4N37TM [FAIRCHILD]

Transistor Output Optocoupler, 1-Element, 7500V Isolation, DIP-6;


型号：	4N37TM
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	Transistor Output Optocoupler, 1-Element, 7500V Isolation, DIP-6 输出元件光电
文件：	总9页 (文件大小：253K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

January 2009

4N25M, 4N26M, 4N27M, 4N28M, 4N35M, 4N36M, 4N37M,

H11A1M, H11A2M, H11A3M, H11A4M, H11A5M

General Purpose 6-Pin Phototransistor Optocouplers

Features

Description

■ UL recognized (File # E90700, Volume 2)

■ VDE recognized (File # 102497)

– Add option V (e.g., 4N25VM)

The general purpose optocouplers consist of a gallium

arsenide infrared emitting diode driving a silicon pho-

totransistor in a 6-pin dual in-line package.

Applications

■ Power supply regulators

■ Digital logic inputs

■ Microprocessor inputs

Schematic

Package Outlines

PIN 1. ANODE

2. CATHODE

3. NO CONNECTION

4. EMITTER

5. COLLECTOR

6. BASE

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

Absolute Maximum Ratings ^{(T = 25°C unless otherwise speciﬁed)}

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Value

Units

TOTAL DEVICE

Storage Temperature

Operating Temperature

-40 to +150

-40 to +100

260 for 10 sec

250

°C

STG

OPR

Wave solder temperature (see page 8 for reﬂow solder proﬁle)

°C

SOL

Total Device Power Dissipation @ T = 25°C

Derate above 25°C

2.94

EMITTER

DC/Average Forward Input Current

Reverse Input Voltage

I (pk)

Forward Current – Peak (300µs, 2% Duty Cycle)

LED Power Dissipation @ T = 25°C

120

1.41

mW/°C

Derate above 25°C

DETECTOR

Collector-Emitter Voltage

Collector-Base Voltage

Emitter-Collector Voltage

CEO

CBO

ECO

Detector Power Dissipation @ T = 25°C

150

1.76

mW/°C

Derate above 25°C

Electrical Characteristics ^{(T = 25°C unless otherwise speciﬁed)}

Individual Component Characteristics

Symbol

EMITTER

Parameter

Test Conditions

Min.

Typ.* Max. Unit

Input Forward Voltage

I = 10mA

1.18

1.50

Reverse Leakage Current

V = 6.0V

0.001

µA

DETECTOR

Collector-Emitter Breakdown Voltage

Collector-Base Breakdown Voltage

Emitter-Collector Breakdown Voltage

Collector-Emitter Dark Current

Collector-Base Dark Current

Capacitance

I = 1.0mA, I = 0

100

120

CEO

CBO

ECO

I = 100µA, I = 0

= 10V, I = 0

CEO

CBO

= 10V

= 0V, f = 1 MHz

Isolation Characteristics

Symbol Characteristic

Test Conditions

Min. Typ.* Max.

Units

Input-Output Isolation Voltage

Isolation Resistance

f = 60Hz, t = 1 sec

7500

Vac(pk)

Ω

ISO

= 500 VDC

I-O

Isolation Capacitance

= &, f = 1MHz

0.2

*Typical values at T = 25°C

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

Electrical Characteristics ^{(Continued) (T = 25°C unless otherwise speciﬁed)}

Transfer Characteristics

Symbol

Parameter

Test Conditions

Device

Min. Typ.* Max. Unit

DC CHARACTERISTICS

CTR

Current Transfer Ratio,

Collector to Emitter

I = 10mA, V = 10V

4N35M, 4N36M,

4N37M

100

H11A1M

H11A5M

4N25M, 4N26M

H11A2M, H11A3M

4N27M, 4N28M

H11A4M

I = 10mA, V = 10V,

4N35M, 4N36M,

4N37M

T = -55°C

I = 10mA, V = 10V,

4N35M, 4N36M,

4N37M

T = +100°C

Collector-Emitter

Saturation Voltage

I = 2mA, I = 50mA

4N25M, 4N26M,

4N27M, 4N28M,

0.5

0.3

0.4

CE (SAT)

I = 0.5mA, I = 10mA

4N35M, 4N36M,

4N37M

H11A1M, H11A2M,

H11A3M, H11A4M,

H11A5M

AC CHARACTERISTICS

Non-Saturated

Turn-on Time

I = 10mA, V = 10V,

4N25M, 4N26M,

4N27M, 4N28M,

H11A1M, H11A2M,

H11A3M, H11A4,

H11A5M

µs

R = 100Ω (Fig. 11)

I = 2mA, V = 10V,

4N35M, 4N36M,

4N37M

µs

R = 100Ω (Fig. 11)

Turn-off Time

I = 10mA, V = 10V,

4N25M, 4N26M,

4N27M, 4N28M,

H11A1M, H11A2M,

H11A3M, H11A4M,

H11A5M

OFF

R = 100Ω (Fig. 11)

I = 2mA, V = 10V,

4N35M, 4N36M,

4N37M

R = 100Ω (Fig. 11)

* Typical values at T = 25°C

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

Typical Performance Curves

Fig. 2 Normalized CTR vs. Forward Current

Fig. 1 LED Forward Voltage vs. Forward Current

1.8

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

= 5.0V

= 25°C

Normalized to

= 10 mA

= -55°C

= 25°C

= 100°C

100

- LED FORWARD CURRENT (mA)

I - FORWARD CURRENT (mA)

Fig. 4 CTR vs. RBE (Unsaturated)

Fig. 3 Normalized CTR vs. Ambient Temperature

1.4

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

= 20 mA

1.2

1.0

0.8

0.6

0.4

0.2

= 5 mA

= 10 mA

= 5 mA

= 10 mA

= 20 mA

= 5.0 V

Normalized to

= 10 mA

= 25°C

-60

-40

-20

100

1000

- BASE RESISTANCE (kΩ)

- AMBIENT TEMPERATURE (°C)

Fig. 6 Collector-Emitter Saturation Voltage

vs. Collector Current

Fig. 5 CTR vs. RBE (Saturated)

100

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

= 25˚C

= 0.3 V

= 20 mA

= 10 mA

= 2.5 mA

0.1

= 5 mA

= 20 mA

0.01

= 10 mA

= 5 mA

0.001

100

1000

0.01

0.1

R - BASE RESISTANCE (k Ω)

- COLLECTOR CURRENT (mA)

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

Typical Performance Curves ^(Continued)

Fig. 8 Normalized t vs. R

Fig. 7 Switching Speed vs. Load Resistor

1000

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

= 10 mA

= 10 V

10 V

CC =

= 2 mA

= 25°C

= 100 Ω

100

off

0.1

100

1000

10000

100000

R-LOAD RESISTOR (kΩ)

- BASE RESISTANCE (k Ω)

Fig. 10 Dark Current vs. Ambient Temperature

Fig. 9 Normalized t vs. R

off

10000

1000

100

1.4

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

= 10 V

= 25°C

10 V

CC =

= 2 mA

0.1

= 100 Ω

0.01

0.001

100

1000

10000

100000

- AMBIENT TEMPERATURE (°C)

R - BASE RESISTANCE (k Ω)

TEST CIRCUIT

WAVE FORMS

V_CC= 10V

INPUT PULSE

I_C

I_F

R_L

10%

90%

INPUT

OUTPUT

OUTPUT PULSE

R_BE

t_r

t_f

t_off

t_on

I_F

I_C

Adjust to produce = 2 mA

Figure 11. Switching Time Test Circuit and Waveforms

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

Package Dimensions

Through Hole

0.4" Lead Spacing

8.13–8.89

6.10–6.60

Pin 1

5.08 (Max.)

3.28–3.53

0.25–0.36

7.62 (Typ.)

5.08 (Max.)

3.28–3.53

0.25–0.36

0.38 (Min.)

2.54–3.81

2.54 (Bsc)

0.38 (Min.)

2.54–3.81

2.54 (Bsc)

0.20–0.30

(0.86)

15° (Typ.)

(0.86)

0.41–0.51

0.76–1.14

0.20–0.30

10.16–10.80

1.02–1.78

0.41–0.51

0.76–1.14

1.02–1.78

Surface Mount

(1.78)

8.13–8.89

(1.52)

(2.54)

(7.49)

6.10–6.60

8.43–9.90

(10.54)

(0.76)

Pin 1

Rcommended Pad Layout

0.25–0.36

3.28–3.53

5.08

(Max.)

0.20–0.30

0.38 (Min.)

0.16–0.88

(8.13)

2.54 (Bsc)

(0.86)

0.41–0.51

0.76–1.14

1.02–1.78

Note:

All dimensions in mm.

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

Ordering Information

Order Entry Identiﬁer

(Example)

Option

Description

No option

4N25M

4N25SM

Standard Through Hole Device

Surface Mount Lead Bend

Surface Mount; Tape and Reel

0.4" Lead Spacing

SR2

4N25SR2M

4N25TM

4N25VM

VDE 0884

4N25TVM

4N25SVM

4N25SR2VM

VDE 0884, 0.4" Lead Spacing

VDE 0884, Surface Mount

VDE 0884, Surface Mount, Tape and Reel

SR2V

Marking Information

4N25

V X YY Q

Deﬁnitions

Fairchild logo

Device number

VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

One digit year code, e.g., ‘7’

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

*Note – Parts that do not have the ‘V’ option (see deﬁnition 3 above) that are

marked with date code ‘325’ or earlier are marked in portrait format.

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

Carrier Tape Specification

12.0 ± 0.1

2.0 ± 0.05

4.5 ± 0.20

Ø1.5 MIN

1.75 ± 0.10

0.30 ± 0.05

4.0 ± 0.1

11.5 ± 1.0

24.0 ± 0.3

9.1 ± 0.20

21.0 ± 0.1

Ø1.5 ± 0.1/-0

10.1 ± 0.20

0.1 MAX

User Direction of Feed

Reflow Profile

300

280

260

240

220

200

180

160

140

120

100

260°C

>245°C = 42 Sec

Time above

183°C = 90 Sec

°C

1.822°C/Sec Ramp up rate

33 Sec

120

180

270

360

Time (s)

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

FRFET^®

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Programmable Active Droop™

QFET^®

QS™

Quiet Series™

RapidConfigure™

Global Power Resource^SM

Green FPS™

TinyBoost™

TinyBuck™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

Green FPS™ e-Series™

GTO™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

MicroPak™

MillerDrive™

MotionMax™

Current Transfer Logic™

EcoSPARK^®

™

EfficentMax™

EZSWITCH™ *

Saving our world, 1mW/W/kW at a time™

SmartMax™

™

SMART START™

TriFault Detect™

µSerDes™

SPM^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS™

Fairchild^®

Motion-SPM™

UHC^®

Ultra FRFET™

UniFET™

VCX™

VisualMax™

XS™

Fairchild Semiconductor^®

FACT Quiet Series™

FACT^®

OPTOLOGIC^®

OPTOPLANAR^®

FAST^®

SyncFET™

FastvCore™

FlashWriter^{® *}

FPS™

PDP SPM™

Power-SPM™

PowerTrench^®

PowerXS™

The Power Franchise^®

F-PFS™

* EZSWITCH™ and FlashWriter^®are trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR

CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE

SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDíS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,

WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE

EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are

intended for surgical implant into the body or (b) support or sustain life,

and (c) whose failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be reasonably

expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,

under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.

Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,

and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of

counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are

listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have

full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.

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any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our

customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status

Definition

Datasheet contains the design specifications for product development. Specifications may change in

any manner without notice.

Advance Information

Preliminary

Formative / In Design

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

First Production

Full Production

Not In Production

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes

at any time without notice to improve the design.

No Identification Needed

Obsolete

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I38

4NXXM, H11AXM Rev. 1.0.2

www.fairchildsemi.com

4N37TM [FAIRCHILD]

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