  
T3 is the time to receiver readiness from the PDN line going high. Receiver  
readiness is determined by valid data on the DATA line. This assumes an  
incoming data stream and the presence of stable supply on VCC  
.
VCC  
T4 is the time to receiver readiness from the application of VCC. Receiver  
readiness is determined by valid data on the DATA line. This assumes an  
incoming data stream and the PDN line is high or open.  
1uF  
10k  
6
4
2
3
HP Analog Out  
+
250uF  
RECEIVING DATA  
5
Once an RF link has been established, the challenge becomes how to effectively  
transfer data across it. While a properly designed RF link provides reliable data  
transfer under most conditions, there are still distinct differences from a wired link  
that must be addressed. Since the modules do not incorporate internal encoding  
or decoding, the user has tremendous flexibility in how data is handled.  
0.05uF  
10 ohm  
LM386  
Figure 12: Audio Buffer Amplifier  
It is important to separate the types of transmissions that are technically possible  
from those that are legally allowed in the country of operation. Application Notes  
AN-00126, AN-00140 and Part 15, Section 249 of the FCC rules should be  
reviewed for details on acceptable transmission content in the U.S.  
The transmitter’s modulation voltage is critical, since it determines the carrier  
deviation and distortion. The transmitter input level should be adjusted to  
achieve the optimum results for your application in your circuit. Please refer to  
the transmitter data guide for full details.  
If you want to transfer simple control or status signals (such as button presses)  
and your product does not have a microprocessor or you wish to avoid protocol  
development, consider using an encoder / decoder IC set. These chips are  
available from several manufacturers, including Linx. They take care of all  
encoding and decoding functions and provide a number of data lines to which  
switches can be directly connected. Address bits are usually provided for  
security and to allow the addressing of multiple receivers independently. These  
ICs are an excellent way to bring basic remote control products to market quickly  
and inexpensively. It is also a simple task to interface with inexpensive  
microprocessors or one of many IR, remote control, DTMF, or modem ICs.  
When used for audio, the analog output of the receiver should be filtered and  
buffered to obtain maximum sound quality. For voice, a 3-4kHz low-pass filter is  
often employed. For broader-range sources, such as music, a 12-17kHz cutoff  
may be more appropriate. In applications that require high-quality audio, a  
compandor may be used to further improve SNR. The HP3 is capable of  
providing audio quality comparable to a radio or intercom. For applications where  
true high fidelity audio is required, the HP3 will probably not be the best choice,  
and a device optimized for audio should be utilized.  
Page 8  
Page 9  
CHANNEL SELECTION  
Parallel Selection  
SERIAL CHANNEL SELECTION TABLE  
CHANNEL TX FREQUENCY  
RX LO  
867.92  
868.17  
868.42  
868.67  
868.92  
869.17  
869.42  
869.67  
869.92  
870.17  
870.42  
870.67  
870.92  
871.17  
871.42  
871.67  
871.92  
872.17  
872.42  
872.67  
872.92  
873.17  
873.42  
873.67  
873.92  
874.17  
874.42  
874.67  
874.92  
875.17  
875.42  
875.67  
875.92  
876.17  
876.42  
876.67  
876.92  
877.17  
877.42  
877.67  
877.92  
878.17  
878.42  
878.67  
878.92  
879.17  
879.42  
879.67  
879.92  
880.17  
880.42  
CHANNEL  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
92  
93  
94  
95  
96  
97  
98  
99  
100  
TX FREQUENCY  
915.37  
915.62  
915.87  
916.12  
916.37  
916.62  
916.87  
917.12  
917.37  
917.62  
917.87  
918.12  
918.37  
918.62  
918.87  
919.12  
919.37  
919.62  
919.87  
920.12  
920.37  
920.62  
920.87  
921.12  
921.37  
921.62  
921.87  
922.12  
922.37  
922.62  
922.87  
923.12  
923.37  
923.62  
923.87  
924.12  
924.37  
924.62  
924.87  
925.12  
925.37  
925.62  
925.87  
926.12  
926.37  
926.62  
926.87  
927.12  
927.37  
927.62  
RX LO  
880.67  
880.92  
881.17  
881.42  
881.67  
881.92  
882.17  
882.42  
882.67  
882.92  
883.17  
883.42  
883.67  
883.92  
884.17  
884.42  
884.67  
884.92  
885.17  
885.42  
885.67  
885.92  
886.17  
886.42  
886.67  
886.92  
887.17  
887.42  
887.67  
887.92  
888.17  
888.42  
888.67  
888.92  
889.17  
889.42  
889.67  
889.92  
890.17  
890.42  
890.67  
890.92  
891.17  
891.42  
891.67  
891.92  
892.17  
892.42  
892.67  
892.92  
CS2  
0
0
0
0
1
1
1
1
CS1  
0
0
1
1
0
0
1
1
CS0  
0
1
0
1
0
1
0
1
Channel  
Frequency  
903.37  
906.37  
907.87  
909.37  
912.37  
915.37  
919.87  
921.37  
0
1
2
3
4
5
6
7
902.62  
902.87  
903.12  
903.37  
903.62  
903.87  
904.12  
904.37  
904.62  
904.87  
905.12  
905.37  
905.62  
905.87  
906.12  
906.37  
906.62  
906.87  
907.12  
907.37  
907.62  
907.87  
908.12  
908.37  
908.62  
908.87  
909.12  
909.37  
909.62  
909.87  
910.12  
910.37  
910.62  
910.87  
911.12  
911.37  
911.62  
911.87  
912.12  
912.37  
912.62  
912.87  
913.12  
913.37  
913.62  
913.87  
914.12  
914.37  
914.62  
914.87  
915.12  
0
1
2
3
4
5
6
7
All HP3 receiver models feature eight  
parallel selectable channels. Parallel  
Mode is selected by grounding the  
MODE line. In this mode, channel  
selection is determined by the logic  
states of pins CS0, CS1, and CS2, as  
shown in the adjacent table. A ‘0’  
represents ground and a ‘1’ the positive supply. The on-board microprocessor  
performs all PLL loading functions, eliminating external programming and  
allowing channel selection via DIP switches or a product’s processor.  
Table 2: Parallel Channel Selection Table  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50*  
Serial Selection  
In addition to the Parallel Mode, PS versions of the HP3 also feature 100 serially  
selectable channels. The Serial Mode is entered when the MODE line is left open  
or held high. In this condition, CS1 and CS2 become a synchronous serial port,  
with CS1 serving as the clock line and CS2 as the data line. The module is easily  
programmed by sending and latching the binary number (0 to 100) of the desired  
channel (see the adjacent Serial Channel Selection Table). With no additional  
effort, the module’s microprocessor handles the complex PLL loading functions.  
The Serial Mode is  
straightforward; however,  
minimum timings and bit  
order must be followed.  
Loading is initiated by  
taking the clock line high  
and the data line low as  
Variable Data  
Note 2  
Note 1  
Data  
1
2
3
4
5
6
7
8
Clock  
T0  
1ms  
T3  
Note 3  
T4  
5µs  
8µs  
T2  
T1  
25µs  
5µs  
shown.  
The  
eight-bit  
1) Loading begins when clock line is high and data line is taken low  
2) Ensure that edge is fully risen prior to high-clock transition  
3) Both lines high triggers automatic latch  
channel number is then  
clocked-in one bit at a  
time, with the LSB first.  
(T0) Time between packets or prior to data startup ................................1mS min.  
(T1) Data-LO / Clock-HI to Data-LO / Clock-LO.......................................25  
(T2) Clock-LO to Clock-HI ...........................................................................5  
(T3) Clock-HI to Clock-LO ...........................................................................8  
(T4) Data-HI / Clock-HI .................................................................................5  
Total Packet Time ......................................................................................157  
µ
µ
µ
µ
µ
S min.  
S min.  
S min.  
S min.  
S min.  
Figure 13: PLL Serial Data Timing  
There is no maximum time for this process, only the minimum times that must be  
observed. After the eighth bit, both the clock and data lines should be taken high  
to trigger the automatic data latch. A typical software routine can complete the  
loading sequence in under 200uS. Sample code is available on the Linx website.  
NOTE: When the module is powered up in the Serial Mode, it will default to channel 50 until changed  
by user software. This allows testing apart from external programming and prevents out-of-band  
operation. When programmed properly, the dwell time on this default channel can be less than 200uS.  
Channel 50 is not counted as a usable channel since data errors may occur as transmitters also default  
to channel 50 on startup. If a loading error occurs, such as a channel number >100 or a timing problem,  
the receiver will default to serial channel 0. This is useful for debugging as it verifies serial port activity.  
= Also available in Parallel Mode  
*See NOTE on previous page.  
Page 10  
Page 11  
PROTOCOL GUIDELINES  
TYPICAL APPLICATIONS  
While many RF solutions impose data formatting and balancing requirements,  
Linx RF modules do not encode or packetize the signal content in any manner.  
The received signal will be affected by such factors as noise, edge jitter, and  
interference, but it is not purposefully manipulated or altered by the modules.  
This gives the designer tremendous flexibility for protocol design and interface.  
The figure below shows a typical RS-232 circuit using the HP3 Series receiver  
and a Maxim MAX232. The receiver outputs a serial data stream and the  
MAX232 converts that to RS-232 compliant signals. The MODE line is grounded  
so the channels are selected by the DIP switches.  
VCC  
Despite this transparency and ease of use, it must be recognized that there are  
distinct differences between a wired and a wireless environment. Issues such as  
interference and contention must be understood and allowed for in the design  
process. To learn more about protocol considerations, we suggest you read Linx  
Application Note AN-00160.  
VCC  
1
2
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
ANT  
GND  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
C1  
4.7uF  
+
C2  
4.7uF  
3
GND  
4
GND  
GND  
GND  
DB-9  
5
6
1
6
2
7
3
+
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
GND  
C3  
4.7uF  
C1+  
V+  
C1-  
C2+  
C2-  
V-  
VCC  
GND  
T1OUT  
R1IN  
R1OUT  
T1IN  
T2IN  
GND  
7
GND  
GND  
NC  
CS0  
8
9
Errors from interference or changing signal conditions can cause corruption of  
the data packet, so it is generally wise to structure the data being sent into small  
packets. This allows errors to be managed without affecting large amounts of  
data. A simple checksum or CRC could be used for basic error detection. Once  
an error is detected, the protocol designer may wish to simply discard the corrupt  
data or implement a more sophisticated scheme to correct it.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
+
4
9
5
C4  
4.7uF  
CS1 / SS CLOCK  
CS2 / SS DATA  
PDN  
T2OUT  
R2IN  
R2OUT  
RSSI  
MAX232  
VCC  
GND  
MODE  
VCC  
C5  
4.7uF  
GND  
AUDIO  
DATA  
GND  
INTERFERENCE CONSIDERATIONS  
Figure 14: HP3 Receiver and MAX232 IC  
The RF spectrum is crowded and the potential for conflict with other unwanted  
sources of RF is very real. While all RF products are at risk from interference, its  
effects can be minimized by better understanding its characteristics.  
The figure below shows a circuit using the QS Series USB module. The QS  
converts the data from the receiver into USB compliant signals to be sent to a  
PC. The MODE line is high, so the module is in Serial Channel Select mode. The  
RTS and DTR lines are used to load the channels. Application Note AN-00155  
shows sample source code that can be adapted to use on a PC. The QS Series  
Data Guide and Application Note AN-00200 discuss the hardware and software  
set-up required for QS Series modules.  
Interference may come from internal or external sources. The first step is to  
eliminate interference from noise sources on the board. This means paying  
careful attention to layout, grounding, filtering, and bypassing in order to  
eliminate all radiated and conducted interference paths. For many products, this  
is straightforward; however, products containing components such as switching  
power supplies, motors, crystals, and other potential sources of noise must be  
approached with care. Comparing your own design with a Linx evaluation board  
can help to determine if and at what level design-specific interference is present.  
1
2
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
ANT  
GND  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
3
GND  
4
GND  
GND  
GND  
USB-B  
5
6
External interference can manifest itself in a variety of ways. Low-level  
interference will produce noise and hashing on the output and reduce the link’s  
overall range.  
4
3
2
1
GND  
GND  
GND  
1
2
3
4
5
6
7
8
16  
15  
USBDP  
USBDM  
GND  
RI  
DCD  
GND  
7
GND  
GND  
NC  
CS0  
DAT -  
5V  
8
9
DSR  
13  
12  
11  
10  
9
VCC  
DATA_IN  
10  
11  
12  
13  
14  
SUSP_IND DATA_OUT  
GND GND  
High-level interference is caused by nearby products sharing the same  
frequency or from near-band high-power devices. It can even come from your  
own products if more than one transmitter is active in the same area. It is  
important to remember that only one transmitter at a time can occupy a  
frequency, regardless of the coding of the transmitted signal. This type of  
interference is less common than those mentioned previously, but in severe  
cases it can prevent all useful function of the affected device.  
RX_IND  
TX_IND  
485_TX  
RTS  
CTS  
DTR  
CS1 / SS CLOCK  
CS2 / SS DATA  
PDN  
VCC  
RSSI  
SDM-USB-QS  
MODE  
VCC  
16  
17  
18  
AUDIO  
DATA  
Figure 15: HP3 Receiver and Linx QS Series USB Module  
The receiver can also be connected to a microcontroller, which will interpret the  
data and take specific actions. A UART may be employed or an I / O line may be  
used to continuously monitor the DATA line for a valid packet. The receiver may  
be connected directly to the microcontroller without the need for buffering or  
amplification.  
Although technically it is not interference, multipath is also a factor to be  
understood. Multipath is a term used to refer to the signal cancellation effects  
that occur when RF waves arrive at the receiver in different phase relationships.  
This effect is a particularly significant factor in interior environments where  
objects provide many different signal reflection paths. Multipath cancellation  
results in lowered signal levels at the receiver and, thus, shorter useful distances  
for the link.  
Page 12  
Page 13  
BOARD LAYOUT GUIDELINES  
MICROSTRIP DETAILS  
If you are at all familiar with RF devices, you may be concerned about  
specialized board layout requirements. Fortunately, because of the care taken by  
Linx in designing the modules, integrating them is very straightforward. Despite  
this ease of application, it is still necessary to maintain respect for the RF stage  
and exercise appropriate care in layout and application in order to maximize  
performance and ensure reliable operation. The antenna can also be influenced  
by layout choices. Please review this data guide in its entirety prior to beginning  
your design. By adhering to good layout principles and observing some basic  
design rules, you will be on the path to RF success.  
A transmission line is a medium whereby RF energy is transferred from one  
place to another with minimal loss. This is a critical factor, especially in high-  
frequency products like Linx RF modules, because the trace leading to the  
module’s antenna can effectively contribute to the length of the antenna,  
changing its resonant bandwidth. In order to minimize loss and detuning, some  
form of transmission line between the antenna and the module should be used,  
unless the antenna can be placed very close (<1/8in.) to the module. One  
common form of transmission line is a coax cable, another is the microstrip. This  
term refers to a PCB trace running over a ground plane that is designed to serve  
as a transmission line between the module and the antenna. The width is based  
on the desired characteristic impedance of the line, the thickness of the PCB,  
and the dielectric constant of the board material. For standard 0.062in thick FR-  
4 board material, the trace width would be 111 mils. The correct trace width can  
be calculated for other widths and materials using the information below. Handy  
software for calculating microstrip lines is also available on the Linx website,  
www.linxtechnologies.com.  
The adjacent figure shows the suggested  
GROUUNNDD PPLLAANNEE  
PCB footprint for the module. The actual pad  
dimensions are shown in the Pad Layout  
section of this manual. A ground plane (as  
large as possible) should be placed on a  
lower layer of your PC board opposite the  
module. This ground plane can also be critical  
to the performance of your antenna, which will  
be discussed later. There should not be any  
ground or traces under the module on the  
same layer as the module, just bare PCB.  
ON LLOWWEERR LLAAYYEERR  
Trace  
Figure 16: Suggested PCB Layout  
Board  
During prototyping, the module should be soldered to a properly laid-out circuit  
board. The use of prototyping or “perf” boards will result in horrible performance  
and is strongly discouraged.  
Ground plane  
No conductive items should be placed within 0.15in of the module’s top or sides.  
Do not route PCB traces directly under the module. The underside of the module  
has numerous signal-bearing traces and vias that could short or couple to traces  
on the product’s circuit board.  
The module’s ground lines should each have their own via to the ground plane  
and be as short as possible.  
AM / OOK receivers are particularly subject to noise. The module should, as  
much as reasonably possible, be isolated from other components on your PCB,  
especially high-frequency circuitry such as crystal oscillators, switching power  
supplies, and high-speed bus lines. Make sure internal wiring is routed away  
from the module and antenna, and is secured to prevent displacement.  
The power supply filter should be placed close to the module’s VCC line.  
In some instances, a designer may wish to encapsulate or “pot” the product.  
Many Linx customers have done this successfully; however, there are a wide  
variety of potting compounds with varying dielectric properties. Since such  
compounds can considerably impact RF performance, it is the responsibility of  
the designer to carefully evaluate and qualify the impact and suitability of such  
materials.  
Figure 17: Microstrip Formulas  
Effective Dielectric  
Constant  
Characteristic  
Impedance  
Dielectric Constant Width/Height (W/d)  
The trace from the module to the antenna should be kept as short as possible.  
A simple trace is suitable for runs up to 1/8-inch for antennas with wide  
bandwidth characteristics. For longer runs or to avoid detuning narrow bandwidth  
antennas, such as a helical, use a 50-ohm coax or 50-ohm microstrip  
transmission line as described in the following section.  
4.80  
4.00  
2.55  
1.8  
2.0  
3.0  
3.59  
3.07  
2.12  
50.0  
51.0  
48.0  
Page 14  
Page 15  
PAD LAYOUT  
AUTOMATED ASSEMBLY  
The following pad layout diagram is designed to facilitate both hand and  
automated assembly.  
For high-volume assembly, most users will want to auto-place the modules. The  
modules have been designed to maintain compatibility with reflow processing  
techniques; however, due to the their hybrid nature, certain aspects of the  
assembly process are far more critical than for other component types.  
Pinned Receiver  
Surface-Mount Receiver  
0.065  
Following are brief discussions of the three primary areas where caution must be  
observed.  
0.090  
0.060  
0.100  
Reflow Temperature Profile  
0.060  
0.750  
The single most critical stage in the automated assembly process is the reflow  
stage. The reflow profile below should not be exceeded, since excessive  
temperatures or transport times during reflow will irreparably damage the  
modules. Assembly personnel will need to pay careful attention to the oven’s  
profile to ensure that it meets the requirements necessary to successfully reflow  
all components while still remaining within the limits mandated by the modules.  
The figure below shows the recommended reflow oven profile for the modules.  
0.030 Dia. Finished  
0.100  
Figure 18: Recommended PCB Layout  
PRODUCTION GUIDELINES  
300  
Recommended RoHS Profile  
Max RoHS Profile  
Recommended Non-RoHS Profile  
The modules are housed in a hybrid SMD package that supports hand or  
automated assembly techniques. Since the modules contain discrete  
components internally, the assembly procedures are critical to ensuring the  
reliable function of the modules. The following procedures should be reviewed  
with and practiced by all assembly personnel.  
255°C  
250  
200  
150  
100  
50  
235°C  
217°C  
185°C  
180°C  
HAND ASSEMBLY  
Pads located on the bottom of the  
module are the primary mounting  
surface. Since these pads are  
inaccessible during mounting,  
castellations that run up the side of  
the module have been provided to  
facilitate solder wicking to the  
module’s underside. This allows for  
very quick hand soldering for  
Soldering Iron  
Tip  
125°C  
Solder  
PCB Pads  
0
30  
60  
90  
120  
150  
Time (Seconds)  
180  
210  
240  
270  
300  
330  
360  
Castellations  
prototyping and small volume  
Figure 20: Maximum Reflow Profile  
Figure 19: Soldering Technique  
production.  
If the recommended pad guidelines have been followed, the pads will protrude  
slightly past the edge of the module. Use a fine soldering tip to heat the board  
pad and the castellation, then introduce solder to the pad at the module’s edge.  
The solder will wick underneath the module, providing reliable attachment. Tack  
one module corner first and then work around the device, taking care not to  
exceed the times listed below.  
Shock During Reflow Transport  
Since some internal module components may reflow along with the components  
placed on the board being assembled, it is imperative that the modules not be  
subjected to shock or vibration during the time solder is liquid. Should a shock  
be applied, some internal components could be lifted from their pads, causing  
the module to not function properly.  
Washability  
Absolute Maximum Solder Times  
The modules are wash resistant, but are not hermetically sealed. Linx  
recommends wash-free manufacturing; however, the modules can be subjected  
to a wash cycle provided that a drying time is allowed prior to applying electrical  
power to the modules. The drying time should be sufficient to allow any moisture  
that may have migrated into the module to evaporate, thus eliminating the  
potential for shorting damage during power-up or testing. If the wash contains  
contaminants, the performance may be adversely affected, even after drying.  
Hand-Solder Temp. TX +225°C for 10 Seconds  
Hand-Solder Temp. RX +225°C for 10 Seconds  
Recommended Solder Melting Point +180°C  
Reflow Oven: +220°C Max. (See adjoining diagram)  
Page 16  
Page 17  
ANTENNA CONSIDERATIONS  
GENERAL ANTENNA RULES  
The choice of antennas is a critical  
The following general rules should help in maximizing antenna performance.  
and  
consideration.  
often  
overlooked  
The  
design  
range,  
1. Proximity to objects such as a user’s hand, body, or metal objects will cause an  
antenna to detune. For this reason, the antenna shaft and tip should be  
positioned as far away from such objects as possible.  
performance, and legality of an RF link  
are critically dependent upon the  
antenna. While adequate antenna  
performance can often be obtained by  
trial and error methods, antenna  
design and matching is a complex  
2. Optimum performance will be obtained  
from a 1/4- or 1/2-wave straight whip  
mounted at a right angle to the ground  
plane. In many cases, this isn’t desirable  
OPTIMUM  
for practical or ergonomic reasons, thus,  
NOT RECOMMENDED  
task.  
A
professionally designed  
Figure 21: Linx Antennas  
USEABLE  
an alternative antenna style such as a  
helical, loop, or patch may be utilized  
antenna, such as those from Linx, will  
help ensure maximum performance and FCC compliance.  
Figure 23: Ground Plane Orientation  
and the corresponding sacrifice in performance accepted.  
Linx transmitter modules typically have an output power that is slightly higher  
than the legal limits. This allows the designer to use an inefficient antenna, such  
as a loop trace or helical, to meet size, cost, or cosmetic requirements and still  
achieve full legal output power for maximum range. If an efficient antenna is  
used, then some attenuation of the output power will likely be needed. This can  
easily be accomplished by using the LADJ line or a T-pad attenuator. For more  
details on T-pad attenuator design, please see Application Note AN-00150.  
3. If an internal antenna is to be used, keep it away from other metal components,  
particularly large items like transformers, batteries, PCB tracks, and ground  
planes. In many cases, the space around the antenna is as important as the  
antenna itself. Objects in close proximity to the antenna can cause direct  
detuning, while those farther away will alter the antenna’s symmetry.  
4. In many antenna designs, particularly 1/4-wave  
VERTICAL λ/4 GROUNDED  
ANTENNA (MARCONI)  
whips, the ground plane acts as a counterpoise,  
forming, in essence, a 1/2-wave dipole. For this  
reason, adequate ground plane area is essential.  
A receiver antenna should be optimized for the frequency or band in which the  
receiver operates and to minimize the reception of off-frequency signals. The  
efficiency of the receiver’s antenna is critical to maximizing range performance.  
Unlike the transmitter antenna, where legal operation may mandate attenuation  
or a reduction in antenna efficiency, the receiver’s antenna should be optimized  
as much as is practical.  
E
DIPOLE  
ELEMENT  
λ/4  
The ground plane can be a metal case or ground-fill  
I
areas on a circuit board. Ideally, it should have a  
surface area > the overall length of the 1/4-wave  
radiating element. This is often not practical due to  
size and configuration constraints. In these  
instances, a designer must make the best use of the  
area available to create as much ground plane as  
GROUND  
PLANE  
VIRTUAL λ/4  
DIPOLE  
λ/4  
It is usually best to utilize a basic quarter-wave whip until your prototype product  
is operating satisfactorily. Other antennas can then be evaluated based on the  
cost, size, and cosmetic requirements of the product. You may wish to review  
Application Note AN-00500 “Antennas: Design, Application, Performance”  
Figure 24: Dipole Antenna  
possible in proximity to the base of the antenna. In cases where the antenna is  
remotely located or the antenna is not in close proximity to a circuit board,  
ground plane, or grounded metal case, a metal plate may be used to maximize  
the antenna’s performance.  
ANTENNA SHARING  
In cases where a transmitter and receiver  
module are combined to form a transceiver,  
0.1μF  
it is often advantageous to share a single  
Module  
V
DD  
Transmitter  
0.1μF  
Antenna  
5. Remove the antenna as far as possible from potential interference sources. Any  
frequency of sufficient amplitude to enter the receiver’s front end will reduce  
system range and can even prevent reception entirely. Switching power  
supplies, oscillators, or even relays can also be significant sources of potential  
interference. The single best weapon against such problems is attention to  
placement and layout. Filter the module’s power supply with a high-frequency  
bypass capacitor. Place adequate ground plane under potential sources of noise  
to shunt noise to ground and prevent it from coupling to the RF stage. Shield  
noisy board areas whenever practical.  
antenna. To accomplish this, an antenna  
switch must be used to provide isolation  
between the modules so that the full  
0.1μF  
GND  
0.1μF  
GND  
Receiver  
Module  
transmitter output power is not put on the  
0.1μF  
sensitive front end of the receiver. There  
Select  
are a wide variety of antenna switches that  
are cost-effective and easy to use. Among  
Figure 22: Typical Antenna Switch  
the most popular are switches from Macom and NEC. Look for an antenna  
switch that has high isolation and low loss at the desired frequency of operation.  
Generally, the Tx or Rx status of a switch will be controlled by a product’s  
microprocessor, but the user may also make the selection manually. In some  
cases, where the characteristics of the Tx and Rx antennas need to be different  
or antenna switch losses are unacceptable, it may be more appropriate to utilize  
two discrete antennas.  
6. In some applications, it is advantageous to  
place the module and antenna away from the  
CASE  
main equipment. This can avoid interference  
problems and allows the antenna to be  
oriented for optimum performance. Always use  
GROUND PLANE  
NUT  
(MAY BE NEEDED)  
50Ω coax, like RG-174, for the remote feed.  
Figure 25: Remote Ground Plane  
Page 19  
Page 18  
COMMON ANTENNA STYLES  
ONLINE RESOURCES  
There are literally hundreds of antenna styles and variations that can be  
employed with Linx RF modules. Following is a brief discussion of the styles  
most commonly utilized. Additional antenna information can be found in Linx  
Application Notes AN-00100, AN-00140, and AN-00500. Linx antennas and  
connectors offer outstanding performance at a low price.  
®
www.linxtechnologies.com  
• Latest News  
A whip-style antenna provides outstanding overall performance  
Whip Style  
and stability. A low-cost whip is can be easily fabricated from a  
wire or rod, but most designers opt for the consistent  
performance and cosmetic appeal of a professionally-made  
model. To meet this need, Linx offers a wide variety of straight  
and reduced-height whip-style antennas in permanent and  
connectorized mounting styles.  
• Data Guides  
• Application Notes  
• Knowledgebase  
• Software Updates  
The wavelength of the operational frequency determines an  
antenna’s overall length. Since a full wavelength is often quite  
If you have questions regarding any Linx product and have Internet access,  
make www.linxtechnologies.com your first stop. Our website is organized in an  
intuitive format to immediately give you the answers you need. Day or night, the  
Linx website gives you instant access to the latest information regarding the  
products and services of Linx. It’s all here: manual and software updates,  
application notes, a comprehensive knowledgebase, FCC information, and much  
more. Be sure to visit often!  
long, a partial 1/2- or 1/4-wave antenna is normally employed.  
Its size and natural radiation resistance make it well matched to  
Linx modules. The proper length for a straight 1/4-wave can be  
easily determined using the adjacent formula. It is also possible  
to reduce the overall height of the antenna by using a helical  
winding. This reduces the antenna’s bandwidth, but is a great  
way to minimize the antenna’s physical size for compact  
applications. This also means that the physical appearance is  
not always an indicator of the antenna’s frequency.  
234  
L =  
F
MHz  
Where:  
L
= length in feet of  
quarter-wave length  
F = operating frequency  
in megahertz  
Specialty Styles  
Linx offers a wide variety of specialized antenna styles.  
Many of these styles utilize helical elements to reduce the  
overall antenna size while maintaining reasonable  
performance. A helical antenna’s bandwidth is often quite  
narrow and the antenna can detune in proximity to other  
objects, so care must be exercised in layout and placement.  
www.antennafactor.com  
The Antenna Factor division of Linx offers  
a diverse array of antenna styles, many of  
which are optimized for use with our RF  
modules. From innovative embeddable  
antennas to low-cost whips, domes to  
Yagis, and even GPS, Antenna Factor  
likely has an antenna for you, or can  
design one to meet your requirements.  
A loop- or trace-style antenna is normally printed directly on a  
product’s PCB. This makes it the most cost-effective of antenna  
styles. The element can be made self-resonant or externally  
resonated with discrete components, but its actual layout is  
usually product specific. Despite the cost advantages, loop-style  
antennas are generally inefficient and useful only for short-range  
applications. They are also very sensitive to changes in layout and  
PCB dielectric, which can cause consistency issues during  
production. In addition, printed styles are difficult to engineer,  
requiring the use of expensive equipment, including a network  
analyzer. An improperly designed loop will have a high SWR at the  
desired frequency, which can cause instability in the RF stage.  
Loop Style  
www.connectorcity.com  
Through its Connector City division, Linx offers a wide  
selection of high-quality RF connectors, including FCC-  
compliant types such as RP-SMAs that are an ideal  
match for our modules and antennas. Connector City  
focuses on high-volume OEM requirements, which  
allows standard and custom RF connectors to be offered  
at a remarkably low cost.  
Linx offers low-cost planar and chip antennas that mount directly  
to a product’s PCB. These tiny antennas do not require testing and  
provide excellent performance in light of their small size. They  
offer a preferable alternative to the often-problematic “printed”  
antenna.  
Page 20  
Page 21  
LEGAL CONSIDERATIONS  
ACHIEVING A SUCCESSFUL RF IMPLEMENTATION  
Adding an RF stage brings an exciting new  
DECIDE TO UTILIZE RF  
NOTE: Linx RF modules are designed as component devices that require  
external components to function. The modules are intended to allow for full Part  
15 compliance; however, they are not approved by the FCC or any other agency  
worldwide. The purchaser understands that approvals may be required prior to  
the sale or operation of the device, and agrees to utilize the component in keeping  
with all laws governing its use in the country of operation.  
dimension to any product. It also means that  
additional effort and commitment will be needed to  
bring the product successfully to market. By utilizing  
premade RF modules, such as the LR Series, the  
design and approval process is greatly simplified. It  
is still important, however, to have an objective view  
of the steps necessary to ensure a successful RF  
integration. Since the capabilities of each customer  
vary widely, it is difficult to recommend one  
particular design path, but most projects follow steps  
similar to those shown at the right.  
RESEARCH RF OPTIONS  
ORDER EVALUATION KIT(S)  
TEST MODULE(S) WITH  
BASIC HOOKUP  
CHOOSE LINX MODULE  
When working with RF, a clear distinction must be made between what is technically  
possible and what is legally acceptable in the country where operation is intended. Many  
manufacturers have avoided incorporating RF into their products as a result of  
uncertainty and even fear of the approval and certification process. Here at Linx, our  
desire is not only to expedite the design process, but also to assist you in achieving a  
clear idea of what is involved in obtaining the necessary approvals to legally market your  
completed product.  
INTERFACE TO CHOSEN  
CIRCUIT AND DEBUG  
CONSULT LINX REGARDING  
ANTENNA OPTIONS AND DESIGN  
LAY OUT BOARD  
In reviewing this sample design path, you may  
notice that Linx offers a variety of services (such as  
antenna design and FCC prequalification) that are  
unusual for a high-volume component manufacturer.  
These services, along with an exceptional level of  
technical support, are offered because we recognize  
that RF is a complex science requiring the highest  
caliber of products and support. “Wireless Made  
Simple” is more than just a motto, it’s our  
commitment. By choosing Linx as your RF partner  
and taking advantage of the resources we offer, you  
SEND PRODUCTION-READY  
PROTOTYPE TO LINX  
FOR EMC PRESCREENING  
OPTIMIZE USING RF SUMMARY  
GENERATED BY LINX  
In the United States, the approval process is actually quite straightforward. The  
regulations governing RF devices and the enforcement of them are the responsibility of  
the Federal Communications Commission (FCC). The regulations are contained in Title  
47 of the Code of Federal Regulations (CFR). Title 47 is made up of numerous volumes;  
however, all regulations applicable to this module are contained in Volume 0-19. It is  
strongly recommended that a copy be obtained from the Government Printing Office in  
Washington or from your local government bookstore. Excerpts of applicable sections are  
included with Linx evaluation kits or may be obtained from the Linx Technologies website,  
www.linxtechnologies.com. In brief, these rules require that any device that intentionally  
radiates RF energy be approved, that is, tested for compliance and issued a unique  
identification number. This is a relatively painless process. Linx offers full FCC pre-  
screening, and final compliance testing is then performed by one of the many  
independent testing laboratories across the country. Many labs can also provide other  
certifications that the product may require at the same time, such as UL, Class A / B, etc.  
Once your completed product has passed, you will be issued an ID number that is to be  
clearly placed on each product manufactured.  
SEND TO PART 15  
TEST FACILITY  
RECEIVE FCC ID #  
COMMENCE SELLING PRODUCT  
Typical Steps For  
Implementing RF  
will not only survive implementing RF, you may even find the process enjoyable.  
HELPFUL APPLICATION NOTES FROM LINX  
It is not the intention of this manual to address in depth many of the issues that  
should be considered to ensure that the modules function correctly and deliver  
the maximum possible performance. As you proceed with your design, you may  
wish to obtain one or more of the following application notes, which address in  
depth key areas of RF design and application of Linx products. These  
applications notes are available online at www.linxtechnologies.com or by  
contacting the Linx literature department.  
Questions regarding interpretations of the Part 2 and Part 15 rules or measurement  
procedures used to test intentional radiators, such as Linx RF modules, for compliance  
with the technical standards of Part 15, should be addressed to:  
Federal Communications Commission  
Office of Engineering and Technology Laboratory Division  
7435 Oakland Mills Road  
NOTE  
AN-00100  
APPLICATION NOTE TITLE  
RF 101: Information for the RF Challenged  
Columbia, MD 21046-1609  
Phone: (301) 362-3000 Fax: (301) 362-3290 E-Mail: labinfo@fcc.gov  
International approvals are slightly more complex, although Linx modules are designed  
to allow all international standards to be met. If you are considering the export of your  
product abroad, you should contact Linx Technologies to determine the specific suitability  
of the module to your application.  
AN-00126  
AN-00130  
AN-00140  
AN-00155  
AN-00160  
AN-00500  
Considerations For Operation Within The 902-928MHz Band  
Modulation Techniques For Low-Cost RF Data Links  
The FCC Road: Part 15 From Concept To Approval  
Serial Loading Techniques for the HP Series 3  
All Linx modules are designed with the approval process in mind and thus much of the  
frustration that is typically experienced with a discrete design is eliminated. Approval is  
still dependent on many factors, such as the choice of antennas, correct use of the  
frequency selected, and physical packaging. While some extra cost and design effort are  
required to address these issues, the additional usefulness and profitability added to a  
product by RF makes the effort more than worthwhile.  
Considerations For Sending Data Over a Wireless Link  
Antennas: Design, Application, Performance  
Page 22  
Page 23  
WIRELESS MADE SIMPLE ®  
U.S. CORPORATE HEADQUARTERS  
LINX TECHNOLOGIES, INC.  
159 ORT LANE  
MERLIN, OR 97532  
PHONE: (541) 471-6256  
FAX: (541) 471-6251  
www.linxtechnologies.com  
Disclaimer  
Linx Technologies is continually striving to improve the quality and function of its products. For this reason,  
we reserve the right to make changes to our products without notice. The information contained in this  
Overview Guide is believed to be accurate as of the time of publication. Specifications are based on  
representative lot samples. Values may vary from lot-to-lot and are not guaranteed. "Typical" parameters can  
and do vary over lots and application. Linx Technologies makes no guarantee, warranty, or representation  
regarding the suitability of any product for use in any specific application. It is the customer's responsibility  
to verify the suitability of the part for the intended application. NO LINX PRODUCT IS INTENDED FOR USE  
IN ANY APPLICATION WHERE THE SAFETY OF LIFE OR PROPERTY IS AT RISK.  
Linx Technologies DISCLAIMS ALL WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A  
PARTICULAR PURPOSE. IN NO EVENT SHALL LINX TECHNOLOGIES BE LIABLE FOR ANY OF  
CUSTOMER'S INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING IN ANY WAY FROM ANY DEFECTIVE  
OR NON-CONFORMING PRODUCTS OR FOR ANY OTHER BREACH OF CONTRACT BY LINX  
TECHNOLOGIES. The limitations on Linx Technologies' liability are applicable to any and all claims or  
theories of recovery asserted by Customer, including, without limitation, breach of contract, breach of  
warranty, strict liability, or negligence. Customer assumes all liability (including, without limitation, liability  
for injury to person or property, economic loss, or business interruption) for all claims, including claims  
from third parties, arising from the use of the Products. The Customer will indemnify, defend, protect, and  
hold harmless Linx Technologies and its officers, employees, subsidiaries, affiliates, distributors, and  
representatives from and against all claims, damages, actions, suits, proceedings, demands, assessments,  
adjustments, costs, and expenses incurred by Linx Technologies as a result of or arising from any Products  
sold by Linx Technologies to Customer. Under no conditions will Linx Technologies be responsible for  
losses arising from the use or failure of the device in any application, other than the repair, replacement, or  
refund limited to the original product purchase price. Devices described in this publication may contain  
proprietary, patented, or copyrighted techniques, components, or materials. Under no circumstances shall  
any user be conveyed any license or right to the use or ownership of such items.  
© 2008 by Linx Technologies, Inc. The stylized Linx logo,  
Linx, “Wireless Made Simple”, CipherLinx, and the stylized  
CL logo are the trademarks of Linx Technologies, Inc.  
Printed in U.S.A.  

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