R3DC-AEFC [EVERLIGHT]
performance oval LED; 性能椭圆LED型号: | R3DC-AEFC |
厂家: | EVERLIGHT ELECTRONICS CO., LTD |
描述: | performance oval LED |
文件: | 总10页 (文件大小:108K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Features
․High luminous intensity output
․Oval Shape
․Well defined spatial radiation
․Wide viewing angle (2θ1/2) : 110o / 40 o
․UV resistant epoxy
․The product itself will remain within RoHS compliant version
Descriptions
․This precision optical performance oval LED is specifically
designed for passenger information signs
․This lamp has matched radiation patterns with yellow, blue
or green mixing color applications
Applications
․Color graphic signs
․Message boards
․Variable message signs (VMS)
․Commercial outdoor advertising
Device Selection Guide
LED Part No.
Chip Material Emitted Color
Lens Color
Stopper
No
5484BN/R3DC-AEFC/R/MS
5484BN/R3DC-AEFC/PR/MS
AlGaInP
Brilliant Red
Red Diffused
Yes
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 1 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Package Dimensions
Stopper Type
No Stopper Type
Notes:
․Other dimensions are in millimeters, tolerance is 0.25mm except being specified.
․Protruded resin under flange is 1.5mm Max LED.
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 2 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Absolute Maximum Rating (Ta=25℃)
Parameter
Forward Current
Symbol
Absolute Maximum Rating
Unit
IF
50
mA
Pulse Forward Current
(Duty1/10@ 1KHz)
IFP
160
mA
℃
℃
℃
mW
V
Operating Temperature
Storage Temperature
Soldering Temperature
Power Dissipation
Topr
Tstg
Tsol
Pd
-40 ~ +85
-40 ~ +100
260
120
5
Reverse Voltage
VR
Electrostatic Discharge
ESD
2K
V
Notes: Soldering time≦5 seconds.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
IV
Min.
360
--
Typ.
Max.
Unit
mcd
deg
Condition
Luminous Intensity
Viewing Angle
--
720
--
2θ1/2
λp
X:110Y:40
Peak Wavelength
Dominant Wavelength
Spectrum Half width
Forward Voltage
Reverse Current
--
635
--
--
IF=20mA
VR=5V
F2
λd
nm
620
--
632
--
Δλ
VF
20
--
2.0
--
2.6
10
V
μA
IR
--
Rank Combination (IF=20mA)
Rank
E1
E2
F1
Luminous Intensity
360~430
430~510
510~610
610~720
*Measurement Uncertainty of Luminous Intensity: ±10%
Unit:mcd
Rank
1
2
Dominant Wavelength
620~626
626~632
*Measurement Uncertainty of Dominant Wavelength ±1.0nm
Unit:nm
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 3 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Typical Electro-Optical Characteristics Curves
Relative Intensity vs. Wavelength
Forward Current vs. Forward Voltage
70
60
50
40
30
20
10
0
1.0
0.8
0.6
0.4
0.2
0.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
500
550
600
650
700
FORWARD VOLTAGE(V)
Wavelength(nm)
Relative Intensity vs. Ambient Temp.
Relative Intensity vs. Forward Current
2.0
2.5
2.0
1.5
1.0
0.5
0.0
1.5
1.0
0.5
0.0
25
30
35
40
45
50
55
60
65
70
0
10
20
30
40
50
Ambient Temperature Ta(OC)
Forward Current(mA)
Forward Current vs. Ambient Temp.
Radiation Characteristics
60
50
40
30
20
10
0
0
20
40
60
80
100
Ambient Temperature Ta(OC)
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 4 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Taping Dimensions
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 5 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Taping Sizes
Specifications
Symbol Items
Symbol
Avg.
Inch
Tolerance
(mm)
±0.2
mm
4.00
Tape Feed Hole Diameter
Component Lead Pitch
D
F
0.157
0.100
0.078
2.54
2.0
±0.3
Front-to-Read Deflection
Feed Hole to Button of Component
Feed Hole to Overall Component Height
Lead Length after Component Removal
Feed Hole Pitch
△H
H1
H2
L
Max
±1.0
18.5
25.5
0.729
1.003
±1.0
11.00 0.433
12.70 0.500
Max
±0.3
P
Lead Location
P1
P2
T
5.10
6.35
1.42
9.00
0.200
0.250
0.056
0.354
±0.7
Center of Component Location
Overall Taped Package Thickness
Feed Hole Location
±1.2
Max
±0.5
W0
W1
W2
W3
Adhesive Tape Width
13.00 0.512
4.00 0.157
±0.5
Adhesive Tape Position
Tape Width
Max
±0.75
18.00 0.709
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 6 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Packing Specification
■ꢀ Inner Carton
EVERLIGHT
CPN:
P/N:XXXXXXXXXX
RoHS
XXX/XXXX-XXXX
QTY:XXXX
CAT:XX
HUE:XX
REF:XX
LOT NO:
MADE IN TAIWAN
■ꢀLabel Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Rank of Luminous Intensity
HUE: Rank of Dominant Wavelength
REF: Reference
■ Outside Carton
LOT No: Lot Number
MADE IN TAIWAN: Production Place
■ Packing Quantity
1. 2000 PCS/1 Inner Carton
2. 10Inner Cartons/1 Outside Carton
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 7 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the
LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may
cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of
the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more,
they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture
absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments
where condensation can occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from
solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering
300℃Max. (30W
DIP Soldering
100℃ Max. (60 sec
Temp. at tip of iron
Preheat temp.
Max.)
Max.)
Soldering time
Distance
3 sec Max.
3mm Min.(From
solder joint to
epoxy bulb)
Bath temp. & time
Distance
260 Max., 5 sec Max
3mm Min. (From
solder joint to epoxy
bulb)
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 8 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
Recommended soldering profile
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature
and dwell time in the solder wave.
4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a
duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause
damage to the LED.
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 9 of 10
Prepared by: Grace Shen
Technical Data Sheet
5484BN/R3DC-AEFC/XR/MS
5. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED
application. The current should be de-rated appropriately by referring to the de-rating curve
found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to
the data sheet de-rating curve.
6. ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling
LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the
LEDs plastic lens as a result of friction between LEDs during storage and handing.
7. Other
Above specification may be changed without notice. EVERLIGHT will reserve authority on
material change for above specification.
When using this product, please observe the absolute maximum ratings and the instructions for
using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any
damage resulting from use of the product which does not comply with the absolute maximum
ratings and the instructions included in these specification sheets.
These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without
EVERLIGHT’s consent.
EVERLIGHT ELECTRONICS CO., LTD.
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,
Tucheng, Taipei 236, Taiwan, R.O.C
Tel: 886-2-2267-2000, 2267-9936
Fax: 886-2267-6244, 2267-6189, 2267-6306
http:\\www.everlight.com
Everlight Electronics Co., Ltd.
Device Number : DT1-548-037
http\\:www.everlight.com
Prepared date: 03-10-2008
Rev 1
Page: 10 of 10
Prepared by: Grace Shen
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