FM93CS56TLZEMT8
更新时间:2024-10-30 02:50:23
品牌:FAIRCHILD
描述:EEPROM, 128X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8
FM93CS56TLZEMT8 概述
EEPROM, 128X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM
FM93CS56TLZEMT8 规格参数
生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | TSSOP, | 针数: | 8 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.76 |
JESD-30 代码: | R-PDSO-G8 | 长度: | 4.4 mm |
内存密度: | 2048 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 128 words |
字数代码: | 128 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 128X16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 并行/串行: | SERIAL |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
串行总线类型: | MICROWIRE | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
宽度: | 3 mm |
FM93CS56TLZEMT8 数据手册
通过下载FM93CS56TLZEMT8数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载December 1999
FM93C56
2K-Bit Serial CMOS EEPROM
(MICROWIRE™ Bus Interface)
General Description
Features
The FM93C56 device is 2048 bits of CMOS non-volatile electri-
cally erasable memory organized as 128x16 bit array. They are
fabricated using Fairchild Semiconductor's floating-gate CMOS
process for high reliability, high endurance and low power con-
sumption. These memory devices are available in an 8-pin SOIC
or 8-pin TSSOP package for small space considerations.
I Device status during programming mode
I Typical active current of 200µA
10µA standby current typical
1µA standby current typical (L)
0.1µA standby current typical (LZ)
I No erase required before write
I Reliable CMOS floating gate technology
I 2.7V to 5.5V operation in all modes
I MICROWIRE compatible serial l/O
I Self-timed programming cycle
I 40 years data retention
FM93C56 is compatible with MICROWIRE serial interface, which
offers simple interface to standard microcontrollers and micropro-
cessors. There are 7 instructions which control this device: Read,
WriteEnable, Erase, EraseAll, Write, WriteAll, andWriteDisable.
The ready/busy status is available on the DO pin to indicate the
completion of a programming cycle.
I Endurance: 1,000,000 data changes
I Packages available: 8-pin SO, 8-pin DIP, 8-pin TSSOP
I Schmitt Trigger inputs and VCC lockout to prevent data
corruption
Block Diagram
VCC
CS
SK
INSTRUCTION
DECODER
CONTROL LOGIC,
AND CLOCK
GENERATORS
INSTRUCTION
REGISTER
DI
HIGH VOLTAGE
GENERATOR
AND
ADDRESS
REGISTER
PROGRAM
TIMER
VPP
DECODER
1 OF 128
EEPROM ARRAY
16
READ/WRITE AMPS
16
VSS
DATA IN/OUT REGISTER
16 BITS
DO
DATA OUT BUFFER
DS800026-1
1
© 1999 Fairchild Semiconductor Corporation
FM93C56
www.fairchildsemi.com
Connection Diagrams
Dual-In-Line Package (N),
8-Pin SO (M8) and 8-Pin TSSOP (MT8)
Rotated Die (93C56T)
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
CS
SK
DI
NC
VCC
NC
NC
GND
DO
DI
V
CC
CS
NC
DO
GND
SK
DS800026-2
DS800026-12
Top View
See Package Number
N08E, M08A and MTC08
Pin Names
CS
Chip Select
SK
Serial Data Clock
Serial Data Input
DI
DO
GND
VCC
Serial Data Output
Ground
Power Supply
Ordering Information
FM
93
C
XX
T
LZ
E
XX
Letter Description
Package
N
8-Pin DIP
M8
MT8
8-Pin SO8
8-Pin TSSOP
Temp. Range
None
0 to 70°C
V
E
-40 to +125°C
-40 to +85°C
Voltage Operating Range
Blank
L
4.5V to 5.5V
2.7V to 5.5V
LZ
2.7V to 5.5V and
<1µA Standby Current
Blank
T
Normal Pin Out
Rotated Die Pin Out
Density
56
2K
C
CMOS
CS
Data protect and sequential
read
Interface
93
MICROWIRE
FM
Fairchild Non-Volatile
Memory
2
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FM93C56
Absolute Maximum Ratings (Note 1)
Operating Range
Ambient Storage Temperature
–65°C to +150°C
Ambient Operating Temperature
FM93C56
0°C to +70°C
-40°C to +85°C
-40°C to +125°C
All Input or Output Voltage
with Respect to Ground
+6.5V to -0.3V
FM93C56E
FM93C56V
Lead Temperature (Soldering, 10 sec.)
ESD Rating
+300°C
Power Supply (VCC
)
4.5V to 5.5V
2000V
DC and AC Electrical Characteristics 4.5V ≤ VCC ≤ 5.5V
Symbol
Parameter
Part Number
Conditions
Min.
Max.
Units
ICCA
ICCS
Operating Current
Standby Current
CS = VIH, SK = 1MHz
CS = VIL
1
50
1
mA
µA
µA
IIL
IOL
Input Leakage
Output Leakage
VIN = 0V to VCC
(Note 2)
VIL
VIH
Input Low Voltage
Input High Voltage
-0.1
2
0.8
VCC +1
V
VOL1
VOH1
Output Low Voltage
Output High Voltage
IOL = 2.1mA
IOH = -400 µA
0.4
0.2
1
V
V
2.4
VOL2
VOH2
Output Low Voltage
Output High Voltage
IOL = 10 µA
IOH = -10 µA
V
V
VCC -0.2
0
fSK
SK Clock Frequency
SK High Time
(Note 3)
MHz
ns
tSKH
FM93C56
FM93C56E/V
250
300
tSKL
tSKS
SK Low Time
250
50
ns
ns
SK Setup Time
SK must be at VIL for
tSKS before CS goes
high
tCS
Minimum CS
Low Time
(Note 4)
250
ns
tCSS
tDH
CS Setup Time
DO Hold Time
DI Setup Time
50
70
ns
ns
ns
tDIS
FM93C56
FM93C56E/V
100
200
tCSH
tDIH
tPD
CS Hold Time
0
ns
ns
ns
ns
ns
ms
DI Hold Time
20
Output Delay
500
500
100
10
tSV
CS to Status Valid
CS to DO in Hi-Z
Write Cycle Time
tDF
CS = VIL
tWP
3
www.fairchildsemi.com
FM93C56
Absolute Maximum Ratings (Note 1)
Operating Range
Ambient Storage Temperature
–65°C to +150°C
Ambient Operating Temperature
FM93C56L/LZ
0°C to +70°C
-40°C to +85°C
-40°C to +125°C
All Input or Output Voltage
with Respect to Ground
+6.5V to -0.3V
FM93C56LE/LZE
FM93C56LV/LZV
Lead Temperature (Soldering, 10 sec.)
ESD Rating
+300°C
Power Supply (VCC
)
2.7V to 5.5V
2000V
DC and AC Electrical Characteristics VCC = 2.7V to 5.5V unless otherwise specified
Symbol
Parameter
Part Number
Conditions
Min.
Max.
Units
ICCA
ICCS
Operating Current
CS = VIH, SK = 250KHz
CS = VIL
1
mA
Standby Current
L
LZ
10
1
µA
µA
IIL
IOL
Input Leakage
Output Leakage
VIN = 0V to VCC
(Note 2)
1
µA
VIL
VIH
Input Low Voltage
Input High Voltage
-0.1
0.8 VCC
0.15 VCC
VCC +1
V
VOL
VOH
Output Low Voltage
Output High Voltage
IOL = 10 µA
IOH = -10 µA
0.1 VCC
V
V
0.9 VCC
fSK
SK Clock Frequency
SK High Time
(Note 3)
0
1
250
KHz
µs
tSKH
tSKL
tSKS
SK Low Time
1
µs
SK Setup Time
SK must be at VIL for
tSKS before CS goes
high
0.2
µs
tCS
Minimum CS
Low Time
(Note 4)
1
µs
tCSS
tDH
CS Setup Time
DO Hold Time
DI Setup Time
CS Hold Time
DI Hold Time
0.2
70
0.4
0
µs
ns
µs
ns
µs
µs
µs
µs
ms
tDIS
tCSH
tDIH
tPD
0.4
Output Delay
2
1
tSV
CS to Status Valid
CS to DO in Hi-Z
Write Cycle Time
tDF
CS = VIL
0.4
15
tWP
Note 1: Stress above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at these or any
other conditions above those indicated in the operational sections of the specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Capacitance TA = 25°C, f = 1 MHz (Note 5)
Symbol
Test
Typ Max Units
Note 2: Typical leakage values are in the 20nA range.
Note 3: The shortest allowable SK clock period = 1/fSK (as shown under the fSK parameter).
Maximum SK clock speed (minimum SK period) is determined by the interaction of several AC
parametersstatedinthedatasheet.WithinthisSKperiod,bothtSKH andtSKL limitsmustbeobserved.
Therefore,itisnotallowabletoset1/fSK =tSKHminimum +tSKLminimum forshorterSKcycletimeoperation.
COUT
CIN
Output Capacitance
Input Capacitance
5
5
pF
pF
Note 4: CS (Chip Select) must be brought low (to VIL) for an interval of tCS in order to reset all
internaldeviceregisters(devicereset)priortobeginninganotheropcodecycle. (Thisisshowninthe
opcode diagram on the following page.)
Note 5: This parameter is periodically sampled and not 100% tested.
AC Test Conditions
VCC Range
VIL/VIH
Input Levels
.03V/1.8V
VIL/VIH
Timing Level
VOL/VOH
Timing Level
0.8V/1.5V
IOL/IOH
2.7V ≤ VCC ≤ 5.5V
(Extended Voltage Levels)
1.0V
10µA
4.5V ≤ VCC ≤ 5.5V
0.4V/2.4V
1.0V/2.0V
0.4V/2.4V
2.1mA/-0.4mA
(TTL Levels)
Output Load: 1 TTL Gate (CL = 100 pF)
4
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FM93C56
Write (WRITE):
Functional Description
TheWRITEinstructionisfollowedbytheaddressand16bitsofdata
to be written into the specified address. After the last bit of data is
put in the data-in (DI) pin, CS must be brought low before the next
rising edge of the SK clock. This falling edge of the CS initiates the
self-timed programming cycle. The D0 pin indicates the READY/
The FM93C56device has7 instructionsas describedbelow. Note
that the MSB of any instruction is a “1” and is viewed as a start bit
in the interface sequence. The next 10 bits carry the op code and
the 8-bit address for register selection.
Read (READ):
BUSYstatusofthechipifCSisbroughthighafteraminimumoft
.
CS
D0 = logical 1 indicates that the register at the address specified in
theinstructionhasbeenwrittenwiththedatapatternspecifiedinthe
instruction and the part is ready for another instruction.
The READ instruction outputs serial data on the D0 pin. After a
READ instruction is received, the instruction and address are
decoded, followed by data transfer from the selected memory
register into a 16-bit serial-out shift register. A dummy bit (logical
0)precedesthe16-bitdataoutputstring. Outputdatachangesare
initiated by a low to high transition of the SK clock.
Erase All (ERAL):
The ERAL instruction will simultaneously program all registers in
thememoryarrayandseteachbittothelogical“1”state.TheErase
All cycle is identical to the ERASE cycle except for the different op-
code. As in the ERASE mode, the DO pin indicates the READY/
BUSY status of the chip if CS is brought high after the tCS interval.
Write Enable (WEN):
When VCC is applied to the part, it 'powers-up' in the Write Disable
(WDS) state. Therefore, all programming modes must be pre-
ceded by a Write Enable (WEN) instruction. Once a Write Enable
instructionisexecuted,programmingremainsenableduntilaWrite
Disable (WDS) instruction is executed or VCC is removed from the
part.
Write All (WRALL):
The WRALL instruction will simultaneously program all registers
with the data pattern specified in the instruction. As in the WRITE
mode, the DO pin indicates the READY/BUSY status of the chip
Erase (ERASE):
if CS is brought high after the t interval.
CS
The ERASE instruction will program all bits in the specified
register to the logical “1” state. CS is brought low following the
loading of the last address bit. This falling edge of the CS pin
initiates the self-timed programming cycle.
Write Disable (WDS):
To protect against accidental data disturb, the WDS instruction
disables all programming modes and should follow all program-
ming operations. Execution of a READ instruction is independent
of both the WEN and WDS instructions.
The DO pin indicates the READY/BUSY status of the chip if CS is
broughthighafteraminimumtimeoftCS. DO=logical“0”indicates
that the register, at the address specified in the instruction, has
been erased, and the part is ready for another instruction.
Note: The Fairchild CMOS EEPROMs do not require an "ERASE" or "ERASE ALL"
operationpriortothe"WRITE"and"WRITEALL"instructions. The"ERASE"and"ERASE
ALL"instructionsareincludedtomaintaincompatibilitywithearliertechnologyEEPROMs.
Instruction Set for the FM93C56
Instruction
READ
SB
1
Op. Code
Address
A7-A0
Data
Comments
Reads data stored in memory, at specified address.
Write enable must precede all programming modes.
Erase selected register.
10
00
11
01
00
00
00
WEN
1
11xxxxxx
A7-A0
ERASE
WRITE
ERAL
1
1
A7-A0
D15-D0
D15-D0
Writes selected register.
1
10xxxxxx
01xxxxxx
00xxxxxx
Erases all registers.
WRALL
WDS
1
Writes all registers.
1
Disables all programming instructions.
Note:
Note:
A7 is "don't care" bit, but must be included in the address string.
x = Don't care.
5
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FM93C56
Timing Diagrams
Synchronous Data Timing
V
IH
CS
V
t
IL
CSS
t
t
t
CSH
SKH
SKL
t
SKS
V
IH
SK
V
IL
t
t
DIH
DIS
V
IH
DI
V
IL
t
t
DF
t
PD
DH
V
OH
DO (READ)
V
OL
t
SV
t
t
DF
DH
V
OH
DO (PROGRAM)
STATUS VALID
V
OL
DS800026-4
READ
CS
SK
DI
t
CS
. . .
1
1
0
A7
A0
. . .
DO
0
D15
D0
DS800026-5
WEN
CS
SK
DI
t
CS
. . .
1
0
0
1
1
X
X
DS800026-6
WDS
CS
SK
DI
tCS
. . .
1
0
0
0
0
X
X
DS800026-7
6
www.fairchildsemi.com
FM93C56
Timing Diagrams (Continued)
WRITE
CS
SK
t
CS
. . .
1
0
1
A7
A0
D15
D0
DI
DO
BUSY
READY
t
WP
DS800026-8
WRALL
CS
SK
DI
t
CS
. . .
1
0
0
0
1
DON'T CARE (6 BITS) D15
D0
DO
BUSY
READY
t
WP
DS800026-9
ERASE
t
CS
CS
SK
STANDBY
. . .
DI
1
1
1
A7
A6
A5
A0
HI-Z
HI-Z
DO
BUSY
READY
t
WP
DS800026-10
ERAL
t
CS
CS
STANDBY
SK
DI
1
0
0
1
0
DON'T CARE BITS (6 BITS)
HI-Z
HI-Z
DO
BUSY
READY
t
WP
DS800026-11
7
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FM93C56
Physical Dimensions inches (millimeters) unless otherwise noted
0.189 - 0.197
(4.800 - 5.004)
8
7
6
5
0.228 - 0.244
(5.791 - 6.198)
1
2
3
4
Lead #1
IDENT
0.150 - 0.157
(3.810 - 3.988)
0.053 - 0.069
(1.346 - 1.753)
0.010 - 0.020
(0.254 - 0.508)
0.004 - 0.010
(0.102 - 0.254)
x 45°
8° Max, Typ.
All leads
Seating
Plane
0.04
0.0075 - 0.0098
(0.190 - 0.249)
Typ. All Leads
(0.102)
All lead tips
0.014
(0.356)
0.016 - 0.050
(0.406 - 1.270)
Typ. All Leads
0.050
(1.270)
Typ
0.014 - 0.020
(0.356 - 0.508)
Typ.
Molded Small Out-Line Package (M8)
Package Number M08A
0.114 - 0.122
(2.90 - 3.10)
8
5
(7.72) Typ
(4.16) Typ
0.169 - 0.177
(4.30 - 4.50)
0.246 - 0.256
(6.25 - 6.5)
(1.78) Typ
(0.42) Typ
0.123 - 0.128
(3.13 - 3.30)
(0.65) Typ
Land pattern recommendation
1
4
Pin #1 IDENT
0.0433
Max
(1.1)
0.0035 - 0.0079
See detail A
0.002 - 0.006
(0.05 - 0.15)
0.0256 (0.65)
Typ.
Gage
plane
0.0075 - 0.0098
(0.19 - 0.30)
0°-8°
DETAIL A
Typ. Scale: 40X
0.0075 - 0.0098
(0.19 - 0.25)
0.020 - 0.028
(0.50 - 0.70)
Seating
plane
8-Pin Molded TSSOP, JEDEC (MT8)
Package Number MTC08
8
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FM93C56
Physical Dimensions inches (millimeters) unless otherwise noted
0.373 - 0.400
(9.474 - 10.16)
0.090
(2.286)
8
7
0.032 0.005
(0.813 0.127)
RAD
8
7
6
5
4
0.092
(2.337)
DIA
0.250 - 0.005
(6.35 0.127)
Pin #1
IDENT
+
Pin #1 IDENT
1
Option 1
1
2
3
Option 2
0.280
MIN
0.040
(1.016)
Typ.
(7.112)
0.030
0.145 - 0.200
(3.683 - 5.080)
0.039
(0.991)
MAX
(0.762)
0.300 - 0.320
(7.62 - 8.128)
20° 1°
0.130 0.005
(3.302 0.127)
0.125 - 0.140
95° 5°
(3.175 - 3.556)
0.065
(1.651)
0.125
(3.175)
DIA
0.020
90° 4°
Typ
0.009 - 0.015
(0.229 - 0.381)
(0.508)
Min
0.018 0.003
(0.457 0.076)
NOM
+0.040
-0.015
0.325
0.100 0.010
+1.016
-0.381
8.255
(2.540 0.254)
0.045 0.015
(1.143 0.381)
0.060
(1.524)
0.050
(1.270)
Molded Dual-In-Line Package (N)
Package Number N08E
Life Support Policy
Fairchild's products are not authorized for use as critical components in life support devices or systems without the express written
approval of the President of Fairchild Semiconductor Corporation. As used herein:
1. Life support devices or systems are devices or systems which,
(a)areintendedforsurgicalimplantintothebody,or(b)support
or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a significant
injury to the user.
2. A critical component is any component of a life support device
or system whose failure to perform can be reasonably ex-
pected to cause the failure of the life support device or system,
or to affect its safety or effectiveness.
Fairchild Semiconductor
Americas
Fairchild Semiconductor
Europe
Fairchild Semiconductor
Hong Kong
Fairchild Semiconductor
Japan Ltd.
Customer Response Center
Tel. 1-888-522-5372
Fax:
Tel:
Tel:
Tel:
Tel:
+44 (0) 1793-856858
8/F, Room 808, Empire Centre
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Kowloon. Hong Kong
Tel; +852-2722-8338
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Deutsch
English
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+49 (0) 8141-6102-0
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2-18-6, Yushima, Bunkyo-ku
Tokyo, 113-0034 Japan
Tel: 81-3-3818-8840
Fax: 81-3-3818-8841
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
9
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FM93C56
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