TD6815 [ETC]

1.5MHz 1.5A Synchronous Step-Down Regulator Dropout; 1.5MHz的同步1.5A降压稳压器低压差
TD6815
型号: TD6815
厂家: ETC    ETC
描述:

1.5MHz 1.5A Synchronous Step-Down Regulator Dropout
1.5MHz的同步1.5A降压稳压器低压差

稳压器
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DATASHEET  
Techcode®  
1.5MHz 1.5A Synchronous Step-Down Regulator  
Dropout  
汪工 TEL:13828719410 QQ:1929794238  
General Description Features  
TD6815  
The TD6815 is a high efficiency monolithic synchronous  
buck regulator using a constant frequency, current mode  
architecture. The device is available in an adjustable  
version and fixed output voltages of 1.5V and 1.8V.  
Supply current during operation is only 20mA and drops  
to 1mA in shutdown. The 2.5V to 5.5V input voltage  
range makes the TD6815 ideally suited for single Li-Ion  
battery-powered applications. 100% duty cycle provides  
low dropout operation, extending battery life in portable  
systems.Automatic Burst Mode operation increases  
efficiency at light loads, further extending battery life.  
Switching frequency is internally set at 1.5MHz, allowing  
the use of small surface mount inductors and capacitors.  
The internal synchronous switch increases efficiency and  
eliminates the need for an external Schottky diode. Low  
output voltages are easily supported with the 0.6V  
feedback reference voltage. The TD6815 is available in  
SOP8 package.  
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High Efficiency: Up to 96%  
High Efficiency at light loads  
Very Low Quiescent Current: Only 20uA During  
Operation  
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1.5A Output Current  
2.5V to 5.5V Input Voltage Range  
1.5MHz Constant Frequency Operation  
No Schottky Diode Required  
Low Dropout Operation: 100% Duty Cycle  
0.6V Reference Allows Low Output Voltages  
Shutdown Mode Draws 1uA Supply Current  
Current Mode Operation for Excellent Line and Load  
Transient Response  
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Overtemperature Protected  
SOP8 Package is Available  
Applications  
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Cellular Telephones  
Personal Information Appliances  
Wireless and DSL Modems  
Digital Still Cameras  
MP3 Players  
Portable Instruments  
Package Types  
SOP8  
Figure 1. Package Types of TD6815  
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1.5MHz 1.5A Synchronous Step-Down Regulator  
Dropout  
TD6815  
Pin Name Description  
Pin Assignments  
Run Control Input. Forcing this pin  
above 1.5V enables the part.  
Forcing this pin below 0.3V shuts  
down the device. In shutdown, all  
functions are disabled drawing  
<1μA supply current. Do not leave  
RUN floating.  
7
RUN  
4,8 GND  
5,6 SW  
Ground Pin.  
Switch Node Connection to  
Inductor. This pin connects to the  
drains of the internal main and  
synchronous power MOSFET  
switches.  
SOP8  
Main Supply Pin. Must be closely  
decoupled to GND, Pin 2, with a  
2.2μF or greater ceramic capacitor.  
Feedback Pin. Receives the  
feedback voltage from an external  
resistive divider across the output.  
Output Voltage Feedback Pin. An  
internal resistive divider divides the  
output voltage down for comparison  
to the internal reference voltage.  
3
1
1
VIN  
VFB  
VOUT  
Ordering Information  
TD6815 □ □  
Circuit Type  
Output Versions  
BlankAdj  
121.2V  
Package  
P:SOP8  
151.5V  
181.8V  
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1.5MHz 1.5A Synchronous Step-Down Regulator  
Dropout  
TD6815  
Functional Block Diagram  
Figure2:Functional Block Diagram of TD6815  
Type Application Circuit  
Figure 3. Type Application Circuit of TD6815  
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1.5MHz 1.5A Synchronous Step-Down Regulator  
Dropout  
TD6815  
Absolute Maximum Ratings  
Note1: Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation  
of the device at these or any other conditions above those indicated in the operation is not implied. Exposure to absolute maximum rating conditions for extended  
periods may affect reliability.  
Parameter  
Value  
Unit  
V
Input Supply Voltage  
RUN, VFB Voltages  
SW Voltage  
-0.3 ~6  
-0.3 ~ VIN  
V
-0.3V ~(VIN+0.3)  
1800  
V
P-Channel Switch Source Current (DC)  
N-Channel Switch Sink Current (DC)  
Peak SW Sink and Source Current  
Operating Temperature Range  
Junction Temperature  
mA  
mA  
A
1800  
2.2  
-40~+85  
125  
ºC  
ºC  
ºC  
ºC  
Lead Temperature (Soldering, 10 sec)  
Storage Temperature Range  
300  
-65~150  
Electrical Characteristics  
Unless otherwise specified, VIN= 3.6V TA=25 ºC.  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
IVFB  
Feedback Current  
30  
nA  
0.5880  
0.5865  
0.5850  
0.6000  
0.6000  
0.6000  
0.6120  
0.6135  
0.6150  
TA = 25°C  
Regulated Feedback  
Voltage  
VFB  
V
0°C TA 85°C  
–40°C TA 85°C  
Reference Voltage Line  
Regulation  
VFB  
VOUT  
VIN = 2.5V to 5.5V  
0.04  
0.4  
%/ V  
V
TD6815-1.5, IOUT = 100mA 1.455  
TD6815-1.8, IOUT = 100mA 1.746  
1.500  
1.800  
1.545  
1.854  
Regulated Output  
Voltage  
Output Voltage Line  
Regulation  
VOUT  
VIN = 2.5V to 5.5V  
0.04  
0.4  
%/ V  
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1.5MHz 1.5A Synchronous Step-Down Regulator  
Dropout  
TD6815  
Electrical Characteristics(Cont.)  
Unless otherwise specified, VIN= 3.6V TA=25 ºC.  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
VIN = 3V, VFB = 0.5V or  
VOUT = 90%, Duty Cycle < 1.75  
35%  
IPK  
Peak Inductor Current  
1.8  
1.9  
A
Output Voltage Load  
Regulation  
VLOADREG  
VIN  
0.5  
%
V
Input Voltage Range  
Input DC Bias Current  
2.5  
5.5  
VFB = 0.5V or VOUT =  
90%, ILOAD = 0A  
Active Mode  
300  
400  
uA  
IS  
VFB = 0.62V or VOUT =  
103%, ILOAD = 0A  
Sleep Mode  
Shutdown  
20  
35  
1
uA  
VRUN = 0V, VIN = 4.2V  
0.1  
1.5  
400  
0.25  
uA  
VFB = 0.6V or VOUT =  
fOSC  
1
2
MHz  
KHz  
100%  
Oscillator Frequency  
VFB = 0V or VOUT = 0V  
RDS(ON) of P-Channel  
RPFET  
RNFET  
ILSW  
ISW = 100mA  
0.35  
0.35  
1
FET  
RDS(ON) of N-Channel  
FET  
ISW = -100mA  
0.25  
0.01  
VRUN = 0V, VSW = 0V or  
5V, VIN = 5V  
SW Leakage  
uA  
VRUN  
IRUN  
RUN Threshold  
0.3  
1
1.5  
1
V
RUN Leakage Current  
0.01  
uA  
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Typical Operating Characteristics  
Reference Voltage  
Oscillator Frequency  
Oscillator Frequency vs Supply Voltage  
RDS(ON) vs Temperature  
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TD6815  
Typical Operating Characteristics(Cont.)  
RDS(ON) vs Input Voltage  
Efficiency vs Output Current  
Efficiency vs Output Current  
Efficiency vs Output Current  
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TD6815  
Typical Operating Characteristics(Cont.)  
Efficiency vs Output Current  
Output Voltage vs Output Current  
Efficiency vs Input Voltage  
Dynamic Supply Current vs Supply Voltage  
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TD6815  
Typical Operating Characteristics  
P-FET Leakage vs Temperature  
N-FET Leakage vs Temperature  
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Function Description  
the EA amplifier’s output rises above the sleep threshold  
signaling the BURST comparator to trip and turn the top  
MOSFET on. This process repeats at a rate that is  
dependent on the load demand.  
Main Control Loop  
The TD6815 uses a constant frequency, current mode  
step-down architecture. Both the main (P-channel  
MOSFET) and synchronous (N-channel MOSFET)  
switches are internal. During normal operation, the  
Short­Circuit Protection  
internal top power MOSFET is turned on each cycle When the output is shorted to ground, the frequency of  
when the oscillator sets the RS latch, and turned off the oscillator is reduced to about 400kHz, 1/4 the  
when the current comparator, ICOMP, resets the RS nominal frequency. This frequency foldback ensures that  
latch. The peak inductor current at which ICOMP resets the inductor current has more time to decay, thereby  
the RS latch, is controlled by  
preventing runaway. The oscillator’s frequency will  
the output of error amplifier EA. When the load current progressively increase to 1.5MHz when VFB or VOUT  
increases, it causes a slight decrease in the feedback rises above 0V.  
voltage, FB, relative to the 0.6V reference, which in turn,  
causes the EA amplifier’s output voltage to increase until  
Dropout Operation  
the average inductor current matches the new load  
current. While the top MOSFET is off, the bottom  
As the input supply voltage decreases to a value  
MOSFET is turned on until either the inductor current  
approaching the output voltage, the duty cycle increases  
starts to reverse, as indicated by the current reversal  
toward the maximum on-time. Further reduction of the  
comparator IRCMP, or the beginning of the next clock  
supply voltage forces the main switch to remain on for  
cycle.  
more than one cycle until it reaches 100% duty cycle.  
The output voltage will then be determined by the input  
Burst Mode Operation  
voltage minus the voltage drop across the P-channel  
MOSFET and the inductor.  
The TD6815 is capable of Burst Mode operation in which An important detail to remember is that at low input  
the internal power MOSFETs operate intermittently  
based on load demand.  
supply voltages, the RDS(ON) of the P-channel switch  
increases (see Typical Performance Characteristics).  
In Burst Mode operation, the peak current of the inductor Therefore, the user should calculate the power  
is set to approximately 200mA regardless of the output dissipation when the TD6815 is used at 100% duty cycle  
load. Each burst event can last from a few cycles at light with low input voltage (See Thermal Considerations in  
loads to almost continuously cycling with short sleep  
intervals at moderate loads. In between these burst  
events, the power MOSFETs and any unneeded circuitry  
are turned off, reducing the quiescent current to 20mA. In  
this sleep state, the load current is being supplied solely  
from the output capacitor. As the output voltage droops,  
the Applications Information  
section).  
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Function Description(Cont.)  
The basic TD6815 application circuit is shown in Figure  
3. External component selection is driven by the load  
requirement and begins with the selection of L followed  
by CIN and COUT.  
Low Supply Operation  
The TD6815 will operate with input supply voltages as  
low as 2.5V, but the maximum allowable output current is  
reduced at this low voltage. Figure 2 shows the reduction  
in the maximum output current as a function of input  
voltage for various output voltages.  
Inductor Selection  
For most applications, the value of the inductor will fall in  
the range of 1mH to 4.7mH. Its value is chosen based on  
the desired ripple current. Large value inductors lower  
ripple current and small value inductors result in higher  
ripple currents. Higher VIN or VOUT also increases the  
ripple current as shown in equation 1. A reasonable  
starting point for setting ripple current is DIL = 600mA  
(40% of 1500mA).  
Slope Compensation and Inductor Peak  
Current  
Slope compensation provides stability in constant  
frequency architectures by preventing subharmonic  
oscillations at high duty cycles. It is accomplished  
internally by adding a compensating ramp to the inductor  
current signal at duty cycles in excess of 40%. Normally,  
this results in a reduction of maximum inductor peak  
current for duty cycles >40%. However, the TD6815 uses  
a patent-pending scheme that counteracts this  
compensating ramp, which allows the maximum inductor  
peak current to remain unaffected throughout all duty  
cycles.  
The DC current rating of the inductor should be at least  
equal to the maximum load current plus half the ripple  
current to prevent core saturation. Thus, a 1620mA rated  
inductor should be enough for most applications  
(1500mA + 120mA). For better efficiency, choose a low  
DC-resistance  
inductor.  
The inductor value also has an effect on Burst Mode  
operation. The transition to low current operation begins  
when the inductor current peaks fall to approximately  
200mA. Lower inductor values (higher DIL) will cause  
this to occur at lower load currents, which can cause a  
dip in efficiency in the upper range of low current  
operation. In Burst Mode operation, lower inductance  
values will cause the burst frequency to increase.  
Maximum Output Current vs Input Voltag  
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Function Description(Cont.)  
This formula has a maximum at VIN = 2VOUT, where  
IRMS = IOUT/2. This simple worst-case condition is  
commonly used for design because even significant  
deviations do not offer much relief. Note that the  
capacitor manufacturer’s ripple current ratings are often  
based on 2000 hours of life. This makes it advisable to  
further derate the capacitor, or choose a capacitor rated  
at a higher temperature than required. Always consult  
the manufacturer if there is any question.  
Inductor Core Selection  
Different core materials and shapes will change the  
size/current and price/current relationship of an inductor.  
Toroid or shielded pot cores in ferrite or permalloy  
materials are small and don’t radiate much energy, but  
generally cost more than powdered iron core inductors  
with similar electrical characteristics. The choice of which  
style inductor to use often depends more on the price vs  
size requirements and any radiated field/EMI  
The selection of COUT is driven by the required effective  
series resistance (ESR). Typically, once the ESR  
requirement for COUT has been met, the RMS current  
rating generally far exceeds the IRIPPLE(P-P)  
requirements than on what the TD6815 requires to  
operate. Table 1 shows some typical surface mount  
inductors that work well in TD6815 applications.  
requirement. The output ripple DVOUT is determined by:  
where f = operating frequency, COUT = output  
capacitanceand DIL = ripple current in the inductor. For a  
fixed output voltage, the output ripple is highest at  
maximum input voltage since DIL increases with input  
voltage.  
Aluminum electrolytic and dry tantalum capacitors are  
both available in surface mount configurations. In the  
case of tantalum, it is critical that the capacitors are  
surge tested for use in switching power supplies. An  
excellent choice is the AVX TPS series of surface mount  
tantalum. These are specially constructed and tested for  
low ESR so they give the lowest ESR for a given volume.  
Other capacitor types include Sanyo POSCAP, Kemet  
T510 and T495 series, and Sprague 593D and 595D  
series. Consult the manufacturer for other specific  
recommendations.  
Table 1. Representative Surface Mount Inductors  
CIN and COUT Selection  
In continuous mode, the source current of the top  
MOSFET is a square wave of duty cycle VOUT/VIN. To  
prevent large voltage transients, a low ESR input  
capacitor sized for the maximum RMS current must be  
used. The maximum RMS capacitor current is given by:  
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Function Description(Cont.)  
Using Ceramic Input and Output  
Capacitors  
Higher values, lower cost ceramic capacitors are now  
becoming available in smaller case sizes. Their high  
ripple current, high voltage rating and low ESR make  
them ideal for switching regulator applications. Because  
the TD6815’s control loop does not depend on the output  
capacitor’s ESR for stable operation, ceramic capacitors  
can be used freely to achieve very low output ripple and  
small circuit size.  
Figure 4:Setting the output Voltage  
Vout  
1.2V  
1.5V  
1.8V  
2.5V  
3.3V  
R1  
R2  
150K  
160K  
150K  
150K  
150K  
150K  
240K  
300K  
470K  
680K  
However, care must be taken when ceramic capacitors  
are used at the input and the output. When a ceramic  
capacitor is used at the input and the power is supplied  
by a wall adapter through long wires, a load step at the  
output can induce ringing at the input, VIN. At best, this  
ringing can couple to the output and be mistaken as loop  
instability. At worst, a sudden inrush of current through  
the long wires can potentially cause a voltage spike at  
VIN, large enough to damage the part.  
Table 2. Vout VS. R1, R2, Cf Select Table  
Efficiency Considerations  
The efficiency of a switching regulator is equal to the  
output power divided by the input power times 100%. It is  
often useful to analyze individual losses to determine  
what is limiting the efficiency and which change would  
produce the most improvement. Efficiency can be  
expressed as:  
When choosing the input and output ceramic capacitors,  
choose the X5R or X7R dielectric formulations. These  
dielectrics have the best temperature and voltage  
characteristics of all the ceramics for a given value and  
size.  
Efficiency = 100% – (L1 + L2 + L3 + ...)  
where L1, L2, etc. are the individual losses as a  
percentage of input power.  
Output Voltage Programming  
Although all dissipative elements in the circuit produce  
losses, two main sources usually account for most of the  
losses in TD6815 circuits: VIN quiescent current and I2R  
losses. The VIN quiescent current loss dominates the  
efficiency loss at very low load currents whereas the I2R  
loss dominates the efficiency loss at medium to high load  
currents. In a typical efficiency plot, the efficiency curve  
at very low load currents can be misleading since the  
actual power lost is of no consequence as illustrated in  
Figure 5.  
In the adjustable version, the output voltage is set by a  
resistive divider according to the following formula:  
The external resistive divider is connected to the output,  
allowing remote voltage sensing as shown in Figure4.  
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Function Description(Cont.)  
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)  
The RDS(ON) for both the top and bottom MOSFETs  
can be obtained from the Typical Performance  
Charateristics curves. Thus, to obtain I2R losses, simply  
add RSW to RL and multiply the result by the square of  
the average output current. Other losses including CIN  
and COUT ESR dissipative losses and inductor core  
losses generally account for less than 2% total additional  
loss.  
Thermal Considerations  
In most applications the TD6815 does not dissipate  
much heat due to its high efficiency. But, in applications  
where the TD6815 is running at high ambient  
temperature with low supply voltage and high duty  
cycles, such as in dropout, the heat dissipated may  
exceed the maximum junction temperature of the part. If  
the junction temperature reaches approximately 150°C,  
both power switches will be turned off and the SW node  
will become high impedance.  
Figure 4:Power Lost VS Load Current  
1. The VIN quiescent current is due to two components:  
the DC bias current as given in the electrical  
characteristics and the internal main switch and  
synchronous switch gate charge currents. The gate  
charge current results from switching the gate  
capacitance of the internal power MOSFET switches.  
Each time the gate is switched from high to low to high  
again, a packet of charge, dQ, moves from VIN to  
ground. The resulting dQ/dt is the current out of VIN that  
is typically larger than  
To avoid the TD6815 from exceeding the maximum  
junction temperature, the user will need to do some  
thermal analysis. The goal of the thermal analysis is to  
determine whether the power dissipated exceeds the  
maximum junction temperature of the part. The  
temperature rise is given by:  
the DC bias current. In continuous mode, IGATECHG  
=f(QT + QB) where QT and QB are the gate charges of  
the internal top and bottom switches. Both the DC bias  
and gate charge losses are proportional to VIN and  
thustheir effects will be more pronounced at higher  
supply voltages.  
TR = (PD)(qJA)  
where PD is the power dissipated by the regulator and  
qJA is the thermal resistance from the junction of the die  
to the ambient temperature.  
2. I2R losses are calculated from the resistances of the  
internal switches, RSW, and external inductor RL. In  
continuous mode, the average output current flowing  
through inductor L is “chopped” between the main switch  
and the synchronous switch. Thus, the series resistance  
looking into the SW pin is a function of both top and  
bottom MOSFET RDS(ON) and the duty cycle (DC) as  
follows:  
The junction temperature, TJ, is given by:  
TJ = TA + TR  
where TA is the ambient temperature.  
As an example, consider the TD6815 in dropout at an  
input voltage of 2.7V, a load current of 800mA and an  
ambient temperature of 70°C. From the typical  
performance graph of switch resistance, the RDS(ON) of  
the P-channel switch at 70°C is approximately 0.52W.  
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Function Description(Cont.)  
Therefore,  
power dissipated by the part is:  
PD = ILOAD 2 • RDS(ON) = 187.2mW  
For the SOP8 package, the qJA is 250°C/ W. Thus, the  
junction temperature of the regulator is:  
TJ = 70°C + (0.1872)(250) = 116.8°C  
which is below the maximum junction temperature of  
125°C.  
Note that at higher supply voltages, the junction  
temperature is lower due to reduced switch resistance  
(RDS(ON)).  
Checking Transient Response  
The regulator loop response can be checked by looking  
at the load transient response. Switching regulators take  
several cycles to respond to a step in load current. When  
a load step occurs, VOUT immediately shifts by an  
amount equal to (ΔILOAD • ESR), where ESR is the  
effective series resistance of COUT. ΔILOAD also begins  
to charge or discharge COUT, which generates a  
feedback error signal. The regulator loop then acts to  
return VOUT to its steadystate value. During this  
recovery time VOUT can be monitored for overshoot or  
ringing that would indicate a stability problem. For a  
detailed explanation of switching control loop theory.  
A second, more severe transient is caused by switching  
in loads with large (>1μF) supply bypass capacitors. The  
discharged bypass capacitors are effectively put in  
parallel with COUT, causing a rapid drop in VOUT. No  
regulator can deliver enough current to prevent this  
problem if the load switch resistance is low and it is  
driven quickly. The only solution is to limit the rise time of  
the switch drive so that the load rise time is limited to  
approximately (25 • CLOAD).Thus, a 10μF capacitor  
charging to 3.3V would require a 250μs rise time, limiting  
the charging current to about 130mA.  
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Package Information  
SOP8 Package Outline Dimensions  
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TD6815  
Design Notes  
www.tongchuangwei.com  
July, 02, 2011.  
Techcode Semiconductor Limited  
17  

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