TR/3216LV-1A [ETC]
Fuse ; 保险丝\n
| 型号： | TR/3216LV-1A |
| 厂家： | 
ETC |
| 描述： | Fuse
|
| 文件： | 总2页 (文件大小：87K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
Bu s s m a n n
S MT Ch ip Fu s e
3 2 1 6 LV
S u b m in ia t u re S u rfa c e Mo u n t Fu s e s
1 2 5 V AC/DC
R
Dimensions - mm (inches)
3.20 ± 0.2
(0.126 ± 0.008)
1.60 ± 0.2
(0.063 ± 0.008)
.75
0.50 ± 0.25
(0.020 ± 0.010)
0.90 + 0.20, -0.15
(0.035 + 0.008, -0.006)
Construction
1. Ceramic Substrate
2. Glass Cover
3. Termination Pad
4. Metal Film Element
5. Silver End Termination
6. Nickel Barrier
(5.1–10.2µm)
7. 90/10 Tin-lead Plating
(7.6–12.7 µm)
Ca ta log Sym bol: 3216LV
Voltage Rating: 125V AC/DC
Interrupting Rating: 50 Amp AC/DC
Physical Size:
1
2
3
4
6
7
5
8
8. Marking
Drawing is not to scale.
EIA SOCM-3216AC (Equivalent to 1206)
3.2 ≈ 1.6 ≈ 0.90mm
0.126 ≈ 0.063 ≈ 0.035 in.
Time-Current Characteristics:
Fast-acting fuse: Will carry 100% of rated current for a mini-
mum of 4 hours, and will open within 5 seconds at 250% of
rated current.
Agency Approvals:
UL Recognized, Std. 248-14, File E19180, Guide JDYX2
CSA Component Acceptance, File 53787, Class 1422-30
General Information:
• Bussmann SMT Chip Fuses utilize thick and thin metal film
technologies for superior fusing action and enhanced
reliability.
• The fuse element is bonded to a ceramic substrate and
encapsulated with glass, providing excellent short-circuit
performance and environmental integrity. Predicted reliability
of the 3216LV chip fuse is 30 times greater than that of the
typical chip capacitor (consult Bussmann for details).
• Substrate and coating thermal expansion coefficients are
closely matched to that of FR-4 epoxy-glass circuit board
for superior solder joint reliability.
Packaging and Ordering Information:
• Tape and Reel: Standard 8mm tape, in compliance with
EIA-RS481 (equivalent to IEC 286, Part 3).
• Fuses are orientated in embossed pockets with ceramic
side facing up to facilitate proper mounting (See “Electrical
Characteristics”, General Note 4).
3216LV
(See Table)
Product
Symbol
Rated Current
Package Code
TR = 3,000 pieces on tape on a 178mm reel.
TR1 = 15,000 pieces on tape on a 330mm reel.
SP = 50 pieces on tape in a plastic box.
Contact Bussmann if other package quantities are required.
• The end terminations are over-plated with nickel and tin-lead.
CE logo denotes compliance with European Union Low Voltage Directive
(50-1000 VAC, 75-1500 VDC). Refer to BIF document #8002 or contact
Bussmann Application Engineering at 314-527-1270 for more information.
Electrical Characteristics
Current
Rating
(Ampere)
Mark
Appearing
On Part
Typical Melting
Integral @ 50A
(A2 * sec)
Typical Total
Clearing Integral
@ 50A (A2 * sec)
Typ. Resistance
@ ² 10% Rated Drop @ Rated
Current (Ohms) Current (Volts)
Typ. Voltage
Part Number
(XX=Package Code)
XX/3216LV-250mA
XX/3216LV-375mA
XX/3216LV-500mA
XX/3216LV-750mA
XX/3216LV-1A
AC
DC
AC
.00017
.0010
.0016
.0033
.022
DC
.0001
.0009
.0026
.0042
.0098
.027
.250
.375
.500
.750
1
.25
White Dot
0.5
.00016
.001
.000084
.0002
.0019
.00095
.0084
.021
4.50
1.80
1.15
.75
1.4
.73
.0014
.0033
.020
.66
.63
.63
.62
.49
.75
1
.52
XX/3216LV-1.25A
XX/3216LV-1.5A
General Notes:
1.25
1.5
White Æ
1.5
.035
.038
.40
.038
.024
.044
.033
.26
1. AC interrupting rating, melting integral and total clearing integral measured at 125V, unity power factor.
2. DC interrupting rating, melting integral and total clearing integral measured at 125V with a battery source.
3. Voltage drop measured at 23 ± 3°C ambient temperature with the device mounted on a suitable circuit board trace.
4. It is recommended that fuses be mounted with ceramic (white) side facing up.
5. Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended,
with further derating required at elevated ambient temperatures.
6. Contact Bussmann if higher ampere ratings are needed.
Form No. 3216LV
Page 1 of 2
BIF Doc #3006
12-16-98
SB98107 Rev. A
®
Bu s s m a n n
S MT Ch ip Fu s e
3 2 1 6 LV
S u b m in ia t u re S u rfa c e Mo u n t Fu s e s
1 2 5 V AC/DC
R
Tim e -Curre nt Cha ra c te ris tic Curve
E
F
(Full Size Curves Available)
D0
CURRENT
RATING
A0
10
W
B
0
P1
P
2
P
0
1
Ca rrie r Dim e ns ions - m m
W
8.0 + 0.3 / -0.1
3.5 ± 0.05
1.75 ± 0.1
2.0 ± 0.05
4.0 ± 0.1
F
E
P2
P0
P1
A0
B0
D0
.1
4.0 ± 0.1
1.73 ± 0.2
3.56 ± 0.2
1.5 + 0.1 / -0.0
Re c om m e nde d La nd Pa tte rn - m m (inc he s )
.01
2.80
1.80 to
2.00
.001
CURRENT IN AMPERES
1.20 to 1.40
4.20 to 4.40
Environm e nta l Spe c ific a tions
Ope ra ting Te m pe ra ture Ra nge :
-65 to +125°C, with proper derating.
1.60
The rm a l Shoc k:
NOTE: Trace geometry may affect fuse performance (time-cur-
rent characteristics ² 300% of rated current and voltage drop at
rated current).
MIL-STD-202, Method 107, Test Condition B (-65 to 125°C),
1000 cycles, fuses soldered to FR-4 glass-epoxy circuit
board.
Vibra tion:
MIL-STD-202, Method 204, Test Condition C (55 to 2000 HZ, 10G).
Solde ra bility:
Withstands 60 seconds above 200°C, 260°C maximum.
Mois ture Re s is ta nc e :
MIL-STD-202, Method 106, 10 day cycle.
Solde r Le a c h Re s is ta nc e & Te rm ina l Adhe s ion:
EIA-576 (30 seconds submersion in 260°C tin-lead solder).
The only controlled copy of this BIF document is the electronic read-only version located on the Bussmann Network Drive. All other copies of this BIF document are by definition uncontrolled. This bulletin
is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in
this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Form No. 3216LV
12-16-98
Page 2 of 2
SB98107 Rev. A
BIF Doc #3006
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