4N30TV [FAIRCHILD]
Darlington Output Optocoupler, 1-Element, 5300V Isolation, DIP-6;
| 型号： | 4N30TV |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Darlington Output Optocoupler, 1-Element, 5300V Isolation, DIP-6 输出元件 光电 |
| 文件： | 总13页 (文件大小：583K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
May 2006
4N29, 4N30, 4N31, 4N32, 4N33
tm
General Purpose 6-Pin Photodarlington Optocoupler
Features
Description
■ High sensitivity to low input drive current
The 4N29, 4N30, 4N31, 4N32, 4N33 have a gallium
arsenide infrared emitter optically coupled to a silicon
planar photodarlington.
■ Meets or exceeds all JEDEC Registered
Specifications
■ VDE 0884 approval available as a test option
– add option .300. (e.g., 4N29.300)
Applications
■ Low power logic circuits
■ Telecommunications equipment
■ Portable electronics
■ Solid state relays
■ Interfacing coupling systems of different potentials
and impedances
Packages
Schematic
White Package (-M Suffix)
ANODE 1
6 BASE
6
6
1
1
CATHODE
N/C
COLLECTOR
2
3
5
4
6
1
EMITTER
Black Package (No -M Suffix)
6
6
1
1
6
1
©2006 Fairchild Semiconductor Corporation
1
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Absolute Maximum Ratings (T = 25°C Unless otherwise specified.)
A
Symbol
Parameter
Value
Units
TOTAL DEVICE
T
Storage Temperature
Operating Temperature
Lead Solder Temperature
-55 to +150
-55 to +100
260 for 10 sec
250
°C
°C
STG
T
OPR
T
°C
SOL
P
Total Device Power Dissipation @ T = 25°C
mW
mW/°C
D
A
Derate above 25°C
3.3
EMITTER
I
Continuous Forward Current
Reverse Voltage
80
3
mA
V
F
V
R
I (pk)
Forward Current – Peak (300µs, 2% Duty Cycle)
3.0
150
2.0
A
F
P
LED Power Dissipation @ T = 25°C
mW
mW/°C
D
A
Derate above 25°C
DETECTOR
BV
BV
BV
Collector-Emitter Breakdown Voltage
Collector-Base Breakdown Voltage
Emitter-Collector Breakdown Voltage
30
30
V
V
CEO
CBO
ECO
5
V
P
Detector Power Dissipation @ T = 25°C
150
2.0
150
mW
mW/°C
mA
D
A
Derate above 25°C
I
Continuous Collector Current
C
2
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Electrical Characteristics (T = 25°C Unless otherwise specified.)
A
Individual Component Characteristics
Symbol
EMITTER
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
Input Forward Voltage*
Reverse Leakage Current*
Capacitance*
I = 10mA
–
–
–
1.2
0.001
150
1.5
100
–
V
F
F
I
V = 3.0V
µA
pF
R
R
C
V = 0V, f = 1.0MHz
F
DETECTOR
BV
BV
BV
Collector-Emitter Breakdown Voltage* I = 1.0mA, I = 0
30
30
5.0
–
60
100
8
–
–
V
V
CEO
CBO
ECO
C
B
Collector-Base Breakdown Voltage*
I = 100µA, I = 0
C E
Emitter-Collector Breakdown Voltage* I = 100µA, I = 0
–
V
E
B
I
Collector-Emitter Dark Current*
DC Current Gain
V
V
= 10V, Base Open
1
100
–
nA
CEO
CE
CE
h
= 5.0V, I = 500µA
–
5000
FE
C
Transfer Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
DC CHARACTERISTICS
(1, 2)
I
Collector Output Current*
4N32, 4N33
I = 10mA, V = 10V, I = 0
F CE B
C(CTR)
50 (500)
10 (100)
5 (50)
–
–
–
–
–
–
mA (%)
4N29, 4N30
4N31
(2)
V
Saturation Voltage*
I = 8mA, I = 2.0mA
F C
CE(SAT)
4N29, 4N30, 4N32, 4N33
4N31
–
–
–
–
1.0
1.2
V
AC CHARACTERISTICS
t
Turn-on Time
I = 200mA, I = 50mA,
–
–
5.0
µS
on
F
C
V
= 10V
CC
t
Turn-off Time
off
–
–
–
4N32, 4N33
I = 200mA, I = 50mA,
–
–
100
40
–
µS
F
C
V
= 10V
CC
4N29, 4N30, 4N31
(3, 4)
BW
30
kHz
Bandwidth
Isolation Characteristics
Symbol Characteristic
Test Conditions
Min.
Typ. Max.
Units
(5)
V
Input-Output Isolation Voltage
ISO
4N29, 4N30, 4N31, 4N32, 4N33
I
≤ 1µA, Vrms, t = 1min.
5300
2500
1500
–
–
–
–
–
–
–
–
–
Vac(rms)
V
I-O
4N32*
4N33*
VDC
VDC
(5)
11
R
C
Isolation Resistance
V
= 500VDC
10
0.8
Ω
ISO
I-O
(5)
Isolation Capacitance
V
= Ø, f = 1MHz
–
pF
ISO
I-O
Notes:
* Indicates JEDEC registered data.
1. The current transfer ratio(I /I ) is the ratio of the detector collector current to the LED input current with V @ 10V.
C F
CE
2. Pulse test: pulse width = 300µs, duty cycle ≤ 2.0% .
4. I adjusted to I = 2.0mA and I = 0.7mA rms.
F
C
C
5. The frequency at which I is 3dB down from the 1kHz value.
C
6. For this test, LED pins 1 and 2 are common, and phototransistor pins 4, 5 and 6 are common.
3
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Typical Performance Curves
Fig. 1 LED Forward Voltage vs. Forward Current
(Black Package)
Fig. 2 LED Forward Voltage vs. Forward Current
(White Package)
1.8
1.7
1.6
1.5
1.4
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
T
T
T
= -55°C
= 25°C
= 100°C
A
A
T
= -55°C
A
1.3
1.2
1.1
1.0
T
T
= 25°C
A
A
A
= 100°C
1
10
100
1
10
100
I
- LED FORWARD CURRENT (mA)
I - LED FORWARD CURRENT (mA)
F
F
Fig.3 Normalized CTR vs. Forward Current
(Black Package)
Fig.4 Normalized CTR vs. Forward Current
(White Package)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
V
T
= 5.0V
V
T
= 5.0V
CE
Normalized to
= 10 mA
Normalized to
I = 10 mA
F
CE
= 25°C
= 25°C
I
F
A
A
0
5
I
10
15
20
0
2
4
6
8
10
12
14
16
18
20
- FORWARD CURRENT (mA)
I - FORWARD CURRENT (mA)
F
F
Fig. 5 Normalized CTR vs. Ambient Temperature
(Black Package)
Fig. 6 Normalized CTR vs. Ambient Temperature
(White Package)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
1.4
1.2
1.0
0.8
0.6
0.4
I = 5 mA
F
I
F
= 5 mA
I
= 10 mA
F
I
= 10 mA
F
I
= 20 mA
F
Normalized to
= 10 mA
Normalized to
= 10 mA
I
I
F
= 20 mA
F
I
F
T
= 25°C
A
T
= 25°C
A
-75
-50
-25
0
25
50
75
100
125
-60
-40
-20
0
20
40
60
80
100
T
- AMBIENT TEMPERATURE (°C)
T - AMBIENT TEMPERATURE (°C)
A
A
4
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Typical Performance Curves (Continued)
Fig. 8 CTR vs. RBE (Unsaturated)
(White Package)
Fig. 7 CTR vs. RBE (Unsaturated)
(Black Package)
1.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.9
I
= 20 mA
F
V
= 5.0 V
CE
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
I
= 10 mA
F
I
I
= 20 mA
= 10 mA
F
F
I
= 5 mA
F
I
= 5 mA
F
V
= 5.0 V
CE
10
100
1000
10
100
1000
R
- BASE RESISTANCE (kΩ)
R
BE
- BASE RESISTANCE (kΩ)
BE
Fig. 9 CTR vs. RBE (Saturated)
(Black Package)
Fig. 10 CTR vs. RBE (Saturated)
(White Package)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
V
= 0.3 V
CE
V
= 0.3 V
CE
I
I
= 20 mA
= 10 mA
F
I
= 20 mA
= 10 mA
F
F
I
F
I
= 5 mA
F
I
F
= 5 mA
10
100
1000
10
100
1000
R
- BASE RESISTANCE (k Ω)
R
BE
- BASE RESISTANCE (k Ω)
BE
Fig. 12 Collector-Emitter Saturation Voltage vs Collector Current
(White Package)
Fig. 11 Collector-Emitter Saturation Voltage vs Collector Current
(Black Package)
100
10
1
100
T
= 25˚C
A
10
1
I
= 2.5 mA
I = 2.5 mA
F
F
0.1
0.01
0.1
I
= 20 mA
F
I
= 10 mA
F
I
= 20 mA
F
0.01
0.001
I
= 5 mA
0.1
F
I
= 5 mA
F
I
= 10 mA
F
T
= 25˚C
A
0.001
0.01
1
10
0.01
0.1
1
10
I
- COLLECTOR CURRENT (mA)
C
I
- COLLECTOR CURRENT (mA)
C
5
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Typical Performance Curves (Continued)
Fig. 14 Switching Speed vs. Load Resistor
(White Package)
Fig. 13 Switching Speed vs. Load Resistor
(Black Package)
1000
100
10
1000
I
V
T
= 10 mA
= 10 V
I
V
T
= 10 mA
= 10 V
F
F
CC
CC
= 25°C
= 25°C
A
A
100
10
1
T
off
T
off
T
f
T
f
T
on
T
on
1
T
r
T
r
0.1
0.1
0.1
1
10
100
0.1
1
10
100
R-LOAD RESISTOR (kΩ)
R-LOAD RESISTOR (kΩ)
Fig. 15 Normalized t vs. R
on
Fig. 16 Normalized t vs. R
on
BE
BE
(Black Package)
(White Package)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
V
10 V
= 2 mA
= 100 Ω
V
I
10 V
= 2 mA
= 100 Ω
CC =
CC =
I
C
L
C
R
R
L
10
100
R
1000
10000
100000
10
100
R
1000
10000
100000
- BASE RESISTANCE (k Ω)
- BASE RESISTANCE (k Ω)
BE
BE
Fig. 17 Normalized t vs. R
off
Fig. 18 Normalized t vs. R
off
BE
BE
(Black Package)
(White Package)
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
V
10 V
= 2 mA
= 100 Ω
V
10 V
= 2 mA
= 100 Ω
CC =
CC =
I
I
C
L
C
L
R
R
10
100
1000
10000
100000
10
100
1000
10000
100000
R - BASE RESISTANCE (k Ω)
BE
R - BASE RESISTANCE (k Ω)
BE
6
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Typical Performance Curves (Continued)
Fig. 19 Dark Current vs. Ambient Temperature
10000
1000
100
10
V
T
= 10 V
CE
A
= 25°
C
1
0.1
0.01
0.001
0
20
40
60
80
100
T
- AMBIENT TEMPERATURE (°C)
A
TEST CIRCUIT
WAVE FORMS
V
CC = 10V
INPUT PULSE
IC
IF
RL
10%
90%
INPUT
OUTPUT
OUTPUT PULSE
RBE
tr
tf
toff
ton
I
I
Adjust
F
t
o
p
r
o
d
u
c
e
C
=
2
m
A
Figure 20. Switching Time Test Circuit and Waveforms
7
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Black Package (No -M Suffix)
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
PIN 1
ID.
0.350 (8.89)
0.320 (8.13)
0.270 (6.86)
0.240 (6.10)
Pin 1 ID
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.92)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.020 (0.51)
0.154 (3.90)
0.100 (2.54)
MIN
0.016 (0.40)
0.008 (0.20)
0.300 (7.62)
0.022 (0.56)
0.016 (0.41)
0.025 (0.63)
0.020 (0.51)
0° to 15°
TYP
0.100 [2.54]
0.035 (0.88)
0.012 (0.30)
0.100 (2.54)
TYP
0.020 (0.50)
0.016 (0.41)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
PIN 1 ID
0.070 (1.78)
0.270 (6.86)
0.240 (6.10)
0.060 (1.52)
0.350 (8.89)
0.330 (8.38)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.070 (1.78)
0.045 (1.14)
0.030 (0.76)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0.004 (0.10)
MIN
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.400 (10.16)
TYP
0.100 (2.54) TYP
Note:
All dimensions are in inches (millimeters).
8
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
White Package (-M Suffix)
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
Pin 1 ID
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.025 (0.63)
0.020 (0.51)
0.100 (2.54)
0.015 (0.38)
0.100 [2.54]
0.035 (0.88)
0.006 (0.16)
0.020 (0.50)
0.016 (0.41)
0.020 (0.50)
0.016 (0.41)
15°
0.100 (2.54)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.014 (0.36)
0.010 (0.25)
0.030 (0.76)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
Note:
All dimensions are in inches (millimeters).
9
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Ordering Information
Black Package
(No Suffix)
White Package
(-M Suffix)
Option
.S
.SD
S
SR2
T
Surface Mount Lead Bend
Surface Mount; Tape and reel
0.4" Lead Spacing
.W
.300
.300W
.3S
V
VDE 0884
TV
VDE 0884, 0.4" Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape & Reel
SV
SR2V
.3SD
Marking Information
1
2
1
2
6
4N29
V XX YY K
4N29
6
V X YY Q
5
3
4
5
3
4
Black Package, No Suffix
White Package, -M Suffix
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
One or two digit year code
4
• Two digits for black package parts, e.g., ‘03’
• One digit for white package parts, e.g., ‘3’
5
6
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
*Note – Parts built in the white package (M suffix) that do not have the ‘V’ option (see
definition 3 above) that are marked with date code ‘325’ or earlier are marked in the
portrait format.
10
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Tape Dimensions
Black Package, No Suffix
12.0 0.1
4.0 0.1
4.85 0.20
Ø1.55 0.05
1.75 0.10
4.0 0.1
0.30 0.05
7.5 0.1
16.0 0.3
9.55 0.20
13.2 0.2
Ø1.6 0.1
10.30 0.20
User Direction of Feed
0.1 MAX
White Package, -M Suffix
12.0 0.1
2.0 0.05
4.5 0.20
Ø1.5 MIN
1.75 0.10
4.0 0.1
0.30 0.05
11.5 1.0
24.0 0.3
9.1 0.20
21.0 0.1
Ø1.5 0.1/-0
10.1 0.20
User Direction of Feed
0.1 MAX
Note:
All dimensions are in millimeters.
11
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
Reflow Soldering Profile
Black Package, No Suffix
300
250
215°C, 10–30 s
225 C peak
200
150
Time above 183°C, 60–150 sec
Ramp up = 3C/sec
100
50
0
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
White Package, -M Suffix
300
280
260
240
220
200
180
160
140
120
100
80
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
°C
1.822°C/Sec Ramp up rate
60
40
20
33 Sec
0
0
60
120
180
270
360
Time (s)
12
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4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
®
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MICROWIRE™
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SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TCM™
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT™
DOME™
FASTr™
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FRFET™
GlobalOptoisolator™
GTO™
®
PowerTrench
®
QFET
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
ScalarPump™
SILENT SWITCHER
SMART START™
SPM™
®
HiSeC™
TinyLogic
2
EcoSPARK™
I C™
MSXPro™
OCX™
TINYOPTO™
TruTranslation™
UHC™
2
E CMOS™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
EnSigna™
FACT™
FACT Quiet Series™
OCXPro™
OPTOLOGIC
®
UniFET™
®
®
OPTOPLANAR™
PACMAN™
POP™
UltraFET
Across the board. Around the world.™
VCX™
Wire™
®
The Power Franchise
Programmable Active Droop™
Power247™
Stealth™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDíS WORLDWIDE TERMS AND CONDITIONS,
SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I19
13
www.fairchildsemi.com
4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.0
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