25-21-BHC-APR-2T [EVERLIGHT]

1206 Package Chip LED with Inner Lens(1.1mm Height); 1206封装与芯片内透镜( 1.1毫米高度)LED
25-21-BHC-APR-2T
型号: 25-21-BHC-APR-2T
厂家: EVERLIGHT ELECTRONICS CO., LTD    EVERLIGHT ELECTRONICS CO., LTD
描述:

1206 Package Chip LED with Inner Lens(1.1mm Height)
1206封装与芯片内透镜( 1.1毫米高度)LED

文件: 总11页 (文件大小:227K)
中文:  中文翻译
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Technical Data Sheet  
1206 Package Chip LED with Inner Lens(1.1mm Height)  
25-21BHC-APR2T  
Features  
Package in 8mm tape on 7diameter reel.  
Compatible with automatic placement equipment.  
Compatible with infrared and vapor phase reflow  
solder process.  
Mono-color type.  
Pb-free.  
The product itself will remain within RoHS compliant version.  
Descriptions  
The 25-21 SMD LED is much smaller than lead  
frame type components, thus enable smaller board  
size, higher packing density, reduced storage space  
and finally smaller equipment to be obtained.  
Besides, lightweight makes them ideal for  
miniature applications. etc.  
Applications  
Backlighting in dashboard and switch.  
Telecommunication: indicator and backlighting in  
telephone and fax.  
Flat backlight for LCD, switch and symbol.  
General use.  
Device Selection Guide  
Chip  
Part No.  
Emitted Color  
Resin Color  
Material  
25-21BHC-APR2T  
InGaN  
Blue  
Water Clear  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 1 of 11  
Prepared by:Sam Feng  
25-21BHC-APR2T  
Package Outline Dimensions  
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 2 of 11  
Prepared by:Sam Feng  
                                       
                                     
25-21BHC-APR2T  
Absolute Maximum Ratings (Ta=25)  
Parameter  
Reverse Voltage  
Symbol  
VR  
Rating  
Unit  
V
5
Forward Current  
IF  
25  
mA  
Peak Forward Current  
(Duty 1/10 @1KHz)  
Power Dissipation  
IFP  
100  
mA  
Pd  
95  
mW  
V
Electrostatic Discharge(HBM)  
Operating Temperature  
Storage Temperature  
ESD  
Topr  
Tstg  
150  
-40 ~ +85  
-40 ~ +90  
Reflow Soldering : 260 for 10 sec.  
Hand Soldering : 350 for 3 sec.  
Soldering Temperature  
Tsol  
Electro-Optical Characteristics (Ta=25)  
Parameter  
Luminous Intensity  
Viewing Angle  
Symbol Min.  
Typ. Max.  
Unit Condition  
Iv  
45.0  
----  
----  
60  
180  
----  
mcd  
deg  
2θ1/2  
λp  
λd  
Peak Wavelength  
----  
464.5  
----  
468  
----  
25  
----  
476.5  
----  
nm  
IF=20mA  
nm  
Dominant  
Wavelength  
Spectrum Radiation  
Bandwidth  
△λ  
VF  
nm  
V
Forward Voltage  
Reverse Current  
2.7  
----  
3.3  
----  
3.7  
50  
μA  
IR  
VR=5V  
Notes:  
1.Tolerance of Luminous Intensity ±11%  
2.Tolerance of Dominant Wavelength ±1nm  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 3 of 11  
Prepared by:Sam Feng  
                                       
                                     
25-21BHC-APR2T  
Bin Range Of Dom. Wavelength  
Group  
Bin  
A9  
Min  
Max  
467.5  
470.5  
473.5  
476.5  
Unit  
nm  
Condition  
IF=20mA  
464.5  
467.5  
470.5  
473.5  
A10  
A11  
A12  
A
Bin Range Of Luminous Intensity  
Bin  
P
Min  
45.0  
72.0  
112  
Max  
Unit  
Condition  
IF=20mA  
72.0  
112  
180  
Q
mcd  
R
Notes:  
1.Tolerance of Luminous Intensity ±11%  
2.Tolerance of Dominant Wavelength ±1nm  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 4 of 11  
Prepared by:Sam Feng  
25-21BHC-APR2T  
Typical Electro-Optical Characteristics Curves  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 5 of 11  
Prepared by:Sam Feng  
25-21BHC-APR2T  
Label explanation  
Pb  
EVERLIGHT  
CAT: Luminous Intensity Rank  
HUE: Dom. Wavelength Rank  
REF: Forward Voltage Rank  
CPN :  
P
N : XXXXXXXXXXXXX  
RoHS  
XXXXXXXXXXXXX  
QTY : XXX  
CAT : XXX  
HUE : XXX  
REF : XXX  
LOT NO : XXXXXXXXXX  
Reference : XXXXXXXX  
MADE IN TAIWAN  
Reel Dimensions  
Note: Tolerances Unless Dimension ±0.1mm ,Unit = mm  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 6 of 11  
Prepared by:Sam Feng  
25-21BHC-APR2T  
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel  
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm  
Moisture Resistant Packaging  
Aluminum moisture-proof bag  
Label  
Desiccant  
Label  
Reliability Test Items And Conditions  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 7 of 11  
Prepared by:Sam Feng  
25-21BHC-APR2T  
The reliability of products shall be satisfied with items listed below.  
Confidence level90%  
LTPD10%  
Test  
Sample  
Ac/Re  
Size  
No.  
1
Items  
Test Condition  
Hours/Cycles  
Temp. : 260℃±5℃  
Reflow Soldering  
22 PCS.  
0/1  
0/1  
6 Min.  
5sec.  
H : +10015min  
300 Cycles  
300 Cycles  
2
Temperature Cycle  
Thermal Shock  
22 PCS.  
5 min  
L : -4015min  
H : +1005min  
3
4
22 PCS.  
22 PCS.  
0/1  
0/1  
10 sec  
L : -105min  
High Temperature  
Storage  
1000 Hrs.  
1000 Hrs.  
Temp. : 100℃  
Temp. : -40℃  
Low Temperature  
Storage  
5
6
7
22 PCS.  
22 PCS.  
22 PCS.  
0/1  
0/1  
0/1  
DC Operating Life  
IF = 20 mA  
1000 Hrs.  
1000 Hrs.  
High Temperature /  
High Humidity  
85/ 85% RH  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 8 of 11  
Prepared by:Sam Feng  
25-21BHC-APR2T  
Precautions For Use  
1. Over-current-proof  
Customer must apply resistors for protection , otherwise slight voltage shift will cause big  
current change ( Burn out will happen ).  
2. Storage  
2.1 Do not open moisture proof bag before the products are ready to use.  
2.2 Before opening the package: The LEDs should be kept at 30or less and 90%RH or less.  
2.3 After opening the package: The LED's floor life is 1 year under 30or less and 60% RH or less.  
If unused LEDs remain, it should be stored in moisture proof packages.  
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the  
storage time, baking treatment should be performed using the following conditions.  
Baking treatment : 60±5for 24 hours.  
3. Soldering Condition  
3.1 Pb-free solder temperature profile  
3.2 Reflow soldering should not be done more than two times.  
3.3 When soldering, do not put stress on the LEDs during heating.  
3.4 After soldering, do not warp the circuit board.  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 9 of 11  
Prepared by:Sam Feng  
25-21BHC-APR2T  
4. Soldering Iron  
Each terminal is to go to the tip of soldering iron temperature less than 350for 3 seconds  
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do  
soldering of each terminal. Be careful because the damage of the product is often started at the time of the  
hand solder.  
5.Repairing  
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a  
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether  
the characteristics of the LEDs will or will not be damaged by repairing.  
EVERLIGHT ELECTRONICS CO., LTD.  
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,  
Tucheng, Taipei 236, Taiwan, R.O.C  
Tel: 886-2-2267-2000, 2267-9936  
Fax: 886-2267-6244, 2267-6189, 2267-6306  
http://www.everlight.com  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 10 of 11  
Prepared by:Sam Feng  
25-21BHC-APR2T  
Everlight Electronics Co., Ltd.  
Device No:  
http://www.everlight.com  
Prepared date: 1-Jul-2011  
Rev 2  
Page: 11 of 11  
Prepared by:Sam Feng  

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