SP3221ECY-L [EXAR]
Line Transceiver, 1 Driver, CMOS, PDSO16,;
| 型号： | SP3221ECY-L |
| 厂家： | 
EXAR CORPORATION |
| 描述： | Line Transceiver, 1 Driver, CMOS, PDSO16, 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总22页 (文件大小：660K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SP3221E
Intelligent +3.0V to +5.5V RS-232 Transceiver
FEATURES
• Meets true EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
• Interoperable with EIA/TIA-232 and adheres
to EIA/TIA-562 down to a +2.7V power
source
EN
16
15
14
13
12
11
1
2
3
4
5
6
7
SHDN
C1+
V+
V
CC
GND
• AUTO ON-LINE® circuitry automatically
wakes up from a 1µA typical shutdown
• Minimum 250kbps data rate under load
• Regulated charge pump yields stable
RS-232 outputs regardless of VCC variations
• ESD specifications:
C1-
SP3221E
T1OUT
C2+
C2-
V-
ONLINE
T1IN
10
9
STATUS
R1OUT
R1IN
8
+15KV Human Body Model
+15KV IEC61000-4-2 Air Discharge
+8KV IEC61000-4-2 Contact Discharge
DESCRIPTION
The SP3221E is an RS-232 transceiver solution intended for portable applications such as
notebookandhandheldcomputers.Thisdeviceusesaninternalhigh-efficiency,charge-pump
power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump and
Exar's driver architecture allow the SP3221E to deliver compliant RS-232 performance from
a single power supply ranging from +3.0V to +5.5V. The SP3221E is a 1-driver/1-receiver
device ideal for laptop/notebook computer and PDA applications. The SP3221E is offered
in 16 pin TSSOP and SSOP packages.
The AUTO ON-LINE® feature allows the device to automatically "wake-up" during a shut-
down state when an RS-232 cable is connected and a connected peripheral is turned on.
Otherwise, the device automatically shuts itself down drawing less than 1µA.
SELECTION TABLE
Device
Power
Supplies
RS- 232
Drivers Receivers
RS-232
AUTO ON-LINE ®
YES
TTL
3-state
Data Rate
(kbps)
SP3221E +3.0V to +5.5V
1
1
YES
250
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability and cause permanent damage to the
device.
Output Voltages
TxOUT.............................................................+13.2V
RxOUT, STATUS.......................-0.3V to (VCC + 0.3V)
Short-Circuit Duration
TxOUT.....................................................Continuous
Storage Temperature......................-65°C to +150°C
Power Dissipation per package
16-pin TSSOP
Theta-JA.................................................100.4°C/W
Theta-JC.................................................19°C/W
V
.......................................................-0.3V to +6.0V
V+CC(NOTE 1).......................................-0.3V to +7.0V
V- (NOTE 1)........................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...........................................+13V
I
(DC V or GND current).........................+100mA
InCCput VolCtaC ges
16-pin SSOP
Theta-JA.................................................87°C/W
Theta-JC.................................................26°C/W
TxIN, ONLINE,
SHUTDOWN, EN......................-0.3V to VCC + 0.3V
RxIN...................................................................+15V
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
.
Typical values apply at VCC = +3.3V or +5.0V and TAMB = 25°C (Note 2).
PARAMETER
MIN.
TYP.
MAX. UNITS
CONDITIONS
DC CHARACTERISTICS
Supply Current,
AUTO ON-LINE®
1.0
10
10
µA
µA
RxIN open, ONLINE = GND,
SHUTDOWN = Vcc, TxIN = Vcc or
GND, Vcc = +3.3V, TAMB = +25ºC
Supply Current, Shutdown
1.0
0.3
SHUTDOWN = GND,
TxIN = Vcc or GND, Vcc = +3.3V,
TAMB = +25ºC
Supply Current,
1.0
mA
ONLINE = SHUTDOWN = Vcc, No
AUTO ON-LINE® Disabled
Load, Vcc = +3.3V, TAMB = +25ºC
LOGIC INPUTS AND RECEIVER OUTPUT
Input Logic Threshold
LOW
Vcc = 3.3V or 5.0V,
TxIN, EN, SHUTDOWN, ONLINE
0.8
+/-1.0
+/-10
0.4
V
HIGH
2.0
Input Leakage Current
+/-0.01
+/-0.05
µA
µA
TxIN, EN, ONLINE, SHUTDOWN,
TAMB = +25ºC, Vin = 0V to Vcc
Output Leakage Current
Receiver disabled,
Vout = 0V to Vcc
Output Voltage LOW
Output Voltage HIGH
V
V
IOUT = 1.6mA
IOUT = -1.0mA
Vcc - 0.6 Vcc - 0.1
NOTE 2: C1 - C4 = 0.1µF, tested at 3.3V ±10%.
C1 = 0.047µF, C2-C4 = 0.33µF, tested at 5V±10%.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
.
Typical values apply at VCC = +3.3V or +5.0V and TAMB = 25°C (Note 2).
PARAMETER
MIN.
TYP.
MAX. UNITS
CONDITIONS
DRIVER OUTPUT
Output Voltage Swing
+/-5.0
300
+/-5.4
V
Driver output loaded with 3kΩ to
GND, TAMB = +25ºC
Output Resistance
Ω
Vcc = V+ = V- = 0V, Vout = +/-2V
Output Short-Circuit Current
Output Leakage Current
+/-60
+/-25
mA
µA
Vout = 0V
Vcc = 0V or 3.0V to 5.5V,
Vout = +/-12V, Driver disabled
RECEIVER INPUT
Input Voltage Range
Input Threshold LOW
Input Threshold LOW
Input Threshold HIGH
Input Threshold HIGH
Input Hysteresis
-15
0.6
0.8
+15
V
V
1.2
1.5
1.5
1.8
0.3
5
Vcc = 3.3V
Vcc = 5.0V
Vcc = 3.3V
Vcc = 5.0V
V
2.4
2.4
V
V
V
Input Resistance
3
7
k Ω
AUTO ON-LINE® CIRCUITRY CHARACTERISTICS (ONLINE = GND, SHUTDOWN = Vcc)
STATUS Output Voltage LOW
STATUS Output Voltage HIGH
Receiver Threshold to Driver
0.4
V
V
IOUT = 1.6mA
IOUT = -1.0mA
Figure 13
Vcc - 0.6
100
0.5
µs
Enabled (tONLINE
)
Receiver Positive or Negative
Threshold to STATUS HIGH
µs
µs
Figure 13
Figure 13
(tSTSH
)
Receiver Positive or Negative
Threshold to STATUS LOW
20
(tSTSL
)
NOTE 2: C1 - C4 = 0.1µF, tested at 3.3V ±10%.
C1 = 0.047µF, C2-C4 = 0.33µF, tested at 5V±10%.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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TIMING CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
.
Typical values apply at VCC = +3.3V or +5.0V and TAMB = 25°C.
PARAMETER
MIN.
TYP.
MAX. UNITS
CONDITIONS
AC CHARACTERISTICS
Data Rate
250
kbps
µs
RL = 3kΩ, CL = 1000pF,
Receiver Propagation Delay
tPHL and tPLH
0.15
Receiver input to Receiver output,
CL = 150pF
Receiver Output Enable Time
Receiver Output Disable Time
Driver Skew
200
200
350
ns
ns
Normal Operation
Normal Operation
800
ns
│tPHL - tPLH│, RL = 3kΩ,
CL = 1000pF
Receiver Skew
50
800
30
ns
│tPHL - tPLH│, CL = 150pF
Transition-Region Slew Rate
6
V/µs
Vcc = 3.3V, RL = 3kΩ, CL = 150pF
to 1000pF, TAMB = 25°C, measure-
ments taken from -3.0V to +3.0V
or +3.0V to -3.0V
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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TYPICAL OPERATING CIRCUIT
Figure 1. SP3221E Typical Operating Circuit
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250Kbps data rate,
driver loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
Txout+
Txout-
Figure 3. Transmitter Output Voltage VS. Supply
Voltage
Figure 2. Supply Current VS. Supply Voltage
Figure 4. Supply Current VS.Data Rate
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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PIN DESCRIPTION
Name
EN
Function
Pin #
Receiver Enable, apply logic LOW for normal operation. Apply logic HIGH to
1
disable receiver output (high-Z state).
C1+
V+
Positive terminal of the voltage doubler charge-pump capacitor
Regulated +5.5V output generated by charge pump
Negative terminal of the voltage doubler charge-pump capacitor
Positive terminal of the inverting charge-pump capacitor
Negative terminal of the inverting charge-pump capacitor
Regulated -5.5V output generated by charge pump
RS-232 receiver input
2
3
C1-
4
C2+
5
C2-
6
V-
7
R1IN
R1OUT
STATUS
T1IN
8
TTL/CMOS receiver output
9
TTL/CMOS output indicating receiver signal activity
TTL/CMOS driver input
10
11
Apply logic HIGH to override AUTO ON-LINE ® circuitry keeping driver active
(SHUTDOWN must also be logic HIGH, refer to table 2)
ONLINE
12
T1OUT
GND
Vcc
RS-232 driver output
Ground
13
14
15
+3.0V to +5.5V supply voltage
Apply logic LOW to shut down drivers and charge pump. This overrides all
AUTO ON-LINE ® circuitry and ONLINE (refer to table 2).
SHUTDOWN
16
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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DESCRIPTION
THEORY OF OPERATION
TheSP3221Eisa1-driver/1-receiverdevice
ideal for portable or handheld applications.
The SP3221E transceiver meets the EIA/
TIA-232andITU-TV.28/V.24communication
protocolsandcanbeimplementedinbattery-
powered,portable,orhandheldapplications
such as notebook or handheld computers.
The SP3221E device features the Exar
proprietary and patented (U.S.-- 5,306,954)
on-board charge pump circuitry that gener-
ates ±5.5V RS-232 voltage levels from a
single +3.0V to +5.5V power supply.
The SP3221E is made up of four basic
circuit blocks:
1. Driver, 2. Receiver, 3. The Exar propri-
etarychargepump,and 4.AUTOON-LINE®
circuitry.
Driver
Thedriverisaninvertingleveltransmitterthat
converts TTL or CMOS logic levels to 5.0V
EIA/TIA-232 levels with an inverted sense
relative to the input logic levels. Typically,
the RS-232 output voltage swing is +5.4V
with no load and +5V minimum fully loaded.
Thedriveroutputisprotectedagainstinfinite
short-circuits to ground without degradation
in reliability. This driver will comply with
the EIA-TIA-232F and all previous RS-232
versions. Unused driver inputs should be
connected to GND or VCC.
This device is an ideal choice for power sen-
sitive designs. Featuring AUTO ON-LINE®
circuitry, the SP3221E reduces the power
supply drain to a 1µA supply current. In
many portable or handheld applications,
an RS-232 cable can be disconnected or
a connected peripheral can be turned off.
Under these conditions, the internal charge
pump and the drivers will be shut down.
Otherwise, the system automatically comes
online. Thisfeatureallowsdesignengineers
to address power saving concerns without
major design changes.
Thedrivercanguaranteeanoutputdatarate
of250kbpswhilebeingfullyloadedwith3kΩ
inparallelwith1000pF,ensuringcompatibility
with PC-to-PC communication software.
Theslewrateofthedriveroutputisinternally
limited to a maximum of 30V/µs in order
to meet the EIA standards (EIA RS-232D
2.1.7, Paragraph 5). The transition of the
loaded output from HIGH to LOW also
meets the monotonicity requirements of
the standard.
VCC
+
+
15
CC
0.1µF
0.1µF
C5
C1
V
2
3
7
C1+
V+
V-
+
+
C3
C4
0.1µF
0.1µF
4
5
C1-
C2+
SP3221E
+
0.1µF
C2
6
C2-
T
1OUT
T
1IN
13
8
TTL/CMOS INPUT
11
RS-232
Figure 6 shows a loopback test circuit used
to test the RS-232 Driver. Figure 8 shows
thetestresultswherethedriverwasactiveat
250kbpsandloadedwithanRS-232receiver
in parallel with a 1000pF capacitor. RS-232
data transmission rate of 250kbps provides
compatibility with designs in personal com-
puter peripherals and LAN applications.
OUTPUT
UART
or
R
1IN
R1OUT
TTL/CMOS OUTPUT
9
RS-232
INPUT
5KΩ
Serial µC
1
EN
V
CC
16
12
SHUTDOWN
ONLINE
10
STATUS
GND
14
µP
Supervisor
IC
VIN
RESET
Figure 5. Interface Circuitry Controlled by Micropro-
cessor Supervisory Circuit
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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Receiver
The receiver converts ±5.0V EIA/TIA-232
levels to TTL or CMOS logic output levels.
Thereceiverhasaninvertingoutputthatcan
be disabled by using the EN pin.
The receiver is active when the AUTO ON-
LINE® circuitry is enabled or when in shut-
down. Duringtheshutdown, thereceiverwill
continue to be active. If there is no activity
present at the receiver for a period longer
than20µsorwhenSHUTDOWNisenabled,
the device goes into a standby mode where
the circuit draws 1µA. Driving EN to a logic
HIGH forces the output of the receiver into
high-impedance. The truth table logic of the
SP3221Edriverandreceiveroutputscanbe
found in Table 2.
Since receiver input is usually from a trans-
mission line where long cable lengths and
system interference can degrade the signal,
the inputs have a typical hysteresis margin
of 300mV. This ensures that the receiver
is virtually immune to noisy transmission
lines. Should an input be left unconnected,
aninternal 5kΩpull-downresistortoground
will commit the output of the receiver to a
HIGH state.
Figure 6. Loopback Test Circuit for RS-232 Driver
Data Transmission Rates
Figure 7. Loopback Test Circuit result at 250Kbps
(Driver Fully Loaded)
Device: SP3221E
SHUTDOWN
EN
0
TXOUT
High Z
High Z
Active
Active
RXOUT
Active
High Z
Active
High Z
0
0
1
1
1
0
1
Table 2. SHUTDOWN and EN Truth Tables
Note: In AUTOON-LINE® ModewhereONLINE=GND
and SHUTDOWN = VCC, the device will shut down if
there is no activity present at the Receiver inputs.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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Charge Pump
Phase 3
— VDD charge storage — The third phase of
the clock is identical to the first phase — the
charge transferred in C1 produces –VCC in
the negative terminal of C , which is applied
to the negative side of ca1pacitor C2. Since
C + is at V , the voltage potential across C2
is22 timesCVCCC.
The charge pump uses a unique approach
compared to older less–efficient designs.
The charge pump still requires four external
capacitors, but uses a four–phase voltage
shifting technique to attain symmetrical
5.5V power supplies. The internal power
supply consists of a regulated dual charge
pump that provides output voltages of
+/-5.5V regardless of input voltage (VCC)
over the +3.0V to +5.5V range. This
is important to maintain compliant RS-
232 levels regardless of power supply
fluctuations.
Phase 4
— VDD transfer — The fourth phase of
the clock connects the negative terminal
of C2 to GND, and transfers this positive
generated voltage across C2 to C4, the
VDD storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the in-
ternal oscillator is disabled. Simultaneous
with the transfer of the voltage to C4, the
positivesideofcapacitorC1 isswitchedtoVCC
andthenegativesideisswitchedtoGND,al-
lowingthechargepumpcycletobeginagain.
The charge pump cycle will continue as long
as the operational conditions for the internal
oscillator are present.
The charge pump operates in a discontinu-
ous mode using an internal oscillator. If the
output voltages are less than a magnitude
of 5.5V, the charge pump is enabled. If the
outputvoltages exceedamagnitudeof5.5V,
the charge pump is disabled. This oscillator
controls the four phases of the voltage shift-
ing. A description of each phase follows.
Since both V+ and V– are separately gener-
ated from VCC, in a no–load condition V+
and V– will be symmetrical. Older charge
pump approaches that generate V– from
V+ will show a decrease in the magnitude
of V– compared to V+ due to the inherent
inefficiencies in the design.
Phase 1
— VSS charge storage — During this phase
oftheclockcycle,thepositivesideofcapaci-
tors C1 and C2 are initially charged to VCC.
Cl+ is then switched to GND and the charge
in C1– is transferred to C –. Since C2+ is con-
nected to V , the volta2ge potential across
capacitor C2CCis now 2 times VCC.
Phase 2
— V transfer — Phase two of the clock
connSeSctsthenegativeterminalofC totheVSS
storagecapacitorandthepositivet2erminalof
C2 to GND. This transfers a negative gener-
ated voltage to C3. This generated voltage is
regulated to a minimum voltage of -5.5V.
Simultaneous with the transfer of the volt-
age to C3, the positive side of capacitor C1
is switched to VCC and the negative side is
connected to GND.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
SS
+
–
+
–
C
C
2
1
–
C
–5V
–5V
3
Figure 8. Charge Pump - Phase 1
V
CC
= +5V
C
4
+
–
V
Storage Capacitor
Storage Capacitor
DD
SS
+
+
C
C
2
1
–
–
+
–
V
C
–10V
3
Figure 9. Charge Pump - Phase 2
[
T
]
+6V
a) C2+
T
T
0V
0V
1
2
2
b) C -
2
-6V
Ch1 2.00V Ch2 2.00V M 1.00ms Ch1 1.96V
Figure 10. Charge Pump Waveforms
V
= +5V
CC
C
+
+5V
4
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 11. Charge Pump - Phase 3
V
= +5V
CC
C
+
+10V
4
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
SS
+
+
–
C
C
2
1
–
–
C
3
Figure 12. Charge Pump - Phase 4
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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Charge Pump Capacitor selection
on the transmitter outputs and may slightly
reduce power consumption. C2, C3, and
C4 can be increased without changing
C1’s value
The Exar charge pump is designed to
operate reliably with a range of low cost
capacitors.Either polarized or non polar-
ized capacitors may be used. If polarized
capacitorsareusedtheyshouldbeoriented
as shown in the Typical Operating Circuit.
TheV+capacitormaybeconnectedtoeither
ground or Vcc (polarity reversed.)
For best charge pump efficiency locate the
charge pump and bypass capacitors as
close as possible to the IC. Surface mount
capacitors are best for this purpose. Using
capacitors with lower equivalent series re-
sistance (ESR) and self-inductance, along
with minimizing parasitic PCB trace induc-
tance will optimize charge pump operation.
Designers are also advised to consider that
capacitor values may shift over time and
operating temperature.
The charge pump operates with 0.1µF ca-
pacitorsfor3.3Voperation. Forothersupply
voltages,seethetableforrequiredcapacitor
values.Donotusevaluessmallerthanthose
listed. Increasing the capacitor values (e.g.,
by doubling in value) reduces ripple
Minimum recommended charge pump capacitor value
Input Voltage VCC
Charge pump capacitor value
3.0V to 3.6V
4.5V to 5.5V
3.0V to 5.5V
C1 - C4 = 0.1µF
C1 = 0.047µF, C2-C4 = 0.33µF
C1 - C4 = 0.22µF
Table 4. Capacitor selection table
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
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The second stage of the AUTO ON-LINE®
circuitry, shown in Figure 15, processes the
receiver's RXINACT signal with an accu-
mulated delay that disables the device to
a 1µA typical supply current. The STATUS
pin goes to a logic LOW when the cable
is disconnected. The typical accumulated
delay is around 20µs. When the SP3221E
driverandinternalchargepumparedisabled,
the supply current is reduced to 1µAtypical.
This can commonly occur in handheld or
portable applications where the RS-232
cable is disconnected or the RS-232 driver
of the connected peripheral are truned off.
AUTO ON-LINE® Circuitry
The SP3221E device has AUTO ON-LINE®
circuitry on board that saves power in ap-
plicationssuchaslaptopcomputers, PDA's,
and other portable systems.
TheSP3221Edeviceincorporatesan AUTO
ON-LINE® circuit that automatically enables
itselfwhentheexternaltransmitterisenabled
and the cable is connected. Conversely,
the AUTO ON-LINE® circuit also disables
mostoftheinternalcircuitrywhenthedevice
is not being used and goes into a standby
mode where the device typically draws 1µA.
This function is externally controlled by the
ONLINE pin. When this pin is tied to a logic
LOW, the AUTO ON-LINE® function is ac-
tive. Once active, the device is enabled until
thereisnoactivityonthereceiverinput. The
receiver input typically sees at least ±3V,
which are generated from the transmitter
at the other end of the cable with a ±5V
minimum. When the external transmitter
is disabled or the cable is disconnected,
the receiver input will be pulled down by its
internal 5kΩ resistor to ground. When this
occurs over a period of time, the internal
transmitter will be disabled and the device
goes into a shutdown or standby mode.
When the ONLINE pin is HIGH, the AUTO
ON-LINE® mode is disabled.
TheAUTOON-LINE® modecanbedisabled
by the SHUTDOWN pin. If this pin is a logic
LOW, the AUTO ON-LINE® function will not
operate regardless of the logic state of the
ONLINE pin. Table 3 summarizes the logic
of the AUTO ON-LINE® operating modes.
The truth table logic of the SP3221E driver
andreceiveroutputscanbefoundinTable2.
When the SP3221E device is shutdown,
the charge pumps are turned off. V+ charge
pump output decays to VCC,the V- output
decays to GND. The decay time will depend
on the size of capacitors used for the charge
pump. Once in shutdown, the time required
to exit the shut down state and have valid
V+ and V- levels is typically 200µs.
For easy programming, the STATUS can
be used to indicate DTR or a Ring Indicator
signal. Tying ONLINE and SHUTDOWN
together will bypass the AUTO ON-LINE®
circuitry so this connection acts like a shut-
down input pin
The AUTO ON-LINE® circuit has two
stages:
1) Inactive Detection
2) Accumulated Delay
The first stage, shown in Figure 14, detects
an inactive input. A logic HIGH is asserted
on RXINACT if the cable is disconnected or
the external transmitters are disabled. Oth-
erwise, RXINACT will be at a logic LOW.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
13
RS-232 SIGNAL
AT RECEIVER
INPUT
SHUTDOWN
HIGH
ONLINE
LOW
STATUS
HIGH
TRANSCEIVER STATUS
Normal Operation
(AUTO ON-LINE©)
YES
YES
NO
HIGH
HIGH
HIGH
LOW
LOW
HIGH
HIGH
HIGH
LOW
LOW
HIGH
LOW
Normal Operation
Normal Operation
Shutdown (AUTO ON-LINE©)
Shutdown
NO
LOW
YES
NO
HIGH/LOW
HIGH/LOW
Shutdown
Table 3. AUTO ON-LINE® Logic
S
H
U
T
+2.7V
0V
RECEIVER
RS-232 INPUT
VOLTAGES
D
O
W
N
-2.7V
VCC
STATUS
0V
t
STSL
tSTSH
tONLINE
+5V
DRIVER
RS-232 OUTPUT
VOLTAGES
0V
-5V
Figure 13. AUTO ON-LINE® Timing Waveforms
R
X
INACT
Inactive Detection Block
RS-232
Receiver Block
R IN
X
R OUT
X
Figure 14. Stage I of AUTO ON-LINE® Circuitry
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
14
ESD TOLERANCE
ESD is applied to points and surfaces of the
equipment that are accessible to personnel
during normal usage. The transceiver IC
receives most of the ESD current when the
ESDsourceisappliedtotheconnectorpins.
The test circuit for IEC61000-4-2 is shown
on Figure 16. There are two methods within
IEC61000-4-2,theAirDischargemethodand
the Contact Discharge method. With the Air
DischargeMethod,anESDvoltageisapplied
to the equipment under test (EUT) through
air. This simulates an electrically charged
person ready to connect a cable onto the
rear of the system only to find an unpleasant
zap just before the person touches the back
panel. The high energy potential on the
person discharges through an arcing path
to the rear panel of the system before he or
she even touches the system. This energy,
whether discharged directly or through air,
is predominantly a function of the discharge
current rather than the discharge voltage.
Variables with an air discharge such as
approach speed of the object carrying the
ESD potential to the system and humidity
will tend to change the discharge current.
For example, the rise time of the discharge
current varies with the approach speed.
The Contact Discharge Method applies the
ESDcurrentdirectlytotheEUT. Thismethod
was devised to reduce the unpredictability
of the ESD arc. The discharge current rise
time is constant since the energy is directly
transferred without the air-gap arc. In situ-
ations such as hand held systems, the ESD
charge can be directly discharged to the
equipment from a person already holding
the equipment. The current is transferred
on to the keypad or the serial port of the
equipment directly and then travels through
the PCB and finally to the IC.
The SP3221E device incorporates
ruggedized ESD cells on the driver output
andreceiverinputpins.TheESDstructureis
improved over our previous family for more
rugged applications and environments
sensitive to electro-static discharges and
associated transients. The improved ESD
tolerance is at least +15kV without damage
nor latch-up.
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC61000-4-2 Air-Discharge
c) IEC61000-4-2 Direct Contact
The Human Body Model has been the
generally accepted ESD testing method
for semiconductors. This method is also
specified in MIL-STD-883, Method 3015.7
forESDtesting.ThepremiseofthisESDtest
is to simulate the human body’s potential to
store electro-static energy and discharge it
to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 15. This method will test the IC’s
capability to withstand an ESD transient
during normal handling such as in manu-
facturing areas where the IC's tend to be
handled frequently.
The IEC-61000-4-2, formerly IEC801-2, is
generallyusedfortestingESDonequipment
and systems. For system manufacturers,
they must guarantee a certain amount of
ESD protection since the system itself is
exposed to the outside environment and
human presence. The premise with IEC-
61000-4-2 is that the system is required to
withstandanamountofstaticelectricitywhen
Figure15. ESD Test Circuit for Human Body Model
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
15
Figure 16. ESD Test Circuit for IEC61000-4-2
The circuit model in Figures 15 and 16 rep-
resentthetypicalESDtestingcircuitusedfor
allthreemethods. TheCS isinitiallycharged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor
is charged, the second switch (SW2) is on
while SW1 switches off. The voltage stored
in the capacitor is then applied through R ,
the current limiting resistor, onto the devicSe
under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under
test receives a duration of voltage.
30A
15A
0A
For the Human Body Model, the current
limitingresistor(RS)andthesourcecapacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-61000-4-2, the current limiting resistor
(R ) and the source capacitor (CS) are 330Ω
anS150pF, respectively.
t=30ns
t=0ns
t →
Figure 17. ESD Test Waveform for IEC61000-4-2
The higher CS value and lower RS value in
theIEC-61000-4-2modelaremorestringent
than the Human Body Model. The larger
storage capacitor injects a higher voltage
to the test point when SW2 is switched on.
The lower current limiting resistor increases
the current charge onto the test point.
DEVICE PIN
TESTED
HUMAN BODY
MODEL
IEC61000-4-2
Air Discharge Direct Contact
Level
Driver Output
Receiver Input
±15kV
±15kV
±15kV
±15kV
±8kV
±8kV
4
4
Table 5. Transceiver ESD Tolerance Levels
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
16
PACKAGE: 16 Pin TSSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
17
PACKAGE: 16 Pin SSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
18
ORDERING INFORMATION
Part Number
Temperature Range
Package Types
SP3221ECY-L .....................................................0°C to +70°C-------------------------------------------16-pin TSSOP
SP3221ECY-L/TR ...............................................0°C to +70°C-------------------------------------------16-pin TSSOP
SP3221EEY-L....................................................-40°C to +85°C------------------------------------------16-pin TSSOP
SP3221EEY-L/TR..............................................-40°C to +85°C------------------------------------------16-pin TSSOP
SP3221ECA-L.....................................................0°C to +70°C-------------------------------------------- 16-pin SSOP
SP3221ECA-L/TR...............................................0°C to +70°C-------------------------------------------- 16-pin SSOP
SP3221EEA-L...................................................-40°C to +85°C------------------------------------------- 16-pin SSOP
SP3221EEA-L/TR .............................................-40°C to +85°C------------------------------------------- 16-pin SSOP
Note: "-L" indicates lead free packaging, "/TR" is for tape and reel option.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • www.exar.com
SP3221E_200_081816
19
REVISION HISTORY
DATE
REVISION
DESCRIPTION
Nov 2012
1.0.0
Production release
Dec 2012
Sept 2014
1.0.1
1.0.2
Remove reference to SSOP package
Add SSOP package option, update package thermal information
ECN 1414-04 Oct 2014
Aug 2016
2.0.0
Update Auto On-Line Circuitry section and Logic table
Notice
EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or
reliability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are
only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully
checked; no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for
use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been
minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Copyright 2014-16 EXAR Corporation
Datasheet August 2016
For technical support please email Exar's Serial Technical Support group at: serialtechsupport@exar.com
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
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SP3221E_200_081816
20
The content of this document is furnished for informational use only, is subject to change without
notice, and should not be construed as a commitment by MaxLinear, Inc.. MaxLinear, Inc. assumes
no responsibility or liability for any errors or inaccuracies that may appear in the informational content
contained in this guide. Complying with all applicable copyright laws is the responsibility of the user.
Without limiting the rights under copyright, no part of this document may be reproduced into, stored in,
or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical,
photocopying, recording, or otherwise), or for any purpose, without the express written permission of
MaxLinear, Inc.
Maxlinear, Inc. does not recommend the use of any of its products in life support applications where
the failure or malfunction of the product can reasonably be expected to cause failure of the life support
system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless MaxLinear, Inc. receives, in writing, assurances to its satisfaction that: (a) the risk
of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of
MaxLinear, Inc. is adequately protected under the circumstances.
MaxLinear, Inc. may have patents, patent applications, trademarks, copyrights, or other intellectual
property rights covering subject matter in this document. Except as expressly provided in any written
license agreement from MaxLinear, Inc., the furnishing of this document does not give you any license
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Company and product names may be registered trademarks or trademarks of the respective owners
with which they are associated.
© 2017 MaxLinear, Inc. All rights reserved
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