MP7523 [EXAR]

15 V CMOS Multiplying 8-Bit Digital-to-Analog Converter; 15 V CMOS乘法8位数字 - 模拟转换器
MP7523
型号: MP7523
厂家: EXAR CORPORATION    EXAR CORPORATION
描述:

15 V CMOS Multiplying 8-Bit Digital-to-Analog Converter
15 V CMOS乘法8位数字 - 模拟转换器

转换器
文件: 总12页 (文件大小:105K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MP7523/XRD7523  
15 V CMOS  
Multiplying 8-Bit  
Digital-to-Analog Converter  
...the analog plus companyTM  
January 1996-2  
FEATURES  
APPLICATIONS  
Full Four-Quadrant Multiplying  
Low Feedthrough: 1/2 LSB @ 200 kHz  
Fast Settling: 100 ns (typ.)  
Low Power Dissipation  
Battery Operated Equipment  
Low Power, Ratiometric A/D Converters  
Digitally Controlled Gain Circuits  
Digitally Controlled Attenuators  
CRT Character Generation  
Low Cost  
5 V/15 V Operation  
Low Noise Audio Gain Control  
Buffered Version: MP7524/XRD7524  
The MP7523/XRD7523’s excellent multiplying characteris-  
tics and low cost allow it to be used in a wide ranging field of ap-  
plications such as: low noise audio gain control, CRT character  
generation,motorspeedcontrol, digitallycontrolledattenuators,  
etc.  
GENERAL DESCRIPTION  
The MP7523/XRD7523 is a low cost multiplying Digital-to-  
Analog Converter. The device uses an advanced thin-film-on-  
CMOS technology to provide 8-bit resolution with accuracy to  
10-bits and very low power dissipation.  
SIMPLIFIED BLOCK DIAGRAM  
V
DD  
2R  
2R  
2R  
V
REF  
R
FB  
4R  
4R  
4R  
4R  
4R  
4R  
4R  
R
I
I
OUT1  
OUT2  
2 to 3 Decoder  
Switch Drivers & Switches  
R = 10k  
BIT 1  
MSB  
BIT 8  
LSB  
3 Segment D/A Converter with Termination to DGND  
Logical “1” at Digital Input Steers Current to I  
OUT1  
Rev. 3.00  
E1996  
EXAR Corporation, 48720 Kato Road, Fremont, CA 94538 z (510) 668-7000 z (510) 668-7010  
MP7523/XRD7523  
ORDERING INFORMATION  
Package  
Type  
Temperature  
Range  
INL  
(LSB)  
DNL  
(LSB)  
Gain Error  
(% FSR)  
Part No.  
–40 to +85°C  
–40 to +85°C  
–40 to +85°C  
–40 to +85°C  
–40 to +85°C  
–40 to +85°C  
–40 to +85°C  
–40 to +85°C  
Plastic Dip  
Plastic Dip  
MP7523JN  
MP7523KN  
1/2  
1/4  
1/2  
1/4  
1/2  
1/4  
1  
1  
1  
1  
1  
1  
1.8  
1.8  
1.8  
1.8  
1.8  
1.8  
SOIC (Jedec, 0.300”)  
SOIC (Jedec, 0.300”)  
SOIC (Jedec, 0.150”)  
SOIC (Jedec, 0.150”)  
SOP (EIAJ)  
MP7523JS  
MP7523KS  
XRD7523AID-J  
XRD7523AID-K  
XRD7523AIK-J  
XRD7523AIK-K  
1/2  
1/4  
1  
1  
1.8  
1.8  
SOP (EIAJ)  
PIN CONFIGURATIONS  
1
1
2
3
4
5
6
7
8
16  
15  
14  
13  
I
I
R
V
V
I
I
16  
15  
14  
13  
R
V
OUT1  
FB  
OUT1  
FB  
2
3
4
OUT2  
REF  
DD  
OUT2  
REF  
GND  
(MSB) BIT 1  
BIT 2  
GND  
V
DD  
N/C  
(MSB) BIT 1  
BIT 2  
N/C  
N/C  
BIT 8 (LSB)  
BIT 7  
BIT 6  
12 N/C  
5
6
7
8
12  
11  
10  
9
BIT 3  
BIT 4  
BIT 5  
BIT 8 (LSB)  
BIT 7  
BIT 6  
BIT 3  
BIT 4  
BIT 5  
11  
10  
9
16 Pin PDIP (0.300”)  
16 pin SOIC (Jedec, 0.300”)  
16 pin SOIC (Jedec, 0.150”)  
16 pin SOP (EIAJ, 5.5 mm)  
PIN OUT DEFINITIONS  
PIN NO.  
NAME  
DESCRIPTION  
PIN NO.  
NAME  
BIT 6  
DESCRIPTION  
1
2
3
4
5
6
7
8
I
I
Current Output 1  
Current Output 2  
Ground  
9
Bit 6  
OUT1  
10  
11  
12  
13  
14  
15  
16  
BIT 7  
BIT 8  
N/C  
Bit 7  
OUT2  
GND  
BIT 1  
BIT 2  
BIT 3  
BIT 4  
BIT 5  
Bit 8  
Bit 1 (MSB)  
Bit 2  
No Connection  
No Connection  
Positive Power Supply  
Reference Input Voltage  
Internal Feedback Resistor  
N/C  
Bit 3  
V
V
DD  
Bit 4  
REF  
Bit 5  
R
FB  
Rev. 3.00  
2
MP7523/XRD7523  
ELECTRICAL CHARACTERISTICS  
(V = + 15 V, V  
= +10 V unless otherwise noted)  
DD  
REF  
25°C  
Typ  
Tmin to Tmax  
Parameter  
Symbol  
Min  
Max  
Min  
Max  
Units  
Test Conditions/Comments  
1
STATIC PERFORMANCE  
Resolution (All Grades)  
N
8
8
Bits  
Integral Non-Linearity  
INL  
LSB  
Best Fit Straight Line  
(Relative Accuracy)  
(Max INL – Min INL) / 2  
J
K
+1/2  
+1/4  
+1/2  
+1/4  
Monotonicity  
Guaranteed over temp  
Differential Non-Linearity  
DNL  
GE  
LSB  
%
All grades monotonic over full  
temperature range.  
J
K
+1  
+1  
+1  
+1  
Gain Error  
+1.5  
+1.8  
Using Internal R  
FB  
J
Digital Inputs = V  
INH  
K
Power Supply Rejection Ratio  
PSRR  
+200  
+300 ppm/%  
+200nA nA  
|∆Gain/V | ∆V = + 5%  
DD DD  
J
K
Digital Inputs = V  
INH  
Output Leakage Current (Pin 1)  
I
+50nA  
+50nA  
Digital Inputs = V  
OUT1  
OUT2  
INL  
J
K
Output Leakage Current (Pin 2)  
I
+200nA nA  
Digital Inputs = V  
INH  
J
K
REFERENCE INPUT  
Input Resistance  
R
V
5
20  
5
20 kΩ  
V
OUT1  
= V  
= 0 V  
IN  
OUT2  
DIGITAL INPUTS  
Logical “1” Voltage  
Logical “0” Voltage  
Input Leakage Current  
14.5  
14.5  
V
IH  
V
IL  
LKG  
0.5  
+1  
0.5  
V
I
+1 µA  
ANALOG OUTPUTS  
2
Output Capacitance  
C
C
C
C
100  
30  
30  
100 pF  
30 pF  
30 pF  
100 pF  
DAC Inputs all 1’s  
DAC Inputs all 0’s  
DAC Inputs all 1’s  
DAC Inputs all 0’s  
OUT1  
OUT1  
OUT2  
OUT2  
100  
Rev. 3.00  
3
MP7523/XRD7523  
ELECTRICAL CHARACTERISTICS (CON’T)  
25°C  
Typ  
Tmin to Tmax  
Parameter  
Symbol  
Min  
Max  
Min  
Max  
Units  
Test Conditions/Comments  
POWER SUPPLY  
2
Functional Voltage Range  
Supply Current  
V
I
5
16  
1.6  
5
16  
1.6 mA  
V
DD  
All digital inputs = 0 V or all = 15 V  
DD  
NOTES:  
1
Full Scale Range (FSR) is 10V.  
Guaranteed but not production tested.  
Digital input levels should not go below ground or exceed the positive supply voltage, otherwise damage may occur.  
Specified values guarantee functionality. Refer to other parameters for accuracy.  
2
3
4
Specificationsare subject to change without notice  
1, 2  
ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)  
V
DD  
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17 V  
Storage Temperature . . . . . . . . . . . . –65°C to +150°C  
Digital Input Voltage to GND GND –0.5 to V +0.5 V  
DD  
Lead Temperature (Soldering, 10 seconds) . +300°C  
I
, I  
to GND . . . . . . . . . . . . . . . . . –0.5 to 6.5 V  
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25 V  
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25 V  
OUT1 OUT2  
Package Power Dissipation Rating to 75°C  
V
V
REF  
RFB  
CDIP, PDIP, SOIC . . . . . . . . . . . . . . . . . . . . 800mW  
Derates above 75°C . . . . . . . . . . . . . . . . . 11mW/°C  
NOTES:  
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a  
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating  
conditions for extended periods may affect device reliability.  
2
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps  
(HP5082-2835) from input pin to the supplies.  
APPLICATION NOTES  
Refer to Section 8 in the 1995 Data Acquisition Products databook for Applications Information  
Rev. 3.00  
4
MP7523/XRD7523  
16 LEAD PLASTIC DUAL-IN-LINE  
(300 MIL PDIP)  
9
16  
1
E
1
8
E
D
A
2
A
L
Seating  
Plane  
C
α
A
1
B
B
e
1
e
B
INCHES  
MILLIMETERS  
SYMBOL  
MIN  
MAX  
MIN  
MAX  
A
A
A
B
B
0.145  
0.015  
0.115  
0.014  
0.030  
0.008  
0.745  
0.300  
0.240  
0.210  
0.070  
0.195  
0.024  
0.070  
0.014  
0.840  
0.325  
0.280  
3.68  
0.38  
2.92  
0.36  
0.76  
0.20  
18.92  
7.62  
6.10  
5.33  
1.78  
4.95  
0.56  
1.78  
0.38  
21.34  
8.26  
7.11  
1
2
1
C
D
E
E
e
1
0.100 BSC  
2.54 BSC  
e
L
α
0.310  
0.430  
0.160  
15°  
7.87  
2.92  
0°  
10.92  
4.06  
15°  
B
0.115  
0°  
Rev. 3.00  
5
MP7523/XRD7523  
16 LEAD SMALL OUTLINE  
(150 MIL JEDEC SOIC)  
D
16  
9
E
H
8
C
A
Seating  
Plane  
α
e
B
A
1
L
INCHES  
MILLIMETERS  
SYMBOL  
MIN  
MAX  
MIN  
MAX  
A
0.053  
0.004  
0.013  
0.007  
0.386  
0.150  
0.069  
0.010  
0.020  
0.010  
0.394  
0.157  
1.35  
0.10  
0.33  
0.19  
9.80  
3.80  
1.75  
0.25  
0.51  
0.25  
10.00  
4.00  
A
B
1
C
D
E
e
0.050 BSC  
1.27 BSC  
H
L
0.228  
0.244  
0.050  
5.80  
0.40  
6.20  
1.27  
0.016  
α
0°  
8°  
0°  
8°  
Rev. 3.00  
6
MP7523/XRD7523  
16 LEAD SMALL OUTLINE  
(300 MIL JEDEC SOIC)  
D
16  
9
E
H
8
C
A
Seating  
Plane  
α
e
B
A
1
L
INCHES  
MILLIMETERS  
SYMBOL  
MIN  
MAX  
MIN  
MAX  
A
0.093  
0.004  
0.013  
0.009  
0.398  
0.291  
0.104  
0.012  
0.020  
0.013  
0.413  
0.299  
2.35  
0.10  
0.33  
0.23  
10.10  
7.40  
2.65  
0.30  
0.51  
0.32  
10.50  
7.60  
A
B
1
C
D
E
e
0.050 BSC  
1.27 BSC  
H
L
0.394  
0.419  
0.050  
10.00  
0.40  
10.65  
1.27  
0.016  
α
0°  
8°  
0°  
8°  
Rev. 3.00  
7
MP7523/XRD7523  
16 LEAD EIAJ SMALL OUTLINE  
(5.5 mm EIAJ SOP)  
D
16  
1
9
E
H
Pin 1 Indexer  
8
C
A
A
2
Seating  
Plane  
α
e
B
A
1
L
MILLIMETERS  
INCHES  
SYMBOL  
MIN  
MAX  
MIN  
MAX  
A
1.80  
0.02  
1.80  
0.30  
0.13  
9.9  
2.40  
0.20  
2.20  
0.50  
0.20  
10.5  
5.70  
0.071  
0.001  
0.079  
0.012  
0.005  
0.390  
0.209  
0.095  
0.008  
0.087  
0.020  
0.008  
0.414  
0.224  
A
1
A
2
B
C
D
E
e
5.30  
1.27 BSC  
0.050 BSC  
H
L
7.80  
0.30  
8.20  
0.90  
0.307  
0.012  
0.323  
0.035  
α
0°  
15°  
0°  
15°  
Rev. 3.00  
8
MP7523/XRD7523  
Notes  
Rev. 3.00  
9
MP7523/XRD7523  
Notes  
Rev. 3.00  
10  
MP7523/XRD7523  
Notes  
Rev. 3.00  
11  
MP7523/XRD7523  
NOTICE  
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to im-  
prove design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits de-  
scribed herein, conveys no license under any patent or other right, and makes no representation that the circuits are  
free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary  
depending upon a user’s specific application. While the information in this publication has been carefully checked;  
no responsibility, however, is assumed for inaccuracies.  
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or  
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly  
affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation  
receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the  
user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circum-  
stances.  
Copyright EXAR Corporation  
Datasheet December 1996  
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.  
Rev. 3.00  
12  

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