TAO-3530-I [ETC]
System on Module;
| 型号： | TAO-3530-I |
| 厂家： | 
ETC |
| 描述： | System on Module |
| 文件： | 总1页 (文件大小：629K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
System on Module
TAO-3530
2
2
TI OMAP 3530 application processor with
ARM Cortex-A8 CPU, integrated DSP and
POWERVR SGX 530 for 2D and
3D graphics acceleration.
1
3
Flexible expansion possibilities by two
100 pin NAIS board to board connectors to
customize your own interfaces on
base boards at low cost.
5
4
System
CPU
DSP core
PMIC
Dimensions
TI OMAP 3530 @ 600MHz (1)
TMS320C64x+TM @ 430MHz
TPS65930 (5)
units in mm
Memory
Storage
256 MB Low power mobile DDR (2)
512 MB NAND Flash (3)
63.5
Wireless LAN
Supported OS
Marvell 8686 802.11b/g (4)
Linux 2.6.x, Windows CE 6, Android
Interfaces
Connectors
two 100 pin NAIS connectors
SPI, UART, USB host, USB OTG/
client, I2C, PWM lines, 1-wire,
MMC lines, A/D lines, camera,
audio in/out/mic, S-Video, Display
M2
58
Graphic Capabilities
Chipset
POWERVR SGX 530
10Mpolys/s, up to 720p resolution
OpenGL 2.0, OpenGLes 1.1,
OpenVG 1.0
API support
Order Information
TAO-3530
TAO-3530-i
OMAP3530 System on Module
Power
OMAP3530 System on Module
with industrial temperature
specifications (MOQ’s apply)
OMAP3530 system on module
with Wireless LAN
Power consumption
Standby
<2.0 Watt with Wireless enabled
<50 mWatt
5V, 4.2V
Input power
TAO-3530W
Environmental and Mechanical
Temperature
Commercial: 0° to 70° C
Extended: -20° to 70° C (no wifi)
Industrial: -40° to 85° C (no wifi)
10-90%
Development kits available
Humidity
Dimensions
63.5 x 35 x 6.4 mm
2½ x 1⅜ x ¼ inch
>100,000 hours
MTBF
Weight
Shock
10 grams
50G / 25ms
Phone: +886-2-8227-3585
Vibration
20G / 0-600 Hz
E-mail: sales@technexion.com
Web:
http://www.technexion.com
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