MP8775 [EXAR]
CMOS 20 MSPS, 8-Bit, High Speed Analog-to-Digital Converter; CMOS 20 MSPS , 8位高速模拟数字转换器型号: | MP8775 |
厂家: | EXAR CORPORATION |
描述: | CMOS 20 MSPS, 8-Bit, High Speed Analog-to-Digital Converter |
文件: | 总8页 (文件大小:460K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MP8775
CMOS
20 MSPS, 8-Bit, High Speed
Analog-to-Digital Converter
March 1999-4
FEATURES
• 8-Bit Resolution
• Power Down Available: MP8776
• 3 V Version: MP87L75
• Small 20 Pin SOIC Package
• 20 MHz Sampling Rate
• DNL = +1/2 LSB, INL = +1 LSB (typ)
• Internal S/H Function
• Single Supply: 5 V
APPLICATIONS
• V DC Range: 0 V to V
IN
DD
• Digital Color Copiers
• Cellular Telephones
• CCD’s Based Systems
• Hardware Scanners
• Video Capture Boards
• V
DC Range: 1 V to V
REF
DD
• Low Power: 85 mW typ. (excluding reference)
• Latch-Up Free
• ESD Protection: 2000 V Minimum
The designer can choose the internally generated
GENERAL DESCRIPTION
reference voltages by connecting V to V
and V to
RB
RBS
RT
V
, or provide external reference voltages to the V
RTS
RB
The MP8775 is an 8-bit Analog-to-Digital Converter in a
small 20 pin SOIC package. Designed using an
advanced 5 V CMOS process, this part offers excellent
performance, low power consumption and latch-up free
operation.
and V pins. The internal reference generates 0.6 V at
RT
V
and 2.6 V at V
.
RT
Providing external reference
RB
voltages allows easy interface to any input signal range
between GND and V . This also allows the system to
adjust these voltages to cancel zero scale and full scale
errors, or to change the input range as needed.
DD
This device uses a two-step flash architecture to maintain
low power consumption at high conversion rates. The
input circuitry of the MP8775 includes an on-chip S/H
function and allows the user to digitize analog input
The device operates from a single +5 V supply. Power
consumption is 85 mW at F = 20 MHz.
s
signals between GND and V . Careful design and chip
Specified for operation over the commercial / industrial
(--40 to +85°C) temperature range, the MP8775 is
available in Surface Mount (SOIC), Shrunk Small Outline
(SSOP) and Plastic dual-in-line (PDIP) packages.
DD
layout have achieved a low analog input capacitance.
This reduces “kickback” and eases the requirements of
the buffer/amplifier used to drive the MP8775.
SIMPLIFIED BLOCK AND TIMING DIAGRAM
V
AV
DV
DD
DD
DD
V
RTS
V
RT
MSB
Comp.
DB7 (MSB)
DB0 (LSB)
Latch
Latch
Encoder
+
F/F
Error
LSB
Comp.
Correction
V
RB
V
RBS
Sample
N
CLK
DB7-
DB0
GND
S/H
Clock Logic
CLK
N-3
N-2
N-1
N
V
AGND
DGND
IN
Rev. 3.01
E1999
EXAR Corporation, 48720 Kato Road, Fremont, CA 94538 z (510) 668-7000 z (510) 668-7017
MP8775
ORDERING INFORMATION
Package
Type
Temperature
Range
DNL
(LSB)
INL
(LSB)
Part No.
--40 to +85°C
--40 to +85°C
--40 to +85°C
SOIC
PDIP
MP8775AS
MP8775AN
MP8775AQ
¦3/4
¦3/4
¦3/4
¦1 1/2
¦1 1/2
¦1 1/2
SSOP
PIN CONFIGURATIONS
See Packaging Section for
Package Dimensions
1
20
1
20
19
18
17
16
DGND
DB0 (LSB)
DGND
DGND
DB0 (LSB)
DGND
2
19
V
V
2
3
4
5
V
V
RB
RB
3
18
17
16
15
14
13
12
11
DB1
DB2
DB3
DB4
DB5
DB6
DB1
DB2
DB3
DB4
DB5
RBS
RBS
4
AGND
AGND
5
V
V
IN
IN
6
6
7
15
14
AV
AV
DD
DD
7
V
V
V
V
RT
RTS
RT
RTS
8
DB6
8
13
12
11
9
DB7 (MSB)
DB7 (MSB)
9
DV
DV
DD
DD
10
10
DV
CLK
DV
CLK
DD
DD
20 Pin PDIP (0.300”)
20 Pin SOIC (Jedec, 0.300”)
20 Pin SSOP
PIN OUT DEFINITIONS
PIN NO.
NAME
DESCRIPTION
Digital Ground
PIN NO.
NAME
CLK
DESCRIPTION
1
2
3
4
5
6
7
8
9
10
DGND
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
11
12
13
14
15
16
17
18
19
20
Sample Clock
Data Output Bit 0 (LSB)
Data Output Bit 1
DV
Digital Power Supply
Generates 2.6 V if tied to V
Top Reference
DD
RTS
RT
V
V
RT
Data Output Bit 2
Data Output Bit 3
AV
Analog Power Supply
Analog Input
DD
Data Output Bit 4
V
IN
Data Output Bit 5
AGND
Analog Ground
Data Output Bit 6
V
RBS
V
RB
Generates 0.6 V if tied to V
Bottom Reference
Digital Ground
RB
Data Output Bit 7 (MSB)
Digital Power Supply
DV
DGND
DD
Rev. 3.01
2
03ꢀꢁꢁꢂ
MP8775
ELECTRICAL CHARACTERISTICS TABLE (CONT’D)
25°C
Typ
Description
Symbol
Min
Max
Units
Conditions
AC PARAMETERS
Differential Gain Error
Differential Phase Error
d
2
1
%
°
FS = 4 x NTSC
FS = 4 x NTSC
G
d
PH
POWER SUPPLIES
9
Operating Voltage (AV , DV
)
V
I
5
17
V
mA
DD
DD
DD
DD
Current (AV + DV
)
25
Does not include ref. current
DD
DD
Notes:
1
Tester measures code transitions by dithering the voltage of the analog input (V ). The difference between the measured and the
IN
ideal code width (V
/256) is the DNL error (Figure 2.). The INL error is the maximum distance (in LSBs) from the best fit line to
REF
any transition voltage (Figure 3.). Accuracy is a function of the sampling rate (FS).
Guaranteed. Not tested.
2
3
4
Specified values guarantee functionality. Refer to other parameters for accuracy.
--1 dB bandwidth is a measure of performance of the A/D input stage (S/H + amplifier). Refer to other parameters for accuracy within
the specified bandwidth.
5
6
See V input equivalent circuit (Figure 4.). Switched capacitor analog input requires driver with low output resistance.
IN
All inputs have diodes to DV and DGND. Input DC currents will not exceed specified limits for any input voltage between
DD
DGND and DV
.
DD
7
8
9
t , t should be limited to >5 ns for best results.
R
F
Depends on the RC load connected to the output pin.
AGND and DGND pins are connected through the silicon substrate. Connect together at the package and to the analog ground plane.
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)1, 2, 3
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VRT & VRB . . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V
All Inputs . . . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V
All Outputs . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V
Storage Temperature . . . . . . . . . . . . . . . . . . . --65 to +150°C
Lead Temperature (Soldering 10 seconds) . . . . . . . +300°C
Package Power Dissipation Rating @ 75°C
SOIC, SSOP, PDIP . . . . . . . . . . . . . . . . . . . . . . . 700 mW
Derates above 75°C . . . . . . . . . . . . . . . . . . . . . . 9 mW/°C
Notes:
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2
3
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short
transients outside the supplies of less than 100mA for less than 100µs.
VDD refers to AVDD and DVDD. GND refers to AGND and DGND.
1/FS
PWH
t
t
PWL
N + 1
PIPELINE DELAY
N + 2
CLK
Sample “N”
N -- 3
N -- 2
N -- 1
DATA N
DATA
t HL
t DL
Figure 1. MP8775 Timing Diagram
Rev. 3.01
4
MP8775
Output
Codes
Best Fit Line
DNL
LSB
7
6
5
4
V
V
(N+1)
(N)
Real Transfer Line
Analog
Input
EFS
INL
N + 1
N
Output
Codes
Ideal Transfer Line
3
2
1
N--1
Code Width (N) = V(N+1) -- V(N)
LSB = [ V -- V ] / 256
RT
RB
LSB
DNL(N) = [ V(N+1) -- V(N) ] -- LSB
Figure 2. DNL Measurement
CLK
Analog Input (Volt)
EZS
Figure 3. INL Error Calculation
+5 V
CLK
10µF
0.1µF
5pF
50Ω
V
Analog
Input
DD
V
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
IN
1.5pF
V
+ V
2
RT
RB
AV
DD
V
V
RTS
RT
Digital
Outputs
0.1µF
CLK
MP8775
V
IN
V
V
RB
CLK
6 pF
0.1µF
RBS
CLK
5pF
CLK
Clock
AGND
GND
1.5pF
V
IN
[N--2]
CLK
Figure 4. Equivalent Input Circuit
Figure 5. Typical Circuit Connections
APPLICATION NOTES
Signals should not exceed AVDD +0.5V or go below AGND
--0.5V or DVDD +0.5 V or DGND --0.5 V. All pins have internal
protection diodes that will protect them from short transients
(<100µs) outside the supply range.
capacitive coupling and reflections will contribute noise to the
conversion.
It is possible for the data valid delay (tDL) to be equal to or
greater than the high pulse width of the sampling clock (tPWH),
See Figure 1. This can cause timing related errors. For sample
rates above 14 MSPS use only the rising edge of the sample
clock (CLK) to latch data from the MP8775 to other parts of the
system.
AGND and DGND pins are connected internally through the
P-- substrate. DC voltage differences between these pins will
cause undesirable internal substrate currents.
The reference can be biased internally by shorting VRT to
VRTS and VRB to VRBS. This will generate 0.6 V at VRB and 2.6 V
at VRT (see Figure 5.).
The power supply (AVDD) and reference voltage (VRT & VRB
pins should be decoupled with 0.1µF and 10µF capacitors to
AGND, placed as close to the chip as possible.
)
If the internal reference pins VRTS and/or VRBS are not used
they should be left unconnected.
The digital outputs should not drive long wires or buses. The
Rev. 3.01
5
MP8775
PERFORMANCE CHARACTERISTICS
Graph 1. DNL vs. Sampling Frequency
Graph 2. INL vs. Sampling Frequency
Graph 3. Supply Current vs.
Sampling Frequency
Graph 4. Supply Current vs.
Temperature
Graph 5. Reference Resistance vs.
Temperature
Graph 6. SNR vs. Input Frequency
Rev. 3.01
6
MP8775
Graph 7. SINAD vs. Input Frequency
Graph 8. ENOB vs. Input Frequency
Graph 9. THD vs. Input Frequency
Rev. 3.01
7
MP8775
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to im-
prove design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits de-
scribed herein, conveys no license under any patent or other right, and makes no representation that the circuits are
free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary
depending upon a user’s specific application. While the information in this publication has been carefully checked;
no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly
affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation
receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the
user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circum-
stances.
Copyright 1999 EXAR Corporation
Datasheet March 1999
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
Rev. 3.01
8
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