MOC8050SVM [FAIRCHILD]
Photodarlington Optocoupler (No Base Connection); 光电复合光耦（无底座的连接）
| 型号： | MOC8050SVM |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Photodarlington Optocoupler (No Base Connection) |
| 文件： | 总9页 (文件大小：259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
November 2007
MOC8021M, MOC8050M
Photodarlington Optocoupler (No Base Connection)
tm
Features
Description
■ High BV
The MOC8021M and MOC8050M are photodarlington-
type optically coupled optocoupler. The devices have a
gallium arsenide infrared emitting diode coupled with a
silicon darlington phototransistor.
CEO
– Minimum 50V (MOC8021M)
– Minimum 80V (MOC8050M)
■ High current transfer ratio:
– Minimum 1,000% (MOC8021M)
– Minimum 500% (MOC8050M)
■ 500%
■ No base connection for improved noise immunity
■ Underwriters Laboratory (UL) recognized
File #E90700, Volume 2
■ IEC 60747-5-2 approved (ordering option V)
Applications
■ Appliances, measuring instruments
■ I/O interface for computers
■ Programmable controllers
■ Portable electronics
■ Interfacing and coupling systems of different
potentials and impedance
■ Solid state relays
Schematic
N/C
ANODE 1
6
CATHODE
N/C
COLLECTOR
EMITTER
2
3
5
4
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
Absolute Maximum Ratings (T = 25°C Unless otherwise specified.)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Value
Units
TOTAL DEVICE
T
Storage Temperature
Operating Temperature
-55 to +150
-40 to +100
260 for 10 sec
250
°C
°C
STG
T
OPR
T
Lead Solder Temperature (Wave solder)
°C
SOL
P
Total Device Power Dissipation @ T = 25°C
mW
mW/°C
D
A
Derate above 25°C
2.94
EMITTER
I
DC/Average Forward Input Current
Reverse Input Voltage
60
3
mA
V
F
V
P
R
D
LED Power Dissipation @ T = 25°C
120
1.41
mW
A
Derate above 25°C
mW/°C
DETECTOR
V
Collector-Emitter Voltage
MOC8021M
CEO
50
80
V
MOC8050M
P
Detector Power Dissipation @ T = 25°C
150
1.76
150
mW
mW/°C
mA
D
A
Derate above 25°C
I
Continuous Collector Current
C
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
2
Electrical Characteristics (T = 25°C Unless otherwise specified.)
A
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.*
Max.
Unit
EMITTER
V
Input Forward Voltage
Reverse Leakage Current
DETECTOR
I = 10mA
1.18
2.00
10
V
F
F
I
V = 3.0V
0.001
µA
R
R
BV
Collector-Emitter Breakdown Voltage I = 1.0mA, I = 0
C F
CEO
MOC8021M
MOC8050M
50
80
100
100
V
BV
Emitter-Collector Breakdown Voltage I = 100µA, I = 0
5
10
V
ECO
E
F
I
Collector-Emitter Dark Current
Capacitance
V
= 60V, I = 0
1
µA
pF
CEO
CE
CE
F
C
V
= 0V, f = 1MHz
8
CE
Transfer Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.*
Max.
Unit
DC CHARACTERISTICS
CTR
Current Transfer Ratio,
Collector to Emitter
MOC8021M
I = 10mA, V = 5V
1,000
500
%
F
CE
MOC8050M
I = 10mA, V = 1.5V
F CE
AC CHARACTERISTICS
t
Non-Saturated Turn-on Time I = 5mA, V = 10V,
8.5
95
µs
µs
on
F
CC
R = 100Ω
L
t
Turn-off Time
I = 5mA, V = 10V,
F CC
off
R = 100Ω
L
Isolation Characteristics
Symbol Characteristic
Test Conditions
Min.
Typ. Max.
Units
Vac(pk)
Ω
V
R
C
Input-Output Isolation Voltage
Isolation Resistance
f = 60Hz, t = 1 sec.
7500
ISO
ISO
ISO
11
V
V
= 500VDC
10
I-O
I-O
Isolation Capacitance
= Ø, f = 1MHz
0.2
2
pF
Note:
*Typical values at T = 25°C
A
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
3
Typical Performance Curves
Fig. 2 Normalized CTR vs. Forward Current
Fig. 1 LED Forward Voltage vs. Forward Current
1.8
V
T
= 10V
Normalized to I = 10 mA
CE
F
= 25oC
1.6
1.4
A
= -40oC
T
A
= 0oC, 25oC
T
A
1
T
= -40oC
A
1.2
1.0
0.8
0.6
T
= 7 oC
0
A
T
T
= 25oC
T
= 110oC
A
A
A
= 110oC
0.1
0.1
1
10
100
0.1
1
10
100
I
- LED FORWARD CURRENT (mA)
I
- FORWARD CURRENT (mA)
F
F
Fig. 4 Turn-on Time vs. Forward Current
1000
100
10
Fig. 3 Normalized CTR vs. Ambient Temperature
V
T
= 10V
CC
1.6
1.4
1.2
1.0
0.8
0.6
0.4
= 25oC
R
= 1kΩ
L
Normalized to T = 25oC
I
= 10mA
= 10V
A
F
A
V
CE
R
= 100Ω
= 10Ω
L
R
L
1
0.1
0.1
-40
-20
0
A
20
40
60
80
100
120
1
10
100
T
- AMBIENT TEMPERATURE (°C)
I
- FORWARD CURRENT (mA)
F
Fig. 6 Normalized Collector-Emitter Current
vs. Collector-Emitter Voltage
Fig. 5 Turn-off Time vs. Forward Current
16
14
12
10
8
V
T
= 10V
Normalized to:
= 25oC
CC
T
A
= 25oC
I
= 1 mA, V = 5V
CE
F
A
1000
I
= 10 mA
F
R
= 1KΩ
L
I
= 5 mA
F
100
R
= 100Ω
= 10Ω
L
6
R
L
10
1
4
I
I
= 2 mA
F
2
= 1 mA
5
F
0
0
1
10
100
0
1
2
3
4
6
7
8
9
10
I
- FORWARD CURRENT (mA)
V
CE
- COLLECTOR-EMITTER VOLTAGE (V)
F
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
4
Typical Performance Curves (Continued)
Fig. 7 Dark Current vs. Ambient Temperature
100,000
10,000
1.000
100
V
= 10V
CE
10
1
0.1
0.01
-40
-20
0
20
60
80
100
120
40
T
- AMBIENT TEMPERATURE (°C)
A
TEST CIRCUIT
WAVE FORMS
VCC = 10V
INPUT PULSE
IC
IF
RL
10%
90%
INPUT
OUTPUT
OUTPUT PULSE
RBE
tr
tf
toff
ton
IF to produce IC = 2 mA
Adjust
Figure 8. Switching Time Test Circuit and Waveforms
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
5
Package Dimensions
Through Hole
Surface Mount
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
Pin 1 ID
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.025 (0.63)
0.020 (0.51)
0.100 (2.54)
0.015 (0.38)
0.100 [2.54]
0.035 (0.88)
0.006 (0.16)
0.020 (0.50)
0.016 (0.41)
0.020 (0.50)
0.016 (0.41)
15°
0.100 (2.54)
0.012 (0.30)
0.4" Lead Spacing
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.014 (0.36)
0.010 (0.25)
0.030 (0.76)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.21)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
0.425 (10.80)
0.400 (10.16)
Note:
All dimensions are in inches (millimeters).
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
6
Ordering Information
Order Entry Identifier
(Example)
Option
Description
No suffix
MOC8050M
MOC8050SM
Standard Through Hole Device (50 parts per tube)
Surface Mount Lead Bend
S
SR2
T
MOC8050SR2M
MOC8050TM
Surface Mount; Tape and Reel
0.4" Lead Spacing
V
MOC8050VM
IEC60747-5-2
TV
MOC8050TVM
MOC8050SVM
MOC8050SR2VM
IEC60747-5-2, 0.4" Lead Spacing
IEC60747-5-2, Surface Mount
IEC60747-5-2, Surface Mount, Tape and Reel
SV
SR2V
Marking Information
1
2
MOC8050
V X YY Q
6
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘7’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
7
Tape Dimensions
12.0 ± 0.1
2.0 ± 0.05
4.5 ± 0.20
Ø1.5 MIN
1.75 ± 0.10
4.0 ± 0.1
0.30 ± 0.05
11.5 ± 1.0
24.0 ± 0.3
9.1 ± 0.20
21.0 ± 0.1
Ø1.5 ± 0.1/-0
10.1 ± 0.20
User Direction of Feed
0.1 MAX
Note:
All dimensions are in millimeters.
Reflow Soldering Profile
300
280
260
240
220
200
180
160
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
°C
140
120
100
80
60
40
20
0
1.822°C/Sec Ramp up rate
33 Sec
0
60
120
180
270
360
Time (s)
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
8
TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx®
Power247®
Green FPS™
Green FPS™ e-Series™
GTO™
i-Lo™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
SuperSOT™-8
POWEREDGE®
Power-SPM™
PowerTrench®
Programmable Active Droop™
QFET®
Build it Now™
CorePLUS™
CROSSVOLT™
CTL™
SyncFET™
The Power Franchise®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
µSerDes™
UHC®
Current Transfer Logic™
EcoSPARK®
QS™
®
QT Optoelectronics™
Quiet Series™
RapidConfigure™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
MicroPak™
MillerDrive™
Motion-SPM™
OPTOLOGIC®
FAST®
OPTOPLANAR®
FastvCore™
®
UniFET™
VCX™
FPS™
FRFET®
PDP-SPM™
Power220®
Global Power ResourceSM
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary
First Production
Full Production
Not In Production
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Obsolete
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I31
©2000 Fairchild Semiconductor Corporation
MOC8021M, MOC8050M Rev. 1.0.3
www.fairchildsemi.com
9
相关型号：
MOC8050X-SMT&R
Darlington Output Optocoupler, 1-Element, 5300V Isolation, SURFACE MOUNT, PLASTIC PACKAGE-6
ISOCOM
MOC8050XSM
Darlington Output Optocoupler, 1-Element, 5300V Isolation, SURFACE MOUNT, PLASTIC PACKAGE-6
ISOCOM
©2020 ICPDF网 联系我们和版权申明