W152-3X [ETC]

Eight Distributed-Output Clock Driver ; 八分布式输出时钟驱动器\n
W152-3X
型号: W152-3X
厂家: ETC    ETC
描述:

Eight Distributed-Output Clock Driver
八分布式输出时钟驱动器\n

时钟驱动器 逻辑集成电路 光电二极管
文件: 总8页 (文件大小:145K)
中文:  中文翻译
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W152  
Spread Aware™, Eight Output Zero Delay Buffer  
Output to Output Skew: Between Banks.....................215 ps  
Features  
Output to Output Skew: Within Banks  
• Spread Aware™—designed to work with SSFTG  
reference signals  
• Two banks of four outputs each  
• Configuration options to halve, double, or quadruple  
the reference frequency refer to Table 1 to determine  
the specific option which meets your multiplication  
needs  
(Refer to Figure 4)...................................................100 ps  
Total Timing Budget Impact:........................................555 ps  
Max. Phase Error Variation:.......................................±225 ps  
Tracking Skew:..........................................................±130 ps  
Table 1. Configuration Options  
• Outputs may be three-stated  
Device  
W152-1/11[1]  
W152-2/12[2]  
W152-2/12[2]  
W152-3  
Feedback Signal  
QA0:3 or QB0:3  
QA0:3  
QA0:3  
REFx1  
REFx1  
REFx2  
REFx2  
REFx4  
REFx2  
QB0:3  
REFx1  
REF/2  
REFx1  
REFx1  
REFx2  
REFx2  
• Available in 16-pin SOIC package  
• Extra strength output drive available (-11/-12 versions)  
• Contact factory for availability information on 16-pin  
TSSOP  
QB0:3  
Key Specifications  
QA0:3  
Operating Voltage: ............................................... 3.3V±10%  
Operating Range: ................... 15 MHz < fOUTQA < 140 MHz  
Cycle-to-Cycle Jitter: (Refer to Figure 3) .................... 225 ps  
W152-3  
QB0:3  
W152-4  
QA0:3 or QB0:3  
Notes:  
1. W152-11 has stronger output drive than the W152-1.  
2. W152-12 has stronger output drive than the W152-2.  
Cycle-to-Cycle Jitter: Frequency Range  
25 to140 MHz ......................................................... 125 ps  
Block Diagram  
Pin Configuration  
(present on the -3 and -4 only)  
FBIN  
REF  
÷2  
PLL  
REF  
QA0  
QA1  
VDD  
GND  
QB0  
QB1  
SEL1  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
FBIN  
QA3  
QA2  
VDD  
GND  
QB3  
QB2  
SEL0  
MUX  
QA0  
QA1  
QA2  
SEL0  
SEL1  
QA3  
÷2  
QB0  
QB1  
QB2  
QB3  
(present on the -2, -12, and -3 only)  
Spread Aware is a trademark of Cypress Semiconductor Corporation.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-07148 Rev. **  
Revised September 24, 2001  
W152  
Pin Definitions  
Pin  
Type  
Pin Name  
Pin No.  
Pin Description  
REF  
1
I
I
Reference Input: The output signals QA0:3 through QB0:3 will be synchronized to  
this signal unless the device is programmed to bypass the PLL.  
FBIN  
16  
Feedback Input: When programmed to zero delay buffer mode, this input must be  
fed by one of the outputs (QA0:3 or QB0:3) to ensure proper functionality. If the trace  
between FBIN and the output pin being used for feedback is equal in length to the  
traces between the outputs and the signal destinations, then the signals received at  
the destinations will be synchronized to the REF signal input.  
QA0:3  
QB0:3  
VDD  
2, 3, 14, 15  
6, 7, 10, 11  
4, 13  
O
O
P
Outputs from Bank A: The frequency of the signals provided by these pins is deter-  
mined by the feedback signal connected to FBIN, and the specific W152 option being  
used. See Table 2.  
Outputs from Bank B: The frequency of the signals provided by these pins is deter-  
mined by the feedback signal connected to FBIN, and the specific W152 option being  
used. See Table 2.  
Power Connections: Connect to 3.3V. Use ferrite beads to help reduce noise for  
optimal jitter performance.  
GND  
5, 12  
9, 8  
G
I
Ground Connections: Connect all grounds to the common system ground plane.  
SEL0:1  
Function Select Inputs: Tie to VDD (HIGH, 1) or GND (LOW, 0) as desired per  
Table 2.  
Overview  
Functional Description  
The W152 products are eight-output zero delay buffers. A  
Phase-Locked Loop (PLL) is used to take a time-varying signal  
and provide eight copies of that same signal out. The external  
feedback to the PLL provides outputs in phase with the refer-  
ence inputs.  
Logic inputs provide the user the ability to turn off one or both  
banks of clocks when not in use, as described in Table 2. Dis-  
abling a bank of unused outputs will reduce jitter and power  
consumption, and will also reduce the amount of EMI gener-  
ated by the W152.  
Internal dividers exist in some options allowing the user to get  
a simple multiple (/2, x2, x4) of the reference input, for details  
see Table 1. Because the outputs are separated into two  
banks, it is possible to provide some combination of these mul-  
tiples at the same time.  
These same inputs allow the user to bypass the PLL entirely  
if so desired. When this is done, the device no longer acts as  
a zero delay buffer, it simply reverts to a standard eight-output  
clock driver.  
The W152 PLL enters an auto power-down mode when there  
are no rising edges on the REF input. In this mode, all outputs  
are three-stated and the PLL is turned off.  
Spread Aware  
Many systems being designed now utilize a technology called  
Spread Spectrum Frequency Timing Generation. Cypress has  
been one of the pioneers of SSFTG development, and we de-  
signed this product so as not to filter off the Spread Spectrum  
feature of the Reference input, assuming it exists. When a  
zero delay buffer is not designed to pass the SS feature  
through, the result is a significant amount of tracking skew  
which may cause problems in systems requiring synchroniza-  
tion.  
Table 2. Input Logic  
SEL1 SEL0  
QA0:3  
QB0:3  
PLL  
0
0
1
0
1
0
Three-State Three-State  
Shutdown  
Active  
Active  
Three-State Active, Utilized  
Active  
Shutdown,  
Bypassed  
1
1
Active  
Active  
Active, Utilized  
For more details on Spread Spectrum timing technology,  
please see the Cypress application note titled, EMI Suppres-  
sion Techniques with Spread Spectrum Frequency Timing  
Generator (SSFTG) ICs.”  
Document #: 38-07148 Rev. **  
Page 2 of 8  
W152  
See Note 3  
Ref In  
QA0  
FB In  
QA3  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
Ferrite  
Bead  
QA1  
QA2  
VDD  
3.3V  
Supply  
Power  
Ground  
QB0  
Power  
Ground  
QB3  
VDD  
0.1µF  
10µF  
0.1µF  
QB1  
QB2  
SEL1  
SEL0  
VDD or GND (for desired operation mo  
VDD or GND (for desired operation mode)  
Figure 1. Schematic[3]  
Note:  
3. Pin 16 needs to be connected to one of the outputs from either bank A or bank B, it should not be connected to both. Pins 2 and 10 are shown here as  
examples. None of the outputs should be considered as preferred for the feedback path.  
some other device. This implementation can be applied to any  
device (ASIC, multiple output clock buffer/driver, etc.) which is  
How to Implement Zero Delay  
Typically, zero delay buffers (ZDBs) are used because a de-  
signer wants to provide multiple copies of a clock signal in  
phase with each other. The whole concept behind ZDBs is that  
the signals at the destination chips are all going HIGH at the  
same time as the input to the ZDB. In order to achieve this,  
layout must compensate for trace length between the ZDB and  
the target devices. The method of compensation is described  
below.  
put into the feedback path.  
Referring to Figure 2, if the traces between the ASIC/buffer  
and the destination of the clock signal(s) (A) are equal in length  
to the trace between the buffer and the FBIN pin, the signals  
at the destination(s) device will be driven HIGH at the same  
time the Reference clock provided to the ZDB goes HIGH.  
Synchronizing the other outputs of the ZDB to the outputs form  
the ASIC/Buffer is more complex however, as any propagation  
delay in the ASIC/Buffer must be accounted for.  
External feedback is the trait that allows for this compensation.  
The PLL on the ZDB will cause the feedback signal to be in  
phase with the reference signal. When laying out the board,  
match the trace lengths between the output being used for  
feedback and the FBIN input to the PLL.  
Reference  
Signal  
Zero  
Delay  
Buffer  
If it is desirable to either add a little delay, or slightly precede  
the input signal, this may also be affected by either making the  
trace to the FBIN pin a little shorter or a little longer than the  
traces to the devices being clocked.  
ASIC/  
Buffer  
Feedback  
Input  
A
Inserting Other Devices in Feedback Path  
Figure 2. 6 Output Buffer in the Feedback Path  
Another nice feature available due to the external feedback is  
the ability to synchronize signals up to the signal coming from  
Document #: 38-07148 Rev. **  
Page 3 of 8  
W152  
Absolute Maximum Ratings  
Stresses greater than those listed in this table may cause per-  
manent damage to the device. These represent a stress rating  
above those specified in the operating sections of this specifi-  
cation is not implied. Maximum conditions for extended peri-  
ods may affect reliability.  
only. Operation of the device at these or any other conditions  
.
Parameter  
VDD, VIN  
Description  
Voltage on any pin with respect to GND  
Storage Temperature  
Rating  
0.5 to +7.0  
65 to +150  
0 to +70  
Unit  
V
TSTG  
TA  
°C  
°C  
°C  
W
Operating Temperature  
TB  
Ambient Temperature under Bias  
Power Dissipation  
55 to +125  
0.5  
PD  
DC Electrical Characteristics: TA =0°C to 70°C, VDD = 3.3V ±10%  
Parameter  
IDD  
Description  
Supply Current  
Test Condition  
Unloaded, 100 MHz  
Min.  
Typ.  
Max.  
Unit  
mA  
V
40  
VIL  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
0.8  
VIH  
2.0  
2.4  
V
VOL  
IOL = 12 mA (-11, -12)  
IOL = 8 mA (-1, -2, -3, -4)  
0.4  
V
VOH  
Output High Voltage  
IOH = 12 mA (-11, -12)  
V
IOH = 8 mA (-1, -2, -3, -4)  
IIL  
Input Low Current  
Input High Current  
VIN = 0V  
50  
50  
µA  
µA  
IIH  
VIN = VDD  
AC Electrical Characteristics: TA = 0°C to +70°C, VDD = 3.3V ±10%  
Parameter  
Description  
Input Frequency  
Test Condition  
Min.  
15  
Typ.  
Max.  
140  
140  
2.5  
Unit  
MHz  
MHz  
ns  
fIN  
Note 3  
15-pF load[8]  
fOUT  
tR  
Output Frequency  
15  
Output Rise Time (-1, -2, -3, -4)  
Output Rise Time (-11, -12)  
Output Fall Time (-1, -2, -3, -4)  
Output Rise Time (-11, -12)  
Input Clock Rise Time[4]  
Input Clock Fall Time[4]  
FBIN to REF Skew[5, 6]  
Output to Output Skew  
Duty Cycle  
0.8V to 0.8V, 15-pF load  
0.8V to 0.8V, 15-pF load  
2.0V to 0.8V, 15-pF load  
2.0V to 0.8V, 20-pF load  
2
2
1.5  
ns  
tF  
2.5  
ns  
1.5  
ns  
tICLKR  
tICLKF  
tPD  
4.5  
ns  
4.5  
ns  
350  
215  
55  
ps  
tSK  
All outputs loaded equally[10]  
15-pF load[7, 8]  
ps  
tD  
45  
50  
%
tLOCK  
PLL Lock Time  
Power supply stable  
Note 9  
1.0  
ms  
ps  
tJC  
Jitter, Cycle-to-Cycle  
225  
Notes:  
3. Input frequency is limited by output frequency range and input to output frequency multiplication factor (which is determined by circuit configuration). See  
Table 1.  
4. Longer input rise and fall time will degrade skew and jitter performance.  
5. All AC specifications are measured with a 50transmission line.  
6. Skew is measured at VDD/2 on rising edges.  
7. Duty cycle is measured at VDD/2.  
8. For the higher drive -11 and -12, the load is 20 pF.  
9. For frequencies above 25 MHz CY - CY = 125 ps.  
10. Measured across all outputs. Maximum skew between outputs in the same bank is 100 ps.  
Document #: 38-07148 Rev. **  
Page 4 of 8  
W152  
W152 -01 CYCLE - CYCLE JITTER @ 15 pF  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
FREQUENCY in MHz  
07/21/99 W152-a1  
Figure 3. Cycle to Cycle Jitter at 15 pF  
W152 -01 PIN- PIN SKEW @ 15 pF  
300  
200  
100  
0
A1  
A2  
A3  
A4  
B1  
B2  
B3  
B4  
-100  
-200  
OUTPUT #  
PIN A1 = REF  
O7/21/99 a3  
Figure 4. Pin to Pin Skew at 15 pF  
Ordering Information  
Package  
Name  
Ordering Code  
Option  
Package Type  
16-pin SOIC (150 mil)  
16-pin TSSOP (4.4 mm)  
W152  
-1, -11, -2, -12,  
-3, -4  
G
X
Document #: 38-07148 Rev. **  
Page 5 of 8  
W152  
Package Diagrams  
16-Pin Small Outline Integrated Circuit (SOIC, 150 mils)  
Document #: 38-07148 Rev. **  
Page 6 of 8  
W152  
Package Diagrams (continued)  
16-Pin Thin Shrink Small Outline Package (TSSOP, 4.4 mm)  
Document #: 38-07148 Rev. **  
Page 7 of 8  
© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.  
W152  
Document Title: W152 Spread Aware, Eight Output Zero Delay Buffer  
Document Number: 38-07148  
Issue  
Date  
Orig. of  
Change  
REV.  
ECN NO.  
Description of Change  
**  
110257  
12/15/01  
SZV  
Change from Spec number: 38-00786 to 38-07148  
Document #: 38-07148 Rev. **  
Page 8 of 8  

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