MOC8113SR2VM [FAIRCHILD]

Transistor Output Optocoupler, 1-Element, 7500V Isolation, SURFACE MOUNT, DIP-6;
MOC8113SR2VM
型号: MOC8113SR2VM
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Transistor Output Optocoupler, 1-Element, 7500V Isolation, SURFACE MOUNT, DIP-6

文件: 总10页 (文件大小:267K)
中文:  中文翻译
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September 2009  
MOC8111M, MOC8112M, MOC8113M  
6-Pin DIP Optocoupler for Power Supply Applications  
(No Base Connection)  
Features  
Description  
High isolation voltage  
The MOC811XM series consists of a Gallium Arsenide  
IRED coupled with an NPN phototransistor. The base of  
the transistor is not bonded to an external pin for  
improved noise immunity.  
7500 VAC Peak—1 second  
High BV  
minimum 70 Volts  
CEO  
Current transfer ratio in selected groups:  
MOC8111M: 20% min.  
MOC8112M: 50% min.  
MOC8113M: 100% min.  
Maximum switching time in saturation specified  
Underwriters Laboratory (UL) recognized  
(File #E90700, Vol. 2)  
IEC60747-5-2 approved (ordering option V)  
Applications  
Power supply regulators  
Digital logic inputs  
Microprocessor inputs  
Appliance sensor systems  
Industrial controls  
Schematic  
ANODE 1  
6 N/C  
6
6
1
CATHODE  
N/C  
COLLECTOR  
2
3
5
4
1
6
EMITTER  
1
©2007 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
Absolute Maximum Ratings (T = 25°C Unless otherwise specified.)  
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Value  
Unit  
TOTAL DEVICE  
P
Total Device Power Dissipation @ T = 25°C  
260  
3.5  
mW  
mW/°C  
°C  
D
A
Derate above 25°C  
T
Ambient Operating Temperature Range  
Storage Temperature Range  
-40 to +100  
-40 to +150  
260  
OPR  
T
°C  
STG  
SOL  
T
Lead Soldering Temperature (Wave Solder)  
(1/16" from case, 10 sec. duration)  
°C  
INPUT LED  
I
Forward Current – Continuous  
Forward Current – Peak (PW = 1µs, 300pps)  
Reverse Voltage  
90  
3
mA  
A
F
I (pk)  
F
V
P
6
V
R
D
LED Power Dissipation @ T = 25°C  
135  
1.8  
mW  
mW/°C  
A
Derate above 25°C  
OUTPUT TRANSISTOR  
P
Detector Power Dissipation @ T = 25°C  
200  
mW  
D
A
Derate above 25°C  
2.67  
mW/°C  
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
2
Electrical Characteristics (T = 25°C Unless otherwise specified.)  
A
Individual Component Characteristics  
Symbol  
EMITTER  
Parameter  
Test Conditions  
Min.  
Typ. Max. Unit  
V
Input Forward Voltage  
I = 60mA  
1.35  
1.15  
15  
1.65  
1.50  
V
F
F
I = 10mA  
F
V
Reverse Voltage  
Capacitance  
I = 10µA  
6.0  
V
R
R
C
V = 0V, f = 1.0MHz  
50  
pF  
J
F
V = 1V, f = 1.0MHz  
65  
F
I
Reverse Leakage Current  
V = 3.0V  
.35  
10  
50  
µA  
R
R
DETECTOR  
BV  
BV  
Breakdow Voltage, Collector to Emitter  
Breakdow Voltage, Emitter to Collector  
Leakage Current, Collector to Emitter  
Capacitance, Collector to Emitter  
I = 1.0mA, I = 0  
70  
7
V
V
CEO  
ECO  
C
F
I = 100µA, I = 0  
E
F
I
V
= 10V, I = 0  
5
8
V
CEO  
CE  
CE  
F
C
V
= 0 V, f = 1MHz  
pF  
CE  
Isolation Characteristics  
Symbol  
Characteristic  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
V
V
Input-Output Isolation Voltage  
Isolation Capacitance  
f = 60Hz, t = 1 sec.  
7500  
AC(PK)  
ISO  
C
V
= 0, f = 1MHz  
0.5  
pF  
ISO  
I-O  
Transfer Characteristic  
Symbol  
Characteristics  
Test Conditions  
Device  
Min. Typ. Max. Units  
DC CHARACTERISTICS  
CTR  
Output/Input Current  
Transfer Ratio  
I = 10mA, V = 5V  
MOC8111M  
MOC8112M  
MOC8113M  
All  
20  
50  
%
V
F
CE  
100  
V
Collector-Emitter  
Saturation Voltage  
I = 10mA, I = 2.5mA  
0.27  
0.4  
CE(SAT)  
F
C
AC CHARACTERISTICS  
Non-Saturated Switching Times  
t
t
Turn-On Time  
Turn-Off Time  
R = 100, I = 2mA,  
All  
All  
6.0  
5.5  
10  
10  
µs  
µs  
on  
off  
L
C
V
= 10V, See Figure 7  
CC  
Saturated Switching Times  
t
Turn-On Time  
Rise-Time  
I = 20mA, V = 0.4V  
MOC8111M  
MOC812M/3M  
MOC8111M  
3.0  
4.2  
2.0  
3.0  
18  
5.5  
8.0  
4.0  
6.0  
34  
µs  
µs  
µs  
µs  
on  
F
CE  
I = 10mA, V = 0.4V  
F
CE  
t
I = 20mA, V = 0.4V  
F CE  
r
I = 10mA, V = 0.4V  
MOC812M/3M  
MOC8111M  
F
CE  
t
Turn-Off Time  
Fall-Time  
I = 20mA, V = 0.4V  
F CE  
off  
I = 10mA, V = 0.4V  
MOC812M/3M  
MOC8111M  
23  
39  
F
CE  
t
I = 20mA, V = 0.4V  
11  
20  
f
F
CE  
I = 10mA, V = 0.4V  
MOC812M/3M  
14  
24  
F
CE  
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
3
Safety and Insulation Ratings  
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.  
Compliance with the safety ratings shall be ensured by means of protective circuits.  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
Installation Classifications per DIN VDE 0110/1.89  
Table 1  
For Rated Main Voltage < 150Vrms  
For Rated Main voltage < 300Vrms  
Climatic Classification  
I-IV  
I-IV  
55/100/21  
2
Pollution Degree (DIN VDE 0110/1.89)  
Comparative Tracking Index  
CTI  
175  
V
Input to Output Test Voltage, Method b,  
1594  
V
V
PR  
peak  
V
x 1.875 = V , 100% Production Test  
IORM  
PR  
with tm = 1 sec, Partial Discharge < 5pC  
Input to Output Test Voltage, Method a,  
1275  
peak  
V
x 1.5 = V , Type and Sample Test  
PR  
IORM  
with tm = 60 sec, Partial Discharge < 5pC  
Max. Working Insulation Voltage  
Highest Allowable Over Voltage  
External Creepage  
V
850  
6000  
7
V
V
IORM  
peak  
V
IOTM  
peak  
mm  
mm  
mm  
External Clearance  
7
Insulation Thickness  
0.5  
9
RIO  
Insulation Resistance at Ts, V = 500V  
10  
IO  
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
4
Typical Performance Characteristics  
Fig. 1 LED Forward Voltage vs. Forward Current  
Fig. 2 Normalized CTR vs. Forward Current  
1.8  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
T
A
= 25°C  
Normalized to  
= 10 mA  
V
= 5.0 V  
I
F
CE  
1.7  
1.6  
1.5  
T
= -55°C  
A
1.4  
1.3  
1.2  
1.1  
1.0  
T
T
= 25°C  
A
A
= 100°C  
1
10  
100  
0
5
10  
15  
20  
I
- LED FORWARD CURRENT (mA)  
I
- FORWARD CURRENT (mA)  
F
F
Fig. 4 Collector Emitter Saturation Voltage  
vs Collector Current  
Fig. 3 Normalized CTR vs. Ambient Temperature  
1.6  
100  
10  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
I = 5 mA  
F
1
I
F
= 10 mA  
I
= 2.5 mA  
F
0.1  
I
F
= 20 mA  
I
= 20 mA  
F
0.01  
0.001  
Normalized to  
= 10 mA  
I
F
= 10 mA  
I
F
I
F
= 5 mA  
T
A
= 25°C  
T
A
= 25°C  
-75  
-50  
-25  
0
25  
50  
75  
100  
125  
0.01  
0.1  
1
10  
T
A
- AMBIENT TEMPERATURE (°C)  
I - COLLECTOR CURRENT (mA)  
C
Fig. 5 Switching Speed vs. Load Resistor  
Fig. 6 Dark current vs. Ambient Temperature.  
1000  
100  
10  
1e+1  
1e+0  
1e-1  
1e-2  
1e-3  
1e-4  
1e-5  
1e-6  
I
V
T
= 10 mA  
= 10 V  
F
CC  
V
CE  
= 10V  
= 25°C  
A
T
off  
T
f
T
on  
1
Tr  
0.1  
0.1  
1
10  
100  
0
25  
50  
75  
100  
125  
R-LOAD RESISTOR (kΩ)  
T - AMBIENT TEMPERATURE (°C)  
A
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
5
TEST CIRCUIT  
WAVE FORMS  
VCC = 10V  
INPUT PULSE  
IC  
IF  
RL = 100Ω  
10%  
90%  
INPUT  
Adjust  
OUTPUT  
OUTPUT PULSE  
tr  
tf  
toff  
ton  
IF to produce IC = 2 mA  
Figure 7. Switching Time Test Circuit and Waveforms  
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
6
Package Dimensions  
Through Hole  
0.4" Lead Spacing  
8.13–8.89  
6
4
8.13–8.89  
6
4
6.10–6.60  
6.10–6.60  
Pin 1  
1
3
Pin 1  
1
3
5.08 (Max.)  
3.28–3.53  
0.25–0.36  
7.62 (Typ.)  
5.08 (Max.)  
3.28–3.53  
0.25–0.36  
0.38 (Min.)  
2.54–3.81  
2.54 (Bsc)  
0.38 (Min.)  
2.54–3.81  
2.54 (Bsc)  
0.20–0.30  
(0.86)  
15° (Typ.)  
(0.86)  
0.41–0.51  
0.76–1.14  
0.20–0.30  
10.16–10.80  
1.02–1.78  
0.41–0.51  
0.76–1.14  
1.02–1.78  
Surface Mount  
(1.78)  
8.13–8.89  
6
4
(1.52)  
(2.54)  
(7.49)  
6.10–6.60  
8.43–9.90  
(10.54)  
1
3
(0.76)  
Pin 1  
Rcommended Pad Layout  
0.25–0.36  
3.28–3.53  
5.08  
(Max.)  
0.20–0.30  
0.38 (Min.)  
0.16–0.88  
(8.13)  
2.54 (Bsc)  
(0.86)  
0.41–0.51  
0.76–1.14  
1.02–1.78  
Note:  
All dimensions in mm.  
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
7
Ordering Information  
Option  
Example Part Number  
Description  
No Suffix  
MOC8111M  
MOC8111SM  
Through Hole  
S
SR2  
T
Surface Mount Lead Bend  
MOC8111SR2M  
MOC8111TM  
Surface Mount; Tape and Reel  
0.4" Lead Spacing  
V
MOC8111VM  
VDE 0884  
TV  
MOC8111TVM  
MOC8111SVM  
MOC8111SR2VM  
IEC60747-5-2 (VDE), 0.4" Lead Spacing  
IEC60747-5-2 (VDE), Surface Mount  
IEC60747-5-2 (VDE), Surface Mount, Tape and Reel  
SV  
SR2V  
Marking Information  
1
2
MOC8111  
6
V X YY Q  
5
3
4
Definitions  
1
2
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE  
option – See order entry table)  
3
4
5
6
One digit year code, e.g., ‘8’  
Two digit work week ranging from ‘01’ to ‘53’  
Assembly package code  
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
8
Tape Dimensions  
12.0 ± 0.1  
2.0 ± 0.05  
4.5 ± 0.20  
Ø1.5 MIN  
1.75 ± 0.10  
0.30 ± 0.05  
4.0 ± 0.1  
11.5 ± 1.0  
24.0 ± 0.3  
9.1 ± 0.20  
21.0 ± 0.1  
Ø1.5 ± 0.1/-0  
10.1 ± 0.20  
0.1 MAX  
User Direction of Feed  
Note:  
All dimensions are in millimeters.  
Reflow Profile  
300  
280  
260  
240  
220  
200  
180  
260°C  
>245°C = 42 Sec  
Time above  
160  
°C  
183°C = 90 Sec  
140  
120  
100  
80  
1.822°C/Sec Ramp up rate  
60  
40  
33 Sec  
20  
0
0
60  
120  
180  
270  
360  
Time (s)  
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
9
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
PowerTrench®  
PowerXS™  
The Power Franchise®  
Auto-SPM  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
Current Transfer Logic™  
EcoSPARK®  
EfficentMax™  
EZSWITCH™*  
™*  
F-PFS™  
FRFET®  
Global Power ResourceSM  
Green FPS™  
Green FPSe-Series™  
Gmax™  
GTO™  
IntelliMAX™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Programmable Active Droop™  
QFET®  
TinyBoost™  
TinyBuck™  
QS™  
Quiet Series™  
RapidConfigure™  
TinyLogic®  
TINYOPTO™  
TinyPower™  
TinyPWM™  
Saving our world, 1mW/W/kW at a time™  
SmartMax™  
TinyWire™  
TriFault Detect™  
TRUECURRENT*  
µSerDes™  
SMART START™  
SPM®  
®
MicroPak™  
MillerDrive™  
MotionMax™  
Motion-SPM™  
OPTOLOGIC®  
STEALTH™  
SuperFET™  
SuperSOT-3  
SuperSOT-6  
SuperSOT-8  
SupreMOS™  
SyncFET™  
Fairchild®  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
UHC®  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
XS™  
OPTOPLANAR®  
FAST®  
®
FastvCore™  
FETBench™  
PDP SPM™  
Power-SPM™  
Sync-Lock™  
FlashWriter®  
®
*
*
FPS™  
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR  
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE  
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,  
WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain life,  
and (c) whose failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to  
cause the failure of the life support device or system, or to affect its  
safety or effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,  
under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.  
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,  
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of  
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are  
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have  
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.  
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide  
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our  
customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications may change in  
any manner without notice.  
Advance Information  
Preliminary  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild  
Semiconductor reserves the right to make changes at any time without notice to improve design.  
First Production  
Full Production  
Not In Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes  
at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.  
The datasheet is for reference information only.  
Rev. I40  
©2007 Fairchild Semiconductor Corporation  
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3  
www.fairchildsemi.com  
10  

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