MP8775 [EXAR]

CMOS 20 MSPS, 8-Bit, High Speed Analog-to-Digital Converter; CMOS 20 MSPS , 8位高速模拟数字转换器
MP8775
型号: MP8775
厂家: EXAR CORPORATION    EXAR CORPORATION
描述:

CMOS 20 MSPS, 8-Bit, High Speed Analog-to-Digital Converter
CMOS 20 MSPS , 8位高速模拟数字转换器

转换器
文件: 总8页 (文件大小:460K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MP8775  
CMOS  
20 MSPS, 8-Bit, High Speed  
Analog-to-Digital Converter  
March 1999-4  
FEATURES  
8-Bit Resolution  
Power Down Available: MP8776  
3 V Version: MP87L75  
Small 20 Pin SOIC Package  
20 MHz Sampling Rate  
DNL = +1/2 LSB, INL = +1 LSB (typ)  
Internal S/H Function  
Single Supply: 5 V  
APPLICATIONS  
V DC Range: 0 V to V  
IN  
DD  
Digital Color Copiers  
Cellular Telephones  
CCD’s Based Systems  
Hardware Scanners  
Video Capture Boards  
V  
DC Range: 1 V to V  
REF  
DD  
Low Power: 85 mW typ. (excluding reference)  
Latch-Up Free  
ESD Protection: 2000 V Minimum  
The designer can choose the internally generated  
GENERAL DESCRIPTION  
reference voltages by connecting V to V  
and V to  
RB  
RBS  
RT  
V
, or provide external reference voltages to the V  
RTS  
RB  
The MP8775 is an 8-bit Analog-to-Digital Converter in a  
small 20 pin SOIC package. Designed using an  
advanced 5 V CMOS process, this part offers excellent  
performance, low power consumption and latch-up free  
operation.  
and V pins. The internal reference generates 0.6 V at  
RT  
V
and 2.6 V at V  
.
RT  
Providing external reference  
RB  
voltages allows easy interface to any input signal range  
between GND and V . This also allows the system to  
adjust these voltages to cancel zero scale and full scale  
errors, or to change the input range as needed.  
DD  
This device uses a two-step flash architecture to maintain  
low power consumption at high conversion rates. The  
input circuitry of the MP8775 includes an on-chip S/H  
function and allows the user to digitize analog input  
The device operates from a single +5 V supply. Power  
consumption is 85 mW at F = 20 MHz.  
s
signals between GND and V . Careful design and chip  
Specified for operation over the commercial / industrial  
(--40 to +85°C) temperature range, the MP8775 is  
available in Surface Mount (SOIC), Shrunk Small Outline  
(SSOP) and Plastic dual-in-line (PDIP) packages.  
DD  
layout have achieved a low analog input capacitance.  
This reduces “kickback” and eases the requirements of  
the buffer/amplifier used to drive the MP8775.  
SIMPLIFIED BLOCK AND TIMING DIAGRAM  
V
AV  
DV  
DD  
DD  
DD  
V
RTS  
V
RT  
MSB  
Comp.  
DB7 (MSB)  
DB0 (LSB)  
Latch  
Latch  
Encoder  
+
F/F  
Error  
LSB  
Comp.  
Correction  
V
RB  
V
RBS  
Sample  
N
CLK  
DB7-  
DB0  
GND  
S/H  
Clock Logic  
CLK  
N-3  
N-2  
N-1  
N
V
AGND  
DGND  
IN  
Rev. 3.01  
E1999  
EXAR Corporation, 48720 Kato Road, Fremont, CA 94538 z (510) 668-7000 z (510) 668-7017  
MP8775  
ORDERING INFORMATION  
Package  
Type  
Temperature  
Range  
DNL  
(LSB)  
INL  
(LSB)  
Part No.  
--40 to +85°C  
--40 to +85°C  
--40 to +85°C  
SOIC  
PDIP  
MP8775AS  
MP8775AN  
MP8775AQ  
¦3/4  
¦3/4  
¦3/4  
¦1 1/2  
¦1 1/2  
¦1 1/2  
SSOP  
PIN CONFIGURATIONS  
See Packaging Section for  
Package Dimensions  
1
20  
1
20  
19  
18  
17  
16  
DGND  
DB0 (LSB)  
DGND  
DGND  
DB0 (LSB)  
DGND  
2
19  
V
V
2
3
4
5
V
V
RB  
RB  
3
18  
17  
16  
15  
14  
13  
12  
11  
DB1  
DB2  
DB3  
DB4  
DB5  
DB6  
DB1  
DB2  
DB3  
DB4  
DB5  
RBS  
RBS  
4
AGND  
AGND  
5
V
V
IN  
IN  
6
6
7
15  
14  
AV  
AV  
DD  
DD  
7
V
V
V
V
RT  
RTS  
RT  
RTS  
8
DB6  
8
13  
12  
11  
9
DB7 (MSB)  
DB7 (MSB)  
9
DV  
DV  
DD  
DD  
10  
10  
DV  
CLK  
DV  
CLK  
DD  
DD  
20 Pin PDIP (0.300”)  
20 Pin SOIC (Jedec, 0.300”)  
20 Pin SSOP  
PIN OUT DEFINITIONS  
PIN NO.  
NAME  
DESCRIPTION  
Digital Ground  
PIN NO.  
NAME  
CLK  
DESCRIPTION  
1
2
3
4
5
6
7
8
9
10  
DGND  
DB0  
DB1  
DB2  
DB3  
DB4  
DB5  
DB6  
DB7  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Sample Clock  
Data Output Bit 0 (LSB)  
Data Output Bit 1  
DV  
Digital Power Supply  
Generates 2.6 V if tied to V  
Top Reference  
DD  
RTS  
RT  
V
V
RT  
Data Output Bit 2  
Data Output Bit 3  
AV  
Analog Power Supply  
Analog Input  
DD  
Data Output Bit 4  
V
IN  
Data Output Bit 5  
AGND  
Analog Ground  
Data Output Bit 6  
V
RBS  
V
RB  
Generates 0.6 V if tied to V  
Bottom Reference  
Digital Ground  
RB  
Data Output Bit 7 (MSB)  
Digital Power Supply  
DV  
DGND  
DD  
Rev. 3.01  
2
03ꢀꢁꢁꢂ  
MP8775  
ELECTRICAL CHARACTERISTICS TABLE (CONT’D)  
25°C  
Typ  
Description  
Symbol  
Min  
Max  
Units  
Conditions  
AC PARAMETERS  
Differential Gain Error  
Differential Phase Error  
d
2
1
%
°
FS = 4 x NTSC  
FS = 4 x NTSC  
G
d
PH  
POWER SUPPLIES  
9
Operating Voltage (AV , DV  
)
V
I
5
17  
V
mA  
DD  
DD  
DD  
DD  
Current (AV + DV  
)
25  
Does not include ref. current  
DD  
DD  
Notes:  
1
Tester measures code transitions by dithering the voltage of the analog input (V ). The difference between the measured and the  
IN  
ideal code width (V  
/256) is the DNL error (Figure 2.). The INL error is the maximum distance (in LSBs) from the best fit line to  
REF  
any transition voltage (Figure 3.). Accuracy is a function of the sampling rate (FS).  
Guaranteed. Not tested.  
2
3
4
Specified values guarantee functionality. Refer to other parameters for accuracy.  
--1 dB bandwidth is a measure of performance of the A/D input stage (S/H + amplifier). Refer to other parameters for accuracy within  
the specified bandwidth.  
5
6
See V input equivalent circuit (Figure 4.). Switched capacitor analog input requires driver with low output resistance.  
IN  
All inputs have diodes to DV and DGND. Input DC currents will not exceed specified limits for any input voltage between  
DD  
DGND and DV  
.
DD  
7
8
9
t , t should be limited to >5 ns for best results.  
R
F
Depends on the RC load connected to the output pin.  
AGND and DGND pins are connected through the silicon substrate. Connect together at the package and to the analog ground plane.  
Specifications are subject to change without notice  
ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)1, 2, 3  
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
VRT & VRB . . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V  
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V  
All Inputs . . . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V  
All Outputs . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V  
Storage Temperature . . . . . . . . . . . . . . . . . . . --65 to +150°C  
Lead Temperature (Soldering 10 seconds) . . . . . . . +300°C  
Package Power Dissipation Rating @ 75°C  
SOIC, SSOP, PDIP . . . . . . . . . . . . . . . . . . . . . . . 700 mW  
Derates above 75°C . . . . . . . . . . . . . . . . . . . . . . 9 mW/°C  
Notes:  
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a  
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating  
conditions for extended periods may affect device reliability.  
2
3
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps  
(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short  
transients outside the supplies of less than 100mA for less than 100µs.  
VDD refers to AVDD and DVDD. GND refers to AGND and DGND.  
1/FS  
PWH  
t
t
PWL  
N + 1  
PIPELINE DELAY  
N + 2  
CLK  
Sample “N”  
N -- 3  
N -- 2  
N -- 1  
DATA N  
DATA  
t HL  
t DL  
Figure 1. MP8775 Timing Diagram  
Rev. 3.01  
4
MP8775  
Output  
Codes  
Best Fit Line  
DNL  
LSB  
7
6
5
4
V
V
(N+1)  
(N)  
Real Transfer Line  
Analog  
Input  
EFS  
INL  
N + 1  
N
Output  
Codes  
Ideal Transfer Line  
3
2
1
N--1  
Code Width (N) = V(N+1) -- V(N)  
LSB = [ V -- V ] / 256  
RT  
RB  
LSB  
DNL(N) = [ V(N+1) -- V(N) ] -- LSB  
Figure 2. DNL Measurement  
CLK  
Analog Input (Volt)  
EZS  
Figure 3. INL Error Calculation  
+5 V  
CLK  
10µF  
0.1µF  
5pF  
50Ω  
V
Analog  
Input  
DD  
V
DB7  
DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
DB0  
IN  
1.5pF  
V
+ V  
2
RT  
RB  
AV  
DD  
V
V
RTS  
RT  
Digital  
Outputs  
0.1µF  
CLK  
MP8775  
V
IN  
V
V
RB  
CLK  
6 pF  
0.1µF  
RBS  
CLK  
5pF  
CLK  
Clock  
AGND  
GND  
1.5pF  
V
IN  
[N--2]  
CLK  
Figure 4. Equivalent Input Circuit  
Figure 5. Typical Circuit Connections  
APPLICATION NOTES  
Signals should not exceed AVDD +0.5V or go below AGND  
--0.5V or DVDD +0.5 V or DGND --0.5 V. All pins have internal  
protection diodes that will protect them from short transients  
(<100µs) outside the supply range.  
capacitive coupling and reflections will contribute noise to the  
conversion.  
It is possible for the data valid delay (tDL) to be equal to or  
greater than the high pulse width of the sampling clock (tPWH),  
See Figure 1. This can cause timing related errors. For sample  
rates above 14 MSPS use only the rising edge of the sample  
clock (CLK) to latch data from the MP8775 to other parts of the  
system.  
AGND and DGND pins are connected internally through the  
P-- substrate. DC voltage differences between these pins will  
cause undesirable internal substrate currents.  
The reference can be biased internally by shorting VRT to  
VRTS and VRB to VRBS. This will generate 0.6 V at VRB and 2.6 V  
at VRT (see Figure 5.).  
The power supply (AVDD) and reference voltage (VRT & VRB  
pins should be decoupled with 0.1µF and 10µF capacitors to  
AGND, placed as close to the chip as possible.  
)
If the internal reference pins VRTS and/or VRBS are not used  
they should be left unconnected.  
The digital outputs should not drive long wires or buses. The  
Rev. 3.01  
5
MP8775  
PERFORMANCE CHARACTERISTICS  
Graph 1. DNL vs. Sampling Frequency  
Graph 2. INL vs. Sampling Frequency  
Graph 3. Supply Current vs.  
Sampling Frequency  
Graph 4. Supply Current vs.  
Temperature  
Graph 5. Reference Resistance vs.  
Temperature  
Graph 6. SNR vs. Input Frequency  
Rev. 3.01  
6
MP8775  
Graph 7. SINAD vs. Input Frequency  
Graph 8. ENOB vs. Input Frequency  
Graph 9. THD vs. Input Frequency  
Rev. 3.01  
7
MP8775  
NOTICE  
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to im-  
prove design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits de-  
scribed herein, conveys no license under any patent or other right, and makes no representation that the circuits are  
free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary  
depending upon a user’s specific application. While the information in this publication has been carefully checked;  
no responsibility, however, is assumed for inaccuracies.  
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or  
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly  
affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation  
receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the  
user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circum-  
stances.  
Copyright 1999 EXAR Corporation  
Datasheet March 1999  
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.  
Rev. 3.01  
8

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