KM04H-P05-27K-N42-TR [EVERLIGHT]
Robust package with high lumens; 强大的封装提供高流明
| 型号： | KM04H-P05-27K-N42-TR |
| 厂家： | 
EVERLIGHT ELECTRONICS CO., LTD |
| 描述： | Robust package with high lumens |
| 文件： | 总27页 (文件大小：1103K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EHP-B05 series
Introduction
B05 series is a high power, multi-chip device with very low
thermal resistance as a result of the PCB substrate. The series
is a surface-mount high-power device featuring high brightness
that is suitable for all kinds of lighting applications such as
general illumination, spot, signal, industrial and commercial lighting.
Features
Applications
General Lighting
Robust package with high lumens
ESD protection up to 8KV
Soldering method: SMT
Spot Lighting
Signal and Symbol Luminaries for
orientation marker lights (e.g. steps,
exit ways, etc.)
Moisture Sensitivity Level: 3
RoHS compliant
Industrial Lighting
ANSI binning
Commercial Lighting
Reliability testing conforms to IESNA
LM80 Lumen maintenance test method
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EHP- B05 Series
Table of Contents
Table of Contents… … ...… … … … … … … … … … … .… … … … … … … … … … … … … … .… … … … … ...2
Product Nomenclature & Materials… … … … … … … … … … … … … … … … … … … … .… ...................3
Maximum Rating & JEDEC Moisture Sensitivity… … .… … … .… … … … … … … … … … … … … ..… … 4
PN of the B05 series：Typ.CRI 75 White LEDs… … … … .… … .… … … .… … … … … … .… … … … … 5
PN of the B05 series：Typ.CRI 85 White LEDs… … .… … ...… … … … … ...… … … … … … … … … … .6
Product Binning & Forward Voltage Bins… … … … … … … … … … … … … … … … … … … … ....8
White Bin Structure & Cool-White Bin Structure… … … … .… … … … … … … … … … … … .… … ......9
Cool-White Bin Coordinates… … … … … … … … … … … … ..… … … … … … … … … … … … … … … … ..10
Neutral-White Bin Structure & Neutral-White Bin Coordinates… … … … … … … … ..… … … … ..… ..11
Warm-White Bin Structure & Warm-White Bin Coordinates… … … … … … … … … ...… … … … … 12
Dimensions … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … … ......14
Wavelength Characteristics Curves… … … … … … … … … … … … … … … … … … … … … … … … … ...15
Typical Light Output Characteristics vs Solder Pad Temperature… … … … … … … … … … ............16
Typical Forward Voltage vs Solder Pad Temperature… … … … … … … … … … ............17
Typical Electrical Characteristics… … … … … … … … … … … … … … … … ..… … … … … … … … … … ..17
Typical Relative Luminous Flux vs Forward Current… … … … … … … … … … … … … … … … … ...… 18
Typical CCT Shift Characteristics vs Forward Current… … … … … … … … … … … … … … … … … … 18
Current Derating Curves… … … … … … … … … … … … … … … … … … … … … … … … … … … … … … ..19
Typical Radiation Pattern… … … … … … … … … … … … … … … … … … … … … … … … .… … … … … .20
Label explanation & Reel dimensions … … … … … … … … … … … … … … … … … … … … ....… … ...21
Carrier Tape Dimensions: Loaded quantity & Moisture Resistant Packaging… … … … … … … … . 22
Reliability Data … … … … … … … ..… … … … … … … … … … … … … … … … … … … … … … .......23
Precautions For Use… … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … ..… ..24
Revision History… … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … 27
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EHP- B05 Series
Product Nomenclature
The product name is designated as below:
EHP-B05MLG/GT04H-P05/50K/R11/TR
Designation:
EHP-B05=Family name
MLG = Lambertian
GT =Color Code [1]
0 _ H = Quantity of the chip [2]
P05 =Power Consumption[3]
50K = Color bin or CCT bin
R11 = min. luminous flux (lm) or radiation power (mW) performance
TR = Tape and Reel
Notes
1. Code of wavelength of the chip:
Symbol
RB
UB
SUG
UY
USO
SUR
GRB
GT
LM
KT
Color
Royal Blue
Ultra Blue
Green
Amber
Dominant wavelength range/Peak wavelength/CCT
445~460nm
460~470nm
520~540nm
580~595nm
610~620nm
620~635nm
SUR+SUG+UB
4745-7050K
2580-4745K
4745-7050K
2580-4745K
Ultra Red-Orange
Super ultra-Red
RGB full color
White, CRI Min 70
Warm White, CRI Min 70
White, CRI Min 80
Warm White, CRI Min 80
KM
2. Quantity of the chip:
Symbol Description
2
4
6
8
2 chips
4 chips
6 chips
8 chips
3. Consume the power:
Symbol Description
P05 5W
P07 7W
10W
P10
Materials
Items
Description
Substrate
Housing
Encapsulating Resin
PCB with Metal Heat Sink
Heat resistant polymer
Silicone resin
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EHP- B05 Series
Maximum Ratings
Parameter
Symbol
Ratings
Unit
DC Forward Current(1)
DC Pulse Current(2)
IF
IPF
800
1000
8000
125
mA
mA
V
ESD Sensitivity
ESD
Tj
Junction Temperature(3)
Operating Temperature(4)(5)
Storage Temperature
°C
Top.
Tstge.
-40 ~ +85
-40 ~ +100
7
°C
°C
Junction To Heat-Sink Thermal Resistance
Max. Solder Pad Temperature
Rth
TSol
n/a
°C /W
°C
260
Max. Allowable Reflow Cycles
2
cycles
Notes:
1. Maximum forward current is 1000mA (Thermal Pad = 25°C).
2. Duty cycle = 1/10@1KHz (Thermal Pad = 25°C)
3. Maximum junction temperature is 125°C for White LEDs.
4. Maximum Operating Temperature (Thermal Pad) is 85°C for White LEDs.
5.Avoid operating LEDs at maximum operating temperature exceeding 1 hour.
JEDEC Moisture Sensitivity
Soak Requirements
Standard
Floor Life
Level
Time
(hours)
Time
(hours)
Conditions
≦30°C / 60% RH
Conditions
30°C / 60% RH
3
168H
192 (+5/-0)
4
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EHP- B05 Series
PN of the B05 series: Typ. CRI 75 White LEDs
The table below is a list of part numbers for the EHP-B05 5W series White LED. All parts listed match ANSI
binning standards. Bin offerings of 2700K to 6500K are listed and currently available. CRI is also listed with min
70 to 80. Typical view angle is 140°. These clearly listed binning options allow for proper design and
implementation into lighting applications.
For Example: If you order product using EHP-B05MLG/GT04H-P05/57K/R11/TR, you will get White,
EHP-B05 series LEDs at 700mA are listed below.
Forward
Voltage
(V)
Minimum
Luminous
Flux (lm)
Color Radiation CRI
CCT
Variant Pattern
Typ
Cool
57K-1 ~ 57K-2
57K-3 ~ 57K-4
6.0~6.5(O4)
6.5~7.0(O5)
Lambertian
White
75
400
EHP-B05MLG represents by **
Forward
CRI
Typ
CRI
Min
Luminous Flux
(lm) [1]
Color
Order Code of EHP-B05
CCT(K)
Voltage
(V) [2]
[3]
400-450
450-500
450-500
500-550
400-450
450-500
450-500
500-550
400-450
450-500
450-500
500-550
**/GT04H-P05/65K/R11/TR
**/GT14H-P05/65K/R12/TR
**/GT04H-P05/57K/R11/TR
**/GT14H-P05/57K/R12/TR
**/GT04H-P05/50K/R11/TR
**/GT14H-P05/50K/R12/TR
Cool
White
6500
75
70
65K-1～65K-4
6.0 - 7.0
6.0 - 7.0
6.0 - 7.0
Cool
White
5700
75
75
57K-1～57K-4
50K-1～50K-4
70
70
Cool
White
5000
Neutral
White
4500
375-400
400-450
75
75
70
70
45K-1～45K-4
40K-1～40K-4
**/LM04H-P05/45K/N52/TR
**/LM04H-P05/40K/N52/TR
6.0 - 7.0
6.0 - 7.0
Neutral
White
4000
350-400
400-450
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EHP- B05 Series
Forward
Voltage
(V) [2]
CRI
Typ
CRI
Min
Luminous Flux
(lm) [1]
Color
Order Code of EHP-B05
CCT(K)
[3]
Warm
White
3500
350-400
400-450
75
75
75
70
70
70
35K-1～35K-4
30K-1～30K-4
27K-1～27K-4
**/LM04H-P05/35K/N51/TR
**/LM04H-P05/30K/N51/TR
**/LM04H-P05/27K/N51/TR
6.0 - 7.0
6.0 - 7.0
6.0 - 7.0
Warm
White
300-350
350-400
Warm
White
2700
300-350
350-400
PN of the B05 series: Typ. CRI 85 White LEDs
EHP-B05MLG represents by **
Forward
Voltage
(V) [2]
CRI
Typ
CRI
Min
Luminous
Flux (lm) [1]
Color
Order Code of EHP-B05
CCT(K)
[3]
Cool
White
6500
375-400
400-450
85
85
85
80
80
80
65K-1～65K-4
57K-1～57K-4
50K-1～50K-4
**/KT04H-P05/65K/N52/TR
**/KT04H-P05/57K/N52/TR
**/KT04H-P05/50K/N52/TR
6.0 - 7.0
6.0 - 7.0
6.0 - 7.0
Cool
White
375-400
400-450
Cool
White
350-400
400-450
350-400
400-450
400-450
450-500
325-350
350-400
375-400
400-450
**/KM04H-P05/45K/N52/TR
**/KM14H-P05/45K/R11/TR
**/KM04H-P05/40K/N51/TR
**/KM14H-P05/40K/N52/TR
Neutral
White
4500
85
85
80
80
45K-1～45K-4
40K-1～40K-4
6.0 - 7.0
6.0 - 7.0
Neutral
White
4000
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DATASHEET
EHP- B05 Series
Forward
Voltage
(V) [2]
CRI
Typ
CRI
Min
Luminous
Flux (lm) [1]
Color
Order Code of EHP-B05
CCT(K)
[3]
300-350
350-400
350-400
400-450
275-300
300-350
325-350
350-400
275-300
300-350
325-350
350-400
**/KM04H-P05/35K/N51/TR
**/KM14H-P05/35K/N52/TR
**/KM04H-P05/30K/N42/TR
**/KM14H-P05/30K/N51/TR
**/KM04H-P05/27K/N42/TR
**/KM14H-P05/27K/N51/TR
Warm
White
3500
85
85
85
80
80
80
35K-1～35K-4
30K-1～30K-4
27K-1～27K-4
6.0 - 7.0
6.0 - 7.0
6.0 – 7.0
Warm
White
3000
Warm
White
2700
Note:
1. Luminous Flux measurement tolerance: ±10%.
2. Forward Voltage measurement tolerance: ±0.1V.
3. Color Rendering Index measurement tolerance: ±2.
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EHP- B05 Series
Product Binning
Luminous Intensity spec
Minimum
Photometric Flux (lm)
Maximum
Photometric Flux (lm)
Group
Bin
31
32
41
42
51
52
11
12
21
22
31
32
33
41
42
43
44
51
52
53
54
200
225
250
275
300
350
400
450
500
550
600
650
700
750
800
850
925
1000
1075
1150
1225
225
250
275
300
350
400
450
500
550
600
650
700
750
800
850
925
1000
1075
1150
1225
1300
N
R
Note: Currently available brightness bins for White LEDs are highlighted and bolded.
Forward Voltage Bins
Minimum Forward
Voltage (V)
Maximum Forward
Voltage (V)
Bin
O1
O2
O3
O4
O5
O6
O7
R1
R2
R3
R4
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
9.0
10.0
11.0
5.0
5.5
6.0
6.5
7.0
7.5
8.0
9.0
10.0
11.0
12.0
Notes
1.
2.
Wide forward voltage 0.5V bin structure
Wide forward voltage 1.0V bin structure
O1 ～ O7
R1 ～ R4
8
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DATASHEET
EHP- B05 Series
White Bin Structure
Chromaticity specification defined by ANSI
Notes:
1.
2.
3.
4.
5.
The CCT range of Warm-White varies from 2580K to 3710K
The CCT range of Neutral-White varies from 3710K to 4745K.
The CCT range of Cool-White varies from4745K to 7050K
Color coordinates measurement allowance : ±0.01
Color bins are defined at IF=350mA operation.
Cool-White Bin Structure
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DATASHEET
EHP- B05 Series
Cool-White Bin Coordinates
5000K
Bin
CIE X
0.346
0.345
0.353
0.355
CIE Y
0.369
0.356
0.362
0.376
Bin
CIE X
0.338
0.337
0.345
0.346
CIE Y
0.362
0.349
0.356
0.369
50K-1
50K-2
Reference Range: 4745~5000K
Reference Range: 5000~5310K
Bin
CIE X
0.345
0.344
0.352
0.353
CIE Y
0.356
0.343
0.349
0.362
Bin
CIE X
0.337
0.337
0.344
0.345
CIE Y
0.349
0.337
0.343
0.356
50K-4
50K-3
Reference Range: 4745~5000K
Reference Range: 5000~5310K
5700K
Bin
CIE X
0.329
0.329
0.337
0.338
CIE Y
0.354
0.342
0.349
0.362
Bin
CIE X
0.321
0.322
0.329
0.329
CIE Y
0.346
0.335
0.342
0.354
57K-1
57K-2
Reference Range: 5310~5700K
Reference Range: 5700~6020K
Bin
CIE X
0.329
0.329
0.337
0.337
CIE Y
0.342
0.331
0.337
0.349
Bin
CIE X
0.322
0.322
0.329
0.329
CIE Y
0.335
0.324
0.331
0.342
57K-4
57K-3
Reference Range: 5310~5700K
Reference Range: 5700~6020K
6500K
Bin
CIE X
0.312
0.313
0.321
0.321
CIE Y
0.339
0.329
0.337
0.348
Bin
CIE X
0.303
0.305
0.313
0.312
CIE Y
0.330
0.321
0.329
0.339
65K-1
65K-2
Reference Range: 6020~6500K
Reference Range: 6500~7050K
Bin
CIE X
0.313
0.315
0.322
0.321
CIE Y
0.329
0.319
0.326
0.337
Bin
CIE X
0.305
0.307
0.315
0.313
CIE Y
0.321
0.311
0.319
0.329
65K-4
65K-3
Reference Range: 6020~6500K
Reference Range: 6500~7050K
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EHP- B05 Series
Neutral-White Bin Structure
Neutral-White Bin Coordinates
4000K
Bin
CIE X
0.387
0.383
0.395
0.401
CIE Y
0.396
0.380
0.388
0.404
Bin
CIE X
0.374
0.370
0.383
0.387
CIE Y
0.387
0.373
0.380
0.396
40K-1
40K-2
Reference Range: 3710~4000K
Reference Range: 4000~4260K
Bin
CIE X
0.383
0.378
0.390
0.395
CIE Y
0.380
0.365
0.372
0.388
Bin
CIE X
0.370
0.367
0.378
0.383
CIE Y
0.373
0.358
0.365
0.380
40K-4
40K-3
Reference Range: 3710~4000K
Reference Range: 4000~4260K
4500K
Bin
CIE X
0.364
0.362
CIE Y
0.381
0.366
0.373
0.387
Bin
CIE X
0.355
0.353
CIE Y
0.374
0.360
0.366
0.381
45K-1
45K-2
0.370
0.374
0.362
0.364
Reference Range: 4260~4500K
Reference Range: 4500~4745K
Bin
CIE X
0.362
0.359
CIE Y
0.366
0.352
0.358
0.373
Bin
CIE X
0.353
0.351
CIE Y
0.360
0.347
0.352
0.366
45K-4
45K-3
0.367
0.370
0.359
0.362
Reference Range: 4260~4500K
Reference Range: 4500~4745K
11
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EHP- B05 Series
Warm-White Bin Structure
Warm-White Bin Coordinates
2700K
Bin
CIE X
0.469
0.459
0.470
0.481
CIE Y
0.429
0.410
0.413
0.432
Bin
CIE X
CIE Y
0.426
0.408
0.410
0.429
0.456
0.447
27K-1
27K-2
0.459
0.469
Reference Range: 2580~2700K
Reference Range: 2700~2870K
Bin
CIE X
0.459
0.448
CIE Y
0.410
0.392
0.394
0.413
Bin
CIE X
CIE Y
0.408
0.389
0.392
0.410
0.447
0.437
27K-4
27K-3
0.459
0.470
0.448
0.459
Reference Range: 2580~2700K
Reference Range: 2700~2870K
3000K
Bin
CIE X
0.443
0.435
CIE Y
0.421
0.403
0.408
0.426
Bin
CIE X
0.430
0.422
CIE Y
0.417
0.399
0.403
0.421
30K-1
30K-2
0.447
0.456
0.435
0.443
Reference Range: 2870~3000K
Reference Range: 3000~3220K
Bin
CIE X
0.435
0.426
CIE Y
0.403
0.385
0.389
0.408
Bin
CIE X
0.422
0.415
CIE Y
0.399
0.381
0.385
0.403
30K-4
30K-3
0.437
0.447
0.426
0.435
Reference Range: 2870~3000K
Reference Range: 3000~3220K
12
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EHP- B05 Series
3500K
Bin
CIE X
CIE Y
0.409
0.392
0.399
0.417
Bin
CIE X
0.400
0.394
0.408
0.415
CIE Y
0.402
0.385
0.392
0.409
0.415
0.408
0.422
0.430
35K-1
35K-2
Reference Range: 3220~3500K
Reference Range: 3500~3710K
Bin
CIE X
0.408
0.402
0.415
0.422
CIE Y
0.392
0.375
0.381
0.399
Bin
CIE X
0.394
0.389
0.402
0.408
CIE Y
0.385
0.369
0.375
0.392
35K-4
35K-3
Reference Range: 3220~3500K
Reference Range: 3500~3710K
Note: Currently available typical CCT ranges are 3000K, 5700K, and 6500K CCT
13
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DATASHEET
EHP- B05 Series
Dimensions
Notes.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ± 0.25mm.
14
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DATASHEET
EHP- B05 Series
Wavelength Characteristics
For Cool-White, @ Solder Pad Temperature = 25℃
For Neutral-White, @ Solder Pad Temperature = 25℃
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EHP- B05 Series
For Warm-White, @ Solder Pad Temperature = 25℃
Typical Light Output Characteristic
vs. Solder Pad Temperature
Cool-White, Neutral-White, Warm-White for 700mA Drive Current
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0
10
20
30
40
50
60
70
80
90 100
Solder Pad Temperature ( C)
16
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DATASHEET
EHP- B05 Series
Typical Forward Voltage vs. Solder Pad Temperature
@ 700mA Drive Current
6.7
6.6
6.5
6.4
6.3
6.2
6.1
6.0
5.9
20
30
40
50
60
70
80
90
100
Solder Pad Temperature ( C)
Typical Electrical Characteristics
For Cool-White, Neutral-White, Warm-White
@ Solder Pad Temperature = 25℃
7.5
7.0
6.5
6.0
5.5
5.0
0
200
400
600
800
1000 1200 1400
Forward Current(mA)
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DATASHEET
EHP- B05 Series
Typical Relative Luminous Flux vs. Forward Current
For Cool-White, Neutral-White, Warm-White
@ Solder Pad Temperature = 25℃
2.0
1.6
1.2
0.8
0.4
0.0
0
200
400
600
800
1000 1200 1400
Forward Current(mA)
Typical CCT Shift Characteristics vs. Forward Current
For Cool-White @ Solder Pad Temperature = 25℃
6500
6250
6000
5750
5500
0
200
400
600
800
1000 1200 1400
Forward Current(mA)
18
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DATASHEET
EHP- B05 Series
For Warm-White @ Solder Pad Temperature = 25℃
3200
3100
3000
2900
0
200
400
600
800
1000 1200 1400
Forward Current(mA)
Current Derating Curves
Current Derating Curve for 700mA Drive Current
Cool-White, Neutral-White, Warm-White
1000
800
600
400
200
0
0
20
40
60
80
100
120
Solder Pad Temperature ( C)
19
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DATASHEET
EHP- B05 Series
Typical Radiation Pattern
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-80
-60
-40
-20
0
20
40
60
80
Degree (2)
Note.
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. View angle tolerance is ± 5∘.
.
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DATASHEET
EHP- B05 Series
Label explanation
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Rank of Luminous Flux
HUE: Color Rank
REF: Rank of Forward Voltage
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Reel Dimensions
Note.
1.
2.
Dimensions are in millimeters.
Tolerances for fixed dimensions are ±0.1mm.
21
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EHP- B05 Series
Carrier Tape Dimensions: Loaded quantity 300 PCS per reel
Note.
1.
2.
Dimensions are in millimeters.
Tolerances for fixed dimensions are ±0.1mm.
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant
Label
22
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EHP- B05 Series
Reliability Data
(EHP-B05 Series-5W)
Stress Test
Stress Condition
Stress Duration
Tsol=260℃, 10sec, 6min
Reflow
3 times
H：＋100℃ 20min.
'∫ 20sec.
Thermal Shock
500 Cycles
500 Cycles
'L：－10℃
20min.
H：＋100℃ 15min.
'∫ 5min.
'L：－ 40℃ 15min.
Power Temperature Cycle
IF= 300 mA , 2min on/off
High Temperature/Humidity
Storage
Ta=85℃ , RH=85%
1000hours
1000hours
High Temperature/Humidity
Operation
Ta=85℃ , RH=85% , IF=400mA
Low Temperature Operation
Ta= -40℃, IF=700mA
Ta=25℃, IF=700mA
1000hours
1000hours
Life
High Temperature Operation
Life #1
High Temperature Operation
Life #2
Ta=55℃, IF=700mA
Ta=85℃, IF=400mA
Ta= 110℃
1000hours
1000hours
1000hours
High Temperature Operation
Life #3
High Temperature Storage
Low Temperature Storage
Ta= -40℃
1000hours
*lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)<30%
*VF: FORWARD VOLTAGE DIFFERENCE<20%
23
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DATASHEET
EHP- B05 Series
Precautions For Use
1. Over-current-Protection
Thought the EHP-B05 series has an ESD protection mechanism, customer must not use the
device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts
may cause significant current changes and may cause failure.
2. Storage
i. Do not open the moisture proof bag before the devices are ready to use
ii. Before the package is opened: The LEDs should be stored at temperatures 30℃or less
and humidity 50% or less.
iii. LEDs may be stored for 6 months. When the storage time has reached more than 6 months,
LEDs should be stored in a sealed container filled with Nitrogen gas.
iv. After the package is opened: The LEDs should be stored at temperatures under 30℃ or less
and humidity 30% or less.
v. LEDs should be used within 168 hours (7 days) after the package is opened.
vi. Before using LEDs: The LEDs should be baked under the following conditions: pre-curing at
60±5℃ for 24 hours.
3. Thermal Management
i. For maintaining high flux output and achieving maximum reliability, EHP-B05 series LEDs
should be mounted on a metal core printed circuit board (MCPCB) with proper thermal
connection to dissipate approximately 5W of thermal energy under 700mA operation.
ii. Special thermal designs are also recommended to take into account outer heat sink design,
such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive
adhesive, etc.
Recommend:
Max TSlug
=
70℃
iii. Sufficient thermal management must be implemented, or the die junction temperature may
exceed the limit and LED lifetime will decrease critically.
24
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EHP- B05 Series
4. Proper Handling
To avoid contamination of materials, damage of internal components, and shortening of LED
lifetime, do not subject LEDs to conditions as those listed below.
Bare Hand
Tweezers
When handling the product, do not apply
direct pressure to the optical surface.
Do not touch the resin with tweezers to
avoid scratching or other damage the
optical surface.
Pick and Place Nozzle for Surface
Mount Assembly.
During Module Assembly
Do not stack the modules together, it
could damage the resin or scratch the
lens.
Avoid directly contacting with nozzle.
25
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EHP- B05 Series
5. Reflow Soldering Process
a. EHP-B05 series are suitable for SMT process
b. Curing of glue in oven according to standard operation flow processes.
300
t
p
250
T
L
200
150
t
100
50
0
s
Preheat time
Time
Profile Feature
Parameter
Ramp-UP Rate
2-3 ℃/S
Preheat Temperature
150-200℃
Preheat Time(ts)
60~120s
Liquid Temperature(TL)
217℃
Time above TL
60-90s
Peak Temperature(TP)
260±5℃(Varied with the solder material)
Peak Time(tp)
Max 20s
Ramp-Down Rate
3-5 ℃/S
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
26
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DATASHEET
EHP- B05 Series
Revision History
Current version：2012/03/15
Previous version：2011/12/30
Device No.： DHE-0001726
Rev. Ver. ： 3
Page
Subjects(major change in previous version)
Date of change
Revised Cool-White Bin 5700K Coordinates
9
2011/12/30
P05.Revised Typ.CRI 75 White LEDs & Typ.CRI 85 White
LEDs(Added Higher Level Products)
P16.Revised Typ. Light Output Characteristic vs. Solder
Pad Temperature
5
16
17
2012/03/15
P17.Add Typical Relative Forward Voltage vs. Solder Pad
Temperature
27
RCopyright © 2011, Everlight All Rights Reserved. Release Date: 12.01.2011. Issue No: DHE-0001726
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