J110_NL [FAIRCHILD]

Small Signal Field-Effect Transistor, 1-Element, N-Channel, Silicon, Junction FET, TO-92, LEAD FREE, TO-92, 3 PIN;
J110_NL
型号: J110_NL
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Small Signal Field-Effect Transistor, 1-Element, N-Channel, Silicon, Junction FET, TO-92, LEAD FREE, TO-92, 3 PIN

开关 晶体管
文件: 总7页 (文件大小:127K)
中文:  中文翻译
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J108/J109/J110/MMBFJ108  
N-Channel Switch  
3
This device is designed for digital switching  
applications where very low on resistance is  
mandatory.  
Sourced from Process 58.  
2
TO-92  
1. Drain 2. Source 3. Gate  
1
SuperSOT-3  
Marking: I8  
1
1. Drain 2. Source 3. Gate  
Absolute Maximum Ratings * T =25°C unless otherwise noted  
A
Symbol  
Parameter  
Value  
25  
Units  
V
V
V
Drain-Gate Voltage  
Gate-Source Voltage  
Forward Gate Current  
DG  
GS  
-25  
V
I
10  
mA  
°C  
GF  
T , T  
Operating and Storage Junction Temperature Range  
-55 ~ +150  
J
stg  
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.  
NOTES:  
1) These ratings are based on a maximum junction temperature of 150 degrees C.  
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.  
Electrical Characteristics T =25°C unless otherwise noted  
A
Symbol  
Parameter  
Test Condition  
Min.  
Max.  
Units  
Off Characteristics  
V
Gate-Source Breakdwon Voltage  
Gate Reverse Current  
I
= -10µA, V = 0  
-25  
V
(BR)GSS  
GSS  
G
DS  
I
V
V
= -15V, V = 0  
-3.0  
-200  
nA  
nA  
GS  
GS  
DS  
= -15V, V = 0, T = 100°C  
DS  
A
V
(off)  
Gate-Source Cutoff Voltage  
V
= 15V, I = 10nA  
108  
109  
110  
-3.0  
-2.0  
-0.5  
-10  
-6.0  
-4.0  
V
V
V
GS  
DS  
D
On Characteristics  
I
Zero-Gate Voltage Drain Current *  
V
V
= 15V, I = 0  
108  
109  
110  
80  
40  
10  
mA  
mA  
mA  
DSS  
DS  
DS  
GS  
r
(on)  
Drain-Source On Resistance  
0.1V, V = 0  
108  
109  
110  
8.0  
12  
18  
DS  
GS  
Small Signal Characteristics  
C
C
(on)  
Drain Gate & Source Gate On  
Capacitance  
V
= 0, V = 0, f = 1.0MHz  
85  
pF  
dg  
DS  
GS  
(off)  
sg  
dg  
C
C
(on)  
(off)  
Drain-Gate Off Capacitance  
Source-Gate Off Capacitance  
V
V
= 0, V = -10, f = 1.0MHz  
15  
15  
pF  
pF  
DS  
DS  
GS  
= 0, V = -10, f = 1.0MHz  
sg  
GS  
* Pulse Test: Pulse Width 300µs, Duty Cycle 2.0%  
©2002 Fairchild Semiconductor Corporation  
Rev. B1, November 2002  
Thermal Characteristics T =25°C unless otherwise noted  
A
Max.  
Symbol  
Parameter  
Units  
J108 - 110  
*MMBFJ108  
P
Total Device Dissipation  
Derate above 25°C  
625  
5.0  
350  
2.8  
mW  
mW/°C  
D
R
R
Thermal Resistance, Junction to Case  
125  
357  
°C/W  
°C/W  
θJC  
θJA  
Thermal Resistance, Junction to Ambient  
556  
* Device mounted on FR-4 PCB 1.6” × 1.6” × 0.06"  
©2002 Fairchild Semiconductor Corporation  
Rev. B1, November 2002  
Typical Characteristics  
100  
50  
1,000  
500  
100  
IDSS @ VDS = 5.0V, VGS = 0 PULSED  
- 2.0 V  
V GS = 0 V  
rDS @ VDS = 100mV, VGS = 0  
80  
V GS(off) @ VDS = 5.0V, I = 3.0 nA  
D
- 1.0 V  
- 3.0 V  
60  
40  
20  
0
r DS  
10  
5
100  
50  
- 4.0 V  
= 25  
T
°C  
A
I DSS  
TYP  
V
GS(off)  
= - 5.0 V  
- 5.0 V  
10  
_ 0.1  
_ 0.5  
_ 1  
_ 5  
_ 10  
0
0
0
0.4  
0.8  
1.2  
1.6  
2
-20  
1
VDS - DRAIN-SOURCE VOLTAGE (V)  
VGS (OFF) - GATE CUTOFF VOLTAGE (V)  
Figure 1. Common Drain-Source  
Figure 2. Parameter Interactions  
50  
40  
30  
20  
10  
0
100  
10  
= 25°C  
T
f = 0.1 - 1.0 MHz  
A
TYP  
V
= - 0.7 V  
GS(off)  
C
(V  
= 5.0V)  
DS  
iss  
V GS = 0 V  
C
(V  
= 0 )  
rss  
DS  
- 0.1 V  
- 0.2 V  
- 0.5 V  
- 0.4 V  
- 0.3 V  
-4  
-8  
-12  
-16  
0
1
2
3
4
5
VGS - GATE-SOURCE VOLTAGE (V)  
VDS - DRAIN-SOURCE VOLTAGE (V)  
Figure 3. Common Drain-Source  
Figure 4. Common Drain-Source  
100  
50  
V
= 10V  
DG  
100  
50  
BW = 6.0 Hz @ f = 10 Hz, 100 Hz  
V
@ 5.0V, 10 µA  
GS(off)  
= 0.21 @ f 1.0 kHz  
rDS  
20  
10  
5
rDS  
=
VGS  
_____  
10  
5
1 -  
VGS(off)  
I
= 1.0 mA  
D
I
= 10 mA  
D
2
1
1
0.2  
0.4  
0.6  
0.8  
0.01 0.03 0.1  
0.5  
1
2
10  
100  
VGS /VGS(off)- NORMALIZED GATE-SOURCE VOLTAGE (V)  
f - FREQUENCY (kHz)  
Figure 5. Normalized Drain Resistance vs  
Bias Voltage  
Figure 6. Noise Voltage vs Frequency  
©2002 Fairchild Semiconductor Corporation  
Rev. B1, November 2002  
Typical Characteristics(Continued)  
50  
40  
30  
20  
10  
0
10  
T
= 25°C  
A
V
= 1.5V  
DD  
8
6
4
2
0
V
V
V
=
=
=
- 8.5V  
- 5.5V  
- 3.5V  
GS(off)  
GS(off)  
GS(off)  
V
= - 12V  
GS(off)  
I
= 30 mA  
D
= 25  
°C  
T
A
I
= 10 mA  
D
V
= 1.5V  
DD  
V
= - 12V  
GS(off)  
0
-2  
-4  
-6  
-8  
-10  
0
5
10  
15  
20  
25  
VGS(off) - GATE-SOURCE CUTOFF VOLTAGE (V)  
I D - DRAIN CURRENT (mA)  
Gof
Figure 7. Switching Turn-On Time vs  
Gate-Source Cutoff Voltage  
Figure 8. Switching Turn-On Time vs Drain Current  
100  
V
= 0  
100  
GS  
50  
V
= 5.0V  
10V  
DG  
V
= - 3.0V  
GS(off)  
125°C  
5.0V  
15V  
V
GS(off)  
20V  
125°C  
- 4.0V  
10V  
10  
5
5.0V  
10  
1
15V  
10V  
25°C  
20V  
15V  
- 2.0V  
- 55°C  
20V  
25  
°C  
V
= - 5.0V  
= 25  
T
°C  
GS(off)  
A
- 1.0V  
f = 1.0 kHz  
1
1
10  
I D - DRAIN CURRENT (mA)  
100  
0.1  
1
10  
I D - DRAIN CURRENT (mA)  
Figure 9. On Resistance vs Drain Current  
Figure 10. Output Conductance vs Drain Current  
100  
7 00  
6 00  
= - 55°C  
T
T
T
T
= 25°C  
A
A
A
A
= 25°C  
V
= 10V  
DG  
°C  
=
125  
f = 1.0 kHz  
5 00  
T O -9 2  
S u p e rS O T -3  
4 00  
3 00  
2 00  
1 00  
0
10  
V
=
=
=
- 1.0V  
- 3.0V  
- 5.0V  
GS(off)  
GS(off)  
GS(off)  
V
V
1
0
2 5  
5 0  
7 5  
1 00  
1 25  
1 50  
0.1  
1
10  
o
ID - DRAIN CURRENT (mA)  
T E M P E R A T U R E  
( C )  
Figure 11. Transconductance vs Drain Current  
Figure 12. Power Dissipation vs Ambient Temperature  
©2002 Fairchild Semiconductor Corporation  
Rev. B1, November 2002  
Package Dimensions  
TO-92  
+0.25  
–0.15  
4.58  
0.46 ±0.10  
+0.10  
–0.05  
1.27TYP  
1.27TYP  
0.38  
[1.27 ±0.20  
]
[1.27 ±0.20]  
3.60 ±0.20  
(R2.29)  
Dimensions in Millimeters  
©2002 Fairchild Semiconductor Corporation  
Rev. B1, November 2002  
Package Dimensions (Continued)  
SuperSOT-3  
Dimensions in Millimeters  
©2002 Fairchild Semiconductor Corporation  
Rev. B1, November 2002  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not  
intended to be an exhaustive list of all such trademarks.  
ACEx™  
FACT™  
ImpliedDisconnect™ PACMAN™  
SPM™  
ActiveArray™  
Bottomless™  
CoolFET™  
CROSSVOLT™ FRFET™  
DOME™  
FACT Quiet series™ ISOPLANAR™  
POP™  
Stealth™  
FAST®  
LittleFET™  
MicroFET™  
MicroPak™  
Power247™  
PowerTrench®  
QFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
FASTr™  
GlobalOptoisolator™ MICROWIRE™  
QS™  
EcoSPARK™  
E2CMOS™  
EnSigna™  
Across the board. Around the world.™  
The Power Franchise™  
GTO™  
HiSeC™  
I2C™  
MSX™  
MSXPro™  
OCX™  
OCXPro™  
OPTOLOGIC®  
OPTOPLANAR™  
QT Optoelectronics™ TinyLogic™  
Quiet Series™  
TruTranslation™  
RapidConfigure™  
RapidConnect™  
UHC™  
UltraFET®  
SILENT SWITCHER® VCX™  
SMART START™  
Programmable Active Droop™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR  
CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In  
Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
©2002 Fairchild Semiconductor Corporation  
Rev. I1  

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