MOC8113SR2VM [FAIRCHILD]
Transistor Output Optocoupler, 1-Element, 7500V Isolation, SURFACE MOUNT, DIP-6;![MOC8113SR2VM](http://pdffile.icpdf.com/pdf2/p00238/img/icpdf/MOC8113SR2M_1395558_icpdf.jpg)
型号: | MOC8113SR2VM |
厂家: | ![]() |
描述: | Transistor Output Optocoupler, 1-Element, 7500V Isolation, SURFACE MOUNT, DIP-6 |
文件: | 总10页 (文件大小:267K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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September 2009
MOC8111M, MOC8112M, MOC8113M
6-Pin DIP Optocoupler for Power Supply Applications
(No Base Connection)
Features
Description
■ High isolation voltage
The MOC811XM series consists of a Gallium Arsenide
IRED coupled with an NPN phototransistor. The base of
the transistor is not bonded to an external pin for
improved noise immunity.
7500 VAC Peak—1 second
■ High BV
minimum 70 Volts
CEO
■ Current transfer ratio in selected groups:
MOC8111M: 20% min.
MOC8112M: 50% min.
MOC8113M: 100% min.
■ Maximum switching time in saturation specified
■ Underwriters Laboratory (UL) recognized
(File #E90700, Vol. 2)
■ IEC60747-5-2 approved (ordering option V)
Applications
■ Power supply regulators
■ Digital logic inputs
■ Microprocessor inputs
■ Appliance sensor systems
■ Industrial controls
Schematic
ANODE 1
6 N/C
6
6
1
CATHODE
N/C
COLLECTOR
2
3
5
4
1
6
EMITTER
1
©2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
Absolute Maximum Ratings (T = 25°C Unless otherwise specified.)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Value
Unit
TOTAL DEVICE
P
Total Device Power Dissipation @ T = 25°C
260
3.5
mW
mW/°C
°C
D
A
Derate above 25°C
T
Ambient Operating Temperature Range
Storage Temperature Range
-40 to +100
-40 to +150
260
OPR
T
°C
STG
SOL
T
Lead Soldering Temperature (Wave Solder)
(1/16" from case, 10 sec. duration)
°C
INPUT LED
I
Forward Current – Continuous
Forward Current – Peak (PW = 1µs, 300pps)
Reverse Voltage
90
3
mA
A
F
I (pk)
F
V
P
6
V
R
D
LED Power Dissipation @ T = 25°C
135
1.8
mW
mW/°C
A
Derate above 25°C
OUTPUT TRANSISTOR
P
Detector Power Dissipation @ T = 25°C
200
mW
D
A
Derate above 25°C
2.67
mW/°C
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
2
Electrical Characteristics (T = 25°C Unless otherwise specified.)
A
Individual Component Characteristics
Symbol
EMITTER
Parameter
Test Conditions
Min.
Typ. Max. Unit
V
Input Forward Voltage
I = 60mA
1.35
1.15
15
1.65
1.50
V
F
F
I = 10mA
F
V
Reverse Voltage
Capacitance
I = 10µA
6.0
V
R
R
C
V = 0V, f = 1.0MHz
50
pF
J
F
V = 1V, f = 1.0MHz
65
F
I
Reverse Leakage Current
V = 3.0V
.35
10
50
µA
R
R
DETECTOR
BV
BV
Breakdow Voltage, Collector to Emitter
Breakdow Voltage, Emitter to Collector
Leakage Current, Collector to Emitter
Capacitance, Collector to Emitter
I = 1.0mA, I = 0
70
7
V
V
CEO
ECO
C
F
I = 100µA, I = 0
E
F
I
V
= 10V, I = 0
5
8
V
CEO
CE
CE
F
C
V
= 0 V, f = 1MHz
pF
CE
Isolation Characteristics
Symbol
Characteristic
Test Conditions
Min.
Typ.
Max.
Units
V
V
Input-Output Isolation Voltage
Isolation Capacitance
f = 60Hz, t = 1 sec.
7500
AC(PK)
ISO
C
V
= 0, f = 1MHz
0.5
pF
ISO
I-O
Transfer Characteristic
Symbol
Characteristics
Test Conditions
Device
Min. Typ. Max. Units
DC CHARACTERISTICS
CTR
Output/Input Current
Transfer Ratio
I = 10mA, V = 5V
MOC8111M
MOC8112M
MOC8113M
All
20
50
%
V
F
CE
100
V
Collector-Emitter
Saturation Voltage
I = 10mA, I = 2.5mA
0.27
0.4
CE(SAT)
F
C
AC CHARACTERISTICS
Non-Saturated Switching Times
t
t
Turn-On Time
Turn-Off Time
R = 100Ω, I = 2mA,
All
All
6.0
5.5
10
10
µs
µs
on
off
L
C
V
= 10V, See Figure 7
CC
Saturated Switching Times
t
Turn-On Time
Rise-Time
I = 20mA, V = 0.4V
MOC8111M
MOC812M/3M
MOC8111M
3.0
4.2
2.0
3.0
18
5.5
8.0
4.0
6.0
34
µs
µs
µs
µs
on
F
CE
I = 10mA, V = 0.4V
F
CE
t
I = 20mA, V = 0.4V
F CE
r
I = 10mA, V = 0.4V
MOC812M/3M
MOC8111M
F
CE
t
Turn-Off Time
Fall-Time
I = 20mA, V = 0.4V
F CE
off
I = 10mA, V = 0.4V
MOC812M/3M
MOC8111M
23
39
F
CE
t
I = 20mA, V = 0.4V
11
20
f
F
CE
I = 10mA, V = 0.4V
MOC812M/3M
14
24
F
CE
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
3
Safety and Insulation Ratings
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.
Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Installation Classifications per DIN VDE 0110/1.89
Table 1
For Rated Main Voltage < 150Vrms
For Rated Main voltage < 300Vrms
Climatic Classification
I-IV
I-IV
55/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
CTI
175
V
Input to Output Test Voltage, Method b,
1594
V
V
PR
peak
V
x 1.875 = V , 100% Production Test
IORM
PR
with tm = 1 sec, Partial Discharge < 5pC
Input to Output Test Voltage, Method a,
1275
peak
V
x 1.5 = V , Type and Sample Test
PR
IORM
with tm = 60 sec, Partial Discharge < 5pC
Max. Working Insulation Voltage
Highest Allowable Over Voltage
External Creepage
V
850
6000
7
V
V
IORM
peak
V
IOTM
peak
mm
mm
mm
Ω
External Clearance
7
Insulation Thickness
0.5
9
RIO
Insulation Resistance at Ts, V = 500V
10
IO
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
4
Typical Performance Characteristics
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Normalized CTR vs. Forward Current
1.8
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
T
A
= 25°C
Normalized to
= 10 mA
V
= 5.0 V
I
F
CE
1.7
1.6
1.5
T
= -55°C
A
1.4
1.3
1.2
1.1
1.0
T
T
= 25°C
A
A
= 100°C
1
10
100
0
5
10
15
20
I
- LED FORWARD CURRENT (mA)
I
- FORWARD CURRENT (mA)
F
F
Fig. 4 Collector Emitter Saturation Voltage
vs Collector Current
Fig. 3 Normalized CTR vs. Ambient Temperature
1.6
100
10
1.4
1.2
1.0
0.8
0.6
0.4
I = 5 mA
F
1
I
F
= 10 mA
I
= 2.5 mA
F
0.1
I
F
= 20 mA
I
= 20 mA
F
0.01
0.001
Normalized to
= 10 mA
I
F
= 10 mA
I
F
I
F
= 5 mA
T
A
= 25°C
T
A
= 25°C
-75
-50
-25
0
25
50
75
100
125
0.01
0.1
1
10
T
A
- AMBIENT TEMPERATURE (°C)
I - COLLECTOR CURRENT (mA)
C
Fig. 5 Switching Speed vs. Load Resistor
Fig. 6 Dark current vs. Ambient Temperature.
1000
100
10
1e+1
1e+0
1e-1
1e-2
1e-3
1e-4
1e-5
1e-6
I
V
T
= 10 mA
= 10 V
F
CC
V
CE
= 10V
= 25°C
A
T
off
T
f
T
on
1
Tr
0.1
0.1
1
10
100
0
25
50
75
100
125
R-LOAD RESISTOR (kΩ)
T - AMBIENT TEMPERATURE (°C)
A
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
5
TEST CIRCUIT
WAVE FORMS
VCC = 10V
INPUT PULSE
IC
IF
RL = 100Ω
10%
90%
INPUT
Adjust
OUTPUT
OUTPUT PULSE
tr
tf
toff
ton
IF to produce IC = 2 mA
Figure 7. Switching Time Test Circuit and Waveforms
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
6
Package Dimensions
Through Hole
0.4" Lead Spacing
8.13–8.89
6
4
8.13–8.89
6
4
6.10–6.60
6.10–6.60
Pin 1
1
3
Pin 1
1
3
5.08 (Max.)
3.28–3.53
0.25–0.36
7.62 (Typ.)
5.08 (Max.)
3.28–3.53
0.25–0.36
0.38 (Min.)
2.54–3.81
2.54 (Bsc)
0.38 (Min.)
2.54–3.81
2.54 (Bsc)
0.20–0.30
(0.86)
15° (Typ.)
(0.86)
0.41–0.51
0.76–1.14
0.20–0.30
10.16–10.80
1.02–1.78
0.41–0.51
0.76–1.14
1.02–1.78
Surface Mount
(1.78)
8.13–8.89
6
4
(1.52)
(2.54)
(7.49)
6.10–6.60
8.43–9.90
(10.54)
1
3
(0.76)
Pin 1
Rcommended Pad Layout
0.25–0.36
3.28–3.53
5.08
(Max.)
0.20–0.30
0.38 (Min.)
0.16–0.88
(8.13)
2.54 (Bsc)
(0.86)
0.41–0.51
0.76–1.14
1.02–1.78
Note:
All dimensions in mm.
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
7
Ordering Information
Option
Example Part Number
Description
No Suffix
MOC8111M
MOC8111SM
Through Hole
S
SR2
T
Surface Mount Lead Bend
MOC8111SR2M
MOC8111TM
Surface Mount; Tape and Reel
0.4" Lead Spacing
V
MOC8111VM
VDE 0884
TV
MOC8111TVM
MOC8111SVM
MOC8111SR2VM
IEC60747-5-2 (VDE), 0.4" Lead Spacing
IEC60747-5-2 (VDE), Surface Mount
IEC60747-5-2 (VDE), Surface Mount, Tape and Reel
SV
SR2V
Marking Information
1
2
MOC8111
6
V X YY Q
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘8’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
8
Tape Dimensions
12.0 ± 0.1
2.0 ± 0.05
4.5 ± 0.20
Ø1.5 MIN
1.75 ± 0.10
0.30 ± 0.05
4.0 ± 0.1
11.5 ± 1.0
24.0 ± 0.3
9.1 ± 0.20
21.0 ± 0.1
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
User Direction of Feed
Note:
All dimensions are in millimeters.
Reflow Profile
300
280
260
240
220
200
180
260°C
>245°C = 42 Sec
Time above
160
°C
183°C = 90 Sec
140
120
100
80
1.822°C/Sec Ramp up rate
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
9
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
PowerTrench®
PowerXS™
The Power Franchise®
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™*
™*
F-PFS™
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
Programmable Active Droop™
QFET®
TinyBoost™
TinyBuck™
QS™
Quiet Series™
RapidConfigure™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
™
Saving our world, 1mW/W/kW at a time™
SmartMax™
TinyWire™
TriFault Detect™
TRUECURRENT™*
µSerDes™
SMART START™
SPM®
®
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
OPTOPLANAR®
FAST®
®
FastvCore™
FETBench™
PDP SPM™
Power-SPM™
Sync-Lock™
FlashWriter®
®
*
*
FPS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Advance Information
Preliminary
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
First Production
Full Production
Not In Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
No Identification Needed
Obsolete
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I40
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.3
www.fairchildsemi.com
10
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