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FUSB302 可编程Type-C/USB PD控制器FUSB302
Prototype PCB
Part No.:   FUSB302
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Description:   可编程Type-C/USB PD控制器FUSB302
File Size :   1298 K    
Page : 35 Pages
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Maker   FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]http://www.fairchildsemi.com
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FUSB302 — Programmable USB Type-C Controller w/PD
July 2015
FUSB302
Programmable USB Type-C Controller w/PD
Features
Dual-Role Functionality with Autonomous DRP
Toggle
Ability to connect as either a host or a device based
on what has been attached.
Software configurable either as a dedicated host,
dedicated device, or dual role.
Description
The FUSB302 targets system designers looking to
implement a DRP/DFP/UFP USB Type-C connector
with low amount of programmability.
The FUSB302 enables the USB Type-C detection
including attach, and orientation. The FUSB302
integrates the physical layer of the USB BMC power
delivery protocol to allow up to 100 W of power and role
swap. The BMC PD block enables full support for
alternative interfaces of the Type-C specification.
-
Dedicated devices can operate both on a Type-C
receptacle or a Type-C plug with a fixed CC and
VCONN channel.
Full Type-C 1.1 Support. Integrates the following
functionality of the CC pin
Applications
Smartphones
Tablets
Laptops
Notebooks
Power Adapters
Cameras
Dongles
-
Attach/Detach Detection as Host
-
Current Capability Indication as Host
-
Current Capability Detection as Device
-
Audio Adapter Accessory Mode
-
Debug Accessory Mode
-
Active Cable Detection
Integrates CCx to VCONN switch with over-current
limiting for powering USB3.1 Full Featured cables.
USB Power Delivery (PD) 2.0, Version 1.1 Support
-
Automatic GoodCRC Packet Response
-
Automatic retries of sending a packet if a
GoodCRC is not received
-
Automatic soft reset packet sent with retries if
needed
-
Automatic Hard Reset Ordered Set Sent
Dead Battery Support (UFP Mode Support when
No Power Applied)
Low Power Operation: I
CC
= 25 μA (Typical)
Packaged in 9-Ball WLCSP (1.215 mm x
1.260 mm) and 14-lead MLP (2.5 mm x 2.5 mm,
0.5 mm Pitch)
Figure 1.
Block Diagram
Ordering Information
Part Number
FUSB302UCX
FUSB302MPX
Operating
Temperature Range
-40 to 85°C
-40 to 85°C
Package
9-Ball Wafer-Level Chip Scale Package (WLCSP),
0.4 mm Pitch
14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch
Packing
Method
Tape and Reel
Tape and Reel
www.fairchildsemi.com
© 2015 Fairchild Semiconductor Corporation
FUSB302 • Rev. 1.7
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