S8812WGM3NR [ETC]
High-performance quad-socket server platform for enterprise & HPC applications;
| 型号： | S8812WGM3NR |
| 厂家： | 
ETC |
| 描述： | High-performance quad-socket server platform for enterprise & HPC applications PC |
| 文件： | 总2页 (文件大小：753K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
QUAD-SOCKET
SERVER
PLATFORM
S8812
S8812WGM3NR
High-performance quad-socket server
platform for enterprise & HPC applications
Quad G34 sockets support AMD Opteron™ 6100/ 6200/ 6300 series
processors (Magny-Cours/ Interlagos/ Abu Dhabi)
Support (4) HyperTransport™ 3.0 link, max. bandwidth up to 25.6 GB/s
@ 6.4GT/s per link
AMD SR5690 + SP5100
(32) 240-pin DDR3 DIMM slots support up to 512GB R-DDR3
1333/1066/800MHz w/ ECC memory
(1) PCI-E Gen.2 x16 slot (w/ x16 or x8 link)
(1) PCI-E Gen.2 x8 slot (w/ x0 or x8 link)
(2) PCI-E Gen.2 x8 slots
(1) SATA-II connector for optional ODD
(8) SAS 6G ports via (2) Mini-SAS connectors w/ RAID 0, 1, 1E, 10 support
(3) GbE LAN
Onboard BMC w/ IPMI and iKVM support
MEB (16.2" x 13") form factor
TM
AMD Opteron 6100 / 6200 series
Specifications are subject to change without notice. Items pictured may only be representative.
S8812
Specifications
S8812WGM3NR
Block Diagram
Supported CPU Series
AMD Opteron™ processors 6100/6200/6300 series
HT3
@ up to
6.4GT/s
DDR3 800 / 1066 / 1333
CPU2
CPU3
DDR3 800 / 1066 / 1333
Socket Type / Q'ty
G34 / (4)
Average CPU Power
(ACP) wattage
Processor
Up to 105W
Support (4) HyperTransport™ 3.0 link, max.
bandwidth up to 25.6 GB/s @ 6.4GT/s per
link
System Bus
HT3 @ up to 6.4GT/s
DDR3 800 / 1066 / 1333
HT3 @ up to 6.4GT/s
HT-Link
HT3 @ up to 6.4GT/s
DDR3 800 / 1066 / 1333
CPU1
CPU0
Chipset
AMD SR5690 + SP5100
Winbond W83627DHG-P
(8+8+8+8) DIMM slots
DDR3 1333/1066/800 RDIMM
Up to 512GB RDIMM
Chipset
Memory
Super I/O
Supported DIMM Qty
DIMM Type / Speed
Capacity
x16
HT1 @ up to 5.2GT/s
SAS 6G
SAS 6G
4 in 1 SAS Connector
4 in 1 SAS Connector
PCI-Ex4
LSI
PCI-E x8
PCI-E x8
PCI-E x8
Memory channel
Memory voltage
16 Channels (4 Channels per CPU)
1.5V/ 1.35V
SAS 2008
PCI-E Gen.2 x16 slot (w/ x16 or x8 link)
PCI-E Gen.2 x8 slot (w/ x16 or x8 link)
PCI-E Gen.2 x8 slot (w/ x8 link)
PCI-Ex4
PCI-Ex1
GB LAN RJ45 (LAN1)
GB LAN RJ45 (LAN2)
North Bridge
SR5690
INTEL
(1) PCI-E Gen.2 x16 slot (w/ x16 or x8 link)
(1) PCI-E Gen.2 x8 slot (w/ x0 or x8 link)
(2) PCI-E Gen.2 x8 slots
82576 EB
Expansion
Slots
PCI-E x8
PCI-E
PCI-E Gen.2 x8 slot (w/ x8 link)
INTEL
GB LAN RJ45 (LAN3)
82574L
Recommended
Barebone /
Chassis
PCI-Ex4
4U Barebone
FT48-B8812
2 x USB 2.0 rear I/O
2 x USB 2.0 Header Front Panel
2 x USB 2.0 Header (2x5 pin)
1 x A Type USB Header
1 x SATAII
PCI-BUS
BMC
AST2050
Port Q'ty
(3)
South Bridge
SP5100
VGA
LAN
Intel® 82576EB
Intel® 82574L
(8)
Controller
Connector
SMBUS
LPC
BUS
TPM
Controller
Speed
LSI SAS2008
SAS
(opt.)
KB/MS
COM 1
H/W Monitor
W83795
Super I/O
W83627 DHG-P
6.0 Gb/s
RAID
RAID 0/1/1E/10 (LSI Integrated RAID)
Storage
Connector
Controller
Speed
(1)
Onboard Chipset
Onboard Aspeed AST2050
AMD SP5100
3.0 Gb/s
SATA
IPMI 2.0 compliant baseboard management
controller (BMC)
BIOS update
Server
Management
AST2050 IPMI Feature
RAID
N/A
Connector type
Resolution
Chipset
D-Sub 15-pin
1600x1200@60Hz
Aspeed AST2050
USB 2.0 virtual hub
Graphic
24-bit high quality video compression
Dual 10/100 Mb/s MAC interfaces
AST2050 iKVM Feature
Brand / ROM size
BIOS
AMI / 4MB
(7) USB2.0 ports (2 at rear, 4 via cable, 1
type A onboard)
USB
Plug and Play (PnP)/ PCI 2.3
WfM2.0 / SMBIOS2.3 / PXE boot
ACPI 2.0 power management
Power on mode after power recovery
User-configurable H/W monitoring
Auto-configurable of hard disk types
Multiple boot options
COM
PS/2
SAS
(2) ports (1 at rear, 1 via cable)
(1) PS/2 connector
Feature
(2) Mini-SAS (4-in-1) connectors
(1) D-Sub 15-pin VGA port
(3) GbE ports
Input /Output
VGA
RJ-45
Universal 24-pin + 8-pin + 8-pin & ATX12V
4-pin auxiliary power connectors
Form Factor
MEB
Power
Form Factor
Board Dimension
16.2"x13" (411.48x330mm)
Front Panel
SATA
(1) 2x12 pin SSI front panel header
(1) SATA-II connector
Operating
System
OS supported list
Please refer to our OS supported list.
Chipset
Winbond W83795G
FCC (DoC)
Class A
Regulation
Monitors voltage for CPU, memory, chipset &
power supply
CE (DoC)
Yes
Voltage
Fan
Operating Temp.
Non-operating Temp.
10° C ~ 35° C (50° F~ 95° F)
- 40° C ~ 70° C (-40° F ~ 158° F)
System
Total (9) 4-pin headers
Operating
Monitoring
Monitors temperature for CPU & system
environment
Environment
Temperature
In/Non-operating
Humidity
90%, non-condensing at 35° C
Yes
Chassis intrusion detection
Watchdog timer support
Others
RoHS 6/6 Complaint
RoHS
(Specifications are subject to change without notice. Items pictured may only be
representative.)
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