74VCX132BQX [FAIRCHILD]

Low Voltage Quad 2-Input NAND Gate with Schmitt Trigger Inputs and 3.6V Tolerant Inputs and Outputs; 低电压四2输入与非门施密特触发器输入和3.6V容限输入和输出
74VCX132BQX
型号: 74VCX132BQX
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Low Voltage Quad 2-Input NAND Gate with Schmitt Trigger Inputs and 3.6V Tolerant Inputs and Outputs
低电压四2输入与非门施密特触发器输入和3.6V容限输入和输出

触发器 栅
文件: 总10页 (文件大小:500K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
July 1999  
Revised February 2005  
74VCX132  
Low Voltage Quad 2-Input NAND Gate  
with Schmitt Trigger Inputs  
and 3.6V Tolerant Inputs and Outputs  
General Description  
Features  
The VCX132 contains four 2-input NAND gates with  
Schmitt Trigger Inputs. The pin configuration and function  
are the same as the VCX00 except the inputs have hyster-  
esis between the positive-going and negative-going input  
thresholds. This hysteresis is useful for transforming slowly  
switching input signals into sharply defined, jitter-free out-  
put signals. This product should be used where noise mar-  
gin greater than that of conventional gates is required.  
1.4V to 3.6V VCC supply operation  
3.6V tolerant inputs and outputs  
tPD  
3.3 ns max for 3.0V to 3.6V VCC  
Power-off high impedance inputs and outputs  
Static Drive (IOH/IOL  
)
24 mA @ 3.0V VCC  
The VCX132 is designed for low voltage (1.4V to 3.6V) VCC  
applications with I/O compatibility up to 3.6V.  
Uses patented Quiet Series noise/EMI reduction  
circuitry  
This product is fabricated with an advanced CMOS tech-  
nology to achieve high-speed operation while maintaining  
low CMOS power dissipation.  
Latchup performance exceeds JEDEC 78 conditions  
ESD performance:  
Human body model 2000V  
Machine model 250V  
Leadless Pb-Free DQFN package  
Ordering Code:  
Order Number Package Number  
Package Description  
74VCX132M  
M14A  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
74VCX132BQX  
(Note 1)  
MLP014A  
Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC  
MO-241, 2.5 x 3.0mm  
74VCX132MTC  
MTC14  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Note 1: DQFN package available in Tape and Reel only.  
Quiet Series is a trademark of Fairchild Semiconductor Corporation.  
© 2005 Fairchild Semiconductor Corporation  
DS500164  
www.fairchildsemi.com  
Logic Diagram  
Connection Diagrams  
Pin Assignments for SOIC and TSSOP  
Pin Descriptions  
Pin Name  
Description  
An, Bn  
Inputs  
On  
Outputs  
Pad Assignments for DQFN  
(Top View)  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 2)  
Recommended Operating  
Conditions (Note 4)  
Supply Voltage (VCC  
)
0.5V to 4.6V  
0.5V to 4.6V  
DC Input Voltage (VI)  
DC Output Voltage (VO)  
HIGH or LOW State (Note 3)  
VCC 0V  
Power Supply  
Operating  
1.4V to 3.6V  
0.3V to 3.6V  
0.5V to VCC 0.5V  
0.5V to 4.6V  
Input Voltage  
Output Voltage (VO)  
HIGH or LOW State  
Output Current in IOH/IOL  
VCC 3.0V to 3.6V  
VCC 2.3V to 2.7V  
VCC 1.65V to 2.3V  
VCC 1.4V to 1.6V  
Free Air Operating Temperature (TA)  
DC Input Diode Current (IIK  
VI 0V  
)
0V to VCC  
50 mA  
DC Output Diode Current (IOK  
VO 0V  
)
24 mA  
18 mA  
50 mA  
50 mA  
VO VCC  
6 mA  
DC Output Source/Sink Current  
(IOH/IOL  
2 mA  
)
50 mA  
40 C to 85 C  
DC VCC or Ground Current per  
Supply Pin (ICC or Ground)  
Note 2: The Absolute Maximum Ratingsare those values beyond which  
the safety of the device cannot be guaranteed. The device should not be  
operated at these limits. The parametric values defined in the Electrical  
Characteristics tables are not guaranteed at the absolute maximum ratings.  
The Recommended Operating Conditionstable will define the conditions  
for actual device operation.  
100 mA  
Storage Temperature (TSTG  
)
65 C to 150 C  
Note 3: I Absolute Maximum Rating must be observed.  
O
Note 4: Floating or unused inputs must be held HIGH or LOW.  
DC Electrical Characteristics  
V
CC  
Symbol  
Parameter  
Conditions  
Min  
Max  
Units  
(V)  
3.6  
V
V
V
V
HIGH Level Input Voltage  
2.2  
2.0  
1.6  
1.2  
1.2  
t
3.0  
2.3  
V
1.6  
1.4  
LOW Level Input Voltage  
3.6  
0.8  
0.7  
0.5  
0.2  
0.2  
0.3  
0.3  
0.3  
0.15  
0.15  
t
3.0  
2.3  
V
V
1.6  
1.4  
Input Hysteresis  
3.6  
1.2  
1.2  
1.0  
0.9  
0.9  
H
3.0  
2.3  
1.6  
1.4  
HIGH Level Output Voltage  
I
I
I
I
I
I
I
I
I
I
I
I
100  
A
2.7 - 3.6  
2.7  
V
- 0.2  
CC  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
OH  
12 mA  
18 mA  
24mA  
2.2  
2.4  
2.2  
3.0  
3.0  
100  
A
2.3 - 2.7  
2.3  
V
- 0.2  
CC  
6 mA  
12 mA  
18 mA  
2.0  
1.8  
1.7  
V
2.3  
2.3  
100  
A
1.65 - 2.3  
1.65  
1.4 - 1.6  
1.4  
V
- 0.2  
CC  
6 mA  
1.25  
- 0.2  
100  
A
V
CC  
2 mA  
1.05  
3
www.fairchildsemi.com  
DC Electrical Characteristics (Continued)  
V
CC  
Symbol  
Parameter  
Conditions  
Min  
Max  
Units  
(V)  
2.7 - 3.6  
2.7  
V
LOW Level Output Voltage  
I
100  
12  
A
0.2  
0.4  
0.4  
0.55  
0.2  
0.4  
0.6  
0.2  
0.3  
0.2  
0.35  
5.0  
OL  
OL  
I
A
OL  
I
18 mA  
24 mA  
3.0  
OL  
I
3.0  
OL  
I
100  
A
2.3 - 2.7  
2.3  
OL  
I
12 mA  
18 mA  
V
OL  
I
2.3  
OL  
I
100  
A
1.65 - 2.3  
1.65  
OL  
I
6 mA  
100  
OL  
I
A
1.4 - 1.6  
1.4  
OL  
I
2 mA  
OL  
I
Input Leakage Current  
0
V
V
3.6V  
3.6V  
1.4 - 3.6  
A
A
A
A
A
I
I
I
3-STATE Output Leakage  
0
OZ  
O
1.4 - 3.6  
10.0  
V
0
V
or V  
IH IL  
I
I
Power Off Leakage Current  
Quiescent Supply Current  
(V , V )  
O
3.6V  
0
10.0  
20.0  
20.0  
750  
OFF  
I
I
V
V
V
V
or GND  
3.6V  
I
1.4 - 3.6  
1.4 - 3.6  
2.7 - 3.6  
CC  
I
CC  
V
CC  
IH  
I
Increase in I per Input  
V
- 0.6V  
CC  
CC  
CC  
AC Electrical Characteristics (Note 5)  
V
T
40 C to 85 C  
Figure  
CC  
A
Symbol  
Parameter  
Propagation Delay  
Conditions  
Units  
(V)  
Min  
Max  
3.3  
Number  
t
t
C
30 pF, R  
500  
3.3 0.3  
2.5 0.2  
1.8 0.15  
1.5 0.1  
0.6  
0.8  
1.0  
1.0  
PHL  
PLH  
L
L
Figures  
1, 2  
4.1  
ns  
ns  
8.2  
C
C
15 pF, R  
30 pF, R  
2k  
16.4  
Figures  
3, 4  
L
L
t
t
Output-to-Output Skew  
(Note 6)  
500  
3.3 0.3  
2.5 0.2  
1.8 0.15  
1.5 0.1  
0.5  
0.5  
OSHL  
OSLH  
L
L
0.75  
1.5  
C
15 pF, R  
2k  
L
L
Note 5: For C  
50 pF, add approximately 300 ps to the AC maximum specification.  
Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The  
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t ) or LOW-to-HIGH (t ).  
L
OSHL  
OSLH  
www.fairchildsemi.com  
4
Dynamic Switching Characteristics  
V
T
25 C  
Typical  
CC  
A
Symbol  
Parameter  
Conditions  
Units  
(V)  
1.8  
2.5  
3.3  
1.8  
2.5  
3.3  
1.8  
2.5  
3.3  
V
V
V
Quiet Output Dynamic Peak V  
C
C
C
30 pF, V  
30 pF, V  
30 pF, V  
V
V
V
, V  
, V  
, V  
0V  
0V  
0V  
0.25  
0.6  
0.8  
0.25  
0.6  
OLP  
OL  
L
L
L
IH  
IH  
IH  
CC  
CC  
CC  
IL  
IL  
IL  
V
Quiet Output Dynamic Valley V  
Quiet Output Dynamic Valley V  
OLV  
OL  
V
V
0.8  
1.5  
1.9  
2.2  
OHV  
OH  
Capacitance  
T
25 C  
A
Symbol  
Parameter  
Conditions  
Units  
Typical  
6.0  
C
Input Capacitance  
Output Capacitance  
Power Dissipation Capacitance  
V
V
V
0V or V , V  
1.8V, 2.5V or 3.3V  
1.8V, 2.5V or 3.3V  
pF  
pF  
pF  
IN  
I
I
I
CC  
CC  
C
C
0V or V , V  
7.0  
OUT  
PD  
CC  
CC  
0V or V , f 10MHz, V  
1.8V, 2.5V or 3.3V  
20.0  
CC  
CC  
AC Loading and Waveforms (V 3.3V r 0.3V to 1.8V r 0.15V)  
CC  
FIGURE 1. AC Test Circuit  
TEST  
SWITCH  
tPLH, tPHL  
Open  
FIGURE 2. Waveform for Inverting and Non-inverting Functions  
VCC  
Symbol  
3.3V 0.3V  
1.5V  
2.5V 0.2V  
VCC/2  
1.8V 0.15V  
VCC/2  
Vmi  
Vmo  
1.5V  
VCC/2  
VCC/2  
5
www.fairchildsemi.com  
AC Loading and Waveforms (V 1.5V r 0.1V)  
CC  
TEST  
SWITCH  
t
PLH, tPHL  
Open  
VCC x 2 at VCC 1.5V 0.1V  
GND  
t
PZL, tPLZ  
tPZH, tPHZ  
FIGURE 3. AC Test Circuit  
FIGURE 4. Waveform for Inverting and Non-inverting Functions  
VCC  
Symbol  
1.5V 0.1V  
Vmi  
VCC/2  
VCC/2  
Vmo  
www.fairchildsemi.com  
6
Tape and Reel Specification  
Tape Format for DQFN  
Package  
Tape  
Section  
Number  
Cavities  
125 (typ)  
2500/3000  
75 (typ)  
Cavity  
Status  
Empty  
Filled  
Cover Tape  
Status  
Designator  
Leader (Start End)  
Carrier  
Sealed  
BQX  
Sealed  
Trailer (Hub End)  
Empty  
Sealed  
TAPE DIMENSIONS inches (millimeters)  
REEL DIMENSIONS inches (millimeters)  
Tape Size  
A
B
C
D
N
W1  
W2  
13.0  
(330)  
0.059  
(1.50)  
0.512  
(13.00)  
0.795  
(20.20)  
7.008  
(178)  
0.488  
(12.4)  
0.724  
(18.4)  
12 mm  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
Package Number M14A  
www.fairchildsemi.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm  
Package Number MLP014A  
9
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC14  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
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10  

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