TXM-900-HP3-SPO_技术文档

HIGH-PERFORMANCE

RF MODULE

TXM-900-HP3-xxx

WIRELESS MADE SIMPLE ^®

HP3 SERIES TRANSMITTER MODULE DATA GUIDE

DESCRIPTION

1.290"

The HP3 RF transmitter module is the third

HP SERIES RF TRANSMITTER

generation of the popular HP Series. Like its

predecessors, the HP3 is designed for the cost-

0.680"

TXM-900-HP3-SP*

LOT 10000

effective, high-performance wireless transfer of

Pin Spacing: 0.1"

analog or digital information in the popular 902-

0.178"

928MHz band. HP3 Series parts feature eight

parallel selectable channels, and some versions

also add direct serial selection of 100 channels.

SIP Style

1.260"

To ensure reliable performance, the transmitter

HP SERIES RF TRANSMITTER

TXM-900-HP3-SP*

0.628"

employs FM / FSK modulation and a micro-

LOT 10000

processor controlled synthesized architecture.

0.150"

Both SMD and pinned packages are available.

When paired with an HP3 receiver, a reliable

link is created for the transfer of analog and

SMD Style

Figure 1: Package Dimensions

digital information up to 1,000 feet. As with all Linx modules, the HP3 requires no

tuning or additional RF components (except an antenna), making integration

straightforward, even for engineers without prior RF experience.

FEATURES

APPLICATIONS INCLUDE

8 parallel, 100 serial (PS Versions) user-

selectable channels

FM / FSK modulation for outstanding

performance and noise immunity

Precision frequency synthesized

architecture

Transparent analog / digital interface

Wide-range analog capability including

audio (50Hz to 28kHz)

Wireless Networks / Data Transfer

Wireless Analog / Audio

Home / Industrial Automation

Remote Access / Control

Remote Monitoring / Telemetry

Long-Range RFID

MIDI Links

Voice / Music / Intercom Links

Wide temperature range

(-30°C to +85°C)

No external RF

ORDERING INFORMATION

PART #

DESCRIPTION

components required

Compatible with previous

HP Series modules

Power-down and CTS

functions

Wide supply range

(2.8 to 13.0VDC)

High data rate

TXM-900-HP3-PPO

HP3 Transmitter (SIP 8 CH only)

HP3 Transmitter (SIP 8p / 100s CH)

HP3 Transmitter (SMD 8 CH only)

HP3 Transmitter (SMD 8p / 100s CH)

HP3 Development Kit (SIP Pkg.)

HP3 Development Kit (SMD Pkg.)

TXM-900-HP3-PPS

TXM-900-HP3-SPO

TXM-900-HP3-SPS

MDEV-900-HP3-PPS-USB

MDEV-900-HP3-PPS-RS232

MDEV-900-HP3-SPS-USB

MDEV-900-HP3-SPS-RS232

(up to 56kbps)

Pinned and SMD packages

No production tuning

Transmitters are supplied in tubes of 15 pcs.

Revised 1/28/08

ELECTRICAL SPECIFICATIONS

ABSOLUTE MAXIMUM RATINGS

Parameter

Designation

Min.

Typical

Max.

Units

Notes

Supply Voltage V_CC

-0.3

to

+18.0

V_CC

+85

VDC

°C

POWER SUPPLY

Operating Voltage

Any Input or Output Pin

Operating Temperature

Storage Temperature

Soldering Temperature

-0.3

-30

-45

V_CC

I_CC

2.8

–

3.0

14.0

–

13.0

17.0

15.0

VDC

mA

µA

–

1

2

+85

°C

Supply Current

+260°C for 10 seconds

Power-Down Current

I_PDN

–

TRANSMIT SECTION

*NOTE* Exceeding any of the limits of this section may lead to permanent

damage to the device. Furthermore, extended operation at these maximum

ratings may reduce the life of this device.

Transmit Frequency Range

F_C

902.62

–

927.62

MHz

3

Center Frequency Accuracy

Available Channels

Channel Spacing

–

-50

–

+50

100 (Ser.)

–

kHz

–

4

–

5

8 (Par.)

–

250

115

0

kHz

dBm

PERFORMANCE DATA

Occupied Bandwidth

Output Power

–

140

These performance parameters

are based on module operation at

25°C from a 5.0VDC supply unless

P_O

-3

+3

GND

ANT

NC

Spurious Emissions

Harmonic Emissions

–

-45

-60

–

dBm

6

P_H

-47

GND

NC

otherwise

illustrates

necessary

noted.

the

for

Figure

connections

testing and

2

NC

CS0

NC

GND

NC

Data Rate

–

100

50

–

56,000

28,000

bps

Hz

7

PC

Analog / Audio Bandwidth

Data Input:

CS1 / SS CLOCK

CS2 / SS D

CTS

PDN

VCC

NC

operation. It is recommended all

ground pins be connected to the

ground plane. The pins marked NC

have no electrical connection.

Logic Low

–

0.0

2.8

–

0.5

5.2

–

VDC

kΩ

kHz

–

8

5VDC

Logic High

–

Data Input Impedance

Frequency Deviation @ 3VDC

Frequency Deviation @ 5VDC

ANTENNA PORT

RF Output Impedance

200

70

115

MODE

DATA

NC

PC

60

90

110

140

GND

Figure 2: Test / Basic Application Circuit

R_OUT

–

50

–

Ω

–

TIMING

TYPICAL PERFORMANCE GRAPHS

Transmitter Turn-On Time

Channel Change Time

ENVIRONMENTAL

–

7.0

1.0

10.0

1.5

mSec

–

V

/ PDN

V

CC

/ PDN

CC

Operating Temperature Range

–

-30

–

+85

°C

–

Table 1: HP3 Series Transmitter Specifications

1

Notes

RX DATA

2.5mS

1. Over the entire operating voltage range.

2. With the PDN pin low.

3. Serial Mode.

CTS

4. 100 serial channels on the PS versions only.

5. Does not change over the 3-13VDC supply.

6. Into 50 ohms.

7. The receiver will not reliably hold a DC level. See the HP3 Series Receiver Module Data Guide for the

minimum transition rate.

2

CH1 1.00V CH2 2.00V

Delta 7.200mS

CH1 1.00V CH2 2.00V

2.5mS

Delta 7.200mS

Figure 3: Power-Up to CTS

Figure 4: TX Powerup to Valid RX Data

8. The voltage specified is the modulation pin voltage.

IN

*CAUTION*

OUT

This product incorporates numerous static-sensitive components.

Always wear an ESD wrist strap and observe proper ESD handling

procedures when working with this device. Failure to observe this

precaution may result in module damage or failure.

OUT

CH1 2.00V CH2 500mV

250μS

CH1 2.00V CH2 500mV

250μS

Figure 5: Sine Wave Modulation Linearity

Figure 6: Square Wave Modulation Linearity

Page 3

Page 2

PIN ASSIGNMENTS

PIN DESCRIPTIONS

Pin #

SMD Pinned

Pinned Transmitter

Surface-Mount Transmitter

Name

Equivalent Circuit

Description

1

2

3

4

5

6

7

8

9

GND

ANT

NC 24

NC 23

NC 22

NC 21

GND 20

NC 19

NC 18

NC 17

NC 16

NC 15

NC 14

GND 13

1, 3

13, 20

1

2

GND

ANT

Analog Ground

GND

NC

CS0

50Ω

RF

CS1 / SS CLOCK

CS2 / SS DATA

CTS

Out

2

50-ohm RF Output

Channel Select 0

PDN

10 VCC

11 MODE

12 DATA

25k

5

6

7

3

4

5

CS0

µ

CS0

CS1

CS2

Figure 7: HP3 Series Receiver Pinout

Channel Select 1 /

Serial Select Clock

CS1 /

SS CLOCK

25k

Pin #

Name

µ

Description

SMD SIP

Channel Select 2 /

Serial Select Data

CS2 /

SS DATA

25k

1

2

3

1

2

GND

ANT

GND

Analog Ground

50-ohm RF Output

µ

Analog Ground (SMD only)

No Electrical Connection. Soldered for physical support

only.

Clear-to-Send

Output

CTS

Out

4

5

NC

8

6

7

CTS

3

4

CS0

Channel Select 0

Channel Select 1 / Serial Select Clock. Channel Select 1

when in parallel channel selection mode, clock input for

serial channel selection mode.

Channel Select 2 / Serial Select Data. Channel Select 2

when in parallel channel selection mode, data input for

serial channel selection mode.

CS1 / SS

CLOCK

6

V_CC

430k

Power Down

(Active Low)

9

PDN

CS2 / SS

DATA

PDN

7

8

9

5

6

7

Clear-To-Send. This line will go high when the transmitter

is ready to accept data.

CTS

V_CC

10

11

8

Voltage Input 2.8-13V

Mode Select

Power Down. Pulling this line low will place the receiver

into a low-current state. The module will not be able to

receive a signal in this state.

PDN

V_CC

25k

9

MODE

µ

MODE

10

11

8

9

Supply Voltage

160k

100k

510k

Mode Select. GND for parallel channel selection, V_CCfor

serial channel selection

MODE

12

10

DATA

NC

Digital / Analog Input

20pF

Digital / Analog Data Input. This line will output the

demodulated digital data.

12

10

DATA

GND

NC

4,

14-19,

21-24

SMD (Only)

No Electrical Connection

13, 20

Analog Ground (SMD only)

14-19,

21-24

Page 4

Figure 8: Pin Functions and Equivalent Circuits

No Electrical Connection. Soldered for physical support

only. (SMD only)

Page 5

THEORY OF OPERATION

POWER-UP SEQUENCE

The HP3 Series transmitter is a high-performance, multi-channel RF transmitter

capable of transmitting both analog (FM) and digital (FSK) information. FM / FSK

modulation offers significant advantages over AM or OOK modulation methods,

including increased noise immunity and the receiver’s ability to capture in the

presence of multiple signals. This is especially helpful in crowded bands, such

as the one in which the HP3 operates.

The HP3 transmitter is controlled by an

on-board microprocessor. When power is

applied, a start-up sequence is initiated.

At the end of the start-up sequence, the

transmitter is ready to transmit data.

POWER ON

Parallel Mode

Serial Mode

Determine Mode

Read Channel-

Selection Inputs

Program Freq. Synth

To Default CH. 50

The adjacent figure shows the start-up

sequence. It is executed when power is

applied to the V_CCline or when the PDN

Crystal Oscillator

Begins to Operate

DATA

IN

Program Frequency

Synthesizer

28kHz Low Pass

line is taken high.

Ready for

Serial Data Input

Filter

Modulator

Crystal Oscillator

Begins to Operate

On power-up, the microprocessor reads

the external channel-selection lines and

sets the frequency synthesizer to the

appropriate channel. When the frequency

synthesizer has locked on to the proper

channel frequency, the circuit is ready to

accept data. This is acknowledged by the

CTS line transitioning high. The module

will then transmit data from the user’s

circuit.

MODE

CS0

CS1

μP

12MHz

Crystal

Program Frequency

Synthesizer

PLL

4MHz

Determine State of

CTS Output Line

Int. Osc.

Band Pass

Filter

CS2

Amplifier

Determine State of

CTS Output Line

Cycle Here Until

Channel

or Mode Change

RF OUT

VCO

Cycle Here Until More

Data Input, Mode Change,

or PLL Loses Lock

Figure 9: HP-3 Series Transmitter Block Diagram

A precision 12.00MHz Voltage Controlled Crystal Oscillator (VCXO) serves as

the frequency reference for the transmitter. Incoming data is filtered to limit the

bandwidth, and then used to directly modulate the reference. Direct reference

modulation inside the loop bandwidth provides fast start-up, while allowing a

wide modulation bandwidth and near DC modulation capability. This also

eliminates the need for code balancing.

Figure 10: Start-up Sequence

POWER SUPPLY

The HP3 incorporates a precision, low-dropout

regulator on-board, which allows operation over an

input voltage range of 2.8 to 13 volts DC. Despite this

regulator, it is still important to provide a supply that is

free of noise. Power supply noise can significantly

affect the transmitter modulation; therefore, providing

a clean power supply for the module should be a high

priority during design.

Vcc TO

MODULE

10Ω

The modulated 12.00MHz reference frequency is applied to the Phase-Locked

Loop (PLL). The PLL, combined with a 902 to 928MHz VCXO, forms a frequency

synthesizer that can be programmed to oscillate at the desired transmit

frequency. An on-board microcontroller manages the PLL programming and

greatly simplifies user interface. The microcontroller reads the channel selection

lines and programs the on-board synthesizer. This frees the designer from

complex programming requirements and allows for manual or software channel

selection. The microcontroller also monitors the status of the PLL and indicates

when the transmitter is ready to transmit data by pulling the CTS line high.

Vcc IN

+

10μF

Figure 11: Supply Filter

A 10Ω resistor in series with the supply followed by a

10µF tantalum capacitor from V_CCto ground will help in cases where the quality

of supply power is poor. This filter should be placed close to the module’s supply

lines. These values may need to be adjusted depending on the noise present on

the supply line.

The PLL-locked carrier is amplified to increase the output power of the

transmitter and to isolate the VCO from the antenna. The output of the buffer

amplifier is connected to a filter network, which suppresses harmonic emissions.

Finally, the signal reaches the single-ended antenna port, which is matched to

50 ohms to support commonly available antennas, such as those from Linx.

USING THE PDN PIN

The Power Down (PDN) line can be used to power down the transmitter without

the need for an external switch. This line has an internal pull-up, so when it is

held high or simply left floating, the module will be active.

CTS OUTPUT

When the PDN line is pulled to ground, the transmitter will enter into a low-

current (<15µA) power-down mode. During this time, the transmitter is off and

cannot perform any function.

The Clear-To-Send (CTS) output goes high to indicate that the transmitter PLL

is locked and the module is ready to accept data. In a typical application, a

microcontroller will raise the PDN line high and begin to monitor the CTS line.

When the line goes high, the microcontroller will start sending data. It is not

necessary to use the CTS output, but if not used, the circuit should wait a

minimum of 10mS after raising the PDN line high before transmitting data. If data

is being sent redundantly, there is generally no need to monitor the CTS line or

to wait a fixed time, though the initial bits may not get through.

The PDN line allows easy control of the transmitter state from external

components, such as a microcontroller. By periodically activating the transmitter,

sending data, then powering down, the transmitter’s average current

consumption can be greatly reduced, saving power in battery-operated

applications.

Page 6

Page 7

ADJUSTING THE OUTPUT POWER

TIMING CONSIDERATIONS

Depending on the type of antenna being used, the output power of the

transmitter may be higher than FCC regulations allow. It is intentionally set high

to compensate for losses resulting from inefficient antennas. Since attenuation is

often required, it is generally wise to provide for its implementation so that the

FCC test lab can easily attenuate the transmitter to the maximum legal limit.

Timing plays a key role in link reliability, especially when the modules are being

rapidly turned on and off or hopping channels. Unlike a wire, allowance must be

made for the programming and settling times of both the transmitter and

receiver, or portions of the signal will be lost. There are two major timing

considerations the engineer must consider when designing with the HP3 Series

transmitter. These are shown in the table below. The stated timing parameters

assume a stable supply of 2.8 volts or greater. They do not include the charging

times of external capacitance on the module’s supply lines, the overhead of

external software execution, or power supply rise times.

A T-pad is a network of three

resistors that allows for variable

attenuation while maintaining the

correct match to the antenna. An

example layout is shown in the

adjacent figure. For more details

on T-pad attenuators, please

see Application Note AN-00150.

ANTENNA

R1

RF

MODULE

R2

Parameter

Description

Max.

10.0mS

1.5mS

GROUND PLANE

ON LOWER LAYER

T1

T2

Transmitter turn-on time

Channel change time (time to valid data)

GROUND

Figure 12: T-Pad Attenuator Example Layout

T1 is the maximum time required for the transmitter to power-up and lock on-

channel. This time is measured from the application of V_CCto the CTS line

INPUTTING DIGITAL DATA

transitioning high.

T2 is the worst-case time needed for a powered-up module to switch between

channels after a valid channel selection. This time does not include external

overhead for loading a desired channel in Serial Channel Select Mode.

The DATA line may be directly connected to virtually any digital peripheral,

including microcontrollers, encoders, and UARTs. It has an impedance of 200kΩ

and can be used with any data that transitions from 0V to a 3 to 5V peak

amplitude within the specified data rate of the module. While it is possible to send

data at higher rates, the internal filter will cause severe roll off and attenuation.

Normally, the transmitter will be turned off after each transmission. This is

courteous use of the airwaves and reduces power consumption. The transmitter

may be shut down by switching its supply or the PDN line. When the transmitter

is again powered up, allowance must be made for the requirements above.

Many RF products require a fixed data rate or place tight constraints on the mark

/ space ratio of the data being sent. The HP3 transmitter architecture eliminates

such considerations and allows virtually any signal, including PWM, Manchester,

and NRZ data, to be sent at rates from 100bps to 56kbps.

In many cases, the transmitter will lock more quickly than the times indicated.

When turn-around time or power consumption are critical, the CTS line can be

monitored so data may be sent immediately upon transmitter readiness.

The HP3 does not encode or packetize the data in any manner. This

transparency gives the designer great freedom in software and protocol

development. A designer may also find creative ways to utilize the ability of the

transmitter to accept both digital and analog signals. For example, an application

might transmit voice, then send out a digital control command. Such mixed mode

systems can greatly enhance the function and versatility of many products.

TRANSMITTING DATA

Once an RF link has been established, the challenge becomes how to effectively

transfer data across it. While a properly designed RF link provides reliable data

transfer under most conditions, there are still distinct differences from a wired link

that must be addressed. Since the modules do not incorporate internal encoding

or decoding, the user has tremendous flexibility in how data is handled.

INPUTTING ANALOG SIGNALS

Analog signals from 50Hz to 28kHz may be connected directly to the

transmitter’s DATA line. The HP3 is a single supply device and, as such, is not

capable of operating in the negative voltage range. Analog sources should be

within 0 to 5V_P-Pand should, in most cases, be AC-coupled into the DATA line

It is important to separate the types of transmissions that are technically possible

from those that are legally allowed in the country of operation. Application Notes

AN-00126, AN-00140 and Part 15, Section 249 of the FCC rules should be

reviewed for details on acceptable transmission content in the U.S.

to achieve the best performance. The size of the coupling capacitor should be

large enough to ensure the passage of all desired frequencies and small enough

to allow the start-up time desired. Since the modulation voltage applied to the

DATA line determines the carrier deviation, distortion can occur if the DATA line

is over-driven. The actual level of the input waveform should be adjusted to

achieve optimum in-circuit results for your application.

If you want to transfer simple control or status signals (such as button presses)

and your product does not have a microprocessor or you wish to avoid protocol

development, consider using an encoder / decoder IC set. These chips are

available from several manufacturers, including Linx. They take care of all

encoding and decoding functions and provide a number of data lines to which

switches can be directly connected. Address bits are usually provided for

security and to allow the addressing of multiple receivers independently. These

ICs are an excellent way to bring basic remote control products to market quickly

and inexpensively. It is also a simple task to interface with inexpensive

microprocessors or one of many IR, remote control, DTMF, or modem ICs.

The HP3 is capable of providing audio quality comparable to a radio or intercom.

In applications where higher quality audio is required, a compandor may be

employed to increase dynamic range and reduce noise. If true high-fidelity audio

is required, the HP3 is probably not the best choice, as it is optimized for data.

Page 8

Page 9

CHANNEL SELECTION

Parallel Selection

SERIAL CHANNEL SELECTION TABLE

CHANNEL TX FREQUENCY

RX LO

867.92

868.17

868.42

868.67

868.92

869.17

869.42

869.67

869.92

870.17

870.42

870.67

870.92

871.17

871.42

871.67

871.92

872.17

872.42

872.67

872.92

873.17

873.42

873.67

873.92

874.17

874.42

874.67

874.92

875.17

875.42

875.67

875.92

876.17

876.42

876.67

876.92

877.17

877.42

877.67

877.92

878.17

878.42

878.67

878.92

879.17

879.42

879.67

879.92

880.17

880.42

CHANNEL

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

TX FREQUENCY

915.37

915.62

915.87

916.12

916.37

916.62

916.87

917.12

917.37

917.62

917.87

918.12

918.37

918.62

918.87

919.12

919.37

919.62

919.87

920.12

920.37

920.62

920.87

921.12

921.37

921.62

921.87

922.12

922.37

922.62

922.87

923.12

923.37

923.62

923.87

924.12

924.37

924.62

924.87

925.12

925.37

925.62

925.87

926.12

926.37

926.62

926.87

927.12

927.37

927.62

RX LO

880.67

880.92

881.17

881.42

881.67

881.92

882.17

882.42

882.67

882.92

883.17

883.42

883.67

883.92

884.17

884.42

884.67

884.92

885.17

885.42

885.67

885.92

886.17

886.42

886.67

886.92

887.17

887.42

887.67

887.92

888.17

888.42

888.67

888.92

889.17

889.42

889.67

889.92

890.17

890.42

890.67

890.92

891.17

891.42

891.67

891.92

892.17

892.42

892.67

892.92

CS2

0

1

CS1

0

1

0

1

CS0

0

1

0

1

0

1

0

1

Channel

Frequency

903.37

906.37

907.87

909.37

912.37

915.37

919.87

921.37

0

1

2

3

4

5

6

7

902.62

902.87

903.12

903.37

903.62

903.87

904.12

904.37

904.62

904.87

905.12

905.37

905.62

905.87

906.12

906.37

906.62

906.87

907.12

907.37

907.62

907.87

908.12

908.37

908.62

908.87

909.12

909.37

909.62

909.87

910.12

910.37

910.62

910.87

911.12

911.37

911.62

911.87

912.12

912.37

912.62

912.87

913.12

913.37

913.62

913.87

914.12

914.37

914.62

914.87

915.12

0

1

2

3

4

5

6

7

All HP3 transmitter models feature

eight parallel selectable channels.

Parallel Mode is selected by

grounding the MODE line. In this

mode, channel selection is deter-

mined by the logic states of pins CS0,

CS1, and CS2, as shown in the table.

A ‘0’ represents ground and a ‘1’ the supply. The on-board microprocessor

performs all PLL loading functions, eliminating external programming and

allowing channel selection via DIP switches or a product’s processor.

Table 2: Parallel Channel Selection Table

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50*

Serial Selection

In addition to the Parallel Mode, PS versions of the HP3 also feature 100 serially

selectable channels. The Serial Mode is entered when the MODE line is left open

or held high. In this condition, CS1 and CS2 become a synchronous serial port,

with CS1 serving as the clock line and CS2 as the data line. The module is easily

programmed by sending and latching the binary number (0 to 100) of the desired

channel (see the adjacent Serial Channel Selection Table). With no additional

effort, the module’s microprocessor handles the complex PLL loading functions.

The Serial Mode is

straightforward; however,

minimum timings and bit

order must be followed.

Loading is initiated by

taking the clock line high

and the data line low as

Variable Data

Note 2

Note 1

Data

1

2

3

4

5

6

7

8

Clock

T0

1ms

T3

Note 3

T4

5µs

8µs

T2

T1

25µs

5µs

shown.

The

eight-bit

1) Loading begins when clock line is high and data line is taken low

2) Ensure that edge is fully risen prior to high-clock transition

3) Both lines high triggers automatic latch

channel number is then

clocked-in one bit at a

time, with the LSB first.

(T0) Time between packets or prior to data startup ................................1mS min.

(T1) Data-LO / Clock-HI to Data-LO / Clock-LO.......................................25

(T2) Clock-LO to Clock-HI ...........................................................................5

(T3) Clock-HI to Clock-LO ...........................................................................8

(T4) Data-HI / Clock-HI .................................................................................5

Total Packet Time ......................................................................................157

µ

S min.

Figure 13: PLL Serial Data Timing

There is no maximum time for this process, only the minimum times that must be

observed. After the eighth bit, both the clock and data lines should be taken high

to trigger the automatic data latch. A typical software routine can complete the

loading sequence in under 200μS. Sample code is available on the Linx website.

NOTE: When the module is powered up in the Serial Mode, it will default to channel 50 until changed

by user software. This allows testing apart from external programming and prevents out-of-band

operation. When programmed properly, the dwell time on this default channel can be less than 200μS.

Channel 50 is not counted as a usable channel since data errors may occur as transmitters also default

to channel 50 on startup. If a loading error occurs, such as a channel number >100 or a timing problem,

the receiver will default to serial channel 0. This is useful for debugging as it verifies serial port activity.

= Also available in Parallel Mode

*See NOTE on previous page.

Page 10

Page 11

PROTOCOL GUIDELINES

TYPICAL APPLICATIONS

While many RF solutions impose data formatting and balancing requirements,

Linx RF modules do not encode or packetize the signal content in any manner.

The received signal will be affected by such factors as noise, edge jitter, and

interference, but it is not purposefully manipulated or altered by the modules.

This gives the designer tremendous flexibility for protocol design and interface.

The figure below shows a typical RS-232 circuit using the HP3 Series transmitter

and a Maxim MAX232. The MAX232 converts RS-232 compliant signals to a

serial data stream, which the transmitter then sends. The MODE line is

grounded, so the channels are selected by the DIP switches.

VCC

Despite this transparency and ease of use, it must be recognized that there are

distinct differences between a wired and a wireless environment. Issues such as

interference and contention must be understood and allowed for in the design

process. To learn more about protocol considerations, we suggest you read Linx

Application Note AN-00160.

C1

4.7uF

+

C2

4.7uF

DB-9

1

6

2

7

3

8

4

9

5

1

2

24

23

22

21

20

19

18

17

16

GND

ANT

NC

+

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

GND

C3

4.7uF

C1+

V+

C1-

C2+

C2-

V-

VCC

GND

T1OUT

R1IN

R1OUT

T1IN

T2IN

3

GND

NC

4

5

6

NC

Errors from interference or changing signal conditions can cause corruption of

the data packet, so it is generally wise to structure the data being sent into small

packets. This allows errors to be managed without affecting large amounts of

data. A simple checksum or CRC could be used for basic error detection. Once

an error is detected, the protocol designer may wish to simply discard the corrupt

data or implement a more sophisticated scheme to correct it.

CS0

GND

NC

+

C4

4.7uF

CS1 / SS CLOCK

CS2 / SS DATA

CTS

PDN

VCC

GND

VCC

T2OUT

R2IN

7

NC

R2OUT

8

9

10

11

12

MAX232

GND

C5

4.7uF

14

13

GND

MODE

NC

DATA

GND

TXM-900-HP3

GND

INTERFERENCE CONSIDERATIONS

Figure 14: HP3 Transmitter and MAX232 IC

The RF spectrum is crowded and the potential for conflict with other unwanted

sources of RF is very real. While all RF products are at risk from interference, its

effects can be minimized by better understanding its characteristics.

The figure below shows a circuit using the QS Series USB module. The QS

converts USB compliant signals from a PC to serial data to be sent to the

transmitter. The MODE line is high, so the module is in Serial Channel Select

Mode. The RTS and DTR lines are used to load the channels. Application Note

AN-00155 shows sample source code that can be adapted to use on a PC. The

QS Series Data Guide and Application Note AN-00200 discuss the hardware

and software set-up required for QS Series modules.

Interference may come from internal or external sources. The first step is to

eliminate interference from noise sources on the board. This means paying

careful attention to layout, grounding, filtering, and bypassing in order to

eliminate all radiated and conducted interference paths. For many products, this

is straightforward; however, products containing components such as switching

power supplies, motors, crystals, and other potential sources of noise must be

approached with care. Comparing your own design with a Linx evaluation board

can help to determine if and at what level design-specific interference is present.

USB-B CONNECTOR

4

GND

DAT+

DAT -

5V

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

24

23

22

21

20

19

18

3

USBDP

USBDM

GND

RI

DCD

GND

ANT

NC

1

DSR

GND

NC

External interference can manifest itself in a variety of ways. Low-level

interference will produce noise and hashing on the output and reduce the link’s

overall range.

VCC

DATA_IN

NC

CS0

NC

GND

NC

GND

SUSP_IND DATA_OUT

GND GND

RX_IND

TX_IND

485_TX

RTS

CTS

DTR

CS1 / SS CLOCK

CS2 / SS DATA

CTS

NC

High-level interference is caused by nearby products sharing the same

frequency or from near-band high-power devices. It can even come from your

own products if more than one transmitter is active in the same area. It is

important to remember that only one transmitter at a time can occupy a

frequency, regardless of the coding of the transmitted signal. This type of

interference is less common than those mentioned previously, but in severe

cases it can prevent all useful function of the affected device.

9

VCC

PDN

VCC

SDM-USB-QS

NC

11

12

14

13

MODE

DATA

GND

TXM-900-HP3

GND

Figure 15: HP3 Transmitter and Linx QS Series USB Module

The transmitter can also be connected to a microcontroller, which will generate

the data based on specific actions. A UART may be employed or an I / O line

may be “bit banged” to send the data to the transmitter. The transmitter may be

connected directly to the microcontroller without the need for buffering or

amplification.

Although technically it is not interference, multipath is also a factor to be

understood. Multipath is a term used to refer to the signal cancellation effects

that occur when RF waves arrive at the receiver in different phase relationships.

This effect is a particularly significant factor in interior environments where

objects provide many different signal reflection paths. Multipath cancellation

results in lowered signal levels at the receiver and, thus, shorter useful distances

for the link.

Page 12

Page 13

BOARD LAYOUT GUIDELINES

MICROSTRIP DETAILS

If you are at all familiar with RF devices, you may be concerned about

specialized board layout requirements. Fortunately, because of the care taken by

Linx in designing the modules, integrating them is very straightforward. Despite

this ease of application, it is still necessary to maintain respect for the RF stage

and exercise appropriate care in layout and application in order to maximize

performance and ensure reliable operation. The antenna can also be influenced

by layout choices. Please review this data guide in its entirety prior to beginning

your design. By adhering to good layout principles and observing some basic

design rules, you will be on the path to RF success.

A transmission line is a medium whereby RF energy is transferred from one

place to another with minimal loss. This is a critical factor, especially in high-

frequency products like Linx RF modules, because the trace leading to the

module’s antenna can effectively contribute to the length of the antenna,

changing its resonant bandwidth. In order to minimize loss and detuning, some

form of transmission line between the antenna and the module should be used,

unless the antenna can be placed very close (<1/8in.) to the module. One

common form of transmission line is a coax cable, another is the microstrip. This

term refers to a PCB trace running over a ground plane that is designed to serve

as a transmission line between the module and the antenna. The width is based

on the desired characteristic impedance of the line, the thickness of the PCB,

and the dielectric constant of the board material. For standard 0.062in thick FR-

4 board material, the trace width would be 111 mils. The correct trace width can

be calculated for other widths and materials using the information below. Handy

software for calculating microstrip lines is also available on the Linx website,

www.linxtechnologies.com.

The adjacent figure shows the suggested

PCB footprint for the module. The actual pad

GRROUND PLANE

ONN LLOOWER LAYER

dimensions are shown in the Pad Layout

section of this manual. A ground plane (as

large as possible) should be placed on a

lower layer of your PC board opposite the

module. This ground plane can also be critical

to the performance of your antenna, which will

be discussed later. There should not be any

Trace

ground or traces under the module on the

same layer as the module, just bare PCB.

Figure 16: Suggested PCB Layout

Board

During prototyping, the module should be soldered to a properly laid-out circuit

board. The use of prototyping or “perf” boards will result in horrible performance

and is strongly discouraged.

Ground plane

No conductive items should be placed within 0.15in of the module’s top or sides.

Do not route PCB traces directly under the module. The underside of the module

has numerous signal-bearing traces and vias that could short or couple to traces

on the product’s circuit board.

The module’s ground lines should each have their own via to the ground plane

and be as short as possible.

AM / OOK receivers are particularly subject to noise. The module should, as

much as reasonably possible, be isolated from other components on your PCB,

especially high-frequency circuitry such as crystal oscillators, switching power

supplies, and high-speed bus lines. Make sure internal wiring is routed away

from the module and antenna, and is secured to prevent displacement.

The power supply filter should be placed close to the module’s V_CCline.

In some instances, a designer may wish to encapsulate or “pot” the product.

Many Linx customers have done this successfully; however, there are a wide

variety of potting compounds with varying dielectric properties. Since such

compounds can considerably impact RF performance, it is the responsibility of

the designer to carefully evaluate and qualify the impact and suitability of such

materials.

Figure 17: Microstrip Formulas

Effective Dielectric

Constant

Characteristic

Impedance

Dielectric Constant Width/Height (W/d)

The trace from the module to the antenna should be kept as short as possible.

A simple trace is suitable for runs up to 1/8-inch for antennas with wide

bandwidth characteristics. For longer runs or to avoid detuning narrow bandwidth

antennas, such as a helical, use a 50-ohm coax or 50-ohm microstrip

transmission line as described in the following section.

4.80

4.00

2.55

1.8

2.0

3.0

3.59

3.07

2.12

50.0

51.0

48.0

Page 14

Page 15

PAD LAYOUT

AUTOMATED ASSEMBLY

The following pad layout diagram is designed to facilitate both hand and

automated assembly.

For high-volume assembly, most users will want to auto-place the modules. The

modules have been designed to maintain compatibility with reflow processing

techniques; however, due to the their hybrid nature, certain aspects of the

assembly process are far more critical than for other component types.

Pinned Transmitter

Surface-Mount Transmitter

0.065

Following are brief discussions of the three primary areas where caution must be

observed.

0.070

0.060

0.100

Reflow Temperature Profile

0.060

0.3"

0.628

The single most critical stage in the automated assembly process is the reflow

stage. The reflow profile below should not be exceeded, since excessive

temperatures or transport times during reflow will irreparably damage the

modules. Assembly personnel will need to pay careful attention to the oven’s

profile to ensure that it meets the requirements necessary to successfully reflow

all components while still remaining within the limits mandated by the modules.

The figure below shows the recommended reflow oven profile for the modules.

0.030 Dia. Finished

0.100

Figure 18: Recommended PCB Layout

PRODUCTION GUIDELINES

300

Recommended RoHS Profile

Max RoHS Profile

Recommended Non-RoHS Profile

The modules are housed in a hybrid SMD package that supports hand or

automated assembly techniques. Since the modules contain discrete

components internally, the assembly procedures are critical to ensuring the

reliable function of the modules. The following procedures should be reviewed

with and practiced by all assembly personnel.

255°C

250

200

150

100

50

235°C

217°C

185°C

180°C

HAND ASSEMBLY

Pads located on the bottom of the

module are the primary mounting

surface. Since these pads are

inaccessible during mounting,

castellations that run up the side of

the module have been provided to

facilitate solder wicking to the

module’s underside. This allows for

very quick hand soldering for

Soldering Iron

125°C

Tip

Solder

PCB Pads

0

30

60

90

120

150

Time (Seconds)

180

210

240

270

300

330

360

Castellations

prototyping and small volume

Figure 20: Maximum Reflow Profile

Figure 19: Soldering Technique

production.

If the recommended pad guidelines have been followed, the pads will protrude

slightly past the edge of the module. Use a fine soldering tip to heat the board

pad and the castellation, then introduce solder to the pad at the module’s edge.

The solder will wick underneath the module, providing reliable attachment. Tack

one module corner first and then work around the device, taking care not to

exceed the times listed below.

Shock During Reflow Transport

Since some internal module components may reflow along with the components

placed on the board being assembled, it is imperative that the modules not be

subjected to shock or vibration during the time solder is liquid. Should a shock

be applied, some internal components could be lifted from their pads, causing

the module to not function properly.

Washability

Absolute Maximum Solder Times

The modules are wash resistant, but are not hermetically sealed. Linx

recommends wash-free manufacturing; however, the modules can be subjected

to a wash cycle provided that a drying time is allowed prior to applying electrical

power to the modules. The drying time should be sufficient to allow any moisture

that may have migrated into the module to evaporate, thus eliminating the

potential for shorting damage during power-up or testing. If the wash contains

contaminants, the performance may be adversely affected, even after drying.

Hand-Solder Temp. TX +225°C for 10 Seconds

Hand-Solder Temp. RX +225°C for 10 Seconds

Recommended Solder Melting Point +180°C

Reflow Oven: +220°C Max. (See adjoining diagram)

Page 16

Page 17

ANTENNA CONSIDERATIONS

GENERAL ANTENNA RULES

The choice of antennas is a critical

The following general rules should help in maximizing antenna performance.

and

consideration.

often

overlooked

The

design

range,

1. Proximity to objects such as a user’s hand, body, or metal objects will cause an

antenna to detune. For this reason, the antenna shaft and tip should be

positioned as far away from such objects as possible.

performance, and legality of an RF link

are critically dependent upon the

antenna. While adequate antenna

performance can often be obtained by

trial and error methods, antenna

design and matching is a complex

2. Optimum performance will be obtained

from a 1/4- or 1/2-wave straight whip

mounted at a right angle to the ground

plane. In many cases, this isn’t desirable

OPTIMUM

for practical or ergonomic reasons, thus,

NOT RECOMMENDED

task.

A

professionally designed

Figure 21: Linx Antennas

USEABLE

an alternative antenna style such as a

helical, loop, or patch may be utilized

antenna, such as those from Linx, will

help ensure maximum performance and FCC compliance.

Figure 23: Ground Plane Orientation

and the corresponding sacrifice in performance accepted.

Linx transmitter modules typically have an output power that is slightly higher

than the legal limits. This allows the designer to use an inefficient antenna, such

as a loop trace or helical, to meet size, cost, or cosmetic requirements and still

achieve full legal output power for maximum range. If an efficient antenna is

used, then some attenuation of the output power will likely be needed. This can

easily be accomplished by using the LADJ line or a T-pad attenuator. For more

details on T-pad attenuator design, please see Application Note AN-00150.

3. If an internal antenna is to be used, keep it away from other metal components,

particularly large items like transformers, batteries, PCB tracks, and ground

planes. In many cases, the space around the antenna is as important as the

antenna itself. Objects in close proximity to the antenna can cause direct

detuning, while those farther away will alter the antenna’s symmetry.

4. In many antenna designs, particularly 1/4-wave

VERTICAL λ/4 GROUNDED

ANTENNA (MARCONI)

whips, the ground plane acts as a counterpoise,

forming, in essence, a 1/2-wave dipole. For this

reason, adequate ground plane area is essential.

A receiver antenna should be optimized for the frequency or band in which the

receiver operates and to minimize the reception of off-frequency signals. The

efficiency of the receiver’s antenna is critical to maximizing range performance.

Unlike the transmitter antenna, where legal operation may mandate attenuation

or a reduction in antenna efficiency, the receiver’s antenna should be optimized

as much as is practical.

E

DIPOLE

ELEMENT

λ/4

The ground plane can be a metal case or ground-fill

I

areas on a circuit board. Ideally, it should have a

surface area > the overall length of the 1/4-wave

radiating element. This is often not practical due to

size and configuration constraints. In these

instances, a designer must make the best use of the

area available to create as much ground plane as

GROUND

PLANE

VIRTUAL λ/4

DIPOLE

λ/4

It is usually best to utilize a basic quarter-wave whip until your prototype product

is operating satisfactorily. Other antennas can then be evaluated based on the

cost, size, and cosmetic requirements of the product. You may wish to review

Application Note AN-00500 “Antennas: Design, Application, Performance”

Figure 24: Dipole Antenna

possible in proximity to the base of the antenna. In cases where the antenna is

remotely located or the antenna is not in close proximity to a circuit board,

ground plane, or grounded metal case, a metal plate may be used to maximize

the antenna’s performance.

ANTENNA SHARING

In cases where a transmitter and receiver

module are combined to form a transceiver,

0.1μF

it is often advantageous to share a single

Module

V

DD

Transmitter

^0.1μF

Antenna

5. Remove the antenna as far as possible from potential interference sources. Any

frequency of sufficient amplitude to enter the receiver’s front end will reduce

system range and can even prevent reception entirely. Switching power

supplies, oscillators, or even relays can also be significant sources of potential

interference. The single best weapon against such problems is attention to

placement and layout. Filter the module’s power supply with a high-frequency

bypass capacitor. Place adequate ground plane under potential sources of noise

to shunt noise to ground and prevent it from coupling to the RF stage. Shield

noisy board areas whenever practical.

antenna. To accomplish this, an antenna

switch must be used to provide isolation

between the modules so that the full

^0.1μF

GND

^0.1μF

GND

Receiver

Module

transmitter output power is not put on the

^0.1μF

sensitive front end of the receiver. There

Select

are a wide variety of antenna switches that

are cost-effective and easy to use. Among

Figure 22: Typical Antenna Switch

the most popular are switches from Macom and NEC. Look for an antenna

switch that has high isolation and low loss at the desired frequency of operation.

Generally, the Tx or Rx status of a switch will be controlled by a product’s

microprocessor, but the user may also make the selection manually. In some

cases, where the characteristics of the Tx and Rx antennas need to be different

or antenna switch losses are unacceptable, it may be more appropriate to utilize

two discrete antennas.

6. In some applications, it is advantageous to

place the module and antenna away from the

CASE

main equipment. This can avoid interference

problems and allows the antenna to be

oriented for optimum performance. Always use

GROUND PLANE

NUT

(MAY BE NEEDED)

50Ω coax, like RG-174, for the remote feed.

Figure 25: Remote Ground Plane

Page 19

Page 18

COMMON ANTENNA STYLES

ONLINE RESOURCES

There are literally hundreds of antenna styles and variations that can be

employed with Linx RF modules. Following is a brief discussion of the styles

most commonly utilized. Additional antenna information can be found in Linx

Application Notes AN-00100, AN-00140, and AN-00500. Linx antennas and

connectors offer outstanding performance at a low price.

®

www.linxtechnologies.com

• Latest News

A whip-style antenna provides outstanding overall performance

Whip Style

and stability. A low-cost whip is can be easily fabricated from a

wire or rod, but most designers opt for the consistent

performance and cosmetic appeal of a professionally-made

model. To meet this need, Linx offers a wide variety of straight

and reduced-height whip-style antennas in permanent and

connectorized mounting styles.

• Data Guides

• Application Notes

• Knowledgebase

• Software Updates

The wavelength of the operational frequency determines an

antenna’s overall length. Since a full wavelength is often quite

If you have questions regarding any Linx product and have Internet access,

make www.linxtechnologies.com your first stop. Our website is organized in an

intuitive format to immediately give you the answers you need. Day or night, the

Linx website gives you instant access to the latest information regarding the

products and services of Linx. It’s all here: manual and software updates,

application notes, a comprehensive knowledgebase, FCC information, and much

more. Be sure to visit often!

long, a partial 1/2- or 1/4-wave antenna is normally employed.

Its size and natural radiation resistance make it well matched to

Linx modules. The proper length for a straight 1/4-wave can be

easily determined using the adjacent formula. It is also possible

to reduce the overall height of the antenna by using a helical

winding. This reduces the antenna’s bandwidth, but is a great

way to minimize the antenna’s physical size for compact

applications. This also means that the physical appearance is

not always an indicator of the antenna’s frequency.

234

L =

F

MHz

Where:

L

= length in feet of

quarter-wave length

F = operating frequency

in megahertz

Specialty Styles

Linx offers a wide variety of specialized antenna styles.

Many of these styles utilize helical elements to reduce the

overall antenna size while maintaining reasonable

performance. A helical antenna’s bandwidth is often quite

narrow and the antenna can detune in proximity to other

objects, so care must be exercised in layout and placement.

www.antennafactor.com

The Antenna Factor division of Linx offers

a diverse array of antenna styles, many of

which are optimized for use with our RF

modules. From innovative embeddable

antennas to low-cost whips, domes to

Yagis, and even GPS, Antenna Factor

likely has an antenna for you, or can

design one to meet your requirements.

A loop- or trace-style antenna is normally printed directly on a

product’s PCB. This makes it the most cost-effective of antenna

styles. The element can be made self-resonant or externally

resonated with discrete components, but its actual layout is

usually product specific. Despite the cost advantages, loop-style

antennas are generally inefficient and useful only for short-range

applications. They are also very sensitive to changes in layout and

PCB dielectric, which can cause consistency issues during

production. In addition, printed styles are difficult to engineer,

requiring the use of expensive equipment, including a network

analyzer. An improperly designed loop will have a high SWR at the

desired frequency, which can cause instability in the RF stage.

Loop Style

www.connectorcity.com

Through its Connector City division, Linx offers a wide

selection of high-quality RF connectors, including FCC-

compliant types such as RP-SMAs that are an ideal

match for our modules and antennas. Connector City

focuses on high-volume OEM requirements, which

allows standard and custom RF connectors to be offered

at a remarkably low cost.

Linx offers low-cost planar and chip antennas that mount directly

to a product’s PCB. These tiny antennas do not require testing and

provide excellent performance in light of their small size. They

offer a preferable alternative to the often-problematic “printed”

antenna.

Page 20

Page 21

LEGAL CONSIDERATIONS

ACHIEVING A SUCCESSFUL RF IMPLEMENTATION

Adding an RF stage brings an exciting new

DECIDE TO UTILIZE RF

NOTE: Linx RF modules are designed as component devices that require

external components to function. The modules are intended to allow for full Part

15 compliance; however, they are not approved by the FCC or any other agency

worldwide. The purchaser understands that approvals may be required prior to

the sale or operation of the device, and agrees to utilize the component in keeping

with all laws governing its use in the country of operation.

dimension to any product. It also means that

additional effort and commitment will be needed to

bring the product successfully to market. By utilizing

premade RF modules, such as the LR Series, the

design and approval process is greatly simplified. It

is still important, however, to have an objective view

of the steps necessary to ensure a successful RF

integration. Since the capabilities of each customer

vary widely, it is difficult to recommend one

particular design path, but most projects follow steps

similar to those shown at the right.

RESEARCH RF OPTIONS

ORDER EVALUATION KIT(S)

TEST MODULE(S) WITH

BASIC HOOKUP

CHOOSE LINX MODULE

When working with RF, a clear distinction must be made between what is technically

possible and what is legally acceptable in the country where operation is intended. Many

manufacturers have avoided incorporating RF into their products as a result of

uncertainty and even fear of the approval and certification process. Here at Linx, our

desire is not only to expedite the design process, but also to assist you in achieving a

clear idea of what is involved in obtaining the necessary approvals to legally market your

completed product.

INTERFACE TO CHOSEN

CIRCUIT AND DEBUG

CONSULT LINX REGARDING

ANTENNA OPTIONS AND DESIGN

LAY OUT BOARD

In reviewing this sample design path, you may

notice that Linx offers a variety of services (such as

antenna design and FCC prequalification) that are

unusual for a high-volume component manufacturer.

These services, along with an exceptional level of

technical support, are offered because we recognize

that RF is a complex science requiring the highest

caliber of products and support. “Wireless Made

Simple” is more than just a motto, it’s our

commitment. By choosing Linx as your RF partner

and taking advantage of the resources we offer, you

SEND PRODUCTION-READY

PROTOTYPE TO LINX

FOR EMC PRESCREENING

OPTIMIZE USING RF SUMMARY

GENERATED BY LINX

In the United States, the approval process is actually quite straightforward. The

regulations governing RF devices and the enforcement of them are the responsibility of

the Federal Communications Commission (FCC). The regulations are contained in Title

47 of the Code of Federal Regulations (CFR). Title 47 is made up of numerous volumes;

however, all regulations applicable to this module are contained in Volume 0-19. It is

strongly recommended that a copy be obtained from the Government Printing Office in

Washington or from your local government bookstore. Excerpts of applicable sections are

included with Linx evaluation kits or may be obtained from the Linx Technologies website,

www.linxtechnologies.com. In brief, these rules require that any device that intentionally

radiates RF energy be approved, that is, tested for compliance and issued a unique

identification number. This is a relatively painless process. Linx offers full FCC pre-

screening, and final compliance testing is then performed by one of the many

independent testing laboratories across the country. Many labs can also provide other

certifications that the product may require at the same time, such as UL, Class A / B, etc.

Once your completed product has passed, you will be issued an ID number that is to be

clearly placed on each product manufactured.

SEND TO PART 15

TEST FACILITY

RECEIVE FCC ID #

COMMENCE SELLING PRODUCT

Typical Steps For

Implementing RF

will not only survive implementing RF, you may even find the process enjoyable.

HELPFUL APPLICATION NOTES FROM LINX

It is not the intention of this manual to address in depth many of the issues that

should be considered to ensure that the modules function correctly and deliver

the maximum possible performance. As you proceed with your design, you may

wish to obtain one or more of the following application notes, which address in

depth key areas of RF design and application of Linx products. These

applications notes are available online at www.linxtechnologies.com or by

contacting the Linx literature department.

Questions regarding interpretations of the Part 2 and Part 15 rules or measurement

procedures used to test intentional radiators, such as Linx RF modules, for compliance

with the technical standards of Part 15, should be addressed to:

Federal Communications Commission

Office of Engineering and Technology Laboratory Division

7435 Oakland Mills Road

NOTE

AN-00100

APPLICATION NOTE TITLE

RF 101: Information for the RF Challenged

Columbia, MD 21046-1609

Phone: (301) 362-3000 Fax: (301) 362-3290 E-Mail: labinfo@fcc.gov

International approvals are slightly more complex, although Linx modules are designed

to allow all international standards to be met. If you are considering the export of your

product abroad, you should contact Linx Technologies to determine the specific suitability

of the module to your application.

AN-00126

AN-00130

AN-00140

AN-00155

AN-00160

AN-00500

Considerations For Operation Within The 902-928MHz Band

Modulation Techniques For Low-Cost RF Data Links

The FCC Road: Part 15 From Concept To Approval

Serial Loading Techniques for the HP Series 3

All Linx modules are designed with the approval process in mind and thus much of the

frustration that is typically experienced with a discrete design is eliminated. Approval is

still dependent on many factors, such as the choice of antennas, correct use of the

frequency selected, and physical packaging. While some extra cost and design effort are

required to address these issues, the additional usefulness and profitability added to a

product by RF makes the effort more than worthwhile.

Considerations For Sending Data Over a Wireless Link

Antennas: Design, Application, Performance

Page 22

Page 23

WIRELESS MADE SIMPLE ^®

U.S. CORPORATE HEADQUARTERS

LINX TECHNOLOGIES, INC.

159 ORT LANE

MERLIN, OR 97532

PHONE: (541) 471-6256

FAX: (541) 471-6251

www.linxtechnologies.com

Disclaimer

Linx Technologies is continually striving to improve the quality and function of its products. For this reason,

we reserve the right to make changes to our products without notice. The information contained in this

Overview Guide is believed to be accurate as of the time of publication. Specifications are based on

representative lot samples. Values may vary from lot-to-lot and are not guaranteed. "Typical" parameters can

and do vary over lots and application. Linx Technologies makes no guarantee, warranty, or representation

regarding the suitability of any product for use in any specific application. It is the customer's responsibility

to verify the suitability of the part for the intended application. NO LINX PRODUCT IS INTENDED FOR USE

IN ANY APPLICATION WHERE THE SAFETY OF LIFE OR PROPERTY IS AT RISK.

Linx Technologies DISCLAIMS ALL WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A

PARTICULAR PURPOSE. IN NO EVENT SHALL LINX TECHNOLOGIES BE LIABLE FOR ANY OF

CUSTOMER'S INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING IN ANY WAY FROM ANY DEFECTIVE

OR NON-CONFORMING PRODUCTS OR FOR ANY OTHER BREACH OF CONTRACT BY LINX

TECHNOLOGIES. The limitations on Linx Technologies' liability are applicable to any and all claims or

theories of recovery asserted by Customer, including, without limitation, breach of contract, breach of

warranty, strict liability, or negligence. Customer assumes all liability (including, without limitation, liability

for injury to person or property, economic loss, or business interruption) for all claims, including claims

from third parties, arising from the use of the Products. The Customer will indemnify, defend, protect, and

hold harmless Linx Technologies and its officers, employees, subsidiaries, affiliates, distributors, and

representatives from and against all claims, damages, actions, suits, proceedings, demands, assessments,

adjustments, costs, and expenses incurred by Linx Technologies as a result of or arising from any Products

sold by Linx Technologies to Customer. Under no conditions will Linx Technologies be responsible for

losses arising from the use or failure of the device in any application, other than the repair, replacement, or

refund limited to the original product purchase price. Devices described in this publication may contain

proprietary, patented, or copyrighted techniques, components, or materials. Under no circumstances shall

any user be conveyed any license or right to the use or ownership of such items.

Linx, “Wireless Made Simple”, CipherLinx, and the stylized

CL logo are the trademarks of Linx Technologies, Inc.

Printed in U.S.A.


型号：	TXM-900-HP3-SPO
厂家：	ETC
描述：	HP3 SERIES TRANSMITTER MODULE HP3系列变送器模块
文件：	总13页 (文件大小：399K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TXM-900-HP3-SPO [ETC]

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