SP3232EU [EXAR]
3.3V, 1000 kbps RS-232 Transceivers;型号: | SP3232EU |
厂家: | EXAR CORPORATION |
描述: | 3.3V, 1000 kbps RS-232 Transceivers |
文件: | 总20页 (文件大小:1227K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SP3222EU/SP3232EU
3.3V, 1000 kbps RS-232 Transceivers
FEATURES
■ Meets true EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
■ Minimum 1000kbps Data Rate
■ 1µA Low Power Shutdown with
Receivers active (SP3222EU)
■ Interoperable with RS-232 down to a
+2.7V power source
■ Enhanced ESD Specifications:
+15kV Human Body Model
+15kV IEC61000-4-2 Air Discharge
+8kV IEC61000-4-2 Contact Discharge
■ Ideal for Handheld, Battery Operated
Applications
EN
18
17
16
15
14
13
1
2
3
4
5
6
SHDN
V
CC
C1+
V+
GND
C1-
T1OUT
R1IN
SP3222EU
C2+
C2-
V-
R1OUT
7
12
T1IN
T2OUT
R2IN
8
9
11
10
T2IN
R2OUT
nSOIC
Now Available in Lead Free Packaging
DESCRIPTION
The SP3222EU and the SP3232EU are 2 driver, 2 receiver RS-232 transceiver solutions
intended for portable or hand-held applications such as notebook or palmtop computers.
Their data transmission rate of 1000 kbps meets the demands of high speed RS-232 ap-
plications. The SP3222EU/SP3232EU series has a high-efficiency, charge-pump power
supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the
SP3222EU/SP3232EU series todeliver trueRS-232 performance fromasingle powersupply
ranging from +3.0V to +5.5V. The ESD tolerance of the SP3222EU/SP3232EU devices are
over +/-15kV for both Human Body Model and IEC61000-4-2Air discharge test methods. The
SP3222EU device has a low-power shutdown mode where the devices' driver outputs and
charge pumps are disabled. During shutdown, the supply current falls to less than 1µA.
SELECTION TABLE
MODEL
Power
RS-232 RS-232
External
Shutdown
TTL
# of
Supplies
Drivers Receivers Components
3-State
Pins
SP3222EU +3.0V to +5.5V
SP3232EU +3.0V to +5.5V
2
2
2
2
4 Capacitors
4 Capacitors
Yes
No
Yes
No
18, 20
16
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
1
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability and cause permanent damage to the
device.
Power Dissipation per package
V
.......................................................-0.3V to +6.0V
V+CC(NOTE 1).......................................-0.3V to +7.0V
V- (NOTE 1)........................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...........................................+13V
ICC (DC VCC or GND current).........................+100mA
20-pin SSOP (derate 9.25mW/oC above +70oC)..............750mW
18-pin SOIC (derate 15.7mW/oC above +70oC)..............1260mW
20-pin TSSOP (derate 11.1mW/oC above +70oC).............890mW
16-pin SSOP (derate 9.69mW/oC above +70oC)...............775mW
16-pin PDIP (derate 14.3mW/oC above +70oC)...............1150mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC)........900mW
16-pin TSSOP (derate 10.5mW/oC above +70oC)..............850mW
16-pin nSOIC (derate 13.57mW/oC above +70oC)...........1086mW
Input Voltages
TxIN, EN, SHDN.........................-0.3V to Vcc + 0.3V
RxIN...................................................................+15V
Output Voltages
TxOUT.............................................................+13.2V
RxOUT, .......................................-0.3V to (VCC +0.3V)
Short-Circuit Duration
TxOUT....................................................Continuous
Storage Temperature......................-65°C to +150°C
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, C1 to
C4 = 0.1µF. Typical values apply at Vcc = +3.3V and TAMB = 25°C
PARAMETER
MIN.
TYP.
MAX. UNITS CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
1.0
10
mA
no load, VCC = 3.3V,
TAMB = 25oC, TxIN = GND or VCC
Shutdown Supply Current
µA
SHDN = GND, VCC = 3.3V,
TAMB = 25oC, TxIN = Vcc or GND
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
GND
0.8
V
TxIN, EN, SHDN, Note 2
Input Logic Threshold HIGH
Input Logic Threshold HIGH
Input Leakage Current
2.0
2.4
V
Vcc = 3.3V, Note 2
Vcc = 5.0V, Note 2
Vcc
V
+0.01
+0.05
+1.0
µA
TxIN, EN, SHDN,
TAMB = +25oC, VIN = 0V to VCC
Output Leakage Current
Output Voltage LOW
Output Voltage HIGH
DRIVER OUTPUTS
Output Voltage Swing
+10
0.4
µA
V
Receivers disabled, VOUT = 0V to VCC
IOUT = 1.6mA
VCC -0.6 VCC -0.1
V
IOUT = -1.0mA
+5.0
+5.4
V
All driver outputs loaded with 3kΩ to
GND, TAMB = +25oC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
2
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, C1 to
C4 = 0.1µF. Typical values apply at Vcc = +3.3V and TAMB = 25°C
PARAMETER
MIN.
TYP. MAX. UNITS CONDITIONS
DRIVER OUTPUTS (continued)
Output Resistance
300
Ω
mA
µA
VCC = V+ = V- = 0V, TOUT=+2V
Output Short-Circuit Current
Output Leakage Current
+35
+60
+25
VOUT = 0V
VCC = 0V or 3.0V to 5.5V,
VOUT = +12V, Drivers disabled
RECEIVER INPUTS
Input Voltage Range
Input Threshold LOW
Input Threshold LOW
Input Threshold HIGH
Input Threshold HIGH
Input Hysteresis
-15
0.6
0.8
+15
V
V
1.2
1.5
1.5
1.8
0.3
5
Vcc = 3.3V
Vcc = 5.0V
Vcc = 3.3V
Vcc = 5.0V
V
2.4
2.4
V
V
V
Input Resistance
3
7
kΩ
TIMING CHARACTERISTICS
Maximum Data Rate
1000
kbps
RL = 3kΩ, CL = 250pF, one driver
switching
Receiver Propagation Delay, tPHL
Receiver Propagation Delay, tPLH
0.15
0.15
µs
µs
Receiver input to Receiver
output, CL = 150pF
Receiver input to Receiver
output, CL = 150pF
Receiver Output Enable Time
Receiver Output Disable Time
Driver Skew
200
200
100
ns
ns
ns
| tPHL - tPLH |, TAMB = 25°C
Receiver Skew
50
90
ns
| tPHL - tPLH |
Transition-Region Slew Rate
V/µs
Vcc = 3.3V, RL = 3kΩ,
CL =1000pF, TAMB = 25°C,
measurements taken from -3.0V
to +3.0V or +3.0V to -3.0V
NOTE 2: Driver input hysteresis is typically 250mV.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
3
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 1000kbps data rate, all
drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
6
120
T1 at 1Mbps
4
2
100
80
60
40
20
0
T2 at 62.5Kbps
T1 at 1Mbps
All TX loaded 3K // CLoad
T2 at 62.5Kbps
0
-2
-4
-6
0
250
500
1000
1500
2000
0
250
500
1000
1500
Load Capacitance (pF)
Load Capacitance (pF)
Figure 1. Transmitter Output Voltage vs Load
Figure 2. Slew Rate vs Load Capacitance for the
Capacitance for the SP3222EU and SP3232EU
SP3222EU and SP3232EU
20
35
30
20
15
15
T1 at 1Mbps
T2 at 62.5Kbps
10
5
T1 at 1Mbps
T2 at 62.5Kbps
10
5
0
0
0
250
500
1000
1500
2.7
3
3.5
4
4.5
5
Load Capacitance (pF)
Supply Voltage (V)
Figure 4. Supply Current VS. Supply Voltage for the
SP3222EU and SP3232EU
Figure 3. Supply Current VS. Load Capacitance
when Transmitting Data for the SP3222EU and
SP3232EU
200
150
100
6
4
2
T1 at 1Mbps
T2 at 62.5Kbps
0
-2
-4
-6
T1 at 500Kbps
50
T2 at 31.2Kbps
All TX loaded 3K // CLoad
0
0
250
500
1000
1500
2000
2.7
3
3.5
4
4.5
5
Load Capacitance (pF)
Supply Voltage (V)
Figure 5. Transmitter Output Voltage vs Supply
Voltage for the SP3222EU and SP3232EU
Figure 6. Transmitter Skew VS. Load Capacitance
for the SP3222EU and SP3232EU
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
4
PIN FUNCTION
PIN NUMBER
SP3222EU
SP3232EU
NAME
FUNCTION
SOIC
SSOP
TSSOP
Receiver Enable. Apply Logic LOW for normal operation.
Apply logic HIGH to disable the receiver outputs (high-Z state)
EN
1
1
-
C1+
V+
Positive terminal of the voltage doubler charge-pump capacitor
+5.5V output generated by the charge pump
Negative terminal of the voltage doubler charge-pump capacitor
Positive terminal of the inverting charge-pump capacitor
Negative terminal of the inverting charge-pump capacitor
-5.5V output generated by the charge pump
RS-232 driver output.
2
3
2
3
1
2
C1-
4
4
3
C2+
C2-
5
5
4
6
6
5
V-
7
7
6
T1OUT
T2OUT
R1IN
R2IN
15
8
17
8
14
7
RS-232 driver output.
RS-232 receiver input
14
9
16
9
13
8
RS-232 receiver input
R1OUT TTL/CMOS receiver output
R2OUT TTL/CMOS receiver output
13
10
12
11
16
17
15
10
13
12
18
19
12
9
T1IN
T2IN
GND
VCC
TTL/CMOS driver input
TTL/CMOS driver input
Ground
11
10
15
16
+3.0V to +5.5V supply voltage
Shutdown Control Input. Drive HIGH for normal device operation.
Drive LOW to shutdown the drivers (high-Z output) and the on-
board power supply
SHDN
18
-
20
-
-
N.C.
No Connect
11, 14
Table 1. Device Pin Description
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SP3222EU/SP3232EU_102_031413
5
PINOUT
EN
1
2
3
4
5
6
20
19
18
17
16
15
SHDN
EN
1
2
3
4
5
6
18
17
16
15
14
13
SHDN
V
CC
C1+
V+
V
CC
C1+
V+
GND
GND
C1-
T1OUT
R1IN
C1-
T1OUT
R1IN
SP3222EU
C2+
C2-
V-
SP3222EU
C2+
C2-
V-
R1OUT
R1OUT
7
14
13
N.C.
T1IN
7
12
T1IN
T2OUT
R2IN
8
9
8
9
11
10
T2OUT
R2IN
12 T2IN
N.C.
T2IN
10
R2OUT
11
R2OUT
nSOIC
SSOP/TSSOP
Figure 7. Pinout Configurations for the SP3222EU
V
CC
1
2
3
4
5
6
16
15
14
13
12
11
C1+
V+
GND
C1-
T1OUT
SP3232EU
C2+
C2-
V-
R1IN
R1OUT
T1IN
7
8
10
9
T2OUT
R2IN
T2IN
R2OUT
Figure 8. Pinout Configuration for the SP3232EU
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SP3222EU/SP3232EU_102_031413
6
TYPICAL OPERATING CIRCUITS
VCC
VCC
+
+
+
+
19
17
0.1µF
0.1µF
C5
C1
0.1µF
0.1µF
C5
C1
VCC
VCC
2
3
2
3
C1+
C1+
V+
V-
V+
V-
+
+
+
+
0.1µF
0.1µF
*C3
C4
0.1µF
0.1µF
*C3
C4
4
5
C1-
4
5
C1-
7
C2+
SP3222EU
7
C2+
SP3222EU
WSOIC
+
+
SSOP
C2
0.1µF
C2
0.1µF
6
TSSOP
C2-
6
C2-
T1OUT
T2OUT
17
8
T1OUT
T2OUT
13 T1IN
15
8
12 T1IN
LOGIC
RS-232
LOGIC
RS-232
12
INPUTS
T2IN
OUTPUTS
11
INPUTS
T2IN
OUTPUTS
16
15
10
R1IN
R1OUT
R2OUT
14
13
10
R1IN
R1OUT
R2OUT
5kΩ
5kΩ
5kΩ
RS-232
INPUTS
LOGIC
RS-232
INPUTS
LOGIC
OUTPUTS
OUTPUTS
R2IN
9
R2IN
9
5kΩ
1 EN
1 EN
20
18
SHDN
SHDN
GND
18
GND
16
*can be returned to
either VCC or GND
*can be returned to
either VCC or GND
Figure 9. SP3222EU Typical Operating Circuits
VCC
+
16
0.1µF
0.1µF
C5
C1
VCC
2
6
1
C1+
V+
V-
+
+
+
+
*C3
C4
0.1µF
0.1µF
3
4
C1-
C2+
SP3232EU
0.1µF
C2
5
C2-
T1OUT
T2OUT
14
7
11 T1IN
LOGIC
RS-232
10
INPUTS
T2IN
OUTPUTS
12
9
R1IN 13
R1OUT
R2OUT
5kΩ
RS-232
INPUTS
LOGIC
OUTPUTS
R2IN
8
5kΩ
GND
15
*can be returned to
either VCC or GND
Figure 10. SP3232EU Typical Operating Circuit
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
7
DESCRIPTION
The SP3222EU/SP3232EU transceivers
meet the EIA/TIA-232 and ITU-T V.28/V.24
communication protocols and can be imple-
mented in battery-powered, portable, or
hand-held applications such as notebook
or palmtop computers. The SP3222EU/
SP3232EU devices feature Exar's propri-
etary on-board charge pump circuitry that
generates ±5.5V for RS-232 voltage levels
from a single +3.0V to +5.5V power supply.
This series is ideal for +3.3V-only systems,
mixed +3.3V to +5.5V systems, or +5.0V-
only systems that require true RS-232
performance. The SP3222EU/SP3232EU
devices can operate at a minimum data rate
of 1000kbps.
The drivers have a minimum data rate of
1000kbps fully loaded with 3kΩ in parallel
with 250pF, ensuring compatability with PC-
to-PC communication software.
Figure 11 shows a loopback test circuit
used to test the RS-232 Drivers. Figure
12 shows the test results of the loopback
circuit with all drivers active at 250kbps
with RS-232 loads in parallel with a
1000pF capacitor. Figure 13 shows the
test results where one driver was active
at 1000kbps and all drivers loaded with an
RS-232 receiver in parallel with 250pF
capacitors.
The SP3222EU driver's output stages are
turned off (tri-state) when the device is in
shutdown mode. When the power is off, the
SP3222EU device permits the outputs to be
driven up to +/-12V. The driver's inputs do
nothavepull-upresistors. Designersshould
connect unused inputs to Vcc or GND.
The SP3222EU and SP3232EU are 2-
driver/2- receiver devices ideal for portable
or hand-held applications. The SP3222EU
featuresa1µA shutdownmodethatreduces
power consumption and extends battery life
in portable systems. Its receivers remain
active in shutdown mode, allowing external
devices such as modems to be monitored
using only 1µA supply current.
In the shutdown mode, the supply current
falls to less than 1µA, where SHDN = LOW.
When the SP3222EU device is shut down,
the device's driver outputs are disabled (tri-
stated) and the charge pumps are turned off
with V+ pulled down to Vcc and V- pulled to
GND. The time required to exit shutdown is
typically 100µs. Connect SHDN to Vcc if the
shutdown mode is not used.
THEORY OF OPERATION
The SP3222EU/SP3232EU series is made
up of three basic circuit blocks:
1. Drivers
2. Receivers
3. The Exar proprietary charge pump
Receivers
The Receivers convert EIA/TIA-232 levels
to TTL or CMOS logic output levels. The
SP3222EU receivers have an inverting
tri-state output. These receiver outputs
(RxOUT) are tri-stated when the enable
control EN = HIGH. In the shutdown mode,
the receivers can be active or inactive. EN
hasnoeffectonTxOUT.Thetruthtablelogic
oftheSP3222EUdriverandreceiveroutputs
can be found in Table 2.
Drivers
The drivers are inverting level transmitters
that convert TTL or CMOS logic levels to
+5.0V EIA/TIA-232 levels with an inverted
sense relative to the input logic levels.
Typically, the RS-232 output voltage swing
is +5.4V with no load and +5V minimum fully
loaded. The driver outputs are protected
against infinite short-circuits to ground with-
out degradation in reliability. Driver outputs
will meet EIA/TIA-562 levels of +/-3.7V with
supply voltages as low as 2.7V.
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SP3222EU/SP3232EU_102_031413
8
DESCRIPTION
Since receiver input is usually from a trans-
mission line where long cable lengths and
system interference can degrade the signal,
the inputs have a typical hysteresis margin
of 300mV. This ensures that the receiver
is virtually immune to noisy transmission
lines. Should an input be left unconnected,
an internal 5kΩ pulldown resistor to ground
will commit the output of the receiver to a
HIGH state.
V
CC
+
+
0.1µF
0.1µF
C5
C1
V
CC
C1+
V+
V-
+
+
C3
C4
0.1µF
0.1µF
C1-
SP3222EU
SP3232EU
C2+
+
C2
0.1µF
C2-
TxOUT
TxIN
LOGIC
INPUTS
RxIN
RxOUT
EN*
LOGIC
OUTPUTS
SHDN
EN
TxOUT
RxOUT
5kΩ
*SHDN
0
0
1
1
0
1
0
1
Tri-state
Tri-state
Active
Active
Tri-state
Active
V
CC
GND
250pF or 1000pF
* SP3222EU only
Active
Tri-state
Table 2. SP3222EU Truth Table Logic for Shutdown
Figure 11. SP3222EU/SP3232EU Driver Loopback
Test Circuit
and Enable Control
Charge Pump
The charge pump is an Exar-patended
design (U.S. 5,306,954) and uses a unique
approach compared to older less-efficient
designs. The charge pump still requires four
external capacitors, but uses a four-phase
voltage shifting technique to attain sym-
metrical 5.5V power supplies. The internal
power supply consists of a regulated dual
charge pump that provides output voltages
of +/-5.5V regardless of the input voltage
(Vcc) over the +3.0V to +5.5V range.
Figure 12. Loopback Test results at 250kbps
In most circumstances, decoupling the
power supply can be achieved adequately
using a 0.1µF bypass capacitor at C5 (refer
to figures 9 and 10). In applications that are
sensitive to power-supply noise, decouple
Vcc to ground with a capacitor of the same
value as charge-pump capacitor C1. Physi-
cally connect bypass capcitors as close to
the IC as possible.
Figure 13. Loopback Test results at 1000kbps
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SP3222EU/SP3232EU_102_031413
9
DESCRIPTION
The charge pump operates in a discontinu-
ous mode using an internal oscillator. If the
output voltages are less than a magnitude
of 5.5V, the charge pump is enabled. If the
outputvoltages exceedamagnitudeof5.5V,
the charge pump is disabled. This oscillator
controls the four phases of the voltage shift-
ing. A description of each phase follows.
to V and the negative side is con-
nectCeCd to GND, allowing the charge
pump cycle to begin again. The charge
pump cycle will continue as long as the
operational conditions for the internal
oscillator are present.
Since both V+ and V– are separately gener-
ated from VCC, in a no–load condition V+
and V– will be symmetrical. Older charge
pump approaches that generate V– from
V+ will show a decrease in the magnitude
of V– compared to V+ due to the inherent
inefficiencies in the design.
Phase 1
— VSS charge storage — During this phase
oftheclockcycle,thepositivesideofcapaci-
tors C1 and C2 are initially charged to VCC.
Cl+ is then switched to GND and the charge
in C1– is transferred to C –. Since C2+ is con-
nected to V , the volta2ge potential across
capacitor C2CCis now 2 times VCC.
The clock rate for the charge pump typically
operatesatgreaterthan250kHz. Theexter-
nal capacitors can be as low as 0.1µF with
a 16V breakdown voltage rating.
Phase 2
— V transfer — Phase two of the clock
connSeSctsthenegativeterminalofC totheVSS
storagecapacitorandthepositivet2erminalof
C2 to GND. This transfers a negative gener-
ated voltage to C3. This generated voltage is
regulated to a minimum voltage of -5.5V.
Simultaneous with the transfer of the volt-
age to C3, the positive side of capacitor C1
is switched to VCC and the negative side is
connected to GND.
Phase 3
— VDD charge storage — The third phase of
the clock is identical to the first phase — the
charge transferred in C1 produces –VCC in
the negative terminal of C , which is applied
to the negative side of ca1pacitor C2. Since
C + is at V , the voltage potential across C2
is22 timesCVCCC.
Phase 4
— V transfer — The fourth phase of
the cDloDck connects the negative terminal
of C2 to GND, and transfers this positive
generated voltage across C2 to C4, the
VDD storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the in-
ternal oscillator is disabled. Simultaneous
with the transfer of the voltage to C4, the
positive side of capacitor C1 is switched
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SP3222EU/SP3232EU_102_031413
10
DESCRIPTION
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 14. Charge Pump — Phase 1
V
CC
= +5V
C
4
+
–
V
V
Storage Capacitor
DD
+
–
+
C
1
C
2
–
+
–
Storage Capacitor
SS
C
3
-5.5V
Figure 15. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
T
GND
GND
1
2
b) C2-
-6V
Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V
Figure 16. Charge Pump Waveforms
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 17. Charge Pump — Phase 3
V
CC
= +5V
+5.5V
+
C
4
+
–
+
V
Storage Capacitor
DD
+
–
C
1
C
2
–
–
V
SS
Storage Capacitor
C
3
Figure 18. Charge Pump — Phase 4
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
11
DESCRIPTION
ESD TOLERANCE
61000-4-2 is that the system is required to
withstandanamountofstaticelectricitywhen
ESD is applied to points and surfaces of the
equipment that are accessible to personnel
during normal usage. The transceiver IC
receives most of the ESD current when the
ESDsourceisappliedtotheconnectorpins.
The test circuit for IEC 61000-4-2 is shown
on Figure 20. There are two methods within
IEC 61000-4-2, the Air Discharge method
and the Contact Discharge method.
The SP3222E/SP3232E series incorpo-
rates ruggedized ESD cells on all driver
output and receiver input pins. The ESD
structure is improved over our previous
family for more rugged applications and
environments sensitive to electro-static
discharges and associated transients. The
improved ESD tolerance is at least +15kV
without damage nor latch-up.
There are different methods of ESD testing
applied:
With the Air Discharge Method, an ESD
voltage is applied to the equipment under
test (EUT) through air. This simulates an
electricallychargedpersonreadytoconnect
a cable onto the rear of the system only to
findanunpleasantzapjustbeforetheperson
touches the back panel. The high energy
potential on the person discharges through
anarcingpathtotherearpanelofthesystem
before he or she even touches the system.
This energy, whether discharged directly or
throughair,ispredominantlyafunctionofthe
discharge current rather than the discharge
voltage. Variableswithanairdischargesuch
asapproachspeedoftheobjectcarryingthe
ESD potential to the system and humidity
will tend to change the discharge current.
For example, the rise time of the discharge
current varies with the approach speed.
a) MIL-STD-883, Method 3015.7
b) IEC 61000-4-2 Air-Discharge
c) IEC 61000-4-2 Direct Contact
The Human Body Model has been the
generally accepted ESD testing method
for semi-conductors. This method is also
specified in MIL-STD-883, Method 3015.7
forESDtesting.ThepremiseofthisESDtest
is to simulate the human body’s potential to
store electro-static energy and discharge it
to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 19. This method will test the IC’s
capability to withstand an ESD transient
during normal handling such as in manu-
facturing areas where the ICs tend to be
handled frequently.
The Contact Discharge Method applies the
ESDcurrentdirectlytotheEUT. Thismethod
was devised to reduce the unpredictability
of the ESD arc. The discharge current rise
time is constant since the energy is directly
transferred without the air-gap arc. In situ-
ations such as hand held systems, the ESD
charge can be directly discharged to the
The IEC-61000-4-2, formerly IEC801-2, is
generallyusedfortestingESDonequipment
and systems. For system manufacturers,
they must guarantee a certain amount of
ESD protection since the system itself is
exposed to the outside environment and
human presence. The premise with IEC
R
S
R
C
SW1
SW2
Device
C
DC Power
Source
S
Under
Test
Figure 19. ESD Test Circuit for Human Body Model
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
12
DESCRIPTION
Contact-Discharge Model
R
R
R
V
C
S
SW1
SW2
Device
Under
Test
C
DC Power
Source
S
and
add up to 330Ω for IEC61000-4-2.
R
V
R
S
Figure 20. ESD Test Circuit for IEC61000-4-2
equipment from a person already holding
the equipment. The current is transferred
on to the keypad or the serial port of the
equipment directly and then travels through
the PCB and finally to the IC.
The higher CS value and lower R value in
the IEC61000-4-2 model are moreSstringent
than the Human Body Model. The larger
storage capacitor injects a higher voltage
to the test point when SW2 is switched on.
The lower current limiting resistor increases
the current charge onto the test point.
The circuit models in Figures 19 and 20 rep-
resentthetypicalESDtestingcircuitusedfor
allthreemethods. TheCS isinitiallycharged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor
is charged, the second switch (SW2) is on
while SW1 switches off. The voltage stored
in the capacitor is then applied through R ,
the current limiting resistor, onto the devicSe
under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under
test receives a duration of voltage.
30A
15A
0A
For the Human Body Model, the current
limitingresistor(RS)andthesourcecapacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-61000-4-2, the current limiting resistor
(R ) and the source capacitor (CS) are 330Ω
anS150pF, respectively.
t = 0ns
t = 30ns
t →
Figure 21. ESD Test Waveform for IEC61000-4-2
DEVICE PIN
TESTED
HUMAN BODY
MODEL
IEC61000-4-2
Air Discharge Direct Contact
Level
Driver Outputs
Receiver Inputs
+15kV
+15kV
+15kV
+15kV
+8kV
+8kV
4
4
Table 3. Transceiver ESD Tolerance Levels
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
13
PACKAGE: 16 PIN SSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
14
PACKAGE: 18 PIN WSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
15
PACKAGE: 16 PIN nSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
16
PACKAGE: 16 PIN TSSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
17
PACKAGE: 20 PIN TSSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
18
ORDERING INFORMATION
Part Number
Temp. Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Package
SP3222EUCT-L
SP3222EUCT-L/TR
SP3222EUCY-L
SP3222EUCY-L/TR
SP3222EUET-L
SP3222EUET-L/TR
SP3222EUEY-L
SP3222EUEY-L/TR
18 Pin WSOIC
18 Pin WSOIC
20 Pin TSSOP
20 Pin TSSOP
18 Pin WSOIC
18 Pin WSOIC
20 Pin TSSOP
20 Pin TSSOP
Part Number
Temp. Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Package
SP3232EUCA-L
SP3232EUCA-L/TR
SP3232EUCN-L
SP3232EUCN-L/TR
SP3232EUCY-L
SP3232EUCY-L/TR
SP3232EUEA-L
SP3232EUEA-L/TR
SP3232EUEY-L
SP3232EUEY-L/TR
16 Pin SSOP
16 Pin SSOP
16 Pin NSOIC
16 Pin NSOIC
16 Pin TSSOP
16 Pin TSSOP
16 Pin SSOP
16 Pin SSOP
16 Pin TSSOP
16 Pin TSSOP
Note: "/TR" is for tape and Reel option. "-L" is for lead free packaging
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
19
REVISION HISTORY
DATE
REVISION DESCRIPTION
02/31/06
12/08/10
06/17/11
03/14/13
--
Legacy Sipex Datasheet
1.0.0
1.0.1
1.0.2
Convert to Exar Format and update ordering information.
Remove EOL devices per PDN 110510-05
Correct type error to RX input voltage range and driver tran-
sition region slew rate test condition.
Notice
EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reli-
ability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are
only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully
checked; no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for
use in such applications unless EXAR Corporation receives, in writting, assurances to its satisfaction that: (a) the risk of injury or damage has been
minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Copyright 2013 EXAR Corporation
Datasheet March 2013
For technical questions please email Exar's Serial Technical Support group at: serialtechsupport@exar.com
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3222EU/SP3232EU_102_031413
20
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