HCPL2611M [FAIRCHILD]
High Speed 10MBit/s Logic Gate Optocouplers; 高速的10Mbit / s的逻辑门光电耦合器
| 型号： | HCPL2611M |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | High Speed 10MBit/s Logic Gate Optocouplers |
| 文件： | 总13页 (文件大小：453K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
February 2010
Single-Channel: 6N137M, HCPL2601M, HCPL2611M
Dual-Channel: HCPL2630M, HCPL2631M (Preliminary)
High Speed 10MBit/s Logic Gate Optocouplers
Features
Description
■ Very high speed – 10 MBit/s
■ Superior CMR – 10 kV/µs
■ Fan-out of 8 over -40°C to +85°C
■ Logic gate output
■ Strobable output
■ Wired OR-open collector
■ U.L. recognized (File # E90700, Vol. 2)
The 6N137M, HCPL2601M, HCPL2611M single-channel
and HCPL2630M, HCPL2631M dual-channel optocou-
plers consist of a 850 nm AlGaAS LED, optically coupled
to a very high speed integrated photo-detector logic gate
with a strobable output. This output features an open col-
lector, thereby permitting wired OR outputs. The
switching parameters are guaranteed over the tempera-
ture range of -40°C to +85°C. A maximum input signal of
5mA will provide a minimum output sink current of 13mA
(fan out of 8).
Applications
■ Ground loop elimination
■ LSTTL to TTL, LSTTL or 5-volt CMOS
■ Line receiver, data transmission
■ Data multiplexing
An internal noise shield provides superior common
mode rejection of typically 10kV/µs. The HCPL2601M
and HCPL2631M has a minimum CMR of 5kV/µs. The
HCPL2611M has a minimum CMR of 10kV/µs.
■ Switching power supplies
■ Pulse transformer replacement
■ Computer-peripheral interface
Schematics
Package Outlines
8
8
VCC
N/C
+
1
8
VCC
+
1
8
1
1
VF1
_
VE
2
3
7
6
5
V01
2
3
7
6
5
VF
_
8
8
_
VO
V02
1
1
VF2
GND
N/C
4
GND
+
4
Truth Table (Positive Logic)
Input
Enable
Output
H
L
H
H
L
H
H
H
L
6N137M
HCPL2601M
HCPL2611M
HCPL2630M
HCPL2631M
(Preliminary)
H
L
L
L
(1)
A 0.1µF bypass capacitor must be connected between pins 8 and 5
.
H
L
NC
NC
H
©2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
Absolute Maximum Ratings (T = 25°C unless otherwise specified)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Value
Units
°C
T
Storage Temperature
Operating Temperature
Lead Solder Temperature
-40 to +125
-40 to +100
260 for 10 sec
STG
T
°C
OPR
T
°C
SOL
EMITTER
I
DC/Average Forward
Input Current
Single Channel
Dual Channel (Each Channel)
50
30
mA
V
F
V
V
Enable Input Voltage Not to Exceed Single Channel
by more than 500mV
5.5
E
V
CC
Reverse Input Voltage
Power Dissipation
Each Channel
5.0
100
45
V
R
P
Single Channel
mW
I
Dual Channel (Each Channel)
DETECTOR
V
Supply Voltage
Output Current
7.0
V
CC
(1 minute max)
I
Single Channel
50
50
7.0
85
60
mA
O
Dual Channel (Each Channel)
Each Channel
V
Output Voltage
V
O
P
Collector Output
Power Dissipation
Single Channel
mW
O
Dual Channel (Each Channel)
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
0
Max.
250
15
Units
µA
mA
V
I
Input Current, Low Level
FL
I
Input Current, High Level
Supply Voltage, Output
Enable Voltage, Low Level
Enable Voltage, High Level
Low Level Supply Current
Fan Out (TTL load)
*6.3
4.5
0
FH
V
5.5
CC
V
0.8
V
EL
V
2.0
-40
V
V
EH
CC
T
+85
8
°C
A
N
*6.3mA is a guard banded value which allows for at least 20% CTR degradation. Initial input current threshold value
is 5.0mA or less.
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
2
Electrical Characteristics (T = 0 to 70°C unless otherwise specified)
A
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Min. Typ.* Max. Unit
EMITTER
V
Input Forward Voltage
I = 10mA
1.8
V
V
F
F
T = 25°C
1.4
1.75
A
B
Input Reverse Breakdown
Voltage
I
= 10µA
R
5.0
VR
C
Input Capacitance
V = 0, f = 1MHz
60
pF
IN
F
∆V / ∆T
Input Diode Temperature
Coefficient
I = 10mA
-1.4
mV/°C
F
A
F
DETECTOR
I
High Level Supply Current
Low Level Supply Current
V
V
= 5.5V, I = 0mA,
= 0.5V
Single Channel
Dual Channel
6
10
8
10
15
13
mA
mA
CCH
CC
F
E
I
Single Channel
V
= 5.5V,
CC
CCL
I = 10mA
F
Dual Channel
V
= 0.5V
14
21
E
I
Low Level Enable Current
High Level Enable Current
High Level Enable Voltage
Low Level Enable Voltage
V
V
V
V
= 5.5V, V = 0.5V
-0.7
-0.5
-1.6
-1.6
mA
mA
V
EL
CC
CC
CC
CC
E
I
= 5.5V, V = 2.0V
E
EH
V
= 5.5V, I = 10mA
2.0
EH
F
(3)
V
= 5.5V, I = 10mA
0.8
V
EL
F
Switching Characteristics (T = -40°C to +85°C, V = 5V, I = 7.5mA unless otherwise specified)
A
CC
F
Symbol
AC Characteristics
Test Conditions
Min.
Typ.* Max. Unit
T
Propagation Delay
Time to Output HIGH
Level
R = 350Ω,
T = 25°C
20
40
75
ns
PLH
L
A
(4)
C = 15pF (Fig. 12)
L
100
(5)
T
Propagation Delay
Time to Output LOW
Level
T = 25°C
25
40
75
ns
PHL
A
R = 350Ω, C = 15pF (Fig. 12)
100
L
L
|T
–T
|
Pulse Width Distortion (R = 350Ω, C = 15pF (Fig. 12)
1
35
ns
ns
PHL PLH
L
L
(6)
t
Output Rise Time
(10–90%)
R = 350Ω, C = 15pF (Fig. 12)
30
r
L
L
(7)
t
Output Rise Time
(90–10%)
R = 350Ω, C = 15pF (Fig. 12)
10
15
ns
ns
f
L
L
(8)
(9)
t
t
Enable Propagation
Delay Time to Output
HIGH Level
I = 7.5mA, V = 3.5V, R = 350Ω, C = 15pF
ELH
EHL
F
EH
L
L
(Fig. 13)
Enable Propagation
Delay Time to Output
LOW Level
I = 7.5mA, V = 3.5V, R = 350Ω, C = 15pF
15
ns
F
EH
L
L
(Fig. 13)
|CM |
Common Mode
T = 25°C, |V | = 50V 6N137M, HCPL2630M
10,000
V/µs
H
A
CM
Transient Immunity
(at Output HIGH Level)
(Peak), I = 0mA,
F
HCPL2601M,
HCPL2631M
5000 10,000
V
(Min.) = 2.0V,
OH
(10)
R = 350Ω
(Fig. 14)
L
|V | = 400V
HCPL2611M
10,000 15,000
10,000
V/µs
CM
|CM |
Common Mode
R = 350Ω, I = 7.5mA, 6N137M, HCPL2630M
L
L
F
Transient Immunity
(at Output LOW Level) T = 25°C
V
(Max.) = 0.8V,
OL
HCPL2601M,
HCPL2631M
5000 10,000
(11)
(Fig. 14)
A
|V | = 400V
HCPL2611M
10,000 15,000
CM
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
3
Electrical Characteristics (Continued)
Transfer Characteristics (T = -40 to +85°C unless otherwise specified)
A
Symbol
DC Characteristics
Test Conditions
Min.
Typ.* Max.
Unit
I
HIGH Level Output Current
V
= 5.5V, V = 5.5V,
100
µA
OH
CC
O
(2)
I = 250µA, V = 2.0V
F
E
V
LOW Level Output Current
Input Threshold Current
V
= 5.5V, I = 5mA, V = 2.0V,
= 13mA
0.4
3
0.6
5
V
OL
CC
F
E
(2)
I
CL
I
V
= 5.5V, V = 0.6V, V = 2.0V,
mA
FT
CC
O
E
I
= 13mA
OL
Isolation Characteristics (T = -40°C to +85°C unless otherwise specified.)
A
Symbol
Characteristics
Test Conditions
Min.
Typ.*
Max.
Unit
I
Input-Output Insulation
Leakage Current
Relative humidity = 45%,
1.0*
µA
I-O
T = 25°C, t = 5s,
A
(12)
V
= 3000 VDC
I-O
V
Withstand Insulation Test
Voltage
RH < 50%, T = 25°C,
5000
V
RMS
ISO
A
(12)
I
≤ 10µA, t = 1 min.
I-O
(12)
11
R
C
Resistance (Input to Output)
V
= 500V
10
Ω
I-O
I-O
(12)
Capacitance (Input to Output) f = 1MHz
1
pF
I-O
*All Typicals at V = 5V, T = 25°C
CC
A
Notes:
1. The V supply to each optoisolator must be bypassed by a 0.1µF capacitor or larger. This can be either a ceramic
CC
or solid tantalum capacitor with good high frequency characteristic and should be connected as close as possible
to the package V and GND pins of each device.
CC
2. Each channel.
3. Enable Input – No pull up resistor required as the device has an internal pull up resistor.
4. t
– Propagation delay is measured from the 3.75mA level on the HIGH to LOW transition of the input current
PLH
pulse to the 1.5 V level on the LOW to HIGH transition of the output voltage pulse.
5. t – Propagation delay is measured from the 3.75mA level on the LOW to HIGH transition of the input current
PHL
pulse to the 1.5 V level on the HIGH to LOW transition of the output voltage pulse.
6. t – Rise time is measured from the 90% to the 10% levels on the LOW to HIGH transition of the output pulse.
r
7. t – Fall time is measured from the 10% to the 90% levels on the HIGH to LOW transition of the output pulse.
f
8. t
– Enable input propagation delay is measured from the 1.5V level on the HIGH to LOW transition of the input
ELH
voltage pulse to the 1.5V level on the LOW to HIGH transition of the output voltage pulse.
9. t – Enable input propagation delay is measured from the 1.5V level on the LOW to HIGH transition of the input
EHL
voltage pulse to the 1.5V level on the HIGH to LOW transition of the output voltage pulse.
10. CM – The maximum tolerable rate of rise of the common mode voltage to ensure the output will remain in the
H
HIGH state (i.e., V
> 2.0V). Measured in volts per microsecond (V/µs).
OUT
11. CM – The maximum tolerable rate of rise of the common mode voltage to ensure the output will remain in the
L
LOW output state (i.e., V
< 0.8V). Measured in volts per microsecond (V/µs).
OUT
12. Device considered a two-terminal device: Pins 1, 2, 3 and 4 shorted together, and Pins 5, 6, 7 and 8 shorted
together.
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
4
Typical Performance Curves
Fig. 1 Low Level Output Voltage vs. Ambient Temperature
Fig. 2 Input Diode Forward Voltage vs. Forward Current
0.8
I
V
V
= 5mA
F
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
= 2V
E
10
1
= 5.5V
CC
I
OL
= 12.8mA
I
OL
= 16mA
0.100
I
OL
= 6.4mA
I
OL
= 9.6mA
0.010
0.001
-40
-20
0
20
40
60
80
100
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
100
6
T
– AMBIENT TEMPERATURE (°C)
V
F
– FORWARD VOLTAGE (V)
A
Fig. 3 Switching Time vs. Forward Current
Fig. 4 Low Level Output vs. Ambient Temperature
120
100
80
50
V
= 5V
CC
= 25°C
T
A
45
40
I
I
= 15mA
= 10mA
F
R
R
= 4kΩ (t
= 1kΩ (t
)
)
L
L
PLH
F
R
= 350Ω (t
)
PLH
35
60
L
PLH
I
F
= 5mA
40
20
0
30
25
R
L
R
L
R
L
= 4kΩ (t
= 1kΩ (t
)
)
PHL
V
V
V
= 5V
CC
PHL
= 2V
E
= 0.6V
= 350Ω (t
)
OL
PHL
20
-40
-20
0
20
40
60
80
5
7
9
11
13
15
T
A
– AMBIENT TEMPERATURE (°C)
I
– FORWARD CURRENT (mA)
F
Fig. 5 Input Threshold Current vs. Ambient Temperature
Fig. 6 Output Voltage vs. Input Forward Current
6
5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
V
V
V
= 5V
CC
= 2V
E
= 0.6V
OL
4
3
2
R
= 350Ω
L
R
= 1kΩ
L
R
R
= 1kΩ
= 4kΩ
L
R
= 350Ω
L
L
R
1
= 4kΩ
L
1
0
-40
-20
0
20
40
60
80
100
0
2
3
4
5
T
A
– AMBIENT TEMPERATURE (°C)
I
- FORWARD CURRENT (mA)
F
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
5
Typical Performance Curves (Continued)
Fig. 7 Pulse Width Distortion vs. Temperature
Fig. 8 Rise and Fall Time vs. Temperature
60
500
400
300
200
100
0
I
V
= 7.5mA
F
I
F
= 7.5mA
= 5V
CC
50
40
30
20
10
0
V
= 5V
CC
R
= 4kΩ (t
)
L
R
R
= 4kΩ
L
R
R
= 1kΩ (t
)
L
L
R
R
= 1kΩ
L
= 350Ω (t
)
R
R
R
R
= 4kΩ (t
= 1kΩ (t
= 350Ω (t
)
L
L
L
F
R
= 350Ω
40
L
)
F
)
F
-100
-10
-40
-20
0
20
60
80
100
-40
-20
0
20
T – AMBIENT TEMPERATURE (°C)
A
40
60
80
100
T
A
– AMBIENT TEMPERATURE (°C)
Fig. 9 Enable Propagation Delay vs. Temperature
Fig. 10 Switching Time vs. Temperature
100
80
60
40
20
0
100
90
80
70
60
50
40
30
20
I
V
= 7.5mA
= 5V
F
I
V
= 7.5mA
F
CC
= 5V
CC
R
= 4kΩ (t )
PLH
L
R
= 4kΩ (t )
ELH
L
R
= 1kΩ (t )
PLH
L
R
L
= 1kΩ (t )
ELH
R
= 350Ω (t
)
PLH
L
R
R
R
= 4kΩ (t
= 1kΩ (t
)
)
L
L
L
PHL
R
= 350Ω (t )
ELH
L
PHL
= 350Ω (t
)
PHL
R
= 4kΩ/1kΩ/350Ω (t
)
EHL
L
-40
-20
0
20
40
60
80
100
-40
-20
0
20
T – AMBIENT TEMPERATURE (°C)
A
40
60
80
100
T
A
– AMBIENT TEMPERATURE (°C)
Fig. 11 High Level Output Current vs. Temperature
1.6
V
V
V
= 5V
= 5.5V
= 2V
CC
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
O
E
I
F
= 250µA
-40
-20
0
20
40
60
80
100
T
A
– AMBIENT TEMPERATURE (°C)
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
6
Test Circuits
Pulse
Generator
tr = 5ns
ZO= 50Ω
+5V
IF = 7.5 mA
VCC
IF = 3.75 mA
Input
(IF)
1
2
3
4
8
7
6
5
tPHL
tPLH
Output
(VO)
.1 µf
bypass
RL
1.5 V
Output
(VO)
Input
Monitor
(IF)
90%
10%
Output
(VO)
CL
47
GND
tf
tr
Fig. 12 Test Circuit and Waveforms for tPLH, tPHL, tr and tf
Pulse
Input
Monitor
(VE)
Generator
tr = 5ns
ZO= 50Ω
+5V
3.0 V
1.5 V
Input
(VE )
VCC
1
2
3
4
8
tEHL
tELH
7.5 mA
Output
(VO)
RL
7
.1 µf
bypass
1.5 V
Output
(VO)
6
CL
5
GND
Fig. 13 Test Circuit tEHL and tELH
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
7
Test Circuits (Continued)
VCC
+5V
1
2
3
4
8
7
6
5
IF
.1 µf
bypass
350Ω
A
B
Output
(VO)
VFF
GND
VCM
Pulse Gen
Peak
VCM
0V
5V
VO
CMH
Switching Pos. (A), IF= 0
VO (Min)
VO (Max)
Switching Pos. (B), IF = 7.5 mA
VO
CML
0.5 V
Fig. 14 Test Circuit Common Mode Transient Immunity
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
8
Package Dimensions
Through Hole
0.4" Lead Spacing (Option TV) (Pending)
PIN 1
ID.
PIN 1
ID.
1
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
0.390 (9.91)
0.370 (9.40)
0.156 (3.94)
0.144 (3.68)
0.070 (1.78)
0.045 (1.14)
0.390 (9.91)
0.370 (9.40)
0.020 (0.51)
MIN
0.200 (5.08)
MAX
0.156 (3.94)
0.144 (3.68)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.154 (3.90)
0.120 (3.05)
0.200 (5.08)
MAX
15° MAX
0.022 (0.56)
0.016 (0.41)
0.016 (0.40)
0.008 (0.20)
0.154 (3.90)
0.120 (3.05)
0.300 (7.62)
TYP
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.016 (0.40)
0.008 (0.20)
0.400 (10.16)
TYP
0.100 (2.54) TYP
0.031 (0.78)
Surface Mount – 0.3" Lead Spacing (Option S)
8-Pin Surface Mount DIP – Land Pattern
(Option S)
0.390 (9.91)
0.370 (9.40)
PIN 1
0.070 (1.78)
ID.
0.060 (1.52)
0.270 (6.86)
0.250 (6.35)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
0.030 (0.76)
0.156 (3.94)
0.144 (3.68)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0.015 (0.40) MIN
Both Sides
0.200 (5.08)
MAX
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.315 (8.00)
MIN
0.405 (10.30)
MAX.
Note:
All dimensions are in inches (millimeters)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
9
Ordering Information
Example Part
Option
Number
Description
No Suffix
6N137M
Standard Through Hole Device, 50 pcs per tube
Surface Mount Lead Bend
S
SD
V
6N137SM
6N137SDM
6N137VM
6N137TVM
6N137SVM
6N137SDVM
Surface Mount; Tape and Reel
IEC60747-5-2 approval pending (VDE)
TV
SV
SDV
IEC60747-5-2 approval pending (VDE), 0.4” lead spacing
IEC60747-5-2 approval pending (VDE), surface mount
IEC60747-5-2 approval pending (VDE), surface mount, tape and reel
Marking Information
1
2
6N137
6
V XX YY B
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table) (pending approval)
3
4
5
6
Two digit year code, e.g., ‘07’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
Note:
‘HCPL’ devices are marked only with the numerical characters (for example, HCPL2630 is
marked as ‘2630’).
The ‘M’ suffix on the part number is an order identifier only. It is used to identify orders for the
white package version. The ‘M’ does not appear on the device’s top mark.
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
10
Carrier Tape Specifications (Option SD)
D0
P0
P2
t
E
K0
F
W
W1
P
User Direction of Feed
d
D1
Symbol
Description
Dimension in mm
16.0 0.3
0.30 0.05
4.0 0.1
W
t
Tape Width
Tape Thickness
P
Sprocket Hole Pitch
Sprocket Hole Diameter
Sprocket Hole Location
Pocket Location
0
D
1.55 0.05
1.75 0.10
7.5 0.1
0
E
F
P
2.0 0.1
2
P
Pocket Pitch
12.0 0.1
10.30 0.20
10.30 0.20
4.90 0.20
13.2 0.2
0.1 max
A
Pocket Dimensions
0
0
0
B
K
W
Cover Tape Width
1
d
Cover Tape Thickness
Max. Component Rotation or Tilt
Min. Bending Radius
10°
R
30
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
11
Reflow Profile
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
T
P
260
240
220
200
180
160
140
120
100
80
t
P
T
L
Tsmax
t
L
Preheat Area
Tsmin
t
s
60
40
20
0
120
Time 25°C to Peak
240
360
Time (seconds)
Profile Freature
Pb-Free Assembly Profile
150°C
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
200°C
Time (t ) from (Tsmin to Tsmax)
60–120 seconds
3°C/second max.
217°C
S
Ramp-up Rate (t to t )
L
P
Liquidous Temperature (T )
L
Time (t ) Maintained Above (T )
60–150 seconds
260°C +0°C / –5°C
30 seconds
L
L
Peak Body Package Temperature
Time (t ) within 5°C of 260°C
P
Ramp-down Rate (T to T )
6°C/second max.
8 minutes max.
P
L
Time 25°C to Peak Temperature
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
12
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
FRFET®
PowerTrench®
PowerXS™
The Power Franchise®
AccuPower
Auto-SPM
Build it Now
CorePLUS
CorePOWER
CROSSVOLT
CTL
Current Transfer Logic
DEUXPEED®
Dual Cool™
EcoSPARK®
Global Power ResourceSM
Green FPS
Green FPS e-Series
Gmax
Programmable Active Droop
QFET®
TinyBoost
TinyBuck
QS
Quiet Series
RapidConfigure
GTO
IntelliMAX
ISOPLANAR
MegaBuck
MICROCOUPLER
MicroFET
MicroPak
MicroPak2
MillerDrive
MotionMax
TinyCalc
TinyLogic®
TINYOPTO
TinyPower
TinyPWM
TinyWire
Saving our world, 1mW/W/kW at a time™
SignalWise
SmartMax
EfficientMax
TriFault Detect
SMART START
®
SPM®
TRUECURRENT
SerDes
*
Fairchild®
STEALTH
SuperFET
SuperSOT -3
SuperSOT -6
SuperSOT -8
SupreMOS
Fairchild Semiconductor®
FACT Quiet Series
FACT®
Motion-SPM
OptoHiT™
UHC®
Ultra FRFET
UniFET
VCX
VisualMax
XS™
OPTOLOGIC®
FAST®
OPTOPLANAR®
FastvCore
®
SyncFET
FETBench
FlashWriter®
Sync-Lock™
*
PDP SPM™
Power-SPM
®
*
FPS
F-PFS
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
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Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Advance Information
Preliminary
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
First Production
Full Production
Not In Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
No Identification Needed
Obsolete
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I47
©2009 Fairchild Semiconductor Corporation
6N137M, HCPL2601M, HCPL2611M, HCPL2630M, HCPL2631M Rev. 1.0.3
www.fairchildsemi.com
13
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