FSA2269UMX [FAIRCHILD]
Low-Voltage Dual-SPDT (0.4ohm) Analog Switch with Negative Swing Audio Capability; 低电压双单刀双掷( 0.4ohm )模拟开关,可处理负摆幅音频功能型号: | FSA2269UMX |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Low-Voltage Dual-SPDT (0.4ohm) Analog Switch with Negative Swing Audio Capability |
文件: | 总2页 (文件大小:98K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ADVANCE INFORMATION
April 2007
FSA2269 / FSA2269TS Low-Voltage Dual-SPDT (0.4Ω)
Analog Switch with Negative Swing Audio Capability
Features
Description
The FSA2269 is a high-performance, dual Single-Pole
Double-Throw (SPDT) analog switch with negative swing
audio capability. The FSA2269 features ultra-low RON of
0.4Ω (typical) at 3.0V VCC. The FSA2269 operates over a
wide VCC range of 1.65V to 4.3V, is fabricated with sub-
micron CMOS technology to achieve fast switching
speeds, and is designed for break-before-make
operation. The select input is TTL-level compatible.
0.4Ω Typical On Resistance (RON) for +3.0V Supply
0.25Ω Maximum RON Flatness for +3.0V Supply
-3db Bandwidth: > 50MHz
Low-ICCT Current Over an Expanded Control Input
Range
Packaged in Pb-free 10-Lead MicroPak™ and UMLP
Power-Off Protection on Common Ports
The FSA2269 features very low quiescent current even
when the control voltage is lower than the VCC supply.
This feature suits mobile handset applications by
allowing direct interface with baseband processor
general-purpose I/Os with minimal battery consumption.
Broad VCC Operating Range: 1.65 to 4.3V
Noise Immunity Termination Resistors in FSA2269TS
The FSA2269TS includes termination resistors that
improve noise immunity during overshoot excursions,
off-isolation coupling, or “pop-minimization.”
Applications
Cell Phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
IMPORTANT NOTE:
For additional performance information, please contact
analogswitch@fairchildsemi.com.
Ordering Information
Part Number
Top Mark
Pb-Free
Package Description
FSA2269L10X
HL
Yes
10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1mm
10-Lead, Quad Ultrathin Molded Leadless Package
(UMLP), 1.4 x 1.8mm, 0.4mm pitch
FSA2269UMX
FSA2269TSL10X
FSA2269TSUMX
HP
HN
HS
Yes
Yes
Yes
10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1mm
10-Lead, Quad Ultrathin Molded Leadless Package
(UMLP), 1.4 x 1.8mm, 0.4mm pitch
Analog Symbols
1B0
1A
1B1
3µs
tON
S1
1B0
1B1
10k
1A
S1
GND
2B0
2B1
2B0
2B1
2A
2A
S2
3µs
tON
S2
10k
GND
Figure 1. FSA2269
Figure 2. FSA2269TS (with Slow Turn On)
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS Rev. 0.2.2
www.fairchildsemi.com
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an
exhaustive list of all such trademarks.
ACEx®
i-Lo™
Power-SPM™
PowerTrench®
Programmable Active Droop™
QFET®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyWire™
TruTranslation™
μSerDes™
UHC®
Across the board. Around the world.™
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
ImpliedDisconnect™
IntelliMAX™
ISOPLANAR™
MICROCOUPLER™
MicroPak™
MICROWIRE™
Motion-SPM™
MSX™
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
ScalarPump™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
CROSSVOLT™
CTL™
Current Transfer Logic™
DOME™
UniFET™
VCX™
Wire™
MSXPro™
OCX™
E2CMOS™
EcoSPARK®
EnSigna™
OCXPro™
OPTOLOGIC®
OPTOPLANAR®
PACMAN™
PDP-SPM™
POP™
FACT Quiet Series™
FACT®
FAST®
FASTr™
Power220®
Power247®
PowerEdge™
PowerSaver™
FPS™
FRFET®
TCM™
The Power Franchise®
™
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GTO™
HiSeC™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary
First Production
Full Production
Not In Production
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Obsolete
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I26
© 2007 Fairchild Semiconductor Corporation
FSA2269 / FSA2269TS Rev. 0.2.2
www.fairchildsemi.com
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