MOC3033T [FAIRCHILD]
Triac Output Optocoupler With Zero CRSVR, 1-Element, 7500V Isolation, DIP-6;型号: | MOC3033T |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Triac Output Optocoupler With Zero CRSVR, 1-Element, 7500V Isolation, DIP-6 三端双向交流开关 输出元件 光电 |
文件: | 总7页 (文件大小:164K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GlobalOptoisolator
(250 Volts Peak)
The MOC3031, MOC3032 and MOC3033 devices consist of gallium arsenide
infrared emitting diodes optically coupled to a monolithic silicon detector
performing the function of a Zero Voltage crossing bilateral triac driver.
They are designed for use with a triac in the interface of logic systems to
equipment powered from 115 Vac lines, such as teletypewriters, CRTs, printers,
motors, solenoids and consumer appliances, etc.
•
•
•
•
Simplifies Logic Control of 115 Vac Power
Zero Voltage Crossing
6
1
dv/dt of 2000 V/µs Typical, 1000 V/µs Guaranteed
STANDARD THRU HOLE
To order devices that are tested and marked per VDE 0884 requirements, the
suffix ”V” must be included at end of part number. VDE 0884 is a test option.
Recommended for 115 Vac(rms) Applications:
•
•
•
•
Solenoid/Valve Controls
Lighting Controls
• Temperature Controls
• E.M. Contactors
COUPLER SCHEMATIC
Static Power Switches
AC Motor Drives
• AC Motor Starters
• Solid State Relays
1
2
3
6
5
4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Rating
INFRARED LED
Symbol
Value
Unit
ZERO
CROSSING
CIRCUIT
Reverse Voltage
V
3
Volts
mA
R
1. ANODE
Forward Current — Continuous
I
F
60
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
Total Power Dissipation @ T = 25°C
Negligible Power in Output Driver
Derate above 25°C
P
D
120
mW
A
1.41
mW/°C
OUTPUT DRIVER
5. DO NOT CONNECT
6. MAIN TERMINAL
Off–State Output Terminal Voltage
V
250
1
Volts
A
DRM
Peak Repetitive Surge Current
(PW = 100 µs, 120 pps)
I
TSM
Total Power Dissipation @ T = 25°C
Derate above 25°C
P
D
150
1.76
mW
mW/°C
A
TOTAL DEVICE
(1)
Isolation Surge Voltage
(Peak ac Voltage, 60 Hz, 1 Second Duration)
V
ISO
7500
Vac(pk)
Total Power Dissipation @ T = 25°C
Derate above 25°C
P
D
250
2.94
mW
mW/°C
A
Junction Temperature Range
Ambient Operating Temperature Range
Storage Temperature Range
Soldering Temperature (10 s)
T
–40 to +100
–40 to +85
–40 to +150
260
°C
°C
°C
°C
J
T
A
T
stg
T
L
1. Isolation surge voltage, V
, is an internal device dielectric breakdown rating.
1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.
ISO
MOC3031, MOC3032, MOC3033
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
INPUT LED
Symbol
Min
Typ
Max
Unit
Reverse Leakage Current
(V = 3 V)
R
I
—
—
0.05
1.3
100
1.5
µA
R
Forward Voltage
(I = 30 mA)
F
V
Volts
F
OUTPUT DETECTOR (I = 0 unless otherwise noted)
F
Leakage with LED Off, Either Direction
I
DRM1
—
—
10
1.8
100
3
nA
(1)
(Rated V
DRM
)
Peak On–State Voltage, Either Direction
(I = 100 mA Peak)
V
TM
Volts
V/µs
TM
Critical Rate of Rise of Off–State Voltage
dv/dt
1000
2000
—
COUPLED
LED Trigger Current, Current Required to Latch Output
I
mA
FT
(2)
(Main Terminal Voltage = 3 V
)
MOC3031
MOC3032
MOC3033
—
—
—
—
—
—
15
10
5
Holding Current, Either Direction
I
—
250
—
—
—
µA
H
Isolation Voltage (f = 60 Hz, t = 1 sec)
V
7500
Vac(pk)
ISO
ZERO CROSSING
Inhibit Voltage
V
—
—
5
20
Volts
IH
(I = Rated I , MT1–MT2 Voltage above which device will not
F
FT
trigger.)
Leakage in Inhibited State
(I = Rated I , Rated V
F
I
DRM2
—
500
µA
, Off State)
FT DRM
1. Test voltage must be applied within dv/dt rating.
2. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating I lies between max
F
FT
F
2. I (15 mA for MOC3031, 10 mA for MOC3032, 5 mA for MOC3033) and absolute max I (60 mA).
FT
F
TYPICAL ELECTRICAL CHARACTERISTICS
T
A
= 25°C
OUTPUT PULSE WIDTH – 80
= 30 mA
µs
NORMALIZED TO
+800
+600
+400
+200
0
1.3
1.2
1.1
I
T
= 25°C
F
A
f = 60 Hz
= 25°C
T
A
1
–200
–400
–600
–800
0.9
0.8
0.7
–4
–3
–2
–1
0
1
2
3
4
–40
–20
0
20
40
60
C)
80
100
V
, ON–STATE VOLTAGE (VOLTS)
T , AMBIENT TEMPERATURE (
°
TM
A
Figure 1. On–State Characteristics
Figure 2. Trigger Current versus Temperature
MOC3031, MOC3032, MOC3033
500
1.5
1.4
I
= 0
200
100
50
F
1.3
1.2
1.1
I
= RATED I
FT
F
1
0.9
20
10
5
0.8
0.7
0.6
–40 –20
0
20
40
60
80
100
–40
–20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE (
°C)
T , AMBIENT TEMPERATURE (°C)
A
A
Figure 3. I
, Peak Blocking Current
Figure 4. I
, Leakage in Inhibit State
versus Temperature
DRM1
DRM2
versus Temperature
25
20
NORMALIZED TO:
PW 100
µs
in
= 25
T
°C
A
15
10
5
0
1
2
5
10
20
50
100
PW , LED TRIGGER WIDTH (
µs)
in
Figure 5. LED Current Required to Trigger
versus LED Pulse Width
+250
Vdc
R
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
TEST
R = 10 k
Ω
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst–case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
C
PULSE
INPUT
TEST
MERCURY
WETTED
RELAY
X100
SCOPE
PROBE
removingthecurrent.ThevariableR
allowsthedv/dttobe
TEST
gradually increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
D.U.T.
the D.U.T. stops triggering.
recorded.
is measured at this point and
RC
V
= 250 V
max
APPLIED VOLTAGE
WAVEFORM
158 V
RC
0.63 V
max
RC
158
RC
dv dt
0 VOLTS
Figure 6. Static dv/dt Test Circuit
MOC3031, MOC3032, MOC3033
Typical circuit for use when hot line switching is required.
In this circuit the “hot” side of the line is switched and the
load connected to the cold or neutral side. The load may be
connected to either the neutral or hot line.
V
R
CC
180
Ω
in
1
6
HOT
5
2
3
MOC3031/
3032/3033
39
R
is calculated so that I is equal to the rated I of the
in
F
FT
115 VAC
part, 5 mA for the MOC3033, 10 mA for the MOC3032, or
15 mA for the MOC3031. The 39 ohm resistor and 0.01 µF
capacitor are for snubbing of the triac and may or may not
be necessary depending upon the particular triac and load
used.
4
0.01
LOAD
1 k
NEUTRAL
* For highly inductive loads (power factor < 0.5), change this value to
360 ohms.
Figure 7. Hot–Line Switching Application Circuit
115 VAC
D1
R1
Suggested method of firing two, back–to–back SCR’s,
with a Motorola triac driver. Diodes can be 1N4001; resis-
tors, R1 and R2, are optional 1 k ohm.
1
2
6
5
4
V
CC
R
in
MOC3031/
3032/3033
SCR
SCR
180
Ω
3
NOTE: This optoisolator should not be used to drive a load directly.
It is intended to be a trigger device only.
D2
R2
LOAD
Figure 8. Inverse–Parallel SCR Driver Circuit
MOC3031, MOC3032, MOC3033
PACKAGE DIMENSIONS
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
6
4
3
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–B–
1
INCHES
MILLIMETERS
DIM
A
B
C
D
E
MIN
MAX
0.350
0.260
0.200
0.020
0.070
0.014
MIN
8.13
6.10
2.93
0.41
1.02
0.25
MAX
8.89
6.60
5.08
0.50
1.77
0.36
C
F 4 PL
L
0.320
0.240
0.115
0.016
0.040
0.010
N
F
–T–
SEATING
PLANE
K
G
J
K
L
M
N
0.100 BSC
2.54 BSC
0.008
0.100
0.012
0.150
0.21
2.54
0.30
3.81
J 6 PL
G
0.300 BSC
7.62 BSC
M
M
M
0.13 (0.005)
T
B
A
M
0
15
0
15
E 6 PL
0.015
0.100
0.38
2.54
D 6 PL
M
M
M
0.13 (0.005)
T
A
B
STYLE 6:
PIN 1. ANODE
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
6. MAIN TERMINAL
THRU HOLE
–A–
6
4
3
NOTES:
–B–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
1
INCHES
MILLIMETERS
DIM
A
B
C
D
E
MIN
MAX
0.350
0.260
0.200
0.020
0.070
0.014
MIN
8.13
6.10
2.93
0.41
1.02
0.25
MAX
8.89
6.60
5.08
0.50
1.77
0.36
L
F 4 PL
0.320
0.240
0.115
0.016
0.040
0.010
H
C
F
–T–
SEATING
PLANE
G
H
J
K
L
0.100 BSC
2.54 BSC
G
J
0.020
0.008
0.006
0.320 BSC
0.332
0.025
0.012
0.035
0.51
0.20
0.16
8.13 BSC
8.43
0.63
0.30
0.88
K 6 PL
0.13 (0.005)
M
E 6 PL
M
M
M
T
B
A
D 6 PL
S
0.390
9.90
M
M
0.13 (0.005)
T
A
B
SURFACE MOUNT
MOC3031, MOC3032, MOC3033
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
6
4
3
–B–
INCHES
MILLIMETERS
1
DIM
A
B
C
D
E
MIN
MAX
0.350
0.260
0.200
0.020
0.070
0.014
MIN
8.13
6.10
2.93
0.41
1.02
0.25
MAX
8.89
6.60
5.08
0.50
1.77
0.36
0.320
0.240
0.115
0.016
0.040
0.010
L
N
F 4 PL
F
C
G
J
K
L
0.100 BSC
2.54 BSC
0.008
0.100
0.400
0.015
0.012
0.150
0.425
0.040
0.21
2.54
0.30
3.81
–T–
SEATING
PLANE
10.16
0.38
10.80
1.02
N
G
J
K
D 6 PL
0.13 (0.005)
E 6 PL
M
M
M
T
A
B
0.4" LEAD SPACING
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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© 2000 Fairchild Semiconductor Corporation
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