FOD060LV [FAIRCHILD]
Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 10MBps, SOIC-8;型号: | FOD060LV |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 10MBps, SOIC-8 |
文件: | 总14页 (文件大小:413K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
May 2010
FOD060L, FOD260L, FOD063L
LVTTL/LVCMOS 3.3V High Speed-10 MBit/s
Logic Gate Optocouplers
Single Channel: FOD060L, FOD260L
Dual Channel: FOD063L
■ Data multiplexing
Features
■ Switching power supplies
■ Compact SO8 package (except FOD260L – 8-pin DIP)
■ Pulse transformer replacement
■ Very high speed – 10 MBit/s
■ Computer-peripheral interface
■ Superior CMR — 50 kV/µs at 2,000V peak
■ Fan-out of 8 over -40°C to +85°C
Description
■ Logic gate output
These optocouplers consist of an AlGaAS LED, optically cou-
pled to a very high speed integrated photo-detector logic gate.
Single channel devices include a strobable output. This output
features an open collector, thereby permitting wired OR outputs.
The output consists of bipolar transistors in a Bi-CMOS process
for reduced power consumption. The coupled parameters are
guaranteed over the temperature range of -40°C to +85°C. A
maximum input signal of 5 mA (3 mA for the FODX6XL ver-
sions) will provide a minimum output sink current of 13 mA (fan
out of 8). An internal noise shield provides superior common
mode rejection of typically 50 kV/µs at 2,000V common mode.
■ Strobable output (single channel devices)
■ Wired OR-open collector
■ U.L. recognized (File # E90700) (pending)
■ UDE approval pending
Applications
■ Ground loop elimination
■ LSTTL to TTL, LSTTL or 5-volt CMOS
■ Line receiver, data transmission
Package
VCC
N/C
+
1
8
VCC
+
1
8
8
VF1
_
1
VE
2
3
4
7
6
5
V01
2
3
4
7
6
5
VF
_
_
VO
V02
VF2
+
8
N/C
GND
8
GND
1
1
Single-channel circuit drawing Dual-channel circuit drawing
(FOD060L, FOD260L) (FOD063L)
Truth Table (Positive Logic)
Input
Enable
Output
H
H
L
L
H
H
H
L
H
L
L
H
H*
L*
NC*
NC*
L*
H*
*Dual channel devices or single channel devices with pin 7 not connected.
A 0.1 µF bypass capacitor must be connected between pins 8 and 5. (See note 1)
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
Absolute Maximum Ratings (No derating required up to 85°C)
Parameter Symbol
Value
-40 to +125
-40 to +85
50
Units
°C
Storage Temperature
Operating Temperature
EMITTER
T
STG
T
°C
OPR
I
mA
F
DC/Average Forward Input Current (each channel)
Enable Input Voltage
Not to exceed VCC by more than 500 mV
Single Channel
V
V
V
+ 0.5V
CC
V
E
Reverse Input Voltage (each channel)
Power Dissipation
5.0
45
V
R
Single Channel
Dual Channel
P
mW
I
DETECTOR
Supply Voltage
V
7.0
V
CC
(1 minute max)
Output Current (each channel)
Output Voltage (each channel)
Collector Output Power Dissipation
I
50
7.0
85
mA
V
O
V
O
O
Single Channel
Dual Channel
P
mW
Recommended Operating Conditions
Parameter
Input Current, Low Level
Symbol
Min
0
Max
250
15
Units
µA
mA
V
I
FL
Input Current, High Level
I
*6.3
2.7
0
FH
Supply Voltage, Output
V
3.3
CC
Enable Voltage, Low Level (Single Channel)
Enable Voltage, High Level (Single Channel)
Operating Temperature
V
0.8
V
EL
V
2.0
-40
V
V
EH
CC
T
+85
8
°C
A
Fan Out (TTL load)
N
Output Pull-up Resistor
R
330
4K
Ω
L
*6.3 mA is a guard banded value which allows for at least 20% CTR degradation. Initial input current threshold value is 5.0 mA or less.
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
2
Electrical Characteristics (T = -40°C to +85°C unless otherwise specified.)
A
Individual Component Characteristics
Parameter
Test Conditions Symbol Min Typ** Max Unit
EMITTER
(I = 10 mA)
V
1.8
V
F
F
Input Forward Voltage
Input Reverse Breakdown Voltage
Input Capacitance
T =25°C
1.75
A
(I = 10 µA)
B
5.0
V
pF
R
VR
(V = 0, f = 1 MHz)
C
IN
F
Input Diode Temperature Coefficient
DETECTOR
(I = 10 mA) ∆VF/∆TA
mV/°C
mA
F
(V = 0.5 V) Single Channel
I
7
E
CCH
High Level Supply Current
Low Level Supply Current
(I = 0 mA, V = 3.3 V)
Dual Channel
10
F
CC
(V = 0.5 V) Single Channel
I
10
mA
E
CCL
(I = 10 mA, V = 3.3 V)
Dual Channel
15
F
CC
Low Level Enable Current
High Level Enable Current
High Level Enable Voltage
Low Level Enable Voltage
(V = 3.3 V, V = 0.5 V) Single Channel
I
-1.6
-1.6
mA
mA
V
CC
E
EL
(V = 3.3 V, V = 2.0 V) Single Channel
I
EH
CC
E
(V = 3.3 V, I = 10 mA) Single Channel
V
EH
2.0
CC
F
(V = 3.3 V, I = 10 mA) (Note 2) Single Channel
V
EL
0.8
V
CC
F
Switching Characteristics (T = -40°C to +85°C, V = 3.3 V, I = 7.5 mA unless otherwise specified.)
A
CC
F
AC Characteristics
Test Conditions Device Symbol Min
Typ Max Unit
Propagation Delay Time
to Output High Level
(Note 3)
(R = 350Ω, C = 15 pF) (Fig. 9)
All
All
T
T
90
75
ns
ns
PLH
PHL
L
L
Propagation Delay Time
to Output Low Level
(Note 4)
(R = 350Ω, C = 15 pF) (Fig. 9)
L
L
Pulse Width Distortion
(R = 350Ω, C = 15 pF) (Fig. 9)
All
All
All
|T -T |
PHL PLH
25
40
ns
ns
ns
L
L
Propagation Delay Skew
(R = 350Ω, C = 15 pF) (Note 5)
t
L
L
PSK
Output Rise Time
(10-90%)
(R = 350Ω, C = 15 pF) (Note 6) (Fig. 9)
t
L
L
r
Output Fall Time
(90-10%)
(R = 350Ω, C = 15 pF) (Note 7) (Fig. 12)
All
All
t
ns
ns
L
L
f
Enable Propagation
Delay Time to Output
High Level
(V = 3 V, R = 350Ω,
Single
t
t
EH
L
ELH
EHL
C = 15 pF)
Channel
L
(Note 8) (Fig. 10)
Enable Propagation
Delay Time to Output
Low Level
(V = 3 V, R = 350Ω,
Single
All
All
All
ns
EH
L
C = 15 pF)
Channel
L
(Note 9) (Fig. 10)
Common Mode
Transient Immunity
(at Output High Level)
(R = 350Ω) (T =25°C) |V | = 50 V
|CM |
25,000 50,000
25,000 50,000
V/µs
V/µs
L
A
CM
H
(I = 0 mA, V (Min.) = 2.0V )
F OH
(Note 10) (Fig. 11)
Common Mode
(R = 350Ω) (T =25°C) |V | = 50 V
|CM |
H
L
A
CM
Transient Immunity
(at Output Low Level)
(I = 7.5 mA, V (Max.) = 0.8
F OL
V) (Note 11) (Fig. 11)
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
3
Transfer Characteristics (T = -40°C to +85°C Unless otherwise specified.)
A
DC Characteristics
Test Conditions Symbol
Min
Typ**
Max
Unit
High Level Output Current
(I = 250 µA, V = 3.3 V, V = 3.3 V)
I
OH
50
µA
F
CC
O
(Note 2) V = 2.0 V
Single Channel
E
Low Level Output Voltage
Input Threshold Current
(V = 3.3 V, I = 5 mA, I = 13 mA)
V
0.6
5
V
CC
F
OL
OL
FT
(Note 2) V = 2.0 V
Single Channel
E
(V = 3.3 V, V = 0.6 V, I = 13 mA)
I
mA
CC
O
OL
(Note 2) V = 2.0 V
Single Channel
E
Isolation Characteristics (T = -40°C to +85°C Unless otherwise specified.)
A
Characteristics
Test Conditions Device Symbol
Min
Typ**
Max
Unit
Input-Output
Insulation Leakage Current
(Relative humidity = 45%)
(T = 25°C, t = 5 s)
I
1.0*
µA
I-O
A
(V = 3000 VDC)
I-O
(Note 12)
Withstand Insulation Test
Voltage
I
≤ 2 µA, R < 50%, FOD060L
V
3750
5000
V
RMS
IO
H
ISO
T = 25°C) FOD063L
A
(Note 12) ( t = 1 min.)
FOD260L
12
Resistance (Input to Output)
Capacitance (Input to Output)
(V = 500 V) (Note 12)
R
C
10
0.6
Ω
I-O
I-O
I-O
(f = 1 MHz) (Note 12)
pF
** All typical values are at V = 3.3 V, T = 25°C
CC
A
Notes
1. The V supply to each optoisolator must be bypassed by a 0.1µF capacitor or larger. This can be either a ceramic or solid
CC
tantalum capacitor with good high frequency characteristic and should be connected as close as possible to the package V and
CC
GND pins of each device.
2. Enable Input – No pull up resistor required as the device has an internal pull up resistor.
3.
4.
5.
t
– Propagation delay is measured from the 3.75 mA level on the HIGH to LOW transition of the input current pulse to the
PLH
1.5V level on the LOW to HIGH transition of the output voltage pulse.
t
level on the HIGH to LOW transition of the output voltage pulse.
t
– Propagation delay is measured from the 3.75 mA level on the LOW to HIGH transition of the input current pulse to the 1.5V
PHL
is the worst case difference between t and t for any devices at the stated test conditions.
PSK
PHL
PLH
6. t – Rise time is measured from the 90% to the 10% levels on the LOW to HIGH transition of the output pulse.
r
7. t – Fall time is measured from the 10% to the 90% levels on the HIGH to LOW transition of the output pulse.
f
8.
t
– Enable input propagation delay is measured from the 1.5V level on the HIGH to LOW transition of the input voltage pulse
ELH
to the 1.5V level on the LOW to HIGH transition of the output voltage pulse.
9.
t
– Enable input propagation delay is measured from the 1.5V level on the LOW to HIGH transition of the input voltage pulse
EHL
to the 1.5V level on the HIGH to LOW transition of the output voltage pulse.
10. CM – The maximum tolerable rate of rise of the common mode voltage to ensure the output will remain in the high state (i.e.,
H
V
> 2.0 V). Measured in volts per microsecond (V/µs).
OUT
11. CM – The maximum tolerable rate of fall of the common mode voltage to ensure the output will remain in the low output state
L
(i.e., V
< 0.8 V). Measured in volts per microsecond (V/µs).
OUT
12. Device considered a two-terminal device: Pins 1,2,3 and 4 shorted together, and Pins 5,6,7 and 8 shorted together.
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
4
Typical Performance Curves
Fig. 1 Input Forward Current vs.
Fig. 2 Input Threshold Current vs.
Ambient Temperature
Forward Voltage
100
2.5
2.0
1.5
1.0
0.5
0.0
V
V
= 3.3V
CC
= 0.6V
O
10
T
= 100°C
FOD063L
A
R
= 350Ω, 1kΩ, 4kΩ
L
1
0.1
FOD060L
= 350Ω, 1kΩ, 4kΩ
R
L
T
= -40°C
= 0°C
T
= 85°C
A
A
T
A
FOD260L
T
= 25°C
A
0.01
0.001
R
= 350Ω, 1kΩ, 4kΩ
L
0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
-40
-20
0
20
40
60
80
100
VF - Forward Voltage (V)
TA - Ambient Temperature (°C)
Fig. 4 High Level Output Current
vs. Ambient Temperature
Fig. 3 Low Level Output Voltage vs.
Ambient Temperature
0.6
0.5
0.4
0.3
0.2
0.1
0.0
20
16
12
8
V
V
= 3.3V
CC
= 2V (Single channel products only)
E
I
= 5mA
F
I
= 13mA
O
4
V
V
= V
= 3.3V
O
E
CC
= 2V (Single channel products only)
I
= 250 µA
F
0
-40
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
TA - Ambient Temperature (°C)
TA - Ambient Temperature (°C)
Fig. 5 Low Level Output Current vs.
Fig. 6 Propagation Delay vs.
Ambient Temperature
Ambient Temperature
40
80
70
60
50
40
30
20
V
= 3.3V
CC
V
I
= 3.3V
CC
V
V
I
= 2V (Single channel products only)
= 0.6V
E
35
30
25
20
15
10
5
= 7.5mA
F
OL
R
= 350Ω
t
- FOD060L, FOD063L
L
= 5mA
PLH
F
t
- FOD260L
PLH
t
- FOD060L, FOD063L
PHL
t
- FOD260L
PHL
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
TA - Ambient Temperature (°C)
TA - Ambient Temperature (°C)
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
5
Typical Performance Curves
Fig. 7 Rise and Fall Times vs.
Fig. 8 Pulse Width Distortion vs.
Ambient Temperature
Ambient Temperature
35
30
25
20
15
10
5
V
I
= 3.3V
V
= 3.3V
CC
= 7.5mA
CC
F
I
= 7.5mA
30
25
20
15
10
5
F
RL = 350Ω
RL = 350Ω
t
r
FOD260L
FOD060L
FOD063L
t
f
0
0
-40
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
TA - Ambient Temperature (°C)
TA - Ambient Temperature (°C)
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
6
Pulse Gen.
= t = 5 ns
O
Pulse Gen.
IF = 7.5 mA
+3.3V
t
f
Z
Z
= 50 Ω
r
O
= 50 Ω
t
f
= t = 5 ns
r
IF = 3.75 mA
Dual Channel
V
Input
(IF
+3.3V
I
)
F
1
2
3
4
8
7
6
5
CC
1
V
8
7
6
5
CC
tPHL
Output
(VO
tPLH
R
L
Input
Monitoring
Node
Output V
O
Monitoring
Node
0.1µF
Bypass
R
L
2
3
4
)
1.5 V
Input
Monitor
0.1µF
Bypass
Output
(V
L
)
O
(I
F
)
R
M
90%
10%
C
C
L
*
Output
(VO
GND
47Ω
)
GND
tf
tr
Test Circuit for FOD060L,
and FOD260L
Test Circuit for FOD063L
Fig. 9 Test Circuit and Waveforms for tPLH, tPHL, tr and tf.
Pulse
Input
Monitor
(VE)
Generator
tr = 5ns
ZO= 50Ω
+3.3V
3.0 V
1.5 V
Input
(VE
)
1
2
3
4
8
7
6
5
tEHL
Output
(VO
tELH
7.5 mA
RL
)
0.1µF
bypass
1.5 V
Output
(VO
)
CL
Fig. 10 Test Circuit tEHL and tELH
.
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
7
I
F
VCC
Dual Channel
V
+3.3V
B
A
1
2
3
4
8
7
6
5
+3.3V
1
2
3
4
8
7
6
5
CC
IF
R
L
Output V
Monitoring
Node
O
0.1µf
bypass
350Ω
A
V
FF
B
0.1µF
Bypass
Output
(VO)
VFF
GND
GND
V
CM
+
–
VCM
Pulse Gen
Pulse
Generator
O = 50 Ω
Z
Test Circuit for FOD060L and FOD260L
Test Circuit for FOD063L
VCM
0V
Peak
3.3V
CMH
Switching Pos. (A), IF= 0
VO (Min)
VO
VO (Max)
Switching Pos. (B), IF= 7.5 mA
VO
CML
0.5 V
Fig. 11 Test Circuit Common Mode Transient Immunity
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
8
8-Pin SOIC
Package Dimensions (Surface Mount)
8-Pin Small Outline
PIN 1
ID.
0.024 (0.61)
0.164 (4.16)
0.144 (3.66)
0.060 (1.52)
0.275 (6.99)
0.202 (5.13)
0.182 (4.63)
0.155 (3.94)
0.010 (0.25)
0.006 (0.16)
0.143 (3.63)
0.123 (3.13)
0.244 (6.19)
0.224 (5.69)
0.008 (0.20)
0.003 (0.08)
0.021 (0.53)
0.011 (0.28)
0.050 (1.27)
TYP
0.050 (1.27)
Lead Coplanarity : 0.004 (0.10) MAX
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
9
8-Pin DIP
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.390 (9.91)
0.370 (9.40)
PIN 1
ID.
PIN 1
ID.
4
3
2
1
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.390 (9.91)
0.370 (9.40)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.140 (3.55)
0.020 (0.51)
MIN
0.016 (0.41)
0.008 (0.20)
0.020 (0.51) MIN
0.200 (5.08)
0.140 (3.55)
0.154 (3.90)
0.120 (3.05)
0.045 [1.14]
0.022 (0.56)
0.016 (0.41)
0.315 (8.00)
MIN
0.022 (0.56)
0.016 (0.41)
15° MAX
0.016 (0.40)
0.008 (0.20)
0.100 (2.54)
TYP
0.405 (10.30)
MIN
0.300 (7.62)
TYP
0.100 (2.54) TYP
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4” Lead Spacing)
8-Pin DIP
PIN 1
ID.
0.070 (1.78)
0.270 (6.86)
0.250 (6.35)
0.060 (1.52)
0.390 (9.91)
0.370 (9.40)
0.100 (2.54)
0.295 (7.49)
0.070 (1.78)
0.045 (1.14)
0.030 (0.76)
0.415 (10.54)
0.004 (0.10) MIN
0.200 (5.08)
0.140 (3.55)
0.154 (3.90)
0.120 (3.05)
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.016 (0.40)
0.008 (0.20)
0.400 (10.16)
TYP
0.100 (2.54) TYP
NOTE
All dimensions are in inches (millimeters)
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
10
Ordering Information
Order Entry
Option
Identifier
Description
No Suffix
FOD260L
Through Hole (DIP package only)
FOD060L
Surface Mount Lead Form (SOIC-8 package only)
Surface Mount Lead Bend (DIP package only)
S
SD
SV
SDV
T
FOD260LS
FOD260LSD
Surface Mount; Tape and reel (DIP package only)
Surface Mount; VDE0884 (DIP package only)
Pending Approval
Pending Approval
FOD260LT
Surface Mount;Tape and reel, VDE0884 (1000 units per reel) (DIP package only)
0.4" Lead Spacing (DIP package only)
TV
R1
R1V
R2
R2V
V
Pending Approval
FOD060LR1
0.4" Lead Spacing, VDE0884 (DIP package only)
Tape and Reel (500 units per reel) (SOIC-8 package only)
VDE, Tape and Reel (500 units per reel) (SOIC-8 package only)
Tape and Reel (2500 units per reel) (SOIC-8 package only)
VDE, Tape and Reel (2500 units per reel) (SOIC-8 package only)
VDE (SOIC-8 package only)
Pending Approval
FOD060LR2
Pending Approval
Pending Approval
Marking Information
DIP
SOIC
2
1
1
60L
6
2
6
V
YY S
X
260L
V XX YY B
5
3
4
5
3
4
Definitions
1
2
3
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE option –
See order entry table)
4 (DIP)
Two digit year code, e.g., ‘03’
4 (SOIC) One digit year code, e.g., ‘3’
5
6
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
11
8-Pin DIP
Carrier Tape Specifications (FOD260L)
12.0 0.1
4.0 0.1
Ø1.55 0.05
1.75 0.10
4.90 0.20
4.0 0.1
0.30 0.05
7.5 0.1
16.0
10.30 0.20
0
13.2 0.2
Ø1.6 0.1
0.1 MAX
10.30 0.20
User Direction of Feed
Reflow Profile (FOD260L)
• Peak reflow temperature
260°C (package surface temperature)
• Time of temperature higher than 245°C
• Number of reflows
40 seconds or less
Three
10s
300
250
200
150
100
50
260°
245°
40s
50
100
150
200
250
Time (s)
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
12
8-Pin SOIC
Carrier Tape Specifications (FOD060L, FOD063L)
8.0 ± 0.10
3.50 ± 0.20
2.0 ± 0.05
Ø1.5 MIN
0.30 MAX
4.0 ± 0.10
1.75 ± 0.10
5.5 ± 0.05
12.0 ± 0.3
8.3 ± 0.10
5.20 ± 0.20
Ø1.5 ± 0.1/-0
6.40 ± 0.20
User Direction of Feed
0.1 MAX
Reflow Profile (FOD060L, FOD063L)
300
280
260
240
220
200
180
260°C
>245°C = 42 Sec
Time above
160
°C
183°C = 90 Sec
140
120
1.822°C/Sec Ramp up rate
100
80
60
40
20
0
33 Sec
0
60
120
180
270
360
Time (s)
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
13
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The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
®
*
AccuPower™
Auto-SPM™
F-PFS™
Power-SPM™
PowerTrench®
PowerXS™
FRFET®
The Power Franchise®
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
Programmable Active Droop™
QFET®
QS™
TinyBoost™
TinyBuck™
Quiet Series™
RapidConfigure™
™
TinyCalc™
Current Transfer Logic™
DEUXPEED®
Dual Cool™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
" SerDes™
Saving our world, 1mW/W/kW at a time™
SignalWise™
SmartMax™
EcoSPARK®
n
EfficientMax™
ESBC™
MicroPak™
SMART START™
®
SPM®
MicroPak2™
MillerDrive™
MotionMax™
Motion-SPM™
OptoHiT™
Fairchild®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
OPTOLOGIC®
UHC®
FAST®
OPTOPLANAR®
Ultra FRFET™
UniFET™
VCX™
FastvCore™
®
SyncFET™
Sync-Lock™
FETBench™
FlashWriter®
*
PDP SPM™
VisualMax™
XS™
FPS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
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LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a)
are intended for surgical implant into the body or (b) support or
sustain life, and (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on ourexternal website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
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are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet
Product Status
Definition
Identification
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Advance Information
Preliminary
Formative / In Design
First Production
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I49
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
www.fairchildsemi.com
14
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