74VHCT74MTC

更新时间:2024-09-18 13:03:44
品牌:FAIRCHILD
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74VHCT74MTC 概述

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74VHCT74MTC 数据手册

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July 1997  
Revised February 2005  
74VHCT74A  
Dual D-Type Flip-Flop with Preset and Clear  
General Description  
Features  
The VHCT74A is an advanced high speed CMOS Dual  
D-Type Flip-Flop fabricated with silicon gate CMOS tech-  
nology. It achieves the high speed operation similar to  
equivalent Bipolar Schottky TTL while maintaining the  
CMOS low power dissipation. The signal level applied to  
the D INPUT is transferred to the Q OUTPUT during the  
positive going transition of the CK pulse. CLR and PR are  
independent of the CK and are accomplished by setting the  
appropriate input LOW.  
High speed: fMAX 160 MHz (typ) at TA 25 C  
High noise immunity: VIH 2.0V, VIL 0.8V  
Power down protection is provided on all inputs and  
outputs  
Low power dissipation:  
ICC  
2 A (max) at TA 25 C  
Pin and function compatible with 74HCT74  
Protection circuits ensure that 0V to 7V can be applied to  
the input pins without regard to the supply voltage and to  
the output pins with VCC  
0V. These circuits prevent  
device destruction due to mismatched supply and input/  
output voltages. This device can be used to interface 3V to  
5V systems and two supply systems such as battery  
backup.  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74VHCT74AM  
M14A  
M14A  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
74VHCT74AMX_NL  
(Note 1)  
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
74VHCT74ASJ  
M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74VHCT74AMTC  
MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74VHCT74AMTCX_NL MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
(Note 1)  
Wide  
74VHCT74AN  
N14A  
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide  
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
© 2005 Fairchild Semiconductor Corporation  
DS500026  
www.fairchildsemi.com  
Logic Symbol  
Connection Diagram  
IEEE/IEC  
Truth Table  
Pin Descriptions  
Inputs  
CLR PR  
Outputs  
Pin Names  
D1, D2  
Description  
Data Inputs  
Function  
D
CK  
X
Q
L
Q
H
L
L
H
L
H
L
X
X
X
L
Clear  
CK1, CK2  
Clock Pulse Inputs  
Direct Clear Inputs  
Direct Preset Inputs  
Outputs  
X
H
H
L
Preset  
CLR1, CLR2  
PR1, PR2  
L
X
H
H
L
H
H
H
H
H
H
H
X
H
Qn  
Q1, Q1, Q2, Q2  
Qn No  
Change  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 2)  
Recommended Operating  
Conditions (Note 6)  
Supply Voltage (VCC  
)
0.5V to 7.0V  
0.5V to 7.0V  
DC Input Voltage (VIN  
)
Supply Voltage (VCC  
)
4.5V to 5.5V  
0V to 5.5V  
DC Output Voltage (VOUT  
)
Input Voltage (VIN  
)
(Note 3)  
0.5V to VCC 0.5V  
0.5V to 7.0V  
20 mA  
Output Voltage (VOUT  
)
(Note 4)  
(Note 3)  
0V to VCC  
0V to 5.5V  
Input Diode Current (IIK  
)
(Note 4)  
Output Diode Current (IOK  
(Note 5)  
)
Operating Temperature (TOPR  
)
40 C to 85 C  
20 mA  
25 mA  
Input Rise and Fall Time (tr, tf)  
VCC 5.0V 0.5V  
DC Output Current (IOUT  
)
0 ns/V 20 ns/V  
Note 2: Absolute maximum ratings are values beyond which the device  
may be damaged or have its useful life impaired. The databook specifica-  
tions should be met, without exception, to ensure that the system design is  
reliable over its power supply, temperature, and output/input loading varai-  
bles. Fairchild does not recommend operation outside databook specifica-  
tions.  
DC VCC/GND Current (ICC  
)
50 mA  
Storage Temperature (TSTG  
Lead Temperature (TL)  
Soldering (10 seconds)  
)
65 C to 150 C  
260 C  
Note 3: HIGH or LOW state.  
I
absolute maximum rating must be  
OUT  
observed.  
Note 4: V  
0V.  
GND, V  
CC  
Note 5: V  
V
.(Outputs Active)  
OUT  
OUT  
CC  
Note 6: Unused inputs must be held HIGH or LOW. They may not float.  
DC Electrical Characteristics  
V
T
25 C  
Typ  
T
40 C to 85 C  
Min Max  
CC  
A
A
Symbol  
Parameter  
Units  
Conditions  
(V)  
4.5  
Min  
2.0  
2.0  
Max  
V
V
V
V
HIGH Level  
2.0  
2.0  
IH  
V
V
V
V
Input Voltage  
5.5  
LOW Level  
4.5  
0.8  
0.8  
0.8  
0.8  
IL  
Input Voltage  
5.5  
HIGH Level  
4.5  
4.40  
3.94  
4.50  
0.0  
4.40  
3.80  
V
V
V
I
OH  
50  
A
OH  
OL  
IN  
IH  
Output Voltage  
LOW Level  
4.5  
or V  
I
8 mA  
IL OH  
4.5  
0.1  
0.36  
0.1  
0.1  
0.44  
1.0  
V
I
50  
A
IN  
IH  
OL  
Output Voltage  
Input Leakage Current  
Quiescent Supply Current  
4.5  
or V  
I
8 mA  
5.5V or GND  
V or GND  
CC  
IL OL  
I
I
I
05.5  
5.5  
A
A
V
V
V
IN  
IN  
IN  
IN  
2.0  
20.0  
CC  
Maximum I /Input  
CC  
3.4V  
CCT  
5.5  
0.0  
1.35  
0.5  
1.50  
5.0  
mA  
A
Other Inputs  
V 5.5V  
OUT  
V
or GND  
CC  
I
Output Leakage Current  
(Power Down State)  
OFF  
3
www.fairchildsemi.com  
AC Electrical Characteristics  
V
(V)  
(Note 7)  
T
25 C  
Typ  
T
40 C to 85 C  
Min Max  
CC  
A
A
Symbol  
Parameter  
Units  
Conditions  
Min  
Max  
f
Maximum Clock  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
100  
80  
160  
140  
5.8  
6.3  
7.6  
8.1  
4
80  
65  
C
C
C
C
C
C
15 pF  
50 pF  
15 pF  
50 pF  
15 pF  
50 pF  
Open  
MAX  
L
MHz  
ns  
Frequency  
L
t
t
t
t
Propagation Delay Time  
(CK-Q, Q)  
7.8  
8.8  
1.0  
1.0  
1.0  
1.0  
9.0  
10.0  
12.0  
13.0  
10  
PLH  
PHL  
PLH  
PHL  
L
L
Propagation Delay time  
(CLR, PR -Q, Q)  
10.4  
11.4  
10  
L
ns  
L
C
C
Input Capacitance  
Power Dissipation Capacitance  
pF  
pF  
V
CC  
IN  
24  
(Note 8)  
PD  
Note 7: V is 5.0 0.5V  
CC  
Note 8: C  
is defined as the value of internal equivalent capacitance which is calculated from the operating current consumption without load. Average  
PD  
operating current can be obtained by the equation: I (opr)  
CC  
C
V
f
I
/2 (per flip-flop).  
PD  
CC  
IN  
CC  
AC Operating Requirements  
V
T
25 C  
T
40 C to 85 C  
Guaranteed Minimum  
CC  
A
A
Symbol  
Parameter  
Minimum Pulse Width (CK)  
Units  
ns  
(V)  
Typ  
t
(L)  
(H)  
(L)  
W
5.0 0.5  
5.0 0.5  
5.0  
5.0  
5.0  
t
W
t
Minimum Pulse Width  
(CLR, PR)  
W
5.0  
ns  
t
Minimum Setup Time  
Minimum Hold Time  
Minimum Removal Time  
(CLR, PR)  
5.0 0.5  
5.0 0.5  
5.0 0.5  
5.0  
0
5.0  
0
ns  
ns  
ns  
S
t
H
t
3.5  
3.5  
REM  
www.fairchildsemi.com  
4
Physical Dimensions inches (millimeters) unless otherwise noted  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
Package Number M14A  
5
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
Package Number M14D  
www.fairchildsemi.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC14  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide  
Package Number N14A  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
8

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