FOD060LV [FAIRCHILD]

Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 10MBps, SOIC-8;
FOD060LV
型号: FOD060LV
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 10MBps, SOIC-8

文件: 总14页 (文件大小:413K)
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May 2010  
FOD060L, FOD260L, FOD063L  
LVTTL/LVCMOS 3.3V High Speed-10 MBit/s  
Logic Gate Optocouplers  
Single Channel: FOD060L, FOD260L  
Dual Channel: FOD063L  
Data multiplexing  
Features  
Switching power supplies  
Compact SO8 package (except FOD260L – 8-pin DIP)  
Pulse transformer replacement  
Very high speed – 10 MBit/s  
Computer-peripheral interface  
Superior CMR — 50 kV/µs at 2,000V peak  
Fan-out of 8 over -40°C to +85°C  
Description  
Logic gate output  
These optocouplers consist of an AlGaAS LED, optically cou-  
pled to a very high speed integrated photo-detector logic gate.  
Single channel devices include a strobable output. This output  
features an open collector, thereby permitting wired OR outputs.  
The output consists of bipolar transistors in a Bi-CMOS process  
for reduced power consumption. The coupled parameters are  
guaranteed over the temperature range of -40°C to +85°C. A  
maximum input signal of 5 mA (3 mA for the FODX6XL ver-  
sions) will provide a minimum output sink current of 13 mA (fan  
out of 8). An internal noise shield provides superior common  
mode rejection of typically 50 kV/µs at 2,000V common mode.  
Strobable output (single channel devices)  
Wired OR-open collector  
U.L. recognized (File # E90700) (pending)  
UDE approval pending  
Applications  
Ground loop elimination  
LSTTL to TTL, LSTTL or 5-volt CMOS  
Line receiver, data transmission  
Package  
VCC  
N/C  
+
1
8
VCC  
+
1
8
8
VF1  
_
1
VE  
2
3
4
7
6
5
V01  
2
3
4
7
6
5
VF  
_
_
VO  
V02  
VF2  
+
8
N/C  
GND  
8
GND  
1
1
Single-channel circuit drawing Dual-channel circuit drawing  
(FOD060L, FOD260L) (FOD063L)  
Truth Table (Positive Logic)  
Input  
Enable  
Output  
H
H
L
L
H
H
H
L
H
L
L
H
H*  
L*  
NC*  
NC*  
L*  
H*  
*Dual channel devices or single channel devices with pin 7 not connected.  
A 0.1 µF bypass capacitor must be connected between pins 8 and 5. (See note 1)  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
Absolute Maximum Ratings (No derating required up to 85°C)  
Parameter Symbol  
Value  
-40 to +125  
-40 to +85  
50  
Units  
°C  
Storage Temperature  
Operating Temperature  
EMITTER  
T
STG  
T
°C  
OPR  
I
mA  
F
DC/Average Forward Input Current (each channel)  
Enable Input Voltage  
Not to exceed VCC by more than 500 mV  
Single Channel  
V
V
V
+ 0.5V  
CC  
V
E
Reverse Input Voltage (each channel)  
Power Dissipation  
5.0  
45  
V
R
Single Channel  
Dual Channel  
P
mW  
I
DETECTOR  
Supply Voltage  
V
7.0  
V
CC  
(1 minute max)  
Output Current (each channel)  
Output Voltage (each channel)  
Collector Output Power Dissipation  
I
50  
7.0  
85  
mA  
V
O
V
O
O
Single Channel  
Dual Channel  
P
mW  
Recommended Operating Conditions  
Parameter  
Input Current, Low Level  
Symbol  
Min  
0
Max  
250  
15  
Units  
µA  
mA  
V
I
FL  
Input Current, High Level  
I
*6.3  
2.7  
0
FH  
Supply Voltage, Output  
V
3.3  
CC  
Enable Voltage, Low Level (Single Channel)  
Enable Voltage, High Level (Single Channel)  
Operating Temperature  
V
0.8  
V
EL  
V
2.0  
-40  
V
V
EH  
CC  
T
+85  
8
°C  
A
Fan Out (TTL load)  
N
Output Pull-up Resistor  
R
330  
4K  
L
*6.3 mA is a guard banded value which allows for at least 20% CTR degradation. Initial input current threshold value is 5.0 mA or less.  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
2
Electrical Characteristics (T = -40°C to +85°C unless otherwise specified.)  
A
Individual Component Characteristics  
Parameter  
Test Conditions Symbol Min Typ** Max Unit  
EMITTER  
(I = 10 mA)  
V
1.8  
V
F
F
Input Forward Voltage  
Input Reverse Breakdown Voltage  
Input Capacitance  
T =25°C  
1.75  
A
(I = 10 µA)  
B
5.0  
V
pF  
R
VR  
(V = 0, f = 1 MHz)  
C
IN  
F
Input Diode Temperature Coefficient  
DETECTOR  
(I = 10 mA) VF/TA  
mV/°C  
mA  
F
(V = 0.5 V) Single Channel  
I
7
E
CCH  
High Level Supply Current  
Low Level Supply Current  
(I = 0 mA, V = 3.3 V)  
Dual Channel  
10  
F
CC  
(V = 0.5 V) Single Channel  
I
10  
mA  
E
CCL  
(I = 10 mA, V = 3.3 V)  
Dual Channel  
15  
F
CC  
Low Level Enable Current  
High Level Enable Current  
High Level Enable Voltage  
Low Level Enable Voltage  
(V = 3.3 V, V = 0.5 V) Single Channel  
I
-1.6  
-1.6  
mA  
mA  
V
CC  
E
EL  
(V = 3.3 V, V = 2.0 V) Single Channel  
I
EH  
CC  
E
(V = 3.3 V, I = 10 mA) Single Channel  
V
EH  
2.0  
CC  
F
(V = 3.3 V, I = 10 mA) (Note 2) Single Channel  
V
EL  
0.8  
V
CC  
F
Switching Characteristics (T = -40°C to +85°C, V = 3.3 V, I = 7.5 mA unless otherwise specified.)  
A
CC  
F
AC Characteristics  
Test Conditions Device Symbol Min  
Typ Max Unit  
Propagation Delay Time  
to Output High Level  
(Note 3)  
(R = 350, C = 15 pF) (Fig. 9)  
All  
All  
T
T
90  
75  
ns  
ns  
PLH  
PHL  
L
L
Propagation Delay Time  
to Output Low Level  
(Note 4)  
(R = 350, C = 15 pF) (Fig. 9)  
L
L
Pulse Width Distortion  
(R = 350, C = 15 pF) (Fig. 9)  
All  
All  
All  
|T -T |  
PHL PLH  
25  
40  
ns  
ns  
ns  
L
L
Propagation Delay Skew  
(R = 350, C = 15 pF) (Note 5)  
t
L
L
PSK  
Output Rise Time  
(10-90%)  
(R = 350, C = 15 pF) (Note 6) (Fig. 9)  
t
L
L
r
Output Fall Time  
(90-10%)  
(R = 350, C = 15 pF) (Note 7) (Fig. 12)  
All  
All  
t
ns  
ns  
L
L
f
Enable Propagation  
Delay Time to Output  
High Level  
(V = 3 V, R = 350,  
Single  
t
t
EH  
L
ELH  
EHL  
C = 15 pF)  
Channel  
L
(Note 8) (Fig. 10)  
Enable Propagation  
Delay Time to Output  
Low Level  
(V = 3 V, R = 350,  
Single  
All  
All  
All  
ns  
EH  
L
C = 15 pF)  
Channel  
L
(Note 9) (Fig. 10)  
Common Mode  
Transient Immunity  
(at Output High Level)  
(R = 350) (T =25°C) |V | = 50 V  
|CM |  
25,000 50,000  
25,000 50,000  
V/µs  
V/µs  
L
A
CM  
H
(I = 0 mA, V (Min.) = 2.0V )  
F OH  
(Note 10) (Fig. 11)  
Common Mode  
(R = 350) (T =25°C) |V | = 50 V  
|CM |  
H
L
A
CM  
Transient Immunity  
(at Output Low Level)  
(I = 7.5 mA, V (Max.) = 0.8  
F OL  
V) (Note 11) (Fig. 11)  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
3
Transfer Characteristics (T = -40°C to +85°C Unless otherwise specified.)  
A
DC Characteristics  
Test Conditions Symbol  
Min  
Typ**  
Max  
Unit  
High Level Output Current  
(I = 250 µA, V = 3.3 V, V = 3.3 V)  
I
OH  
50  
µA  
F
CC  
O
(Note 2) V = 2.0 V  
Single Channel  
E
Low Level Output Voltage  
Input Threshold Current  
(V = 3.3 V, I = 5 mA, I = 13 mA)  
V
0.6  
5
V
CC  
F
OL  
OL  
FT  
(Note 2) V = 2.0 V  
Single Channel  
E
(V = 3.3 V, V = 0.6 V, I = 13 mA)  
I
mA  
CC  
O
OL  
(Note 2) V = 2.0 V  
Single Channel  
E
Isolation Characteristics (T = -40°C to +85°C Unless otherwise specified.)  
A
Characteristics  
Test Conditions Device Symbol  
Min  
Typ**  
Max  
Unit  
Input-Output  
Insulation Leakage Current  
(Relative humidity = 45%)  
(T = 25°C, t = 5 s)  
I
1.0*  
µA  
I-O  
A
(V = 3000 VDC)  
I-O  
(Note 12)  
Withstand Insulation Test  
Voltage  
I
2 µA, R < 50%, FOD060L  
V
3750  
5000  
V
RMS  
IO  
H
ISO  
T = 25°C) FOD063L  
A
(Note 12) ( t = 1 min.)  
FOD260L  
12  
Resistance (Input to Output)  
Capacitance (Input to Output)  
(V = 500 V) (Note 12)  
R
C
10  
0.6  
I-O  
I-O  
I-O  
(f = 1 MHz) (Note 12)  
pF  
** All typical values are at V = 3.3 V, T = 25°C  
CC  
A
Notes  
1. The V supply to each optoisolator must be bypassed by a 0.1µF capacitor or larger. This can be either a ceramic or solid  
CC  
tantalum capacitor with good high frequency characteristic and should be connected as close as possible to the package V and  
CC  
GND pins of each device.  
2. Enable Input – No pull up resistor required as the device has an internal pull up resistor.  
3.  
4.  
5.  
t
– Propagation delay is measured from the 3.75 mA level on the HIGH to LOW transition of the input current pulse to the  
PLH  
1.5V level on the LOW to HIGH transition of the output voltage pulse.  
t
level on the HIGH to LOW transition of the output voltage pulse.  
t
– Propagation delay is measured from the 3.75 mA level on the LOW to HIGH transition of the input current pulse to the 1.5V  
PHL  
is the worst case difference between t and t for any devices at the stated test conditions.  
PSK  
PHL  
PLH  
6. t – Rise time is measured from the 90% to the 10% levels on the LOW to HIGH transition of the output pulse.  
r
7. t – Fall time is measured from the 10% to the 90% levels on the HIGH to LOW transition of the output pulse.  
f
8.  
t
– Enable input propagation delay is measured from the 1.5V level on the HIGH to LOW transition of the input voltage pulse  
ELH  
to the 1.5V level on the LOW to HIGH transition of the output voltage pulse.  
9.  
t
– Enable input propagation delay is measured from the 1.5V level on the LOW to HIGH transition of the input voltage pulse  
EHL  
to the 1.5V level on the HIGH to LOW transition of the output voltage pulse.  
10. CM – The maximum tolerable rate of rise of the common mode voltage to ensure the output will remain in the high state (i.e.,  
H
V
> 2.0 V). Measured in volts per microsecond (V/µs).  
OUT  
11. CM – The maximum tolerable rate of fall of the common mode voltage to ensure the output will remain in the low output state  
L
(i.e., V  
< 0.8 V). Measured in volts per microsecond (V/µs).  
OUT  
12. Device considered a two-terminal device: Pins 1,2,3 and 4 shorted together, and Pins 5,6,7 and 8 shorted together.  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
4
Typical Performance Curves  
Fig. 1 Input Forward Current vs.  
Fig. 2 Input Threshold Current vs.  
Ambient Temperature  
Forward Voltage  
100  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
V
= 3.3V  
CC  
= 0.6V  
O
10  
T
= 100°C  
FOD063L  
A
R
= 350, 1k, 4kΩ  
L
1
0.1  
FOD060L  
= 350, 1k, 4kΩ  
R
L
T
= -40°C  
= 0°C  
T
= 85°C  
A
A
T
A
FOD260L  
T
= 25°C  
A
0.01  
0.001  
R
= 350, 1k, 4kΩ  
L
0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7  
-40  
-20  
0
20  
40  
60  
80  
100  
VF - Forward Voltage (V)  
TA - Ambient Temperature (°C)  
Fig. 4 High Level Output Current  
vs. Ambient Temperature  
Fig. 3 Low Level Output Voltage vs.  
Ambient Temperature  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
20  
16  
12  
8
V
V
= 3.3V  
CC  
= 2V (Single channel products only)  
E
I
= 5mA  
F
I
= 13mA  
O
4
V
V
= V  
= 3.3V  
O
E
CC  
= 2V (Single channel products only)  
I
= 250 µA  
F
0
-40  
-40  
-20  
0
20  
40  
60  
80  
100  
-20  
0
20  
40  
60  
80  
100  
TA - Ambient Temperature (°C)  
TA - Ambient Temperature (°C)  
Fig. 5 Low Level Output Current vs.  
Fig. 6 Propagation Delay vs.  
Ambient Temperature  
Ambient Temperature  
40  
80  
70  
60  
50  
40  
30  
20  
V
= 3.3V  
CC  
V
I
= 3.3V  
CC  
V
V
I
= 2V (Single channel products only)  
= 0.6V  
E
35  
30  
25  
20  
15  
10  
5
= 7.5mA  
F
OL  
R
= 350Ω  
t
- FOD060L, FOD063L  
L
= 5mA  
PLH  
F
t
- FOD260L  
PLH  
t
- FOD060L, FOD063L  
PHL  
t
- FOD260L  
PHL  
0
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
TA - Ambient Temperature (°C)  
TA - Ambient Temperature (°C)  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
5
Typical Performance Curves  
Fig. 7 Rise and Fall Times vs.  
Fig. 8 Pulse Width Distortion vs.  
Ambient Temperature  
Ambient Temperature  
35  
30  
25  
20  
15  
10  
5
V
I
= 3.3V  
V
= 3.3V  
CC  
= 7.5mA  
CC  
F
I
= 7.5mA  
30  
25  
20  
15  
10  
5
F
RL = 350Ω  
RL = 350Ω  
t
r
FOD260L  
FOD060L  
FOD063L  
t
f
0
0
-40  
-40  
-20  
0
20  
40  
60  
80  
100  
-20  
0
20  
40  
60  
80  
100  
TA - Ambient Temperature (°C)  
TA - Ambient Temperature (°C)  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
6
Pulse Gen.  
= t = 5 ns  
O
Pulse Gen.  
IF = 7.5 mA  
+3.3V  
t
f
Z
Z
= 50 Ω  
r
O
= 50 Ω  
t
f
= t = 5 ns  
r
IF = 3.75 mA  
Dual Channel  
V
Input  
(IF  
+3.3V  
I
)
F
1
2
3
4
8
7
6
5
CC  
1
V
8
7
6
5
CC  
tPHL  
Output  
(VO  
tPLH  
R
L
Input  
Monitoring  
Node  
Output V  
O
Monitoring  
Node  
0.1µF  
Bypass  
R
L
2
3
4
)
1.5 V  
Input  
Monitor  
0.1µF  
Bypass  
Output  
(V  
L
)
O
(I  
F
)
R
M
90%  
10%  
C
C
L
*
Output  
(VO  
GND  
47Ω  
)
GND  
tf  
tr  
Test Circuit for FOD060L,  
and FOD260L  
Test Circuit for FOD063L  
Fig. 9 Test Circuit and Waveforms for tPLH, tPHL, tr and tf.  
Pulse  
Input  
Monitor  
(VE)  
Generator  
tr = 5ns  
ZO= 50Ω  
+3.3V  
3.0 V  
1.5 V  
Input  
(VE  
)
1
2
3
4
8
7
6
5
tEHL  
Output  
(VO  
tELH  
7.5 mA  
RL  
)
0.1µF  
bypass  
1.5 V  
Output  
(VO  
)
CL  
Fig. 10 Test Circuit tEHL and tELH  
.
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
7
I
F
VCC  
Dual Channel  
V
+3.3V  
B
A
1
2
3
4
8
7
6
5
+3.3V  
1
2
3
4
8
7
6
5
CC  
IF  
R
L
Output V  
Monitoring  
Node  
O
0.1µf  
bypass  
350Ω  
A
V
FF  
B
0.1µF  
Bypass  
Output  
(VO)  
VFF  
GND  
GND  
V
CM  
+
VCM  
Pulse Gen  
Pulse  
Generator  
O = 50 Ω  
Z
Test Circuit for FOD060L and FOD260L  
Test Circuit for FOD063L  
VCM  
0V  
Peak  
3.3V  
CMH  
Switching Pos. (A), IF= 0  
VO (Min)  
VO  
VO (Max)  
Switching Pos. (B), IF= 7.5 mA  
VO  
CML  
0.5 V  
Fig. 11 Test Circuit Common Mode Transient Immunity  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
8
8-Pin SOIC  
Package Dimensions (Surface Mount)  
8-Pin Small Outline  
PIN 1  
ID.  
0.024 (0.61)  
0.164 (4.16)  
0.144 (3.66)  
0.060 (1.52)  
0.275 (6.99)  
0.202 (5.13)  
0.182 (4.63)  
0.155 (3.94)  
0.010 (0.25)  
0.006 (0.16)  
0.143 (3.63)  
0.123 (3.13)  
0.244 (6.19)  
0.224 (5.69)  
0.008 (0.20)  
0.003 (0.08)  
0.021 (0.53)  
0.011 (0.28)  
0.050 (1.27)  
TYP  
0.050 (1.27)  
Lead Coplanarity : 0.004 (0.10) MAX  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
9
8-Pin DIP  
Package Dimensions (Through Hole)  
Package Dimensions (Surface Mount)  
0.390 (9.91)  
0.370 (9.40)  
PIN 1  
ID.  
PIN 1  
ID.  
4
3
2
1
0.270 (6.86)  
0.250 (6.35)  
0.270 (6.86)  
0.250 (6.35)  
5
6
7
8
0.390 (9.91)  
0.370 (9.40)  
0.300 (7.62)  
TYP  
0.070 (1.78)  
0.045 (1.14)  
0.070 (1.78)  
0.045 (1.14)  
0.200 (5.08)  
0.140 (3.55)  
0.020 (0.51)  
MIN  
0.016 (0.41)  
0.008 (0.20)  
0.020 (0.51) MIN  
0.200 (5.08)  
0.140 (3.55)  
0.154 (3.90)  
0.120 (3.05)  
0.045 [1.14]  
0.022 (0.56)  
0.016 (0.41)  
0.315 (8.00)  
MIN  
0.022 (0.56)  
0.016 (0.41)  
15° MAX  
0.016 (0.40)  
0.008 (0.20)  
0.100 (2.54)  
TYP  
0.405 (10.30)  
MIN  
0.300 (7.62)  
TYP  
0.100 (2.54) TYP  
Lead Coplanarity : 0.004 (0.10) MAX  
Package Dimensions (0.4” Lead Spacing)  
8-Pin DIP  
PIN 1  
ID.  
0.070 (1.78)  
0.270 (6.86)  
0.250 (6.35)  
0.060 (1.52)  
0.390 (9.91)  
0.370 (9.40)  
0.100 (2.54)  
0.295 (7.49)  
0.070 (1.78)  
0.045 (1.14)  
0.030 (0.76)  
0.415 (10.54)  
0.004 (0.10) MIN  
0.200 (5.08)  
0.140 (3.55)  
0.154 (3.90)  
0.120 (3.05)  
0.022 (0.56)  
0.016 (0.41)  
0° to 15°  
0.016 (0.40)  
0.008 (0.20)  
0.400 (10.16)  
TYP  
0.100 (2.54) TYP  
NOTE  
All dimensions are in inches (millimeters)  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
10  
Ordering Information  
Order Entry  
Option  
Identifier  
Description  
No Suffix  
FOD260L  
Through Hole (DIP package only)  
FOD060L  
Surface Mount Lead Form (SOIC-8 package only)  
Surface Mount Lead Bend (DIP package only)  
S
SD  
SV  
SDV  
T
FOD260LS  
FOD260LSD  
Surface Mount; Tape and reel (DIP package only)  
Surface Mount; VDE0884 (DIP package only)  
Pending Approval  
Pending Approval  
FOD260LT  
Surface Mount;Tape and reel, VDE0884 (1000 units per reel) (DIP package only)  
0.4" Lead Spacing (DIP package only)  
TV  
R1  
R1V  
R2  
R2V  
V
Pending Approval  
FOD060LR1  
0.4" Lead Spacing, VDE0884 (DIP package only)  
Tape and Reel (500 units per reel) (SOIC-8 package only)  
VDE, Tape and Reel (500 units per reel) (SOIC-8 package only)  
Tape and Reel (2500 units per reel) (SOIC-8 package only)  
VDE, Tape and Reel (2500 units per reel) (SOIC-8 package only)  
VDE (SOIC-8 package only)  
Pending Approval  
FOD060LR2  
Pending Approval  
Pending Approval  
Marking Information  
DIP  
SOIC  
2
1
1
60L  
6
2
6
V
YY S  
X
260L  
V XX YY B  
5
3
4
5
3
4
Definitions  
1
2
3
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE option –  
See order entry table)  
4 (DIP)  
Two digit year code, e.g., ‘03’  
4 (SOIC) One digit year code, e.g., ‘3’  
5
6
Two digit work week ranging from ‘01’ to ‘53’  
Assembly package code  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
11  
8-Pin DIP  
Carrier Tape Specifications (FOD260L)  
12.0 0.1  
4.0 0.1  
Ø1.55 0.05  
1.75 0.10  
4.90 0.20  
4.0 0.1  
0.30 0.05  
7.5 0.1  
16.0  
10.30 0.20  
0
13.2 0.2  
Ø1.6 0.1  
0.1 MAX  
10.30 0.20  
User Direction of Feed  
Reflow Profile (FOD260L)  
• Peak reflow temperature  
260°C (package surface temperature)  
• Time of temperature higher than 245°C  
• Number of reflows  
40 seconds or less  
Three  
10s  
300  
250  
200  
150  
100  
50  
260°  
245°  
40s  
50  
100  
150  
200  
250  
Time (s)  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
12  
8-Pin SOIC  
Carrier Tape Specifications (FOD060L, FOD063L)  
8.0 ± 0.10  
3.50 ± 0.20  
2.0 ± 0.05  
Ø1.5 MIN  
0.30 MAX  
4.0 ± 0.10  
1.75 ± 0.10  
5.5 ± 0.05  
12.0 ± 0.3  
8.3 ± 0.10  
5.20 ± 0.20  
Ø1.5 ± 0.1/-0  
6.40 ± 0.20  
User Direction of Feed  
0.1 MAX  
Reflow Profile (FOD060L, FOD063L)  
300  
280  
260  
240  
220  
200  
180  
260°C  
>245°C = 42 Sec  
Time above  
160  
°C  
183°C = 90 Sec  
140  
120  
1.822°C/Sec Ramp up rate  
100  
80  
60  
40  
20  
0
33 Sec  
0
60  
120  
180  
270  
360  
Time (s)  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
13  
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
®
*
AccuPower  
Auto-SPM™  
F-PFS™  
Power-SPM™  
PowerTrench®  
PowerXS™  
FRFET®  
The Power Franchise®  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
Global Power ResourceSM  
Green FPS™  
Green FPSe-Series™  
Gmax™  
GTO™  
IntelliMAX™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Programmable Active Droop™  
QFET®  
QS™  
TinyBoost™  
TinyBuck™  
Quiet Series™  
RapidConfigure™  
TinyCalc™  
Current Transfer Logic™  
DEUXPEED®  
Dual Cool™  
TinyLogic®  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
TriFault Detect™  
TRUECURRENT*  
" SerDes™  
Saving our world, 1mW/W/kW at a time™  
SignalWise™  
SmartMax™  
EcoSPARK®  
n
EfficientMax™  
ESBC™  
MicroPak™  
SMART START™  
®
SPM®  
MicroPak2™  
MillerDrive™  
MotionMax™  
Motion-SPM™  
OptoHiT™  
Fairchild®  
STEALTH™  
SuperFET™  
SuperSOT-3  
SuperSOT-6  
SuperSOT-8  
SupreMOS®  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
OPTOLOGIC®  
UHC®  
FAST®  
OPTOPLANAR®  
Ultra FRFET™  
UniFET™  
VCX™  
FastvCore™  
®
SyncFET™  
Sync-Lock™  
FETBench™  
FlashWriter®  
*
PDP SPM™  
VisualMax™  
XS™  
FPS™  
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE  
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,  
WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a)  
are intended for surgical implant into the body or (b) support or  
sustain life, and (c) whose failure to perform when properly used in  
accordance with instructions for use provided in the labeling, can be  
reasonably expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to  
cause the failure of the life support device or system, or to affect its  
safety or effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on ourexternal website, www.fairchildsemi.com,  
under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their  
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed  
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the  
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild  
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors  
are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical  
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.  
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global  
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet  
Product Status  
Definition  
Identification  
Datasheet contains the design specifications for product development. Specifications may change  
in any manner without notice.  
Advance Information  
Preliminary  
Formative / In Design  
First Production  
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild  
Semiconductor reserves the right to make changes at any time without notice to improve design.  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make  
changes at any time without notice to improve the design.  
No Identification Needed Full Production  
Obsolete Not In Production  
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.  
The datasheet is for reference information only.  
Rev. I49  
©2008 Fairchild Semiconductor Corporation  
FOD060L, FOD260L, FOD063L Rev. 1.0.3  
www.fairchildsemi.com  
14  

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