UCC3911DPTR-3 [ETC]

Analog IC ; 模拟IC\n
UCC3911DPTR-3
型号: UCC3911DPTR-3
厂家: ETC    ETC
描述:

Analog IC
模拟IC\n

模拟IC
文件: 总11页 (文件大小:180K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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SLUS429A – AUGUST 2001  
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FEATURES  
DESCRIPTION  
The UCC3911 is a two-cell lithium-ion (Li-Ion) and  
lithium-polymer (Li-Pol) battery pack protector  
device that incorporates an on-chip series FET  
switch thus reducing manufacturing costs and  
increasing reliability. The device’s primary  
function is to protect both Li-Ion and Li-Pol cells in  
a two-cell battery pack from being either  
overcharged (overvoltage) or overdischarged  
(undervoltage). It employs a precision bandgap  
voltage reference that is used to detect when  
either cell is approaching an overvoltage or  
undervoltage state. When on-board logic detects  
either condition, the series FET switch opens to  
protect the cells.  
D
Protects Sensitive Lithium-Ion and  
Lithium-Polymer Cells from Overcharging  
and Overdischarging  
D
D
D
D
Used for Two-Cell Battery Packs  
No External FETs Required  
Provides Protection Against Battery Pack  
Output Short Circuit  
Extremely Low Power Drain on Batteries of  
About 20 µA  
D
Low Internal FET Switch Voltage Drop  
D
User Controllable Delay for Tripping Short  
Circuit Current Protector  
D
3-A Current Capacity  
A negative feedback loop controls the FET switch  
when the battery pack is in either the overvoltage  
or undervoltage state. In the overvoltage state the  
action of the feedback loop is to allow only  
discharge current to pass through the FET switch.  
In the undervoltage state, only charging current is  
allowed to flow. The operational amplifier that  
drives the loop is powered only when in one of  
these two states. In the undervoltage state the  
chip enters sleep mode until it senses that the  
pack is being charged.  
APPLICATIONS  
D
PDA, Camcorder, Digital Camera, Private  
Mobile Radio  
SIMPLIFIED APPLICATION DIAGRAM  
UCC3911  
B2 16  
The FET switch is driven by a charge pump when  
the battery pack is in a normally charged state to  
1
2
3
4
5
6
7
8
NC  
achieve the lowest possible R  
. In this state  
+
+
DS(on)  
CDLY 15  
B1 14  
OV  
UV  
the negative feedback loop’s operational amplifier  
is powered down to conserve battery power. Short  
circuit protection for the battery pack is provided  
and has a nominal delay of 100 µs before tripping.  
An external capacitor may be connected between  
CDLY and B0 to increase this delay time to allow  
longer overcurrent transients.  
ISOLATED  
COPPER  
PAD  
ISOLATED  
COPPER  
PAD  
SUBS SUBS 13  
SUBS SUBS 12  
GND  
GND  
B0 11  
B0 10  
A chip enable (CE) pin is provided that when held  
low, inhibits normal operation of the device to  
facilitate assembly of the battery pack.  
LPWARN CE  
9
UDG–01075  
ꢋꢣ  
Copyright 2001, Texas Instruments Incorporated  
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ꢡꢣ  
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SLUS429A AUGUST 2001  
description (continued)  
The UCC3911 is specified for operation over the temperature range of 20°C to 70°C, the typical operating and  
storage temperature range of Li-Ion and Li-Pol batteries.  
}w  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)  
Maximum input voltage (B2, GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 V  
Minimum input voltage (B0, GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 V  
Maximum charge current (B0, GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 A  
Minimum discharge current (B0, GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 A  
Operating junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C to 150°C  
J
Storage temperature range T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
§
All voltages are with respect to ground. Currents are positive into and negative out of the specified terminals.  
AVAILABLE OPTIONS  
PACKAGES  
SOIC–16 (DW)  
UCC3911DP1  
UCC3911DP2  
OVERVOLTAGE THRESHOLD  
T
A
MIN  
TYP  
MAX  
4.15  
4.20  
4.25  
4.30  
4.20  
4.25  
4.30  
4.35  
4.40  
4.25  
4.30  
4.35  
20°C to 70 °C  
UCC3911DP3  
UCC3911DP4  
The DP package is available taped and reeled. Add TR suffix to device type (e.g. UCC3911DPTR1)  
to order quantities of 3000 devices per reel.  
DP PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
NC  
OV  
UV  
B2  
CDLY  
B1  
SUBS  
SUBS  
B0  
SUBS  
SUBS  
GND  
GND  
LPWARN  
B0  
CE  
2
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SLUS429A AUGUST 2001  
electrical characteristics 20°C < T = 70°C, all voltages are referenced to B0, V = 7.2 V, T = T  
A
B2  
A
J
(unless otherwise noted)  
state transition threshold  
PARAMETER  
TEST CONDITIONS  
MIN  
4.15  
TYP  
4.20  
MAX  
UNITS  
V
V
V
V
V
V
V
V
V
V
Overvoltage threshold  
4.25  
3.80  
4.30  
3.85  
4.35  
3.90  
4.40  
3.95  
2.58  
3.10  
OV  
UCC39111  
Overvoltage threshold recovery  
Overvoltage threshold  
3.60  
4.20  
3.65  
4.25  
3.70  
4.30  
3.75  
2.42  
2.90  
3.70  
4.25  
3.75  
4.30  
3.80  
4.35  
3.85  
2.50  
3.00  
OVR  
OV  
UCC39112  
UCC39113  
UCC39114  
Overvoltage threshold recovery  
Overvoltage threshold  
OVR  
OV  
V
Overvoltage threshold recovery  
Overvoltage threshold  
OVR  
OV  
Overvoltage threshold recovery  
Undervoltage threshold  
OVR  
UV  
Undervoltage threshold recovery  
UVR  
B0-to-GND switch  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
(Normal) I  
(Normal) I  
= 2 A  
320  
160  
160  
GND  
= 2 A  
320  
GND  
(Overcharge) I  
(Overcharge) I  
= 1 mA  
300  
500  
150  
250  
150  
GND  
V
to V  
GND  
mV  
B0  
= 2 A  
GND  
(Undercharge) I  
= 1 mA  
= 2 A  
300  
500  
GND  
GND  
GND  
(Undercharge) I  
250  
(Overcharge) V  
= 5 V  
5  
I
µA  
GND  
(Undercharge) V  
GND  
= 5 V  
0
30  
input bias current  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
18  
MAX  
UNITS  
Nominal  
25  
I
I
B2  
In sleep mode  
3.5  
0
µA  
1  
1
B1  
short circuit protection  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
5.25  
100  
MAX  
UNITS  
A
I
t
Current threshold  
Delay time  
3.5  
7
SC  
CDLY = OPEN,  
See Note 1  
µs  
DLY  
timing delays  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
7.5  
2.0  
1.0  
MAX  
UNITS  
F
Internal clock frequency  
See Note 2  
kHz  
INTERNAL  
t
t
OV Delay time to register overcharge  
UV Delay time to register undercharge  
0.6  
0.3  
5.0  
3.5  
DLY  
ms  
DLY  
3
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SLUS429A AUGUST 2001  
electrical characteristics 20°C < T = 70°C, all voltages are referenced to B0, V = 7.2 V, T = T  
A
B2  
A
J
(unless otherwise noted) (continued)  
drives  
PARAMETER  
TEST CONDITIONS  
= 100 µA  
MIN  
TYP  
0.15  
MAX  
UNITS  
V
V  
I
I
I
I
0.89  
0.75  
0.75  
0.75  
B2 HIGH  
PIN  
OV and UV output  
LPWARN output  
V
V
= 100 µA  
0.05  
0.05  
0.04  
LOW  
V  
PIN  
V
= 0.1 mA  
B2 HIGH  
LPWARN  
LPWARN  
V
V
LOW  
= 0.1 mA  
other thresholds  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
7
UNITS  
V
V
= 8.5 V  
= 5 V,  
5
6
2.45  
165  
B2  
V
CE  
Chip enable threshold voltage  
Thermal shutdown  
V
See Note 3  
2.05  
4.05  
B2  
T
SD  
See Note 1  
°C  
NOTE: 1. Ensured by design. Not production tested.  
NOTE: 2. Tested at functional probe only.  
NOTE: 3. V is the voltage at the B2 pin relative to the B0 pin.  
B2  
Terminal Functions  
TERMINAL  
PACKAGE  
NAME  
I/O  
DESCRIPTION  
DP  
10, 11  
14  
B0  
B1  
I
I
Connects to the negative teminal of the lower cell in the battery pack.  
Connects to the junction of the positive terminal of the lower cell and the negative terminal of the upper  
cell in the battery pack.  
B2  
16  
I
Connects to the positive terminal of the upper cell in the battery pack. This pin also connects to the  
positive of the two terminals that are presented to the user of the battery pack.  
CDLY  
CE  
15  
9
I
Delay control pin for the short circuit protection feature.  
O
Chip enable. The internal FET is disabled when CE is connected to B0. With the CE pin connected to  
B0, the supply current drain is only about 4 µA.  
GND  
6,7  
The second of two terminals that are presented to the user of the battery pack. The internal FET switch  
connects this terminal to the B0 terminal to give the battery pack user appropriate access to the batter-  
ies. In an overcharged state, current is allowed to flow only into this terminal. Similarly, in an over-dis-  
charged state, current is allowed to flow only out of this terminal.  
LPWARN  
OV  
8
2
O
O
This activehigh signal is the low Power Warning. The voltage on this pin goes high (to B2 potential) as  
soon as either of the batterys cells voltage falls below 3.0 V. Once the UV state is entered, this output  
goes back to low.  
This activelow signal indicates the state of the state machines OV bit. When low, it indicates that one  
or both cells are overvoltage. Further charging is inhibited by the opening of the FET switch. The out-  
put buffer for this pin is sized to drive a very light load.  
SUBS  
UV  
4,5,12,13  
3
I
The substrate connections connect these points to a heat sink which is electrically isolated from all  
other device pins.  
O
This activelow signal indicates the state of the state machines undervoltage bit. When low, it indi-  
cates that one or both cells are under voltage. Further discharging is inhibited by the opening of the  
FET switch.  
4
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SLUS429A AUGUST 2001  
detailed pin descriptions  
CDLY: Delay control pin for the short circuit protection feature. A capacitor connected between this pin and the  
B0 pin lengthens the time delay from when an overcurrent situation is detected to when the protection circuitry  
is activated. This control will be useful for those applications where high-peak load currents may momentarily  
exceed the protection circuits threshold current and interruption of the battery current is undesirable. The  
nominal delay time is internally set at 100 µs. The equation for determining this delay is:  
(
) ( )  
ms + 25 ) 25 ) CDLY (pF)   0.4   V  
B2  
t
(1)  
DLY  
To recover from an overcurrent shutdown the load must be removed momentarily from the pack.  
CE: While the chip enable signal is held low, the internal FET is held off. CE is pulled high by a 2-µA current  
source. This function was included to facilitate construction of the battery pack. The last step in the electrical  
assembly of the pack is to cut a link grounding B0. With the CE pin connected to B0, the supply current drain  
is only about 4 µA.  
GND: The second of the two terminals that are presented to the user of the battery pack. The internal FET switch  
connects this terminal to the B0 terminal to give the battery pack user appropriate access to the cells. In an  
overvoltage state, current is allowed to flow only into this terminal. Similarly, in an undervoltage state, current  
is allowed to flow only out of this terminal.  
OV: This active-low signal indicates the state of the state machines overvoltage bit. When low, it indicates that  
one or both cells are overvoltage. Further charging is inhibited by the opening of the FET switch. The output  
buffer for this pin is sized to drive a very light load.  
UV: This active-low signal indicates the state of the state machines undervoltage bit. When low, it indicates that  
one or both cells are undervoltage. Further discharging is inhibited by the opening of the FET switch. The chip  
enters the sleep mode when UV goes low and waits in this state until the device detects that the battery pack  
has been placed in a charging circuit. The output buffer for this pin is sized to drive a very light load.  
5
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SLUS429A AUGUST 2001  
functional block diagram  
B2 16  
B1 14  
8
3
2
LPWARN  
UV  
REFERENCE  
VOLTAGE  
SELECT  
AND  
COMPARE  
CELL  
VOLTAGE  
INPUT  
STATE  
MACHINE  
B0 10  
B0 11  
SELECT  
OV  
4
9
1
CE  
NC  
CLOCK  
REFERENCE  
AND  
THERMAL  
SHUTDOWN  
TS  
CE  
S
R
Q
SCP  
CDLY 15  
CLOCK  
R
SHORT CIRCUIT  
PROTECTION  
SENSE  
CHARGE  
PUMP  
UV  
OV  
EN  
GND  
GND  
6
7
4
5
CE  
SCP  
OV  
UV  
UV  
OV  
ENABLE  
LOGIC  
OV  
UV  
SUBS  
SUBS  
+
SUBS 12  
SUBS 13  
100 mV  
TS  
SLP  
SLEEP  
MODE  
CONTROLLER  
CLOCK  
UV  
50 mV  
UDG99173  
6
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SLUS429A AUGUST 2001  
APPLICATION INFORMATION  
Figure 1 shows a typical application for the UCC3911 Li-Ion and Li-Pol battery protector. All of the functions  
required to protect two series cells from overvoltage and undervoltage conditions, as well as provide short circuit  
protection for the complete battery pack, are included in a single chip. An internal state machine controls an  
internal power FET which allows either bi-directional or uni-directional battery current. An optional time delay  
capacitor can be included to slow the reaction time of the short circuit protection circuitry if desired.  
While the device is capable of providing overload and over/undervoltage protection of both cells with virtually  
no external parts, the demands of true short circuit protection require some passive external components.  
UCC3911  
R1 220  
B2 16  
1
2
3
4
5
6
7
8
NC  
µ
C1 10  
10 V  
F
C
330 pF  
DLY  
+
+
CELL 2  
CELL 1  
µ
C3 0.1  
25 V  
F
CDLY  
15  
OV  
UV  
R2 10 k  
C4  
B1 14  
(OPTIONAL)  
SUBS  
SUBS  
GND  
SUBS  
SUBS  
13  
12  
ISOLATED COPPER PAD  
FOR HEAT SINKING AT  
HIGH LOAD CURRENTS  
ISOLATED COPPER PAD  
FOR HEAT SINKING AT  
HIGH LOAD CURRENTS  
C2  
0.22  
µ
F
B0 11  
B0 10  
GND  
J1  
LPWARN  
CE  
9
ENABLE (OPEN)  
UDG99173  
Figure 1. Application Circuit Including Components for Short-Circuit Protection  
state machine operation  
The internal state machine constantly monitors the two cells for both overvoltage and undervoltage conditions.  
Figure 2 shows a state diagram which describes the operation of the protection circuitry for the UCC39112  
version. In the normal mode, both the external overvoltage and undervoltage status bits are held high and full  
battery current is allowed through the internal power FET in either the charge or discharge direction.  
If the voltage across one or both cells exceeds the overvoltage (V ) threshold, the external overvoltage signal  
OV  
goes low, and further charge current is not allowed. An internal feedback loop controls the power FET to allow  
only discharge current, allowing for battery recovery. The state machine will not reenter normal mode until the  
voltage across both cells decays to less than the overvoltage recovery (V  
important to prevent circuit oscillation due to battery ESR when the circuitry transitions between states.  
) threshold. This feature is  
OVR  
If the voltage across one or both battery cells falls below 3 V, the LPWARN signal goes high indicating a low  
power condition. This signal can be used to signal the user that the battery pack is in need of charge.  
If the voltage across one or both cells falls below 2.5 V, the UV signal goes low, and the feedback loop allows  
only charge current. The LPWARN signal goes low and the UCC3911 enters sleep mode which consumes only  
3 µA, limiting self discharge to a minimum. The circuit remains in this state until the voltage across both cells  
exceeds 3 V. The battery pack can still be charged, unless the sum of the two cells voltages falls below 3.7 V,  
which is the minimum guaranteed operating voltage for the device.  
7
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SLUS429A AUGUST 2001  
APPLICATION INFORMATION  
If the battery cells become so poorly matched that the voltage across one cell exceeds 4.25 V and the voltage  
across the other cell falls below 2.5 V, the power FET does not pass either charge or discharge current, and  
both the OV and UV signals will be set low.  
The normal high current path for battery current is through the B0 (10, 11) and GND (6, 7) pins of the UCC3911.  
The GND pins are intended to be connected to system ground for either the charger or the load. The SUBS pins  
(4, 5, 12, 13) are internally connected to the substrate of the UCC3911, which is internally referenced to B0 or  
GND depending on the direction of pack current. If high battery currents are anticipated, the SUBS pins can be  
thermally connected to a heat sink to control the device temperature. However, this heat sink must be electrically  
isolated from all other device pins including ground. This is a critically important point, as heat sinking to the  
system ground is not possible.  
The CE pin is used to initialize the state of the battery pack during assembly. Holding this pin low forces the state  
machine to hold the FET off. The last step in the assembly process would be to cut the trace between this pin  
and B0 which allows the internal pull up to start the state machine. While CE is low, the devices current  
consumption is approximately 4 µA. This is a useful feature for battery packs that may experience a long period  
of storage while waiting to be sold.  
The one cell over and one cell under state (see Figure 2) is entered whenever one cell is overcharged and the  
other cell is simultaneously overdischarged. When in this state, the series FET switch is turned off inhibiting both  
charging and discharging of the battery pack. If the battery pack ever gets into this condition, it should be  
discarded.  
short-circuit protection  
The demands of true short-circuit protection require that careful attention be paid to the selection of a few  
external components.  
In the application circuit shown in Figure 1, C3 protects the battery pack output terminals from inductive kick  
when the pack current is shut off due to an overcurrent or overvoltage/undervoltage condition. (It also increases  
the ESD protection level.)  
To prevent a momentary cell voltage drop, caused by large capacitive loads, from causing an erroneous  
undervoltage shutdown, an RC filter is required in series with the two battery sense inputs, B1 and B2. The  
resistors (R1 and R2) are sized to have a negligible impact on voltage sensing accuracy. The capacitors (C1  
and C2) should be sized to provide a time constant longer than the overcurrent delay time. In the example of  
Figure 1, they are sized for a nominal 2.2 ms time constant. They do not need to be low ESR style capacitors,  
as they see no ripple current. A larger resistor value and smaller capacitor value can be used on the B1 input  
due to the extremely low input current on this pin.  
The overcurrent delay capacitor, CDLY, sets the time delay, after the overcurrent threshold is exceeded, before  
turning off the UCC3911s internal FET. If no capacitor is used, the nominal delay is 100 µs. To charge large  
capacitive loads without tripping the overcurrent circuit, a small capacitor (typically less than 1000 pF) is used  
to extend the delay time. The approximate delay time is given below and shown graphically in Figure 3.  
(
) ( )  
ms + 25 ) 25 ) CDLY(pF)   0.4   V  
B2  
t
(2)  
DLY  
8
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ꢀꢁꢁ ꢂ ꢃꢄꢄ ꢅꢄ ꢆ ꢀ ꢁꢁ ꢂꢃ ꢄꢄꢅ ꢇ  
ꢀꢁꢁ ꢂ ꢃꢄꢄ ꢅꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄꢄꢅ ꢈ  
SLUS429A AUGUST 2001  
APPLICATION INFORMATION  
UCC39112 STATE DIAGRAM  
NOMINAL OVERCURRENT DELAY TIME  
vs  
DELAY CAPACITANCE AND B2 VOLTAGE  
3500  
3000  
2500  
2000  
1500  
1000  
500  
V
B2  
= 7  
V
B2  
= 8  
V
B2  
= 5  
V
B2  
= 6  
0
0
200  
400  
600  
800  
1000  
Delay Capacitance (pF)  
Figure 2  
Figure 3  
The amount of time required will be a function of the load capacitance, battery voltage, and the total circuit  
impedance, including the internal resistance of the cells, the UCC3911s on resistance, and the load capacitor  
ESR. The required delay time can be calculated from:  
ǒI   RǓ  
V
t + * R   C   ln  
(3)  
In this equation, R is the total circuit resistance, C is the capacitor being charged, I is the overcurrent trip current  
(5.25 A nominal), and V is the battery voltage. Using the minimum trip current of 3.5 A and the maximum battery  
voltage of 8.4 V, the worst case maximum delay time required is defined as:  
ǒ R Ǔ  
(ms) + * R   C (mF)   ln  
t
MAX  
2.4  
(4)  
In the example of Figure 1, CDLY, C1 and C2 are sized to drive a 1500-µF load capacitor.  
If large capacitive loads (or other loads with surge currents above the overcurrent trip threshold) are not being  
applied to the pack terminals, the overcurrent delay time can be short. In this case, it may be possible to eliminate  
CDLY, as well as R2 and C2 altogether (replacing R2 with a short). In addition, the time constant of R1 and C1  
can be made much shorter. R1 and C2 are still necessary, however, to assure proper operation under short  
circuit conditions. It is important to maintain a minimum R1/C1 time constant of 100 µs. (For example, R1 and  
C1 could be reduced to 100 and 1 µF.)  
Capacitor C4 is recommended, in case the wires connecting to the top and bottom of the cell stack are more  
than an inch long (not likely in a small battery pack). In this case, a 10-µF, low ESR capacitor is recommended  
to prevent excessive overshoot at turn-off due to wiring inductance.  
9
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ꢀ ꢁꢁꢂ ꢃ ꢄꢄ ꢅꢄ ꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄꢄ ꢅꢇ  
ꢀ ꢁꢁꢂ ꢃ ꢄꢄ ꢅꢂ ꢆ ꢀ ꢁꢁ ꢂ ꢃꢄꢄ ꢅꢈ  
SLUS429A AUGUST 2001  
PLASTIC SMALL-OUTLINE PACKAGE (DP)  
16 PINS SHOWN  
0.050 (1,27)  
16  
0.020 (0,51)  
0.014 (0,35)  
0.010 (0,25)  
M
9
0.419 (10,65)  
0.400 (10,15)  
0.010 (0,25) NOM  
0.299 (7,59)  
0.291 (7,39)  
Gage Plane  
0.010 (0,25)  
1
8
0°ā8°  
0.050 (1,27)  
0.016 (0,40)  
A
Seating Plane  
0.004 (0,10)  
0.012 (0,30)  
0.004 (0,10)  
0.104 (2,65) MAX  
PINS **  
16  
20  
24  
28  
0.710  
DIM  
0.410  
0.510  
0.610  
A MAX  
A MIN  
(10,41) (12,95) (15,49) (18,03)  
0.400  
0.500  
0.600  
0.700  
(10,16) (12,70) (15,24) (17,78)  
4040000/D 01/00  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MS-013  
10  
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IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TIs terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, maskworkright, orotherTIintellectualpropertyrightrelatingtoanycombination, machine, orprocess  
in which TI products or services are used. Information published by TI regarding thirdparty products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
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Mailing Address:  
Texas Instruments  
Post Office Box 655303  
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Copyright 2001, Texas Instruments Incorporated  

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