MM74HC08M_NL [FAIRCHILD]
AND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, PDSO14, 0.150 INCH, MS-012, SOIC-14;型号: | MM74HC08M_NL |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | AND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, PDSO14, 0.150 INCH, MS-012, SOIC-14 栅 |
文件: | 总7页 (文件大小:85K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
September 1983
Revised January 2005
MM74HC08
Quad 2-Input AND Gate
General Description
Features
The MM74HC08 AND gates utilize advanced silicon-gate
CMOS technology to achieve operating speeds similar to
LS-TTL gates with the low power consumption of standard
CMOS integrated circuits. The HC08 has buffered outputs,
providing high noise immunity and the ability to drive 10
LS-TTL loads. The 74HC logic family is functionally as well
as pin-out compatible with the standard 74LS logic family.
All inputs are protected from damage due to static dis-
charge by internal diode clamps to VCC and ground.
■ Typical propagation delay: 7 ns (tPHL), 12 ns (tPLH
)
■ Fanout of 10 LS-TTL loads
■ Quiescent power consumption: 2 µA maximum at room
temperature
■ Low input current: 1 µA maximum
Ordering Code:
Package
Order Number
Package Description
Number
MM74HC08M
M14A
M14A
M14D
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC08MX_NL
MM74HC08SJ
MM74HC08MTC
MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC08MTCX-NL MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
MM74HC08N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. (Tape and Reel not available in N14A)
Pb-Free package per JEDEC J-STD-020B.
Connection Diagram
Top View
© 2005 Fairchild Semiconductor Corporation
DS005297
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Absolute Maximum Ratings(Note 1)
(Note 2)
Recommended Operating
Conditions
Supply Voltage (VCC
DC Input Voltage (VIN
DC Output Voltage (VOUT
Clamp Diode Current (IIK, IOK
)
−0.5 to +7.0V
−1.5 to VCC +1.5V
−0.5 to VCC +0.5V
±20 mA
Min
Max
6
Units
)
Supply Voltage (VCC
DC Input or Output Voltage
(VIN, VOUT
)
2
0
V
V
)
VCC
)
)
DC Output Current, per pin (IOUT
)
±25 mA
Operating Temperature Range (TA) −40
+85
°C
DC VCC or GND Current, per pin
Input Rise or Fall Times
(ICC
)
±50 mA
(tr, tf)
V
V
V
CC = 2.0V
CC = 4.5V
CC = 6.0V
1000
500
ns
ns
ns
Storage Temperature Range (TSTG
Power Dissipation (PD)
(Note 3)
)
−65°C to +150°C
400
600 mW
500 mW
Note 1: Absolute Maximum Ratings are those values beyond which dam-
age to the device may occur.
S.O. Package only
Note 2: Unless otherwise specified all voltages are referenced to ground.
Lead Temperature (TL)
(Soldering 10 seconds)
Note 3: Power Dissipation temperature derating — plastic “N” package: −
12 mW/°C from 65°C to 85°C.
260°C
DC Electrical Characteristics (Note 4)
T
A = 25°C
TA = −40 to 85°C TA = −40 to 125°C
VCC
Symbol
Parameter
Conditions
Units
Typ
Guaranteed Limits
VIH
Minimum HIGH Level
Input Voltage
2.0V
4.5V
6.0V
2.0V
4.5V
6.0V
1.5
1.5
3.15
4.2
1.5
3.15
4.2
V
V
V
V
V
V
3.15
4.2
VIL
Maximum LOW Level
Input Voltage
0.5
0.5
0.5
1.35
1.8
1.35
1.8
1.35
1.8
VOH
Minimum HIGH Level
Output Voltage
V
IN = VIH
|IOUT| ≤ 20 µA
2.0V
4.5V
6.0V
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
V
V
V
IN = VIH
|IOUT| ≤ 4.0 mA
|IOUT| ≤ 5.2 mA
4.5V
6.0V
4.2
5.7
3.98
5.48
3.84
5.34
3.7
5.2
V
V
VOL
Maximum LOW Level
Output Voltage
V
IN = VIH or VIL
|IOUT| ≤ 20 µA
2.0V
4.5V
6.0V
0
0
0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
V
V
V
IN = VIH or VIL
|IOUT| ≤ 4.0 mA
|IOUT| ≤ 5.2 mA
4.5V
6.0V
0.2
0.2
0.26
0.26
±0.1
2.0
0.33
0.33
±1.0
20
0.4
0.4
V
V
IIN
Maximum Input Current
Maximum Quiescent
Supply Current
V
V
IN = VCC or GND 6.0V
IN = VCC or GND 6.0V
±1.0
40
µA
µA
ICC
I
OUT = 0 µA
Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage cur-
rent (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
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2
AC Electrical Characteristics
VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns
Guaranteed
Limit
Symbol
Parameter
Conditions
Typ
Units
tPHL
Maximum Propagation
12
20
ns
Delay, Output HIGH-to-LOW
Maximum Propagation
tPLH
7
15
ns
Delay, Output LOW-to-HIGH
AC Electrical Characteristics
VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified)
T
A = 25°C
T
A = −40 to 125°C
VCC
Symbol
tPHL
Parameter
Conditions
Units
Typ
77
15
13
30
10
8
Guaranteed Limits
Maximum Propagation Delay,
Output HIGH-to-LOW
2.0V
121
175
35
ns
ns
ns
ns
ns
ns
ns
ns
ns
pF
pF
4.5V
6.0V
2.0V
4.5V
6.0V
2.0V
4.5V
6.0V
24
20
90
18
15
75
15
13
30
tPLH
Maximum Propagation Delay,
Output LOW-to-HIGH
134
27
23
t
TLH, tTHL
Maximum Output
Rise and Fall Time
30
8
110
22
7
19
CPD
CIN
Power Dissipation Capacitance (Note 5)
Maximum Input Capacitance
(per gate)
38
4
10
10
Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption,
S = CPD VCC f + ICC
I
.
3
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Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
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4
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
5
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
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6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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7
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