XLS93LC66JR-3 [ETC]
Microwire Serial EEPROM ; Microwire串行EEPROM\n
| 型号： | XLS93LC66JR-3 |
| 厂家： | 
ETC |
| 描述： | Microwire Serial EEPROM
|
| 文件： | 总36页 (文件大小：319K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
MPLAB -ICE
Transition Socket Specifications
INTRODUCTION
This document describes the transition sockets used with
MPLAB-ICE, Microchip’s in-circuit emulator.
FIGURE 1:
MPLAB-ICE Emulator System
Parallel Cable
Emulator Pod
Processor Module
with Cable
Power Supply
Cable
Logic Probe
Connector
Device Adapter
Transition Socket
WHAT ARE TRANSITION SOCKETS?
Transition sockets are devices that allow MPLAB-ICE device
adaptors to interface to sockets on customer products that differ
from the standard emulator adapter connection.
Embedded microcontrollers/microprocessors come in many dif-
ferent types of IC packages, i.e., DIP, PLCC, SOIC, SSOP,
MQFP, etc. Typically, development cycle components are
EPROM based and, as a result, are provided in larger windowed
package formats such as DIP or PLCC. Production components
are primarily preprogrammed ROM, OTP or Flash-based and are
often in very compact SOIC, SSOP, MQFP or PQFP package for-
mats.
The MPLAB-ICE solution is transition sockets. A transition socket
is specifically designed to provide compatibility between two dif-
fering types of IC package formats.
2000 Microchip Technology Inc.
DS51194D-page 1
®
MPLAB -ICE
Transition sockets are typically composed of two parts: the DIP
adapter socket and the SOIC/SSOP header. The DIP adapter
socket is designed to plug into the emulator system’s DIP device
adapter on one side and the header on the other. The header is
then soldered down to the target application.
The QFP Adapter is a single part soldered directly to the target
application and fits into the QFP device adapter.
WHY SHOULD I USE TRANSITION
SOCKETS IN MY PRODUCT DESIGN?
There are two very significant advantages to using transition
sockets:
1.
2.
A shorter product development cycle, and
Reduced expense in the design, layout, and prototype
testing.
A typical product design cycle has two important phases: the pro-
totype design phase and the production design phase. Tradition-
ally, these phases were different simply because the prototype
used a microcontroller with a different package type. However,
with the availability of the transition sockets, the prototype design
can be identical to the production design because a transition
socket can be used to bridge the microcontroller package differ-
ences.
WHAT ARE THE CURRENTLY
AVAILABLE TRANSITION SOCKETS?
Microchip Technology currently offers the following transition
sockets for use with our emulator systems:
•
•
•
•
PDIP – 28-Lead, 0.300-inch Male to 0.600-inch Female
SOIC – 8-, 14-, 18-, 20- and 28-Lead
SSOP – 20- and 28-Lead
QFP – 44-, 64- and 80-Lead
Please check the Microchip web site (www.microchip.com) for
the most current version of this document.
DS51194D-page 2
2000 Microchip Technology Inc.
®
MPLAB -ICE
HOW CAN I OBTAIN MAXIMUM BENEFIT
FROM THE USE OF TRANSITION
SOCKETS?
Attention to component placement should be considered to pro-
vide adequate clearance for the transition socket interface to the
PCB footprint. This is especially true for any tall components
such as connector headers, radial components or voltage regu-
lators. Refer to the transition socket mechanical drawings for
dimensions.
COMMENTS AND SUGGESTIONS ON
TRANSITION SOCKET APPLICATIONS
Attention to component placement should be considered in mat-
ing the adapter sockets to the SOIC/SSOP headers. If visual
alignment is difficult in your application, c-shaped end brackets
have been included to aid in header-to-adapter socket alignment.
Clip the brackets onto the SOIC/SSOP header.
The placement of via’s around the Surface Mount Technology
(SMT) layout area should be examined. Via’s immediately adja-
cent to the end of a SMT pad may inadvertently come into contact
with the header leads. Via’s should be placed along the center-
line of the SMT pad to lessen the chance of pin to pin shorts while
soldering.
The SOIC Header is designed for SOIC body width of 0.300-inch,
the adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
2000 Microchip Technology Inc.
DS51194D-page 3
MPLAB™-ICE
XLT28XP
28-Lead DIP 0.300-inch Male to 0.600-inch Female
Adapter Socket .............................................................7
XLT08SO
8-Lead DIP to 0.050-inch Adapter Socket ....................9
8-Lead SOIC Header ..................................................10
XLT14SO
14-Lead DIP to 0.050-inch Adapter Socket ................11
14-Lead SOIC Header ................................................12
XLT18SO
18-Lead DIP to 0.050-inch Adapter Socket ................13
18-Lead SOIC Header ...............................................14
XLT20SO1
20-Lead DIP to 0.050-inch Adapter Socket ................15
20-Lead SOIC Header ...............................................16
XLT28SO
28-Lead DIP to 0.050-inch Adapter Socket ................17
28-Lead SOIC Header ................................................18
XLT20SS
18-Lead DIP to 0.8 mm Adapter Socket .....................20
20-Lead SSOP Header ..............................................21
XLT20SS1
20-Lead DIP to 0.8 mm Adapter Socket .....................22
20-Lead SSOP Header ..............................................23
XLT28SS, XLT28SS2
28-Lead DIP to 0.8 mm Adapter Socket .....................24
28-Lead SSOP Header ..............................................25
DS51194D-page 4
2000 Microchip Technology Inc.
MPLAB™-ICE
XLT44PT
44-Lead Transition Socket – Top View .....................29
44-Lead Transition Socket – Side View ....................30
XLT64PT1, XLT64PT2, XLT80PT
64/80-Lead Transition Socket – Top View ................31
64/80-Lead Transition Socket – Side View ...............32
2000 Microchip Technology Inc.
DS51194D-page 5
®
MPLAB -ICE
PDIP TRANSITION SOCKET
A PDIP transition socket and associated hardware is shown in
Figure 2.
FIGURE 2:
PDIP Transition Socket
Cable to Processor Module
PDIP Type Device Adapter
0.300-inch Male to 0.600-inch Female Adapter Socket
(PDIP Transition Socket)
Gold Standoffs / Adapters
Target / Application Board
The PDIP transition socket is a 0.300-inch Male to 0.600-inch
Female adapter socket.
Microchip offers the following PDIP transition socket:
•
XLT28XP: One 28-Lead PDIP adapter socket and two
28-Lead gold stand-offs
See the drawings in this section for layout dimensions.
DS51194D-page 6
2000 Microchip Technology Inc.
®
MPLAB -ICE
XLT28XP
28-Lead DIP 0.300-inch Male to 0.600-inch Female
Adapter Socket
1.400"
TOP
VIEW
0.700"
SIDE
VIEW
0.100"
0.600"
FRONT/
REAR
VIEW
0.300"
2000 Microchip Technology Inc.
DS51194D-page 7
®
MPLAB -ICE
SOIC TRANSITION SOCKET
An SOIC transition socket and associated hardware is shown in
Figure 3.
FIGURE 3:
SOIC Transition Socket
Cable to Processor Module
PDIP Type Device Adapter
Gold Standoffs / Adapters
SOIC Transition Socket
Adapter Socket
SOIC Header
Target / Application Board
There are two components of the SOIC transition socket.
1. Adapter socket that connects to the PDIP device adapter.
2. SOIC header that is to be soldered down to the target appli-
cation.
Microchip offers the following SOIC transition sockets:
•
•
•
•
•
XLT08SO:One adapter socket and three 8-Lead SOIC
headers
XLT14SO:One adapter socket and three 14-Lead SOIC
headers
XLT18SO:One adapter socket and three 18-Lead SOIC
headers
XLT20SO1:One adapter socket and three 20-Lead
SOIC headers
XLT28SO:One adapter socket and three 28-Lead SOIC
headers
See the drawings in this section for layout dimensions.
Note: The SOIC header is designed for SOIC body width of
0.300 inch. The adapter leads should be cut to fit the
0.150-inch and 0.208-inch SOIC body widths.
DS51194D-page 8
2000 Microchip Technology Inc.
®
MPLAB -ICE
XLT08SO
8-Lead DIP to 0.050-inch Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
2000 Microchip Technology Inc.
DS51194D-page 9
®
MPLAB -ICE
8-Lead SOIC Header
TOP
VIEW
F
E
FRONT/
REAR
VIEW
D
A
G
B
SIDE
VIEW
C
A
B
C
D
E
F
G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inch.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
DS51194D-page 10
2000 Microchip Technology Inc.
®
MPLAB -ICE
XLT14SO
14-Lead DIP to 0.050-inch Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
2000 Microchip Technology Inc.
DS51194D-page 11
®
MPLAB -ICE
14-Lead SOIC Header
TOP
VIEW
F
E
D
FRONT/
REAR
VIEW
G
A
B
SIDE
VIEW
C
A
B
C
D
E
F
G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inch.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
DS51194D-page 12
2000 Microchip Technology Inc.
®
MPLAB -ICE
XLT18SO
18-Lead DIP to 0.050-inch Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
2000 Microchip Technology Inc.
DS51194D-page 13
®
MPLAB -ICE
18-Lead SOIC Header
TOP
VIEW
F
E
D
FRONT/
REAR
VIEW
A
G
B
SIDE
VIEW
C
A
B
C
D
E
F
G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inches.
The adapter leads should be cut to fit the 0.150inch and
0.208-inch SOIC body widths.
DS51194D-page 14
2000 Microchip Technology Inc.
®
MPLAB -ICE
XLT20SO1
20-Lead DIP to 0.050-inch Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
2000 Microchip Technology Inc.
DS51194D-page 15
®
MPLAB -ICE
20-Lead SOIC Header
TOP
VIEW
F
E
D
FRONT/
REAR
VIEW
A
G
B
SIDE
VIEW
C
A
B
C
D
E
F
G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inches.
The adapter leads should be cut to fit the 0.150inch and
0.208-inch SOIC body widths.
DS51194D-page 16
2000 Microchip Technology Inc.
®
MPLAB -ICE
XLT28SO
28-Lead DIP to 0.050-inch Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
2000 Microchip Technology Inc.
DS51194D-page 17
®
MPLAB -ICE
28-Lead SOIC Header
TOP
VIEW
F
E
D
FRONT/
REAR
VIEW
A
G
C
B
SIDE
VIEW
A
B
C
D
E
F
G
0.060 0.410 0.050 0.075 0.178 0.050 0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inches.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
DS51194D-page 18
2000 Microchip Technology Inc.
®
MPLAB -ICE
SSOP TRANSITION SOCKET
An SSOP transition socket and associated hardware is shown in
Figure 4.
FIGURE 4:
SSOP Transition Socket
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs / Adapters
SSOP Transition Socket
Adapter Socket
SSOP Header
Target / Application Board
The SSOP transition sockets are similar to the SOIC transition
sockets. There are two parts to the SSOP transition socket:
1. Adapter socket that connects to the PDIP device adapter.
2. SSOP header that gets soldered down to the target applica-
tion.
Note: To keep the leads straight during assembly and ship-
ping, the SSOP headers are shipped with break-away
tabs attached to the leads. Please remove the break-
away tabs before applying power to the target system.
Be careful not to bend the leads prior to soldering to the
target application.
Microchip offers the following SSOP transition sockets:
•
•
•
•
XLT20SS: One adapter socket and three 20-Lead
SSOP headers
XLT20SS1: One adapter socket and three 20-Lead
SSOP headers
XLT28SS: One adapter socket and three 28-Lead
SSOP headers
XLT28SS2: One adapter socket and three 28-Lead
SSOP headers for PIC16C55/57.
See the drawings in this section for layout dimensions and clear-
ances for tall components.
2000 Microchip Technology Inc.
DS51194D-page 19
®
MPLAB -ICE
XLT20SS
18-Lead DIP to 0.8 mm Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
DS51194D-page 20
2000 Microchip Technology Inc.
®
MPLAB -ICE
20-Lead SSOP Header
Shipped with break-
away tabs attached
to leads
TOP
VIEW
Remove prior to
providing power
* Top drawing shown
with clip-on shrouds
installed
F
FRONT/
REAR
VIEW
E
D
A
B
G
SIDE
VIEW
C
A
B
C
D
E
F
G
0.040 0.295 0.026 0.075 0.190 0.047 0.0315
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
Break away tabs are to be removed prior to providing power.
2000 Microchip Technology Inc.
DS51194D-page 21
®
MPLAB -ICE
XLT20SS1
20-Lead DIP to 0.8 mm Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
DS51194D-page 22
2000 Microchip Technology Inc.
®
MPLAB -ICE
20-Lead SSOP Header
Shipped with break-
away tabs attached
to leads
TOP
VIEW
Remove prior to
providing power
* Top drawing shown
with clip-on shrouds
installed
F
FRONT/
REAR
VIEW
E
D
A
B
G
SIDE
VIEW
C
A
B
C
D
E
F
G
0.040 0.295 0.026 0.075 0.190 0.047 0.0315
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
Break away tabs are to be removed prior to providing power.
2000 Microchip Technology Inc.
DS51194D-page 23
®
MPLAB -ICE
XLT28SS, XLT28SS2
28-Lead DIP to 0.8 mm Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
DS51194D-page 24
2000 Microchip Technology Inc.
®
MPLAB -ICE
28-Lead SSOP Header
TOP
VIEW
Shipped with break-
away tabs attached
to leads
Remove prior to
applying power.
* Top drawing
shown with clip-on
shrouds installed
F
FRONT/
REAR
VIEW
E
D
SIDE
VIEW
G
A
B
C
A
B
C
D
E
F
G
0.040 0.295 0.026 0.075 0.190 0.0470.0315
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Break away tabs are to be removed prior to applying power.
2000 Microchip Technology Inc.
DS51194D-page 25
®
MPLAB -ICE
MQFP/TQFP TRANSITION SOCKET
An MQFP/TQFP transition socket and associated hardware is
shown in Figure 5.
FIGURE 5:
MQFP/TQFP Transition Socket
Cable to Processor Module
MQFP/TQFP Device Adapter
MQFP/TQFP Transition Socket
Target / Application Board
The MQFP/TQFP transition socket is required for use along with
the MQFP/TQFP device adapters. The device adapter is
equipped with four socket strips that interface with the transition
socket.
Note: To avoid solder bridging, do not place via’s within 0.025-
inch of the MQFP/TQFP footprint. Also, any via’s near
the MQFP/TQFP should be directly on the centerline of
the pad.
Microchip offers the following MQFP/TQFP transition sockets:
•
•
•
•
XLT44PT: One 44-Lead MQFP/TQFP transition
socket
XLT64PT1 One 64-Lead MQFP/TQFP transition
socket, PIC16C92X
XLT64PT2: One 64-Lead MQFP/TQFP transition
socket, PIC17CXXX
XLT80PT: One 80-Lead MQFP/TQFP transition
socket
DS51194D-page 26
2000 Microchip Technology Inc.
®
MPLAB -ICE
Note: The XLT64PT1 for the PIC16C92X is not symmetrical.
Please note Pin 1 orientation prior to soldering to the tar-
get system.
Pin 1
1
ST92X
TOP
VIEW
See the drawings in this section for layout dimensions and clear-
ances for tall components.
2000 Microchip Technology Inc.
DS51194D-page 27
®
MPLAB -ICE
TQFP TRANSITION SOCKET SOLDERING
TIPS
•
•
•
•
•
Before soldering, consider keeping the break away tabs
in place during soldering.
Use controlled soldering iron tip temperatures between
300 and 325 ° C (570 to 615 ° F)
If it is possible, use a PACE mini wave soldering iron tip
or an equivalent tip design.
Plan to solder one (1 of 4) side first, then the opposite
side, then remaining two sides.
Soldering iron tip movement should be in direction of
the leads (backward and forward), not across the leads;
dragging the tip across the leads may cause lead dam-
age.
•
•
Use generous amounts of soldering flux to aid in the
solder flow action.
If the breakaway tabs are removed after soldering
(using a dental pick or equivalent), any solder bridging
between leads can be repaired by simply gently touch-
ing the soldering tip to the lead tip.
Remember the 64- and 80-pin TQFP headers are very del-
icate and can be damaged!
DS51194D-page 28
2000 Microchip Technology Inc.
®
MPLAB -ICE
XLT44PT
44-Lead Transition Socket – Top View
TOP
VIEW
A
A
0.90
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
2000 Microchip Technology Inc.
DS51194D-page 29
®
MPLAB -ICE
44-Lead Transition Socket – Side View
B
F
H
SIDE
VIEW
J
G
E
D
C
B
C
D
E
F
G
H
J
0.80 0.65 0.55 0.365 0.05 0.80 mm 0.275
0.130
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
DS51194D-page 30
2000 Microchip Technology Inc.
®
MPLAB -ICE
XLT64PT1, XLT64PT2, XLT80PT
64/80-Lead Transition Socket – Top View
A
A
TOP
VIEW
A
1.25
1.45
64 Lead
80 Lead
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 64-Lead.
This drawing shown with break away tabs attached to
the leads.
Break away tabs are to be removed prior to applying
power.
2000 Microchip Technology Inc.
DS51194D-page 31
®
MPLAB -ICE
64/80-Lead Transition Socket – Side View
B
F
SIDE
VIEW
H
J
G
E
C
B
C
E
F
G
H
J
64 Lead 0.95 0.500 0.400 0.05 0.5 mm 0.275 0.095
80 Lead 1.15 0.575 0.475 0.05 0.5 mm 0.275 0.095
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 64-Lead.
Break away tabs are to be removed prior to applying
power.
DS51194D-page 32
2000 Microchip Technology Inc.
®
MPLAB -ICE
NOTES:
2000 Microchip Technology Inc.
DS51194D-page 33
®
MPLAB -ICE
NOTES:
DS51194D-page 34
2000 Microchip Technology Inc.
®
MPLAB -ICE
NOTES:
2000 Microchip Technology Inc.
DS51194D-page 35
Worldwide Sales and Service
AMERICAS
ASIA/
EUROPE
PACIFIC
Corporate Office
Tel: 480-786-7200
Technical Support:
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Tel: 45-4420-9895
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Tel: 91-80-229-0061
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Tel: 44 118 921 5858
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Tel: 972-818-7423
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Tel: 81-45-471- 6166
05/16/00
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Tel: 905-405-6279
Microchip received QS-9000 quality system
certification for its worldwide headquarters, design
and wafer fabrication facilities in Chandler and
Tempe, Arizona in July 1999. The Company’s
quality system processes and procedures are QS-
®
9000 compliant for its PICmicro 8-bit MCUs,
®
KEELOQ code hopping devices, Serial EEPROMs
and microperipheral products. In addition,
Microchip’s quality system for the design and
manufacture of development systems is ISO 9001
certified.
All rights reserved. © 6/00 Microchip Technology Incorporated. Printed in the USA. 6/00
Printed on recycled paper.
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be
superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated
with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from
such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The
Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights
reserved. All other trademarks mentioned herein are the property of their respective companies.
DS51194D-page 36
2000 Microchip Technology Inc.
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