FSA3230UMX [FAIRCHILD]
High-Speed USB2.0 / Mobile High- Definition Link (MHLâ¢) with Negative Swing Audio; 高速USB2.0 /移动高清晰度链路（ MHLâ ?? ¢ ）与负电压音频
| 型号： | FSA3230UMX |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | High-Speed USB2.0 / Mobile High- Definition Link (MHLâ¢) with Negative Swing Audio |
| 文件： | 总3页 (文件大小：445K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
November 2012
FSA3230 — High-Speed USB2.0 / Mobile High-
Definition Link (MHL™) with Negative Swing Audio
Features
Description
The FSA3230 is a bi-directional, low-power, high-speed,
3:1, USB2.0, MHL™ and audio switch. Configured as a
double-pole, triple-throw (DP3T) switch, it is optimized
for switching between high- or full-speed USB, Mobile
High-Definition Link sources (per MHL Rev. 2.0
specification) and negative swing capable audio. A
Single-Pole, Double-Throw (SPDT) switch is provided
for ID. This ID switch provides path to support On-The-
Go (OTG) communication for the USB Path OR CBUS
for the MHL Path.
.
Low On Capacitance: 6 pF / 6 pF MHL / USB
(Typical)
.
.
.
.
.
.
.
Low Power Consumption: 30 μA Maximum
Supports MHL Rev. 2.0
MHL Data Rate: 4.0 Gbps
Audio Swing: -1.5 V to +1.5 V (Typical)
VBUS Powers Device with No VCC
Packaged in 16-Lead UMLP (1.8 x 2.6 mm)
The FSA3230 contains special circuitry on the switch
I/O pins, for applications where the VCC supply is
powered off (VCC=0), that allows the device to withstand
an over-voltage condition. This switch is designed to
minimize current consumption even when the control
voltage applied to the control pins is lower than the
supply voltage (VCC). This is especially valuable in
mobile applications, such as cell phones; allowing direct
interface with the general-purpose I/Os of the baseband
processor. Other applications include switching and
connector sharing in portable cell phones, digital
cameras, and notebook computers.
Over-Voltage Tolerance (OVT) on all USB Ports,
Up to 5.25 V without External Components
Applications
.
Cell Phones and Digital Cameras
Ordering Information
Part Number Top Mark Operating Temperature Range
Package
16-Lead, Ultrathin Molded Leadless Package
(UMLP), 1.8 x 2.6 mm
FSA3230UMX
LK
-40 to +85°C
© 2012 Fairchild Semiconductor Corporation
FSA3230 • Rev. 1.0.1
www.fairchildsemi.com
Physical Dimensions
2.10
0.563 (15X)
0.10
C
1.80
A
B
0.663
0.40
2X
1
2.60
2.90
PIN#1 IDENT
0.10
C
TOP VIEW
0.225 (16X)
2X
RECOMMENDED
LAND PATTERN
0.55 MAX.
0.152
0.10
0.08
0.05
0.00
C
C
TERMINAL SHAPE VARIANTS
SEATING
PLANE
C
0.40
0.60
SIDE VIEW
0.30
0.50
0.15
0.25
0.15
0.25
0.10
15X
15X
0.45
0.10
0.35
PIN 1
NON-PIN 1
5
Supplier 1
9
0.40
0.30
0.50
0.15
0.25
0.15
15X
0.25
0.30
0.50
15X
1
PIN 1
NON-PIN 1
PIN#1 IDENT
Supplier 2
13
0.25
0.15
16
0.55
0.45
0.10
0.05
C
C
A B
BOTTOM VIEW
R0.20
PACKAGE
EDGE
NOTES:
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
LEAD
OPTION 2
SCALE : 2X
LEAD
OPTION 1
SCALE : 2X
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
E. DRAWING FILENAME: MKT-UMLP16Arev4.
F. TERMINAL SHAPE MAY VARY ACCORDING
TO PACKAGE SUPPLIER, SEE TERMINAL
SHAPE VARIANTS.
Figure 20. 16-Lead, Ultrathin Molded Leadless Package (UMLP)
Description
Overall Height
Package Standoff
Lead Thickness
Lead Width
Nominal Values for MKT-UMLP16A Rev4 (mm)
0.50
0.012
0.15
0.20
Lead Length
0.40
Lead Pitch
0.40
Body Length (Y)
Body Width (X)
Min: 2.50, Nom: 2.60, Max: 2.70
Min: 1.70, Nom: 1.80, Max: 1.90
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2012 Fairchild Semiconductor Corporation
FSA3230 • Rev. 1.0.1
www.fairchildsemi.com
13
© 2012 Fairchild Semiconductor Corporation
FSA3230 • Rev. 1.0.1
www.fairchildsemi.com
14
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