SP2526A-2EN-L/TR [EXAR]
Power Supply Support Circuit, Fixed, 2 Channel, PDSO8, LEAD FREE, MS-012AA, NSOIC-8;
| 型号： | SP2526A-2EN-L/TR |
| 厂家： | 
EXAR CORPORATION |
| 描述： | Power Supply Support Circuit, Fixed, 2 Channel, PDSO8, LEAD FREE, MS-012AA, NSOIC-8 光电二极管 |
| 文件： | 总9页 (文件大小：403K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SP2526A
Dual Channel USB Power Distribution Switch
November 2011
Rev. 2.1.0
GENERAL DESCRIPTION
APPLICATIONS
The SP2526A device is a dual +3.0V to +5.5V
USB Supervisory Power Control Switch ideal
for self-powered and bus-powered Universal
Serial Bus (USB) applications.
Self Powered USB 2.0 and 3.0 Hubs
USB Compliant VBUS Power Distribution
Audio-Video Equipments
Generic Power Switching
Each switch has low on-resistance (110mΩ
typical) and can supply 500mA minimum. The
fault currents are limited to 1.0A typical and
the flag output pin for each switch is available
to indicate fault conditions to the USB
controller. The thermal shutdown feature will
prevent damage to the device when subjected
to excessive current loads. The undervoltage
lockout feature will ensure that the device will
remain off unless there is a valid input voltage
present.
FEATURES
+3.0V to +5.5V Input Voltage Range
Two Independent Power Switches
Two Error Flag Outputs, Open Drain
2.6V Undervoltage Lockout
1.25A Short Circuit Current Limit
150mΩ Maximum On-Resistance
110μA On-State Supply Current
1μA Shutdown Current
The SP2526A is offered in a RoHS compliant
“green”/halogen free 8-pin NSOIC package.
Output can be Forced Higher than
Input (Off-State)
Thermal Shutdown
1ms Soft Start Power Up, Fast Turn Off
Active-high Version: SP2526A-1
Active-low Version: SP2526A-2
RoHS Compliant, Green/Halogen Free
8-Pin NSOIC Package
TYPICAL APPLICATION DIAGRAM
Fig. 1: SP2526A Application Diagram – Two Port Self Powered Hub
Exar Corporation
www.exar.com
48720 Kato Road, Fremont CA 94538, USA
Tel. +1 510 668-7000 – Fax. +1 510 668-7001
SP2526A
Dual Channel USB Power Distribution Switch
ABSOLUTE MAXIMUM RATINGS
OPERATING RATINGS
These are stress ratings only and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect
reliability.
Ambient Temperature Range..................... -40°C to 85°C
Supply Voltage VIN ................................................. 7.0V
Fault Flag Voltage VFLG............................................ 7.0V
Fault Flag Current IFLG ...........................................50mA
Enable Input VEN.........................................-0.3V to 15V
Storage Temperature.............................. -65°C to 150°C
Soldering Temperature (10sec).............................260°C
Maximum Junction Temperature............................125°C
Power Dissipation (NSOIC-8) .........................................
(derate 6.14mW/°C above 70°C)......................500mW
ELECTRICAL SPECIFICATIONS
Specifications with standard type are for an Operating Ambient Temperature of TA = 25°C only; limits applying over the full
Operating Junction Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test,
design, or statistical correlation. Typical values represent the most likely parametric norm at TA = 25°C, and are provided
for reference purposes only. Unless otherwise indicated, VIN = 5.0V, TA= 25°C.
Parameter
Supply Current
Min.
Typ.
Max.
Units
Conditions
0.75
110
1.7
5.0
VEN = Logic “0” OUT =open
VEN = Logic “1” OUT =open
VEN = Logic “0”
µA
160
0.8
Enable Input Voltage
Enable Input Current
V
2.0
2.4
1
V
EN = Logic “1”
VEN = Logic “0”
VEN = Logic “1”
0.01
0.01
1
µA
1
Enable Input Capacitance
Output MOSFET Resistance
Output turn-on delay
pF
mꢀ
µs
µs
µs
µs
µA
A
110
100
1000
0.8
150
RL=10ꢀ, each output
RL=10ꢀ, each output
RL=10ꢀ, each output
RL=10ꢀ, each output
Output turn-on rise time
Output turn-off delay
4000
20
Output turn-off fall time
Output Leakage Current
Current limit threshold
0.7
20
10
1.0
135
125
10
1.25
0.6
°C
Temperature TJ raising
Temperature TJ decreasing
VIN=5V, IL=10mA
VIN=3.3V, IL=10mA
VFLAG=5V
Over temperature shutdown
threshold
25
40
1
Error Flag Output Resistance
Error Flag Current
ꢀ
µA
V
15
0.01
2.6
2.4
VIN increasing
UVLO threshold
VIN decreasing
© 2011 Exar Corporation
2/9
Rev. 2.1.0
SP2526A
Dual Channel USB Power Distribution Switch
BLOCK DIAGRAM
Fig. 2: SP2526A Block Diagram
PIN ASSIGNMENT
Fig. 3: SP2526A Pin Assignment
© 2011 Exar Corporation
3/9
Rev. 2.1.0
SP2526A
Dual Channel USB Power Distribution Switch
PIN DESCRIPTION
Name
Pin Number
Description
Enable Input for channel A.
Active High for SP2526A-1 and Active Low for SP2526A-2
1
2
ENA
An active-low and open-drained fault flag output for channel A. It can indicate
current limit ENA is active. In normal mode operation (ENA and/or ENB is active),
it also can indicate thermal shutdown or under voltage
FLGA
FLGB
An active-low and open-drained fault flag output for channel B. It can indicate
current limit ENA is active. In normal mode operation (ENA and/or ENB is active),
it also can indicate thermal shutdown or under voltage
3
Enable Input for channel B.
Active High for SP2526A-1 and Active Low for SP2526A-2
1
5
ENB
Output for Channel B. This is the output pin of the MOSFET source of channel B,
typically connected to the switched side of the load
OUTB
6
7
Ground
GND
IN
Power Supply Input
Output for Channel A. This is the output pin of the MOSFET source of channel A,
typically connected to the switched side of the load
8
OUTA
ORDERING INFORMATION
Temperature
Part Number
Packing
Quantity
Marking
Package
Note 1
Note 2
Enable
Range
Sipex
2526A-1E
YYWWL
Sipex
2526A-2E
YYWWL
Bulk
SP2526A-1EN-L
-40°C≤TA≤+85°C
-40°C≤TA≤+85°C
-40°C≤TA≤+85°C
-40°C≤TA≤+85°C
RoHS Compliant
Halogen Free
NSOIC8
Active high
2.5K/Tape & Reel
Bulk
SP2526A-1EN-L/TR
SP2526A-2EN-L
Enable Active
Low
RoHS Compliant
Halogen Free
NSOIC8
2.5K/Tape & Reel
SP2526A-2EN-L/TR
“YY” = Year – “WW” = Work Week – “X” = Lot Number
© 2011 Exar Corporation
4/9
Rev. 2.1.0
SP2526A
Dual Channel USB Power Distribution Switch
TYPICAL PERFORMANCE CHARACTERISTICS
All data taken at VIN = 5.0V, TA = 25°C, unless otherwise specified - Schematic and BOM from Application Information
section of this datasheet.
Fig. 4: Output On-Resistance vs Supply Voltage
Fig. 5: Output On-Resistance vs Temperature
Fig. 7: On-state Supply Current vs Supply Voltage
Fig. 9: Off-state Supply Current vs Temperature
Fig. 6: UVLO Threshold vs Temperature
Fig. 8: On-state Supply Current vs Temperature
© 2011 Exar Corporation
5/9
Rev. 2.1.0
SP2526A
Dual Channel USB Power Distribution Switch
Fig. 11: Control Threshold vs Supply Voltage
Fig. 10: Off-state Supply Current vs Supply Voltage
Fig. 12: Turn-on/Turn-off Characteristics
© 2011 Exar Corporation
6/9
Rev. 2.1.0
SP2526A
Dual Channel USB Power Distribution Switch
may cause ringing on the input (from supply
lead inductance) which can damage internal
control circuitry.
APPLICATION INFORMATION
E
RROR FLAG
An open-drained output of an N-channel
MOSFET, the FLG output is pulled low to signal
T
RANSIENT REQUIREMENTS
USB supports dynamic attachment (hot
plugin) of peripherals. A current surge is
caused by the input capacitance of
the
following
fault
conditions:
input
undervoltage, output current limit, and
thermal shutdown.
a
are
downstream device. Ferrite beads
recommended in series with all power and
ground connector pins. Ferrite beads reduce
EMI and limit the inrush current during hot-
attachment by filtering high-frequency signals.
C
URRENT LIMIT
The current limit threshold is preset internally.
It protects the output MOSFET switches from
damage resulting from undesirable short
circuit conditions or excess inrush current,
which is often encountered during hot plug-in.
The low limit of the current limit threshold of
the SP2526A allows a minimum current of
0.6A through the MOSFET switches. A current
limit condition will signal the Error Flag.
S
HORT CIRCUIT TRANSIENT
Bulk capacitance provides the short-term
transient current needed during a hot-
attachment event. A 33μF/16V tantalum or a
100μF/10V electrolytic capacitor mounted
close to the downstream connector at each
port should provide sufficient transient drop
protection.
T
HERMAL SHUTDOWN
When the chip temperature exceeds 135ºC for
any reason other than overcurrent fault of
either one of the two MOSFETs, the thermal
shutdown function turns off both MOSFET
switches and signals the error flag. A
hysteresis of 10ºC prevents the MOSFETs from
turning back on until the chip temperature
drops below 125ºC. However, if thermal
shutdown is triggered by chip temperature rise
resulting from overcurrent fault condition of
either one of the MOSFET switches, the
thermal shutdown function will only turn off
the switch that is in overcurrent condition and
the other switch can still remain its normal
operation. In other words, the thermal
shutdown function of the two switches is
independent of each other in the case of
overcurrent fault.
P
RINTED CIRCUIT LAYOUT
The Power circuitry of USB printed circuit
boards requires a customized layout to
maximize thermal dissipation and to minimize
voltage drop and EMI.
TEST CIRCUIT
S
UPPLY FILTERING
A 0.1μF to 1μF bypass capacitor from IN to
GND, located near the device, is strongly
recommended to control supply transients.
Without a bypass capacitor, an output short
© 2011 Exar Corporation
7/9
Rev. 2.1.0
SP2526A
Dual Channel USB Power Distribution Switch
PACKAGE SPECIFICATION
8-PIN NSOIC
© 2011 Exar Corporation
8/9
Rev. 2.1.0
SP2526A
Dual Channel USB Power Distribution Switch
REVISION HISTORY
Revision
Date
Description
11/19/2010
11/04/2011
Reformat of datasheet
Updated package specification
2.0.0
2.1.1
FOR FURTHER ASSISTANCE
Email:
customersupport@exar.com
Exar Technical Documentation:
http://www.exar.com/TechDoc/default.aspx?
E
XAR
CORPORATION
H
EADQUARTERS AND
SALES OFFICES
48720 Kato Road
Fremont, CA 94538 – USA
Tel.: +1 (510) 668-7000
Fax: +1 (510) 668-7030
www.exar.com
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve
design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein,
conveys no license under any patent or other right, and makes no representation that the circuits are free of patent
infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a
user’s specific application. While the information in this publication has been carefully checked; no responsibility, however,
is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its
safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in
writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all
such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
© 2011 Exar Corporation
9/9
Rev. 2.1.0
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