STPS1045BH [ETC]

POWER SCHOTTKY RECTIFIER ; 功率肖特基整流器\n


型号：	STPS1045BH
厂家：	ETC
描述：	POWER SCHOTTKY RECTIFIER 功率肖特基整流器\n
文件：	总5页 (文件大小：76K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

STPS1045B/H

POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS

I_F(AV)

V_RRM

10 A

45 V

V_F(max)

0.57 V

FEATURES AND BENEFITS

NEGLIGIBLE SWITCHING LOSSES

LOW FORWARD DROP VOLTAGE

LOW CAPACITANCE

HIGH REVERSE AVALANCHE SURGE

CAPABILITY

AVALANCHE CAPABILITY SPECIFIED

DESCRIPTION

IPAK

STPS1045H

DPAK

STPS1045B

High voltage Schottky rectifier suited for Switch

Mode Power Supplies and other Power

Converters.

Packaged in DPAK and IPAK, these devices are

intended for use in high frequency circuitries

where low switching losses are required.

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Repetitive peak reverse voltage

Value

Unit

V_RRM

I_F(RMS)/ pin RMS forward current / pin

I_F(AV)

Average forward current

Tc = 150°C

d = 0.5

I_FSM

Surge non repetitive forward current

tp = 10 ms

Sinusoidal

I_RRM

P_ARM

T_stg

Repetitive peak reverse current

Repetitive peak avalanche power

Storage temperature range

tp = 2 µs F = 1KHz

tp = 1µs Tj = 25°C

4000

- 65 to + 175

175

°C

Maximum junction temperature

Critical rate of rise of reverse voltage

°C

dV/dt

10000

V/µs

July 2003 - Ed: 3B

1/5

STPS1045B/H

THERMAL RESISTANCES

Symbol

Parameter

Value

Unit

R_{th (j-c)}Junction to case

°C/W

STATIC ELECTRICAL CHARACTERISTICS

Symbol

Parameter

Tests Conditions

Min. Typ. Max.

Unit

µA

I_R*

Reverse leakage current

Tj = 25°C

V_R= 45 V

100

Tj = 125°C

Tj = 25°C

Tj = 125°C

Tj = 25°C

Tj = 125°C

V_F**

Forward voltage drop

I_F= 10 A

I_F= 20 A

0.63

0.57

0.84

0.72

0.5

0.65

Pulse test : * tp = 380 µs, δ < 2 %

**tp = 5 ms, δ < 2%

To evaluate the maximum₂conduction losses use the following equation :

P = 0.42 x I_F(AV)+ 0.015 I_{F (RMS)}

Fig. 1: Average forward power dissipation versus

average forward current.

Fig. 2: Average forward current versus ambient

temperature (δ=0.5).

PF(av)(W)

IF(av)(A)

δ = 0.1

δ = 0.2

δ = 0.5

δ = 0.05

Rth(j-a)=Rth(j-c)

δ = 1

Rth(j-a)=15°C/W

Rth(j-a)=70°C/W

Tamb(°C)

IF(av) (A)

=tp/T

100

125

150

175

10 11 12

Fig. 3: Normalized avalanche power derating

versus pulse duration.

Fig. 4: Normalized avalanche power derating

versus junction temperature.

(t )

(1µs)

ARM

(t )

(25°C)

ARM

1.2

0.1

0.8

0.6

0.4

0.2

0.01

T (°C)

t (µs)

0.001

100

125

150

0.01

0.1

100

1000

2/5

STPS1045B/H

Fig. 5: Non repetitive surge peak forward current

versus overload duration (maximum values).

Fig. 6: Relative variation of thermal impedance

junction to case versus pulse duration.

Zth(j-c)/Rth(j-c)

IM(A)

1.0

120

100

0.8

δ = 0.5

0.6

Tc=50°C

Tc=100°C

0.4

δ = 0.2

Tc=150°C

δ = 0.1

0.2

t(s)

tp(s)

δ=0.5

Single pulse

=tp/T

0.0

1E-4

1E-3

1E-2

1E-1

1E+0

1E-3

1E-2

1E-1

1E+0

Fig. 7: Reverse leakage current versus reverse

voltage applied (typical values).

Fig. 8: Junction capacitance versus reverse

voltage applied (typical values).

IR(µA)

C(pF)

1E+5

1000

F=1MHz

Tj=25°C

Tj=150°C

1E+4

Tj=125°C

500

200

1E+3

Tj=100°C

1E+2

Tj=75°C

Tj=50°C

1E+1

Tj=25°C

1E+0

VR(V)

1E-1

100

10 15 20 25 30 35 40 45

Fig. 9: Forward voltage drop versus forward

current (maximum values).

Fig. 10: Thermal resistance junction to ambient

versus copper surface under tab (Epoxy printed

circuit

board,

copper

thickness:

35µm)

(STPS1045B).

IFM(A)

Rth(j-a) (°C/W)

100.0

100

Tj=125°C

(Typical values)

Tj=125°C

Tj=25°C

10.0

1.0

S(Cu) (cm²)

8 10 12 14 16 18 20

VFM(V)

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

3/5

STPS1045B/H

PACKAGE MECHANICAL DATA

IPAK

DIMENSIONS

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

REF.

2.2

0.9

2.4 0.086

1.1 0.035

1.3 0.027

0.9 0.025

5.4 0.204

0.85

0.094

0.043

0.051

0.035

0.212

0.033

0.7

0.64

5.2

0.3

0.035

0.95

0.037

0.023

0.244

0.260

0.181

0.641

0.370

0.047

0.45

0.6 0.017

0.6 0.019

6.2 0.236

6.6 0.252

4.6 0.173

16.3 0.626

9.4 0.354

1.2 0.031

C2 0.48

6.4

4.4

15.9

0.8

10°

0.031 0.039

10°

COOLING METHOD: BY CONDUCTION (C)

4/5

STPS1045B/H

PACKAGE MECHANICAL DATA

DPAK

DIMENSIONS

Millimeters Inches

Min. Typ. Max Min. Typ. Max.

REF.

2.20

0.90

0.03

0.64

5.20

0.45

0.48

6.00

6.40

4.40

9.35

2.40 0.086

1.10 0.035

0.23 0.001

0.90 0.025

5.40 0.204

0.60 0.017

0.60 0.018

6.20 0.236

6.60 0.251

4.60 0.173

10.10 0.368

0.094

0.043

0.009

0.035

0.212

0.023

0.244

0.259

0.181

0.397

0.80

0.031

0.60

0°

1.00 0.023

0.039

8°

0°

COOLING METHOD: BY CONDUCTION (C)

FOOT PRINT DIMENSIONS (in millimeters)

6.7

1.6

2.3 2.3

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5/5

STPS1045BH [ETC]

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