H11L2MSR2 [FAIRCHILD]
6-PIN DIP OPTOISOLATORS LOGIC OUTPUT; 6引脚DIP光隔离器输出逻辑
| 型号： | H11L2MSR2 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | 6-PIN DIP OPTOISOLATORS LOGIC OUTPUT |
| 文件： | 总9页 (文件大小：517K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
PACKAGE
SCHEMATIC
1
2
6 VCC
ANODE
6
6
CATHODE
5 GND
1
1
VO
4
3
6
1
Truth Table
DESCRIPTION
Input
Output
The H11LXM series has a high speed integrated circuit detector optically
coupled to a gallium-arsenide infrared emitting diode. The output incorpo-
rates a Schmitt trigger, which provides hysteresis for noise immunity and
pulse shaping. The detector circuit is optimized for simplicity of operation
and utilizes an open collector output for maximum application flexibility.
H
L
L
H
FEATURES
•
•
High data rate, 1 MHz typical (NRZ)
Free from latch up and oscilliation throughout voltage and temperature
ranges.
•
•
•
•
•
•
Microprocessor compatible drive
Logic compatible output sinks 16 mA at 0.4 V maximum
Guaranteed on/off threshold hysteresis
Wide supply voltage capability, compatible with all popular logic systems
Underwriters Laboratory (UL) recognized—file #E90700, Volume 2
VDE recognized – File#102497 – Add option V (e.g., H11LIVM)
APPLICATIONS
•
•
•
•
•
•
Logic to logic isolator
Programmable current level sensor
Line receiver—eliminate noise and transient problems
A.C. to TTL conversion—square wave shaping
Digital programming of power supplies
Interfaces computers with peripherals
© 2003 Fairchild Semiconductor Corporation
Page 1 of 9
3/24/03
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
ABSOLUTE MAXIMUM RATINGS
Parameters
Symbol
Device
Value
Units
TOTAL DEVICE
T
T
Storage Temperature
Operating Temperature
All
All
All
-55 to +150
-40 to +85
°C
°C
STG
OPR
T
Lead Solder Temperature
Total Device Power Dissipation @ 25°C
Derate Above 25°C
260 for 10 sec
250
°C
SOL
mW
P
All
D
2.94
mW/°C
EMITTER
I
Continuous Forward Current
All
All
All
60
6
mA
V
F
V
Reverse Voltage
R
I (pk)
Forward Current - Peak (1 µs pulse, 300 pps)
LED Power Dissipation 25°C Ambient
Derate Linearly From 25°C
3.0
120
1.41
A
F
mW
P
All
D
mW/°C
DETECTOR
Detector Power Dissipation @ 25°C
Derate Linearly from 25°C
150
2.0
mW
mW/°C
V
P
All
D
V
Allowed Range
Allowed Range
V
All
All
All
0 to 16
45
65
O
V
V
3 to 16
50
V
CC
I Output Current
I
mA
4
O
ELECTRICAL CHARACTERISTICS (T = 25°C Unless otherwise specified.)
A
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters
EMITTER
Test Conditions
Symbol
Device
Min
Typ
Max
Units
I = 10 mA
1.2
1.0
1.5
F
V
Input Forward Voltage
All
V
F
I = 0.3 mA
0.75
F
V = 3 V
I
Reverse Current
Capacitance
All
All
10
µA
pF
R
R
C
V = 0, f = 1.0 MHz
100
J
DETECTOR
V
Operating Voltage Range
Supply Current
All
All
All
3
15
5.0
100
V
CC
I = 0, V = 5V
I
1.6
mA
µA
F
CC
CC(off)
I = 0, V = V = 15V
I
Output Current, High
F
CC
O
OH
© 2003 Fairchild Semiconductor Corporation
Page 2 of 9
3/24/03
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
ISOLATION CHARACTERISTICS
Parameters
Test Conditions
t =1 sec.
Symbol
Min
Typ
Max
Units
V
V
PEAK
Input-Output Isolation Voltage
Isolation Capacitance
Isolation Resistance
7500
ISO
V
= 0V, f = 1 MHz
C
0.4
0.6
pF
I-O
I-O
ISO
ISO
11
V
= 500 VDC
R
Ω
10
TRANSFER CHARACTERISTICS
DC Characteristics
Supply Current
Test Conditions
I = 10mA, V = 5V
Symbol
Device
Min
Typ
Max
Units
I
All
1.6
0.2
5.0
mA
V
F
CC
CC(on)
R =270Ω,V =5V, I =I
max.
V
Output Voltage, low
All
0.4
1.6
L
CC
F
F(on)
OL
H11L1M
H11L2M
H11L3M
All
R =270Ω, V = 5V
I
*
Turn-On Threshold Current
10.0
5.0
mA
mA
L
CC
F(on)
R =270Ω, V = 5V
I
F(off)
Turn-Off Threshold Current
Hysteresis Ratio
0.3
0.50
Min
1.0
0.75
Typ
L
CC
R =270Ω, V = 5V
I
/I
All
0.90
L
CC
F(off) F(on)
AC Characteristics
SWITCHING SPEED
Test Conditions
Symbol
Device
Max
Units
1.0
R =270Ω, V = 5V, I =I ,
F(on)
L
CC
F
t
Turn-On time
Fall Time
All
All
All
0.65
µs
µs
µs
on
T =25°C
A
4
4
0.1
.05
0.1
2.0
1.2
R =270Ω, V = 5V, I =I
,
,
,
L
CC
F
F(on)
F(on)
F(on)
t
f
T =25°C
A
R =270Ω, V = 5V, I =I
L
CC
F
t
Turn-Off Time
Rise time
off
T =25°C
A
0.1
0.07
0.1
R =270Ω, V = 5V, I =I
L
CC
F
t
All
All
µs
r
T =25°C
A
Data Rate
1.0
MHz
NOTE:
*Maximum I
is the maximum current required to trigger the output. For example, a 1.6mA maximum trigger current would
F(ON)
require the LED to be driven at a current greater than 1.6mA to guarantee the device will turn on. A 10% guard band is recom-
mended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 60mA.
© 2003 Fairchild Semiconductor Corporation
Page 3 of 9
3/24/03
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
C
I6
V
5V
IN
50%
5V
IF
0
1
2
H11L1
6
RE
RL
270Ω
4
VIN
VO
ton
toff
5
tr = t = 0.01µS
f
Z = 50Ω
10%
90%
VO
tf
tr
Figure 1. Switching Test Circuit and Waveforms
TYPICAL PERFORMANCE CURVES
Figure 2. Transfer Characteristics
Figure 3. Threshold Current vs. Supply Voltage
1.6
1.4
1.2
1.0
0.8
0.6
0.4
6
V
= 5V
CC
I
F NORMALIZED TO :
R = 270Ω
= 25°C
A
L
V
IF(ON) AT VCC = 5V
TA = 25oC
OH
T
5
4
3
2
1
0
TURN ON THRESHOLD
I
I
F(ON)
F(OFF)
TURN OFF THRESHOLD
V
OL
0
2
4
6
8
10
12
14
16
0
1
2
3
VCC - SUPPLY VOLTAGE (V)
I
- INPUT CURRENT (mA)
F
Figure 4. Threshold Current vs. Supply Temperature
Figure 5. Output Voltage, Low vs. Load Current
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
2
1
0.9
0.8
0.7
0.6
0.5
0.4
NORMALIZED TO :
VCC = 5V
TA = 25oC
0.3
0.2
IF = IF(ON)
CC = 5V
L = 270
V
-50
-25
0
25
50
75
100
R
TA - TEMPERATURE ( oC)
0.1
1
10
100
IO - LOAD CURRENT (mA)
© 2003 Fairchild Semiconductor Corporation
Page 4 of 9
3/24/03
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
TYPICAL PERFORMANCE CURVES
Figure 6. Supply Current vs. Supply Voltage
Figure 7. LED Forward Voltage vs. Forward Current
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
6
TA = 0 °C
5
25°C
IF = 5mA
70
°C
4
3
2
1
0
T
T
T
= 55°C
= 25°C
= 100°C
A
TA = 0°C
70°C
25°C
A
A
IF = 0mA
0
2
4
6
8
10
12
14
16
VCC - SUPPLY VOLTAGE (V)
1
10
100
I
- LED FORWARD CURRENT (mA)
F
© 2003 Fairchild Semiconductor Corporation
Page 5 of 9
3/24/03
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.100 (2.54)
0.015 (0.38)
0.025 (0.63)
0.020 (0.51)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
15°
0.035 (0.88)
0.006 (0.16)
0.100 (2.54)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
NOTE
All dimensions are in inches (millimeters)
© 2003 Fairchild Semiconductor Corporation
Page 6 of 9
3/24/03
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
ORDERING INFORMATION
Option/Order Entry Identifier
Description
S
Surface Mount Lead Bend
SR2
T
Surface Mount; Tape and reel
0.4" Lead Spacing
V
VDE 0884
TV
SV
SR2V
VDE 0884, 0.4" Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape & Reel
MARKING INFORMATION
1
2
6
H11L1
V X YY Q
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘3’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
*Note – ‘V’ option parts marked with date code ‘325’ or earlier are marked in portrait format.
© 2003 Fairchild Semiconductor Corporation
Page 7 of 9
3/24/03
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
Carrier Tape Specifications
12.0 0.1
2.0 0.05
4.5 0.20
Ø1.5 MIN
1.75 0.10
0.30 0.05
4.0 0.1
11.5 1.0
24.0 0.3
9.1 0.20
21.0 0.1
Ø1.5 0.1/-0
10.1 0.20
User Direction of Feed
0.1 MAX
NOTE
All dimensions are in inches (millimeters)
Reflow Profile
300
230°C, 10–30 s
250
245°C peak
200
150
Time above 183°C, 120–180 sec
Ramp up = 2–10°C/sec
100
50
0
• Peak reflow temperature: 245°C (package surface temperature)
• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
© 2003 Fairchild Semiconductor Corporation
Page 8 of 9
3/24/03
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
© 2003 Fairchild Semiconductor Corporation
Page 9 of 9
3/24/03
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