FGD4536TM [FAIRCHILD]

360 V PDP Trench IGBT; 360 V PDP沟道IGBT
FGD4536TM
型号: FGD4536TM
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

360 V PDP Trench IGBT
360 V PDP沟道IGBT

晶体 晶体管 功率控制 光电二极管 瞄准线 双极性晶体管 栅
文件: 总8页 (文件大小:1135K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 2013  
FGD4536  
360 V PDP Trench IGBT  
Features  
General Description  
High Current Capability  
Low Saturation Voltage: V  
High Input Impedance  
Fast Switching  
Using novel trench IGBT technology, Fairchild’s new series of  
trench IGBTs offer the optimum performance for consumer  
appliances and PDP TV applications where low conduction and  
switching losses are essential.  
= 1.59 V @ I = 50 A  
C
CE(sat)  
RoHS Compliant  
Applications  
PDP TV, Consumer Appliances  
C
G
TO-252/D-PAK  
E
Absolute Maximum Ratings  
Symbol  
Description  
Ratings  
360  
Unit  
V
V
Collector to Emitter Voltage  
Gate to Emitter Voltage  
Pulsed Collector Current  
V
V
A
CES  
30  
GES  
o
@ T = 25 C  
220  
I
C
C pulse(1)*  
o
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
@ T = 25 C  
125  
50  
W
W
C
P
D
o
@ T = 100 C  
C
o
T
T
-55 to +150  
-55 to +150  
C
J
o
C
stg  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
o
T
300  
C
L
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
1.0  
Unit  
o
R
R
(IGBT)  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
-
-
C/W  
JC  
o
62.5  
C/W  
JA  
Notes:  
(1) Half Sine Wave, D < 0.01, pluse width < 1sec  
* Ic_pluse limited by max Tj  
©2011 Fairchild Semiconductor Corporation  
FGD4536 Rev. C1  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Device Marking  
FGD4536  
Device  
FGD4536TM  
Package  
TO252(D-PAK)  
TO252(D-PAK)  
Reel Size  
380 mm  
Tape Width  
16 mm  
Quantity  
-
-
FGD4536  
FGD4536TM_F065  
380 mm  
16 mm  
Electrical Characteristics of the IGBT  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristics  
BV  
Collector to Emitter Breakdown Voltage  
V
V
= 0V, I = 250 A  
360  
-
-
-
-
V
CES  
GE  
GE  
C
BV  
Temperature Coefficient of Breakdown  
Voltage  
CES  
o
= 0V, I = 250 A  
0.4  
V/ C  
C
T  
J
I
Collector Cut-Off Current  
G-E Leakage Current  
V
V
= V  
= V  
, V = 0 V  
-
-
-
-
100  
A  
CES  
CE  
GE  
CES  
GE  
I
, V = 0 V  
±400  
nA  
GES  
GES  
CE  
On Characteristics  
V
G-E Threshold Voltage  
I
= 250 A, V = V  
GE  
2.4  
-
3.3  
4.0  
-
V
V
GE(th)  
C
CE  
I
I
= 20 A, V = 15 V  
1.19  
C
C
GE  
= 30 A, V = 15 V  
GE  
-
-
1.33  
1.59  
-
V
V
V
Collector to Emitter  
Saturation Voltage  
CE(sat)  
I
= 50 A, V = 15 V,  
GE  
C
1.8  
o
T
= 25 C  
C
I
T
= 50 A, V = 15 V,  
GE  
C
-
1.66  
-
V
o
= 125 C  
C
Dynamic Characteristics  
C
C
C
Input Capacitance  
-
-
-
1295  
56  
-
-
-
pF  
pF  
pF  
ies  
V
= 30 V V = 0 V,  
, GE  
CE  
Output Capacitance  
oes  
res  
f = 1 MHz  
Reverse Transfer Capacitance  
43  
Switching Characteristics  
t
t
t
t
t
t
t
t
Turn-On Delay Time  
Rise Time  
-
-
-
-
-
-
-
-
-
-
-
5
20  
41  
182  
5
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
d(on)  
V
R
= 200 V, I = 20 A,  
CC  
C
r
= 5 , V = 15 V,  
G
GE  
o
Turn-Off Delay Time  
Fall Time  
d(off)  
ResistiveLoad,T =25 C  
C
f
Turn-On Delay Time  
Rise Time  
d(on)  
V
R
= 200 V, I = 20 A,  
CC  
C
21  
43  
249  
47  
5.4  
15  
r
= 5 , V = 15 V,  
G
GE  
o
Turn-Off Delay Time  
Fall Time  
d(off)  
f
Resistive Load, T = 125 C  
C
Q
Q
Q
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
g
V
V
= 200 V I = 20 A,  
, C  
= 15 V  
CE  
GE  
ge  
gc  
©2011 Fairchild Semiconductor Corporation  
FGD4536 Rev. C1  
2
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Transfer Characteristics  
Figure 5. Saturation Voltage vs. V  
Figure 6. Saturation Voltage vs. V  
GE  
GE  
©2011 Fairchild Semiconductor Corporation  
FGD4536 Rev. C1  
3
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 7. Saturation Voltage vs. Case  
Temperature at Variant Current Level  
Figure 8. Capacitance Characteristics  
Figure 9. Gate charge Characteristics  
Figure 10. SOA Characteristics  
Fgure 11. Turn-on Characteristics vs.  
Gate Resistance  
Figure 12. Turn-off Characteristics vs.  
Gate Resistance  
©2011 Fairchild Semiconductor Corporation  
FGD4536 Rev. C1  
4
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 13. Turn-on Characteristics vs.  
Collector Current  
Figure 14. Turn-off Characteristics vs.  
Collector Current  
Figure 15. Switching Loss vs. Gate Resistance  
Figure 16. Switching Loss vs. Collector Current  
Figure 17. Turn off Switching SOA Characteristics  
©2011 Fairchild Semiconductor Corporation  
FGD4536 Rev. C1  
5
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 18.Transient Thermal Impedance of IGBT  
PDM  
t1  
t2  
©2011 Fairchild Semiconductor Corporation  
FGD4536 Rev. C1  
6
www.fairchildsemi.com  
Mechanical Dimensions  
Figure 19. TO252 (D-PAK), MOLDED, 3 LEAD,OPTION AA&AB  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-  
ically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT252-003.  
Dimensions in Millimeters  
©2011 Fairchild Semiconductor Corporation  
FGD4536 Rev. C1  
7
www.fairchildsemi.com  
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
AccuPower™  
AX-CAP®*  
BitSiC™  
F-PFS™  
Sync-Lock™  
®*  
FRFET®  
®
Global Power ResourceSM  
GreenBridge™  
Green FPS™  
Green FPS™ e-Series™  
Gmax™  
GTO™  
IntelliMAX™  
ISOPLANAR™  
Marking Small Speakers Sound Louder  
and Better™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MicroPak2™  
PowerTrench®  
PowerXS™  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
Current Transfer Logic™  
DEUXPEED®  
Dual Cool™  
EcoSPARK®  
EfficentMax™  
ESBC™  
TinyBoost®  
Programmable Active Droop™  
TinyBuck®  
QFET®  
TinyCalc™  
QS™  
TinyLogic®  
Quiet Series™  
RapidConfigure™  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
Saving our world, 1mW/W/kW at a time™  
SignalWise™  
SmartMax™  
SMART START™  
Solutions for Your Success™  
SPM®  
TranSiC™  
TriFault Detect™  
TRUECURRENT®*  
SerDes™  
Fairchild®  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
MillerDrive™  
STEALTH™  
UHC®  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
VoltagePlus™  
XS™  
MotionMax™  
SuperFET®  
mWSaver®  
SuperSOT™-3  
SuperSOT™-6  
FAST®  
FastvCore™  
FETBench™  
FPS™  
OptoHiT™  
OPTOLOGIC®  
OPTOPLANAR®  
SuperSOT™-8  
SupreMOS®  
SyncFET™  
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY  
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY  
THEREIN, WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used here in:  
1. Life support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain life,  
and (c) whose failure to perform when properly used in accordance with  
instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or  
effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,  
www.Fairchildsemi.com, under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their  
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed  
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the  
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild  
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild  
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of  
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and  
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is  
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I66  
©2011 Fairchild Semiconductor Corporation  
FGD4536 Rev. C1  
8
www.fairchildsemi.com  

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