TM24RSG-5A-88 [ETC]
Modular Jack Connector for High-Speed Transmission; 模块化插孔连接器的高速传输
| 型号： | TM24RSG-5A-88 |
| 厂家： | 
ETC |
| 描述： | Modular Jack Connector for High-Speed Transmission |
| 文件： | 总5页 (文件大小：411K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
NEW
Modular Jack Connector for High-Speed Transmission
TM24R Series
Unique Contact Configuration
C
B
A-A
A
(Contact No. 1, 4, and 8)
A
B
C
B-B
(Contact No. 2, 5, and 7)
C-C
(Contact No. 3 and 6)
ꢀFeatures
1. Supports high-speed transmission
Meets requirements of 10G Ethernet standard
IEEE802.3an for FEXT, Return loss and Z bal.
Recommended board layout for differential routing
2. Unique contact configuration (Patented)
and board-mounting pattern
8
Differential pair 4
Differential pair 3
Differential pair 2
Differential pair 1
7
5
6
3
The adjacent contacts have different angles of
engagement thus increasing the distance between them,
in effect reducing the cross talk within connector and its
footprint.
4
1
2
Contact #3 and # 6, affecting the cross talk the most;
have been isolated from other contacts resulting in
maximum NEXT noise suppression.
In addition, the board layout allows easy tracing of the
differential signal lines.
3. Full EMI shielding
The entire connector is covered with a metal shell.
Multiple panel ground contact springs (2 on each side of
the mating opening) and 4 board ground connection
solder contacts placed at each corner of the connector
guarantee effective suppression of noise radiation.
4. Sequential mating
Panel ground
Board ground connection
solder contacts
contact springs
Separate ground springs (Patent pending) make contact
with the mating connector’s ground before the signal
contacts, allowing equalization of any ground differential.
Separate ground springs
Metal shell
5. Conforms to FCC (Federal Communications
Commission) standards
Meets requirements of FCC Title 47, Part 68, Subpart F.
Separation
ꢀApplications
LAN related equipment, measuring instruments, office
equipment and other high transmission speed applications
requiring use of high performance modular jacks.
Ground spring
2006.10
1
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
ꢀProduct Specifications
Current rating 1A
Voltage rating 125V AC
Ratings
Operating temperature range: -25ç to +80ç (Note)
Item
Specification
100M ohms min.
Conditions
100V DC
1. Insulation resistance
2. Withstanding voltage
(Basic terminal between 123-456-78)
3. Withstanding voltage
(Terminal to shield)
No flashover or insulation breakdown.
No flashover or insulation breakdown.
500V AC / one minute
1500V AC / one minute
4. Contact resistance
50m ohms max.
100mA
No electrical discontinuity of 5µs or more.
No damage, cracks, or parts dislocation.
No electrical discontinuity of 5µs or more.
Contact resistance: 60 m ohms max.
Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 3 axis,
10 cycles
5. Vibration
6. Shock
Acceleration of 490 m/s2, 11 ms duration, sine half-wave
waveform, 3 cycles / each of 3 axis
700 cycles
7. Durability (insertion/withdrawal) Contact resistance: 60 m ohms max.
(Temperature: -55ç ꢀ+15ç to +35ç ꢀ+85 ꢀ+15ç to +35ç
Duration: 30 ꢀ 2 to 3 ꢀ 30 ꢀ2 to 3 (Minutes)
5 cycles
Insulation resistance: 100 M ohms min.
8. Temperature cycle
Contact resistance: 60 m ohms max.
Insulation resistance: 1 M ohms min. (High hujmidity)
9. Humidity
500 hours at 40ç, HR 90% to 95%
5% water solution for 48 hours
Insulation resistance: 10 M ohms min. (Dry state)
10. Salt spray
Contact resistance: 60 m ohms max.
Note: Includes temperature rise caused by current flow.
Temperature range for mechanical operation : -25ç to +60ç
ꢀMaterials
Part
Material
PBT
Finish
Remarks
UL94V-0
Insulator
Contact
Shield
Color: Black
Contact area: Gold plated 1.27 µm
Termination area: Gold plated 0.03 µm
Under plate: Nickel plated 1µm
Tin reflow plated 1µm
Phosphor bronze
-------------
Brass
-------------
-------------
Phosphor bronze
Ground spring
Tin reflow plated 1µm
ꢀOrdering information
Series name
: TM24
1
2
3
4
5
6
Connector type
Shell type
: R... Jack
: SG... Separate ground spring –outer shell
: 5A... Right-angle dip
Jack type
TM24 R SG - 5A 8 8
Jack opening code
: 8... 8 contacts
Number of inserted contact : 8... 8 contacts
1
2
3
4
5 6
2
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
ꢀModular Jack Connectors
16
T M 2 4 R S G - 5 A - 8 8
15.5
(17.5 )
14
Contact
No.1
Contact No.8
0.43
1
13.25
15.25
1
1
0.25
6
11
Part number
CL No.
RoHS
YES
(17)
8.925
TM24RSG-5A-88
222-2946-7-00
BRecommended PCB mounting pattern
BRecommended panel cutout
15.25
13.25
11
15.9
7.112
8-Ø0.8(Signal line through hole
)
5.08
3.048
1.016
3
4.5MIN
2-Ø1.63(Separate ground spring through hole)
Board surface
8
4 1
7 5
2
6
3
4-Ø1.63(Outer shell through hole)
Board edge
Panel cutout bottom edge
2
No conductive traces
12.25MAX
18.25MIN
2
Lock lever
TM21P-88P
Plug
Board edge
2.4
Panel thickness: 2 mm max.
* Precautions and recommendations for board and panel design
1 . Recommended board thickness: 1.6 mm.
2 . No conductive traces in the crosshatched areas.
3 . Make sure that the panel cutout has enough clearance to assure free operation of the lock lever of the mating plug.
4 . Make sure that the panel cutout bottom edge is 0.15 mm below the board-mounting surface.
5 . Connector can be cleaned with isopropyl alcohol (IPA) at room temperature.
3
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales represent
■Signal Integrity Data
These are the representative values of the electrical performance demanded for modular connectors according to
IEEE802.3-an (10GBASE-T).
Measurement Outline Drawing
■
Measurement point : FEXT ■ Sdd21
Return Loss ■ Sdd11
Impedance Balance ■ Scd11
Through hole solder
Through hole solder
FEXT Data
■
(
)
Frequency GHz
4
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales represent
Return Loss Data
■
(
)
Frequency GHz
Impedance Balance Data
■
0
-10
-20
-30
-40
-50
-60
-70
-80
Pair1
Pair2
Pair3
Pair4
LIMIT
0
0.5
1
1.5
2
(
)
Frequency GHz
5
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