FODM3052 [FAIRCHILD]

4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS; 4 -PIN FULL PITCH微型扁平封装随机相可控硅驱动器输出光电耦合器
FODM3052
型号: FODM3052
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS
4 -PIN FULL PITCH微型扁平封装随机相可控硅驱动器输出光电耦合器

驱动器 可控硅 光电 三端双向交流开关 输出元件
文件: 总8页 (文件大小:81K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
4-PIN FULL PITCH MINI-FLAT PACKAGE  
RANDOM PHASE TRIAC DRIVER  
OUTPUT OPTOCOUPLERS  
FODM3051  
FODM3052  
FODM3053  
DESCRIPTION  
The FODM305X series consists of a galium arsenide diode driving a silicon bilateral switch housed in a compact 4-pin mini-flat  
package. The lead pitch is 2.54 mm. The FODM305X series isolates low voltage logic from 115 and 240 Vac lines to provide  
random phase control of high current triacs or thyristors. It also features greatly enhanced static dv/dt capability to ensure stable  
switching performance of inductive loads.  
FEATURES  
PACKAGE DIMENSIONS  
Compact 4-pin surface mount package  
(2.4 mm maximum standoff height)  
Peak blocking voltage – 600V  
Guaranteed static dv/dt of 1000 V/µs  
Available in tape and reel quantities of  
500 and 2500.  
PIN 1  
0.026 (0.66)  
0.100 (2.54) TYP  
Applicable to Infrared Ray reflow  
(230°C max, 30 seconds.)  
0.020 (0.51)  
0.012 (0.30)  
0.287 (7.29)  
0.248 (6.30)  
BSI, CSA and VDE certifications pending  
UL (File# E90700) certified  
0.173 (4.40)  
TYP  
0.169 (4.29)  
0.154 (3.91)  
APPLICATIONS  
Solenoid/valve controls  
Interfacing microprocessors to  
115 and 240 Vac peripherals  
Temperature controls  
Solid state relays  
Lamp ballast  
Static AC power switch  
Motor control  
0.094 (2.39)  
0.079 (2.01)  
0.008 (0.20)  
0.000 (0.0)  
0.035 (0.89)  
0.012 (0.30)  
MAIN  
TERMINAL  
0.033 (0.85)  
0.026 (0.65)  
1
2
4
3
ANODE  
MAIN  
TERMINAL  
CATHODE  
NOTE  
All dimensions are in inches (millimeters)  
Incandescent lamp dimmers  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise specified)  
A
Parameter  
Symbol  
Value  
Units  
TOTAL PACKAGE  
Storage Temperature  
T
-40 to +125  
125  
°C  
°C  
°C  
STG  
T
Junction Temperature  
J
T
Operating Temperature  
-40 to +85  
OPR  
EMITTER  
I
Continuous Forward Current  
Peak Forward Current (1 µs pulse, 300 pps.)  
60  
1
mA  
A
F (avg)  
I
F (pk)  
V
Reverse Input Voltage  
3
V
R
Power Dissipation  
P
100  
mW  
D
(No derating required over operating temp. range)  
DETECTOR  
I
70  
mA (RMS)  
T(RMS)  
On-State RMS Current  
V
Off-State Output Terminal Voltage  
Power Dissipation  
600  
250  
V
DRM  
P
mW  
D
(No derating required over operating temp. range)  
© 2003 Fairchild Semiconductor Corporation  
Page 1 of 8  
11/10/03  
4-PIN FULL PITCH MINI-FLAT PACKAGE  
RANDOM PHASE TRIAC DRIVER  
OUTPUT OPTOCOUPLERS  
FODM3051  
FODM3052  
FODM3053  
ELECTRICAL CHARACTERISTICS (T = 25°C Unless otherwise specied)  
A
INDIVIDUAL COMPONENT CHARACTERISTICS  
Parameter  
Test Conditions  
Symbol Device  
Min  
Typ*  
Max  
Unit  
EMITTER  
I = 10 mA  
V
I
Input Forward Voltage  
All  
All  
1.20  
0.01  
1.5  
V
F
F
V = 3 V  
Reverse Leakage Current  
DETECTOR  
100  
µA  
R
R
V
= 600V, I = 0 (note 1)  
I
DRM  
Peak Blocking Current Either Direction  
Peak On-State Voltage Either Direction  
Critical Rate of Rise of Off-State Voltage  
All  
All  
All  
3
100  
2.5  
nA  
V
DRM  
F
I
= 100mA peak  
V
2.0  
TM  
TM  
I = 0 (Figure 8, note 2)  
dV/dt  
1000  
V/µs  
F
TRANSFER CHARACTERISTICS (T = 25°C Unless otherwise specied)  
A
DC Characteristics  
Test Conditions  
Symbol  
Device  
Min  
Typ*  
Max  
Unit  
FODM3051  
FODM3052  
FODM3053  
15  
10  
5
Main Terminal  
Voltage = 3V (note 3)  
I
LED Trigger Current  
mA  
FT  
Holding Current, Either Direc-  
tion  
I
All  
300  
µA  
H
ISOLATION CHARACTERISTICS (T = 25°C Unless otherwise specied)  
A
Characteristic  
Test Conditions  
Symbol  
Device  
Min  
Typ*  
Max  
Unit  
V
Steady State Isolation Voltage  
t = 1 Minute  
All  
3750  
V(RMS)  
ISO  
* All typicals at T = 25°C  
A
Note  
1. Test voltage must be applied within dv/dt rating.  
2. This is static dv/dt. See Figure 1 for test circuit. Commutating dv/dt is function of the load-driving thyristor(s) only.  
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating I lies  
F
FT  
F
between max I (15 mA for FODM3051, 10 mA for FODM3052, 5 mA for FODM3053) and absolute max I (60 mA).  
FT  
F
© 2003 Fairchild Semiconductor Corporation  
Page 2 of 8  
11/10/03  
4-PIN FULL PITCH MINI-FLAT PACKAGE  
RANDOM PHASE TRIAC DRIVER  
OUTPUT OPTOCOUPLERS  
FODM3051  
FODM3052  
FODM3053  
TYPICAL PERFORMANCE CURVES  
Fig. 1 LED Forward Voltage vs. Forward Current  
Fig. 2 Leakage Current vs. Ambient Temperature  
1000  
100  
10  
1.7  
VDRM = 600V  
1.6  
1.5  
1.4  
1.3  
T
= -40°C  
A
1.2  
1.1  
1.0  
0.9  
T
= 25°C  
= 85°C  
A
1
T
A
0.1  
-40  
-20  
0
20  
40  
60  
80  
100  
1
10  
100  
T
- AMBIENT TEMPERATURE (°C)  
I
- FORWARD CURRENT (mA)  
A
F
Fig. 3 Holding Current vs. Ambient Temperature  
Fig. 4 Trigger Current vs. Ambient Temperature  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
5
V
= 3V  
TM  
NORMALIZED TO T = 25°C  
NORMALIZED TO T = 25°C  
A
A
2
1.0  
0.5  
0.2  
0.1  
-40  
-20  
0
20  
40  
60  
80  
100  
100  
-40  
-20  
T
- AMBIENT TEMPERATURE (°C)  
A
T
- AMBIENT TEMPERATURE (°C)  
A
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width  
Fig. 6 Off-state Output Terminal Voltage vs. Ambient Temperature  
12  
10  
8
1.4  
T
=25°C  
NORMALIZED TO T = 25°C  
A
A
NORMALIZED TO PW >> 100µs  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
IN  
6
4
2
0
20  
40  
60  
80  
100  
-40  
-20  
0
1
10  
100  
T
- AMBIENT TEMPERATURE (°C)  
A
PW - LED TRIGGER PULSE WIDTH (µs)  
IN  
© 2003 Fairchild Semiconductor Corporation  
Page 3 of 8  
11/10/03  
4-PIN FULL PITCH MINI-FLAT PACKAGE  
RANDOM PHASE TRIAC DRIVER  
OUTPUT OPTOCOUPLERS  
FODM3051  
FODM3052  
FODM3053  
Fig. 7 On-State Characteristics  
800  
600  
400  
200  
0
T
= 25°C  
A
-200  
-400  
-600  
-800  
-6  
-4  
-2  
V
0
2
4
6
- ON-STATE VOLTAGE (V)  
TM  
1. The mercury wetted relay provides a high speed repeated  
pulse to the D.U.T.  
2. 100x scope probes are used, to allow high speeds and  
voltages.  
400V  
Vdc  
RTEST  
R = 10 k  
3. The worst-case condition for static dv/dt is established by  
triggering the D.U.T. with a normal LED input current, then  
CTEST  
removing the current. The variable R  
allows the dv/dt to  
TEST  
PULSE  
INPUT  
be gradually increased until the D.U.T. continues to trigger in  
response to the applied voltage pulse, even after the LED  
current has been removed. The dv/dt is then decreased until  
MERCURY  
WETTED  
RELAY  
X100  
SCOPE  
PROBE  
D.U.T.  
the D.U.T. stops triggering. τ is measured at this point and  
RC  
recorded.  
V
= 400 V  
max  
APPLIED VOLTAGE  
WAVEFORM  
252 V  
0.63 V  
252  
max  
dv/dt =  
=
τ
τ
0 VOLTS  
RC  
RC  
τ
RC  
Figure 8. Static dv/dt Test Circuit  
© 2003 Fairchild Semiconductor Corporation  
Page 4 of 8  
11/10/03  
4-PIN FULL PITCH MINI-FLAT PACKAGE  
RANDOM PHASE TRIAC DRIVER  
OUTPUT OPTOCOUPLERS  
FODM3051  
FODM3052  
FODM3053  
ORDERING INFORMATION  
Option  
Description  
V
VDE Approved  
R1  
Tape and Reel (500 units)  
Tape and Reel (2500 units)  
R2  
R3  
Tape and Reel (500 units; unit 180° rotated)  
Tape and Reel (2500 units; unit 180° rotated)  
R4  
R1V  
R2V  
R3V  
R4V  
Tape and Reel (500 units) and VDE Approved  
Tape and Reel (2500 units) and VDE Approved  
Tape and Reel (500 units; unit 180° rotated) and VDE Approved  
Tape and Reel (2500 units; unit 180° rotated) and VDE Approved  
MARKING INFORMATION  
1
2
3051  
6
V X YY M  
3
4
5
Definitions  
1
2
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE  
option See order entry table)  
3
4
5
6
One digit year code  
Two digit work week ranging from 01to 53’  
Assembly package code  
© 2003 Fairchild Semiconductor Corporation  
Page 5 of 8  
11/10/03  
4-PIN FULL PITCH MINI-FLAT PACKAGE  
RANDOM PHASE TRIAC DRIVER  
OUTPUT OPTOCOUPLERS  
FODM3051  
FODM3052  
FODM3053  
P
2
D0  
P
0
t
K0  
E
A0  
W
W
1
B0  
F
d
D1  
P
2.54 Pitch  
Description  
Symbol  
Dimensions (mm)  
12.00±0.4  
0.30±0.20  
4.00±0.20  
1.55±0.20  
1.75±0.20  
5.50±0.20  
2.00±0.20  
8.00±0.20  
4.40±0.20  
7.30±0.20  
2.30±0.20  
1.55±0.20  
9.20  
Tape Width  
W
t
Tape Thickness  
Sprocket Hole Pitch  
Sprocket Hole Dia.  
P
0
D
0
Sprocket Hole Location  
Pocket Location  
E
F
P
2
Pocket Pitch  
P
Pocket Dimension  
A0  
B0  
K0  
D1  
Pocket Hole Dia.  
Cover Tape Width  
Cover Tape Thickness  
W
1
d
0.065±0.02  
Max. Component Rotation or Tilt  
20˚ max  
R1  
R2  
R1  
R2  
Devices Per Reel  
500  
2500  
Reel Diameter  
178 mm (7")  
330 mm (13")  
© 2003 Fairchild Semiconductor Corporation  
Page 6 of 8  
11/10/03  
4-PIN FULL PITCH MINI-FLAT PACKAGE  
RANDOM PHASE TRIAC DRIVER  
OUTPUT OPTOCOUPLERS  
FODM3051  
FODM3052  
FODM3053  
Footprint Drawing for PCB Layout  
0.024 (0.61)  
0.060 (1.52)  
0.190 (4.83)  
0.310 (7.87)  
0.100 (2.54)  
Recommended Infrared Reflow Soldering Profile  
(heating)  
to 30 s  
230°C (peak temperature)  
210°C  
180°C  
to 60 s  
150 s  
90 s  
60 s  
Time (s)  
Peak reflow temperature: 230°C (package surface temperature) for 30 seconds  
Time of temperature higher than 210°C: 60 seconds or less  
One time soldering reflow is recommended  
© 2003 Fairchild Semiconductor Corporation  
Page 7 of 8  
11/10/03  
4-PIN FULL PITCH MINI-FLAT PACKAGE  
RANDOM PHASE TRIAC DRIVER  
OUTPUT OPTOCOUPLERS  
FODM3051  
FODM3052  
FODM3053  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO  
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME  
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in a significant injury of the user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
© 2003 Fairchild Semiconductor Corporation  
Page 8 of 8  
11/10/03  

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