SP3220E [EXAR]
3.0V to 5.5V RS-232 Driver/Receiver Pair; 3.0V至5.5V的RS - 232驱动器/接收器对
| 型号： | SP3220E |
| 厂家： | 
EXAR CORPORATION |
| 描述： | 3.0V to 5.5V RS-232 Driver/Receiver Pair |
| 文件： | 总21页 (文件大小：985K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SP3220E/EB/EU
+3.0V to +5.5V RS-232 Driver/Receiver Pair
FEATURES
■ Meets all EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
• Interoperable with RS-232 and V.28 at +2.7V
■ Supports High Serial Data Rates:
• 120kbps SP3220E
• 250kbps SP3220EB
• 1Mbps SP3220EU
■ 1µA Low Power Shutdown Mode
■ Footprint Compatible with MAX3221E, ISL3221
■ 4 x 1.0µF External Charge Pump Capacitors
■ Improved ESD Specifications:
+15kV Human Body Model
EN
1
2
3
4
5
6
16
15
SHDN
C1+
V+
V
CC
14
13
12
GND
C1-
SP3220
T1OUT
E/EB/EU
C2+
C2-
V-
No Connect
11
10
9
T1IN
7
8
No Connect
R1OUT
+15kV IEC61000-4-2 Air Discharge
+8kV IEC61000-4-2 Contact Discharge
R1IN
Now Available in Lead Free Packaging
DESCRIPTION
The SP3220E devices are RS-232 driver/receiver solutions intended for portable or hand-
held applications such as palmtop computers, intrumentation and consumer products. These
devices incorporate a high-efficiency, charge-pump power supply that allows the SP3220E
devices to deliver true RS-232 performance from a single power supply ranging from +3.0V
to +5.0V. This charge pump requires only 0.1µF capacitors in 3.3V operation. The ESD toler-
ance of the these devices are over +/-15kV for both Human Body Model and IEC61000-4-2
Air discharge test methods. All devices have a low-power shutdown mode where the driver
outputs and charge pumps are disabled. During shutdown, the supply current falls to less
than 1µA.
SELECTION TABLE
MODEL
Power
RS-232
RS-232
External
Shutdown Data Rate
Supplies
Drivers Receivers Components
SP3220E
+3.0V to +5.5V
1
1
1
1
1
1
4 Capacitors
4 Capacitors
4 Capacitors
Yes
Yes
Yes
120kbps
250kbps
1Mbps
SP3220EB +3.0V to +5.5V
SP3220EU +3.0V to +5.5V
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
1
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability and cause permanent damage to the
device.
Power Dissipation per package
V
.......................................................-0.3V to +6.0V
V+CC(NOTE 1).......................................-0.3V to +7.0V
V- (NOTE 1)........................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...........................................+13V
ICC (DC VCC or GND current).........................+100mA
16-pin SSOP (derate 9.69mW/oC above +70oC)...............775mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC)........900mW
16-pin TSSOP (derate 10.5mW/oC above +70oC)..............840mW
Input Voltages
TxIN, EN, SHDN...........................-0.3V to Vcc + 0.3V
RxIN...................................................................+25V
Output Voltages
TxOUT.............................................................+13.2V
RxOUT, .......................................-0.3V to (VCC +0.3V)
Short-Circuit Duration
TxOUT....................................................Continuous
Storage Temperature......................-65°C to +150°C
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
.
Typical values apply at Vcc = +3.3V or +5.0V and TAMB = 25oC, C1 - C4 = 0.1µF.
PARAMETER
MIN.
TYP.
MAX. UNITS CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
1.0
10
mA
no load, VCC = 3.3V,
TAMB = 25oC, TxIN = GND or VCC
Shutdown Supply Current
µA
SHDN = GND, VCC = 3.3V,
TAMB = 25oC, TxIN = Vcc or GND
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
GND
0.8
V
TxIN, EN, SHDN, Note 2
Input Logic Threshold HIGH
Input Logic Threshold HIGH
Input Leakage Current
2.0
2.4
V
Vcc = 3.3V, Note 2
Vcc = 5.0V, Note 2
V
+0.01
+0.05
+1.0
µA
TxIN, EN, SHDN,
TAMB = +25oC, VIN = 0V to VCC
Output Leakage Current
Output Voltage LOW
Output Voltage HIGH
DRIVER OUTPUTS
Output Voltage Swing
+10
µA
V
Receivers disabled, VOUT = 0V to VCC
IOUT = 1.6mA
0.4
VCC -0.6 VCC -0.1
V
IOUT = -1.0mA
+5.0
+5.4
V
Driver output loaded with 3KΩ to
GND, TAMB = +25oC
NOTE 2: Driver input hysteresis is typically 250mV.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
2
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
,
Typical values apply at VCC = +3.3V or +5.0V and TAMB = 25°C.
PARAMETER
MIN.
TYP. MAX. UNITS CONDITIONS
DRIVER OUTPUTS (continued)
Output Resistance
300
Ω
mA
µA
VCC = V+ = V- = 0V, TOUT=+2V
Output Short-Circuit Current
Output Leakage Current
+35
+60
+25
VOUT = 0V
V
= +12V, V = GND to 5.5V,
DOriUvTers disableCdC
RECEIVER INPUTS
Input Voltage Range
Input Threshold LOW
Input Threshold LOW
Input Threshold HIGH
Input Threshold HIGH
Input Hysteresis
-25
0.6
0.8
+25
V
V
1.2
1.5
1.5
1.8
0.3
5
Vcc = 3.3V
Vcc = 5.0V
Vcc = 3.3V
Vcc = 5.0V
V
2.4
2.4
V
V
V
Input Resistance
3
7
kΩ
TIMING CHARACTERISTICS
Data Rate SP3220E
120
250
235
kbps
kbps
kbps
RL = 3KΩ, CL = 1000pF
RL = 3KΩ, CL = 1000pF
RL = 3KΩ, CL = 250pF
Data Rate SP3220EB
Data Rate SP3220EU
1000
Receiver Propagation Delay, tPHL
Receiver Propagation Delay, tPLH
0.15
0.15
µs
µs
Receiver input to Receiver
output, CL = 150pF
Receiver input to Receiver
output, CL = 150pF
Receiver Output Enable Time
Receiver Output Disable Time
Driver Skew
200
200
100
ns
ns
ns
| tPHL - tPLH |, TAMB = 25°C
Receiver Skew
50
ns
| tPHL - tPLH
|
Transition-Region Slew Rate
30
V/µs
Vcc = 3.3V, RL = 3kΩ, TAMB =
25°C, measurements taken from
-3.0V to +3.0V or +3.0V to -3.0V
(SP3220E and SP3220EB)
Transition-Region Slew Rate
90
V/µs
Vcc = 3.3V, RL = 3kΩ, TAMB =
25°C, measurements taken from
-3.0V to +3.0V or +3.0V to -3.0V
(SP3220EU)
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
3
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rate, all
drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
6
30
T1 at Full Data Rate
T2 at 1/16 Full Data Rate
T1+T2 Loaded with 3k/CLoad
4
2
125Kbps
25
20
15
10
5
TxOUT+
TxOUT-
T1 at 250Kbps
60Kbps
0
20Kbps
-2
-4
-6
0
0
1000
2000
3000
4000
5000
0
1000
2000
3000
4000
5000
Load Capacitance (pF)
Load Capacitance (pF)
Figure 1. Icc vs Load Capacitance for the
Figure 2. Transmitter Output Voltage vs Load
SP3220EB.
Capacitance for the SP3220EB.
12
10
8
6
TxOUT+
4
2
0
6
4
-2
2
-4
T1 Loaded with 3K // 1000pf @ 250Kbps
TxOUT-
-6
0
2.7
3
3.5
4
4.5
5
2.7
3
3.5
4
4.5
5
Supply Voltage (V)
Supply V oltage (V)
Figure 4. Supply Current vs Supply Voltage for the
SP3220EB.
Figure 3. Transmitter Output Voltage vs Supply
Voltage for the SP3220EB.
40
25
1Mbps
- Slew
+ Slew
20
30
2Mbps
500Kbps
15
10
5
20
10
0
0
0
500 1000
2000 3000 4000 5000
0
250
500
1000 2000 3000 4000
Load Capacitance (pF)
Load Capacitance (pF)
Figure 6. Supply Current vs Supply Voltage for the
Figure 5. Slew Rate vs Load Capacitance for the
SP3220EU.
SP3220EB.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
4
TYPICAL PERFORMANCE CHARACTERISTICS: Continued
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rate, all
drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
6
6
TxOUT+
1.5Mbps
2Mbps
1Mbps
4
2
4
2
0
0
-2
-4
-6
-2
-4
-6
1.5Mbps
1000
Load Capacitance (pF)
2Mbps
1Mbps
1500
TxOUT-
0
250
500
2000
2.5
2.7
3
3.5
4
4.5
5
Supply V oltage (V)
Figure 8. Transmitter Output Voltage vs Supply
Voltage for the SP3220EU.
Figure 7. Transmitter Output Voltage vs Load
Capacitance for the SP3220EU.
16
14
12
10
8
6
4
T1 Loaded with 3K // 1000pf @1Mbps
2
0
2.7
3
3.5
4
4.5
5
Supply Voltage (V)
Figure 9. Supply Current vs Supply Voltage for the
SP3220EU.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
5
PIN FUNCTION
NAME
FUNCTION
PIN NUMBER
Receiver Enable. Apply Logic LOW for normal operation.
Apply logic HIGH to disable the receiver outputs (high-Z state)
EN
1
C1+
V+
Positive terminal of the voltage doubler charge-pump capacitor
+5.5V output generated by the charge pump
2
3
C1-
C2+
C2-
V-
Negative terminal of the voltage doubler charge-pump capacitor
Positive terminal of the inverting charge-pump capacitor
Negative terminal of the inverting charge-pump capacitor
-5.5V output generated by the charge pump
4
5
6
7
R1IN
RS-232 receiver input
8
R1OUT TTL/CMOS receiver output
9
T1IN
T1OUT
GND
VCC
TTL/CMOS driver input
RS-232 driver output.
Ground
11
13
14
15
+3.0V to +5.5V supply voltage
Shutdown Control Input. Drive HIGH for normal device operation.
Drive LOW to shutdown the drivers (high-Z output) and the on-
board power supply
SHDN
16
N.C.
No Connect
10, 12
Table 1. Device Pin Description
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SP3220E_EB_EU_101_060311
6
PINOUT
EN
1
2
3
4
5
6
16
15
SHDN
C1+
V+
V
CC
14
13
12
11
GND
C1-
SP3220
T1OUT
E/EB/EU
C2+
C2-
V-
No Connect
T1IN
7
8
10
9
No Connect
R1OUT
R1IN
Figure 10. Pinout Configurations for the SP3220E/EB/EU
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
7
TYPICAL OPERATING CIRCUITS
VCC
+
+
15
0.1µF
0.1µF
C5
C1
VCC
3
2
C1+
V+
+
µF
µF
0.1
*C3
C4
4
5
C1-
7
C2+
SP3220
V-
+
E/EB/EU
0.1
µF
C2
0.1
+
6
C2-
T1OUT
R1IN
LOGIC
13
8
11
T1IN
RS-232
INPUTS
OUTPUTS
R1OUT
EN
9
1
LOGIC
RS-232
INPUTS
OUTPUTS
5kΩ
16
SHDN
GND
14
*can be returned to
either VCC or GND
Figure 11. SP3220E/EB/EU Typical Operating Circuit
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
8
DESCRIPTION
The SP3220E/EB/EU devices meet the
EIA/TIA-232 and ITU-T V.28/V.24 commu-
nication protocols and can be implemented
in battery-powered, portable, or hand-held
applications such as notebook or palmtop
computers. The SP3220E/EB/EU devices
feature Exar's proprietary on-board charge
pump circuitry that generates ±5.5V for RS-
232 voltage levels from a single +3.0V to
+5.5V power supply. This series is ideal for
+3.3V-only systems, mixed +3.3V to +5.5V
systems, or+5.0V-onlysystemsthatrequire
true RS-232 performance. The SP3220EB
devicehasadriverthatcanoperateatadata
rateof250kbpsfullyloaded.TheSP3220EU
can operate at 1000kbps; the SP3220E
device can operate at a typical data rate of
235kbps when fully loaded.
will meet EIA/TIA-562 levels of +/-3.7V with
supply voltages as low as 2.7V.
The SP3220EB driver can guarantee a data
rate of 250kbps fully loaded with 3kΩ in
parallelwith1000pF, ensuringcompatability
withPC-to-PCcommunicationsoftware.The
SP3220EU driver can guarantee a data rate
of 1000kbps fully loaded with 3kΩ in parallel
with 250pF.
The slew rate of the SP3220E and
SP3220EBoutputsareinternallylimitedtoa
maximum of 30V/µs in order to meet the EIA
standards (EIA RS-232D 2.1.7, Paragraph
5). The transition of the loaded output from
HIGH to LOW also meet the monotonicity
requirements of the standard. The slew rate
of the SP3220EU is not limited. This allows
it to transmit at much faster data rates.
TheSP3220E/EB/EUisa1-driver/1-receiver
device ideal for portable or hand-held ap-
plications. The SP3220E/EB/EU features a
1µA shutdown mode that reduces power
consumption and extends battery life in por-
table systems. Its receivers remain active in
shutdown mode, allowing external devices
such as modems to be monitored using only
1µA supply current.
Figure 12 shows a loopback test circuit
used to test the RS-232 Driver. Figure
13 shows the test results of the loopback
circuit with the SP3220EB driver active at
250kbps with RS-232 load in parallel with
a 1000pF capacitor. Figure 14 shows the
test results where the SP3220EU driver
was active at 1000kbps and loaded with an
RS-232 receiver in parallel with 250pF ca-
pacitors. A solid RS-232 data transmission
rate of 250kbps provides compatibility with
many designs in personal computer periph-
erals and LAN applications.
THEORY OF OPERATION
The SP3220E/EB/EU series is made up of
three basic circuit blocks:
1. Driver
2. Receiver
3. The Exar proprietary charge pump
The SP3220E/EB/EU driver's output stage
is turned off (tri-state) when the device
is in shutdown mode. When the power is
off, the SP3220E/EB/EU device permits
the outputs to be driven up to +/-12V. The
driver's inputs do not have pull-up resistors.
Designers should connect unused inputs to
Vcc or GND.
Driver
Thedriverisaninvertingleveltransmitterthat
converts TTLor CMOS logic levels to +5.0V
EIA/TIA-232 levels with an inverted sense
relative to the input logic levels. Typically,
the RS-232 output voltage swing is +5.5V
with no load and at least +5V minimum fully
loaded. The driver outputs are protected
against infinite short-circuits to ground with-
out degradation in reliability. Driver outputs
In the shutdown mode, the supply current
falls to less than 1µA, where SHDN = LOW.
When the SP3220E/EB/EU device is shut
down, the device's driver output is disabled
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
9
DESCRIPTION
(tri-stated) and the charge pump is turned
off with V+ pulled down to Vcc and V- pulled
to GND. The time required to exit shutdown
is typically 100ms. Connect SHDN to Vcc if
the shutdown mode is not used. SHDN has
no effect on RxOUT. Note that the driver is
enabled only when the magnitude of V- ex-
ceeds approximately 3V.
V
CC
+
+
0.1µF
C5
C1
V
CC
C1+
V+
V-
+
+
µF
0.1
0.1
µF
C3
C4
0.1
C1-
SP3220
C2+
+
E/EB/EU
µF
0.1
C2
µF
C2-
TxOUT
RxIN
TxIN
LOGIC
INPUTS
Receiver
The receiver converts EIA/TIA-232 levels
to TTL or CMOS logic output levels. The
receiver has an inverting high-impedance
output. This receiver output (RxOUT) is at
high-impedance when the enable control
EN = HIGH. In the shutdown mode, the
receiver can be active or inactive. EN has
no effect on TxOUT. The truth table logic
of the SP3220E/EB/EU driver and receiver
outputs can be found in Table 2.
RxOUT
EN
LOGIC
OUTPUTS
5kΩ
VCC
*SHDN
GND
(SP3220EU 250pF)
(SP3220E/EB 1000pF)
Figure 12. SP3220E/EB/EU Driver Loopback Test
Circuit
SHDN
EN
TxOUT
RxOUT
0
0
1
1
0
1
0
1
Tri-state
Tri-state
Active
Active
Tri-state
Active
Active
Tri-state
Table 2. SP3220E/EB/EU Truth Table Logic for
Shutdown and Enable Control
Figure 13. SP3220EB Loopback Test results at
250kbps
Since receiver input is usually from a trans-
mission line where long cable lengths and
systeminterferencecandegradethesignal,
the inputs have a typical hysteresis margin
of 300mV. This ensures that the receiver
is virtually immune to noisy transmission
lines. Should an input be left unconnected,
aninternal 5KΩpulldownresistortoground
will commit the output of the receiver to a
HIGH state.
Figure 14. SP3220EU Loopback Test results at
1Mbps
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SP3220E_EB_EU_101_060311
10
DESCRIPTION
Charge Pump
Simultaneous with the transfer of the volt-
age to C3, the positive side of capacitor C1
is switched to VCC and the negative side is
connected to GND.
The charge pump is an Exar-patended
design (U.S. 5,306,954) and uses a unique
approach compared to older less-efficient
designs. The charge pump still requires four
external capacitors, but uses a four-phase
voltage shifting technique to attain sym-
metrical 5.5V power supplies. The internal
power supply consists of a regulated dual
charge pump that provides output voltages
of +/-5.5V regardless of the input voltage
(Vcc) over the +3.0V to +5.5V range.
Phase 3
— VDD charge storage — The third phase of
the clock is identical to the first phase — the
charge transferred in C1 produces –VCC in
the negative terminal of C , which is applied
to the negative side of ca1pacitor C2. Since
C + is at V , the voltage potential across C2
is22 timesCVCCC.
In most circumstances, decoupling the
power supply can be achieved adequately
using a 0.1µF bypass capacitor at C5 (refer
to figures 6 and 7). In applications that are
sensitive to power-supply noise, decouple
Vcc to ground with a capacitor of the same
value as charge-pump capacitor C1. Physi-
cally connect bypass capcitors as close to
the IC as possible.
Phase 4
— V transfer — The fourth phase of
the cDloDck connects the negative terminal
of C2 to GND, and transfers this positive
generated voltage across C2 to C4, the
VDD storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the in-
ternal oscillator is disabled. Simultaneous
with the transfer of the voltage to C4, the
positive side of capacitor C is switched
to V and the negative1 side is con-
nectCeCd to GND, allowing the charge
pump cycle to begin again. The charge
pump cycle will continue as long as the
operational conditions for the internal
oscillator are present.
The charge pump operates in a discontinu-
ous mode using an internal oscillator. If the
output voltages are less than a magnitude
of 5.5V, the charge pump is enabled. If the
outputvoltages exceedamagnitudeof5.5V,
the charge pump is disabled. This oscillator
controls the four phases of the voltage shift-
ing. A description of each phase follows.
Since both V+ and V– are separately gener-
ated from VCC, in a no–load condition V+
and V– will be symmetrical. Older charge
pump approaches that generate V– from
V+ will show a decrease in the magnitude
of V– compared to V+ due to the inherent
inefficiencies in the design.
Phase 1
— VSS charge storage — During this phase
oftheclockcycle,thepositivesideofcapaci-
tors C1 and C2 are initially charged to VCC.
Cl+ is then switched to GND and the charge
in C1– is transferred to C –. Since C2+ is con-
nected to V , the volta2ge potential across
capacitor C2CCis now 2 times VCC.
Phase 2
— V transfer — Phase two of the clock
connSeSctsthenegativeterminalofC totheVSS
storagecapacitorandthepositivet2erminalof
C2 to GND. This transfers a negative gener-
ated voltage to C3. This generated voltage is
regulated to a minimum voltage of -5.5V.
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SP3220E_EB_EU_101_060311
11
DESCRIPTION
Voltage potential across any of the capaci-
tors will never exceed 2 x VCC. Therefore
capacitors with working voltages as low as
6.3V rating may be used with a 3.0V VCC
supply. The reference terminal of the V+
capacitor may be connected either to VCC
or ground, but if connected to ground a
minimum 10V working voltage is required.
Higherworkingvoltagesand/orcapacitance
values may be advised if operating at higher
VCC or to provide greater stability as the
capacitors age.
Charge Pump Design Guidelines
The charge pump operates with 0.1µF ca-
pacitorsfor3.3Voperation. Forothersupply
voltages,seethetableforrequiredcapacitor
values.Donotusevaluessmallerthanthose
listed. Increasing the capacitor values (e.g.,
by doubling in value) reduces ripple on the
transmitter outputs and may slightly reduce
powerconsumption. C2, C3, andC4maybe
increased without changing C1’s value.
Minimum recommended charge pump
capacitor value
Underlightlyloadedconditionstheintelligent
pump oscillator maximizes efficiency by
running only as needed to maintain V+ and
V-. Sinceinterfacetransceiversoftenspend
much of their time at idle this power-efficient
innovation can greatly reduce total power
consumption. This improvement is made
possiblebytheindependentphasesequence
of the Exar charge-pump design.
Input Voltage
Vcc
Charge pump
capacitor value for
SP3220E/EB/EU
3.0V to 3.6V
3.0V to 5.5V
C1 - C4 = 0.1µF
C1 - C4 = 0.22µF
Thechargepumposcillatortypicallyoperates
at greater than 250kHz allowing the pump to
run efficiently with small 0.1μF capacitors.
Efficientoperationdependsonrapidlycharg-
ing and discharging C1 and C2, therefore
capacitors should be mounted close to the
IC and have low ESR (equivalent series
resistance).
Low cost surface mount ceramic capacitors
(such as are widely used for power-supply
decoupling) are ideal for use on the charge
pump. However the charge pumps are de-
signed to be able to function properly with a
wide range of capacitor styles and values.
If polarized capacitors are used the positive
andnegativeterminalsshouldbeconnected
as shown in the Typical Operating Circuit.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
12
DESCRIPTION
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 15. Charge Pump — Phase 1
V
CC
= +5V
C
4
+
–
V
V
Storage Capacitor
DD
+
–
+
C
1
C
2
–
+
–
Storage Capacitor
SS
C
3
-5.5V
Figure 16. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
T
GND
GND
1
2
b) C2-
-6V
Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V
Figure 17. Charge Pump Waveforms
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 18. Charge Pump — Phase 3
V
CC
= +5V
+5.5V
+
C
4
+
–
+
V
Storage Capacitor
DD
+
–
C
1
C
2
–
–
V
SS
Storage Capacitor
C
3
Figure 19. Charge Pump — Phase 4
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
13
DESCRIPTION
ESD TOLERANCE
thesystemisrequiredtowithstandanamount
of static electricity when ESD is applied to
points and surfaces of the equipment that
are accessible to personnel during normal
The SP3220E/EB/EU device incorpo-
rates ruggedized ESD cells on all driver
output and receiver input pins. The ESD
structure is improved over our previous
family for more rugged applications and
environments sensitive to electro-static
discharges and associated transients. The
improved ESD tolerance is at least +15kV
without damage nor latch-up.
usage. The transceiver IC receives most
of the ESD current when the ESD source is
appliedtotheconnectorpins. Thetestcircuit
for IEC61000-4-2 is shown on Figure 21.
TherearetwomethodswithinIEC61000-4-2,
the Air Discharge method and the Contact
Discharge method.
With the Air Discharge Method, an ESD
voltage is applied to the equipment under
test (EUT) through air. This simulates an
electricallychargedpersonreadytoconnect
a cable onto the rear of the system only to
findanunpleasantzapjustbeforetheperson
touches the back panel. The high energy
potential on the person discharges through
anarcingpathtotherearpanelofthesystem
before he or she even touches the system.
This energy, whether discharged directly or
throughair,ispredominantlyafunctionofthe
discharge current rather than the discharge
voltage. Variableswithanairdischargesuch
asapproachspeedoftheobjectcarryingthe
ESD potential to the system and humidity
will tend to change the discharge current.
For example, the rise time of the discharge
current varies with the approach speed.
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC61000-4-2 Air-Discharge
c) IEC61000-4-2 Direct Contact
The Human Body Model has been the
generally accepted ESD testing method
for semi-conductors. This method is also
specified in MIL-STD-883, Method 3015.7
forESDtesting.ThepremiseofthisESDtest
is to simulate the human body’s potential to
store electro-static energy and discharge it
to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 20. This method will test the IC’s
capability to withstand an ESD transient
during normal handling such as in manu-
facturing areas where the ICs tend to be
handled frequently.
The Contact Discharge Method applies the
ESDcurrentdirectlytotheEUT. Thismethod
was devised to reduce the unpredictability
of the ESD arc. The discharge current rise
time is constant since the energy is directly
transferred without the air-gap arc. In situ-
ations such as hand held systems, the ESD
charge can be directly discharged to the
The IEC-61000-4-2, formerly IEC801-2, is
generallyusedfortestingESDonequipment
and systems. For system manufacturers,
theymustguaranteeacertainamountofESD
protection since the system itself is exposed
totheoutsideenvironmentandhumanpres-
ence. ThepremisewithIEC61000-4-2isthat
R
S
R
C
SW1
SW2
Device
C
DC Power
Source
S
Under
Test
Figure 20. ESD Test Circuit for Human Body Model
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
14
DESCRIPTION
Contact-Discharge Model
R
R
R
V
C
S
SW1
SW2
Device
Under
Test
C
DC Power
Source
S
and
add up to 330Ω for IEC61000-4-2.
R
V
R
S
Figure 21. ESD Test Circuit for IEC61000-4-2
equipment from a person already holding
the equipment. The current is transferred
on to the keypad or the serial port of the
equipment directly and then travels through
the PCB and finally to the IC.
The higher CS value and lower R value in
the IEC61000-4-2 model are moreSstringent
than the Human Body Model. The larger
storage capacitor injects a higher voltage
to the test point when SW2 is switched on.
The lower current limiting resistor increases
the current charge onto the test point.
The circuit models in Figures 20 and 21 rep-
resentthetypicalESDtestingcircuitusedfor
allthreemethods. TheCS isinitiallycharged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor
is charged, the second switch (SW2) is on
while SW1 switches off. The voltage stored
in the capacitor is then applied through R ,
the current limiting resistor, onto the devicSe
under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under
test receives a duration of voltage.
30A
15A
0A
For the Human Body Model, the current
limitingresistor(RS)andthesourcecapacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-61000-4-2, the current limiting resistor
(R ) and the source capacitor (CS) are 330Ω
anS150pF, respectively.
t = 0ns
t = 30ns
t →
Figure 22. ESD Test Waveform for IEC61000-4-2
DEVICE PIN
TESTED
HUMAN BODY
MODEL
IEC61000-4-2
Air Discharge Direct Contact
Level
Driver Outputs
Receiver Inputs
+15kV
+15kV
+15kV
+15kV
+8kV
+8kV
4
4
Table 3. Transceiver ESD Tolerance Levels
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
15
PACKAGE: 16 PIN SSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
16
PACKAGE: 16 PIN WSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
17
PACKAGE: 16 PIN TSSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
18
ORDERING INFORMATION
Part Number
Temp. Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Package
SP3220ECA-L
SP3220ECA-L/TR
SP3220ECT-L
16 Pin SSOP
16 Pin SSOP
16 Pin WSOIC
16 Pin WSOIC
16 Pin TSSOP
16 Pin TSSOP
16 Pin SSOP
16 Pin SSOP
16 Pin WSOIC
16 Pin WSOIC
16 Pin TSSOP
16 Pin TSSOP
SP3220ECT-L/TR
SP3220ECY-L
SP3220ECY-L/TR
SP3220EEA-L
SP3220EEA-L/TR
SP3220EET-L
SP3220EET-L/TR
SP3220EEY-L
SP3220EEY-L/TR
Part Number
Temp. Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Package
SP3220EBCA-L
SP3220EBCA-L/TR
SP3220EBCT-L
SP3220EBCT-L/TR
SP3222EBCY-L
SP3222EBCY-L/TR
SP3220EBEA-L
SP3220EBEA-L/TR
SP3220EBET-L
16 Pin SSOP
16 Pin SSOP
16 Pin WSOIC
16 Pin WSOIC
16 Pin TSSOP
16 Pin TSSOP
16 Pin SSOP
16 Pin SSOP
16 Pin WSOIC
16 Pin WSOIC
16 Pin TSSOP
16 Pin TSSOP
SP3220EBET-L/TR
SP3220EBEY-L
SP3220EBEY-L/TR
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
19
ORDERING INFORMATION
Part Number
Temp. Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Package
SP3220EUCT-L
SP3220EUCT-L/TR
SP3222EUCY-L
SP3222EUCY-L/TR
SP3220EUET-L
SP3220EUET-L/TR
SP3220EUEY-L
SP3220EUEY-L/TR
16 Pin WSOIC
16 Pin WSOIC
16 Pin TSSOP
16 Pin TSSOP
16 Pin WSOIC
16 Pin WSOIC
16 Pin TSSOP
16 Pin TSSOP
Note: "/TR" is for tape and Reel option. "-L" is for lead free packaging
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
20
REVISION HISTORY
DATE
REVISION DESCRIPTION
08/30/05
02/02/11
06/03/11
--
Legacy Sipex Datasheet
1.0.0
1.0.1
Convert to Exar Format and update ordering information.
Remove SP3220EUCA-L(/TR) and SP3220EUEA-L(/TR) per
PDN 110510-01
Notice
EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reli-
ability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are
only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully
checked; no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for
use in such applications unless EXAR Corporation receives, in writting, assurances to its satisfaction that: (a) the risk of injury or damage has been
minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Copyright 2011 EXAR Corporation
Datasheet June 2011
For technical questions please email Exar's Serial Technical Support group at: serialtechsupport@exar.com
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3220E_EB_EU_101_060311
21
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