MOC8204.300 [FAIRCHILD]
Transistor Output Optocoupler, 1-Element, 5300V Isolation, DIP-6;
| 型号： | MOC8204.300 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Transistor Output Optocoupler, 1-Element, 5300V Isolation, DIP-6 |
| 文件： | 总7页 (文件大小：396K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GENERAL PURPOSE 6-PIN
PHOTOTRANSISTOR OPTOCOUPLERS
DESCRIPTION
MOC8204
The MOC8204 device consists of a gallium arsenide infrared emitting diode
optically coupled to a high voltage, silicon, phototransistor detector in a
standard 6-pin DIP package. It is designed for high voltage applications and
is particularly useful in copy machines and solid state relays.
APPLICATIONS
• Copy Machines
• Interfacing and coupling systems of different potentials and impedances
• Monitor and Detection Circuits
• Solid State Relays
SCHEMATIC
1
2
3
6
5
4
NC
PIN 1. ANODE
2. CATHODE
3. NO CONNECTION
4. EMITTER
5. COLLECTOR
6. BASE
Parameter
Symbol
Value
Units
TOTAL DEVICE
TSTG
-55 to +150
°C
Storage Temperature
Operating Temperature
Lead Solder Temperature
TOPR
TSOL
-55 to +100
°C
°C
260 for 10 sec
Input-Output Isolation Voltage
Peak ac Voltage, 60 Hz, 1 Second Duration(1)
Total Device Power Dissipation @ TA = 25°C
Derate above 25°C
VISO
PD
7500
Vac(pk)
mW
250
2.94
EMITTER
IF
IF(pk)
PD
60
mA
DC/Average Forward Input Current
Forward Current - Peak (Pulse Width = 1µs, 330 pps)
LED Power Dissipation @ TA = 25°C
Derate above 25°C
1.2
120
1.41
A
mW
mW/°C
DETECTOR
VCEO
400
V
Collector-Emitter Voltage
Collector-Base Voltage
VCBO
VECO
400
7
V
V
Emitter-Collector Voltage
Detector Power Dissipation @ TA = 25°C
Derate above 25°C
150
1.76
mW
mW/°C
PD
2001 Fairchild Semiconductor Corporation
DS300269
3/22/01
1 OF 6
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GENERAL PURPOSE 6-PIN
PHOTOTRANSISTOR OPTOCOUPLERS
MOC8204
ELECTRICAL CHARACTERISTICS (T = 25 Unless otherwise specified.)
°C
A
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
Test Conditions
Symbol
Min
Typ(1)
Max
Unit
EMITTER
(IF = 10 mA)
VF
—
1.2
15
V
Input Forward Voltage
Reverse Leakage Current
Capacitance
(VR = 6.0 V)
IR
10
—
µA
pF
—
—
—
(V = 0, f =1 MHz)
CJ
18
DETECTOR
BVCEO
400
—
—
V
Collector-Emitter Breakdown Voltage (IC = 1.0 mA, RBE = 1M!)
Collector-Base Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector-Emitter Dark Current
TA = 25°C
(IC = 100 µA)
(IE = 100 µA)
BVCBO
BVEBO
400
7
V
V
—
—
—
—
(RBE = 1M!, VCE = 300 V)
ICEO
nA
µA
—
—
—
—
100
250
T = 100
°C
A
ISOLATION CHARACTERISTICS
Characteristic
Test Conditions Symbol
(VCE = 10 V, IF = 10 mA, RBE = 1M!) IC (CTR)(2) 2 (20)
Min
Typ(1)
—
Max
—
Units
mA(%)
V
Output Collector Current
Collector-Emitter Saturation Voltage (IC = 0.5 mA, IF = 10 mA, RBE = 1M!)
V(SAT)
—
5300
7300
—
0.4
—
—
VAC(RMS)
VAC(PEAK)
!
—
Input-Output Isolation Voltage(3)
(II-O ≤ 1 µA, Time = 1min)
VISO
—
—
Isolation Resistance(3)
Isolation Capacitance(1)
Turn-On Time
RISO
CISO
tON
1011
0.2
5
—
pf
—
—
—
—
(VCC = 10 V, IC = 2 mA, RL = 100!)
µs
Turn-Off Time
tOFF
5
Notes
1. Alway design to the specified minimum/maximum electrical limits (where applicable).
2. Current Transfer Ratio (CTR) = IC /IF x 100%.
3. For this test LED pins 1 and 2 are common and phototransistor Pins 4,5 and 6 are common.
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3/22/01 DS300269
GENERAL PURPOSE 6-PIN
PHOTOTRANSISTOR OPTOCOUPLERS
MOC8204
50
20
6
= 10 Ω
R
V
BE
= 10 V
CE
10
5
20
10
I
= 20 mA
= 10 mA
F
2
1
6
= 10 Ω
I
R
V
T
F
BE
5
= 10 V
CE
= 25°C
0.5
A
I
= 5 mA
F
2
1
0.2
0.1
1
2
5
10
20
50
–60
–40
–20
0
20
40
60
80
100
I , LED INPUT CURRENT (mA)
T
, AMBIENT TEMPERATURE (°C)
F
A
Figure 1. Output Current versus LED Input Current
Figure 2. Output Current versus Temperature
2
40
I
= 50 mA
= 10 mA
PULSE ONLY
PULSE OR DC
F
10
5.0
1.8
I
F
1.0
5
1.6
1.4
1.2
1
I
= 5 mA
F
6
= 10 Ω
= 25°C
R
T
A
1
BE
T
= –55
°
C
C
A
0.05
25°
0.01
0.005
100°C
1
10
100
1000
0.1
0.5
1
5
10
50 100
300
V
, COLLECTOR–EMITTER VOLTAGE (VOLTS)
I , LED FORWARD CURRENT (mA)
CE
F
Figure 3. Output Characteristics
Figure 4. Forward Characteristics
300
240
180
1000
100
I
= 50 mA
F
6
= 10 Ω
R
BE
V
= 10 V
CE
V
= 300 V
CE
V
= 100 V
6
= 10 Ω
CE
R
120
60
0
BE
I
= 10 mA
F
10
1
I
= 5 mA
F
V
= 50 V
CE
20
30
40
50
60
70
80
90
100
–60
–40 –20
0
20
40
60
80
100
T
, AMBIENT TEMPERATURE (
°C)
T , AMBIENT TEMPERATURE (°C)
A
A
Figure 5. Collector–Base Current versus Temperature
Figure 6. Dark Current versus Temperature
DS300269
3/22/01
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GENERAL PURPOSE 6-PIN
PHOTOTRANSISTOR OPTOCOUPLERS
MOC8204
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
PIN 1
ID.
0.350 (8.89)
0.330 (8.38)
PIN 1
ID.
3
2
1
0.270 (6.86)
0.240 (6.10)
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
4
5
6
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.200 (5.08)
0.165 (4.18)
0.016 (0.41)
0.008 (0.20)
0.020 (0.51)
MIN
0.154 (3.90)
0.100 (2.54)
0.020 (0.51)
MIN
0.016 (0.40) MIN
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.016 (0.40)
0.008 (0.20)
0.315 (8.00)
MIN
0.300 (7.62)
TYP
0.022 (0.56)
0.016 (0.41)
0.405 (10.30)
MAX
0° to 15°
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4”Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.060 (1.52)
0.350 (8.89)
0.330 (8.38)
0.415 (10.54)
0.100 (2.54)
0.070 (1.78)
0.045 (1.14)
0.295 (7.49)
0.030 (0.76)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0.004 (0.10)
MIN
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.400 (10.16)
TYP
0.100 (2.54) TYP
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3/22/01 DS300269
GENERAL PURPOSE 6-PIN
PHOTOTRANSISTOR OPTOCOUPLERS
MOC8204
ORDERING INFORMATION
Order Entry Idenifier
Option
Description
R2
.R2
.S
Opto Plus Reliability Conditioning
Surface Mount Lead Bend
Surface Mount; Tape and reel
Surface Mount; Tape and reel
0.4” Lead Spacing
S
SD
SDL
W
.SD
.SDL
.W
300
300W
3S
.300
.300W
.3S
VDE 0884
VDE 0884, 0.4” Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape & Reel
3SD
.3SD
QT Carrier Tape Specifications
12.0 ± 0.1
4.0 ± 0.1
4.85 ± 0.20
Ø1.55 ± 0.05
1.75 ± 0.10
0.30 ± 0.05
4.0 ± 0.1
7.5 ± 0.1
16.0 ± 0.3
13.2 ± 0.2
9.55 ± 0.20
Ø1.6 ± 0.1
10.30 ± 0.20
User Direction of Feed
0.1 MAX
DS300269
3/22/01
5 OF 6
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MARKING INFORMATION
1
2
6
MOC8204
V XX YY K
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
Two digit year code, e.g., ‘03’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
Reflow Profile (Black Package, No Suffix)
300
250
215°C, 10–30 s
225 C peak
200
150
Time above 183°C, 60–150 sec
Ramp up = 3C/sec
100
50
0
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Power247™
PowerEdge™
PowerSaver™
Stealth™
ISOPLANAR™
LittleFET™
MICROCOUPLER™
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FAST
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Bottomless™
CoolFET™
CROSSVOLT™
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
FASTr™
FPS™
FRFET™
GlobalOptoisolator™
GTO™
PowerTrench
QFET
QS™
SyncFET™
QT Optoelectronics™ TinyLogic
HiSeC™
I2C™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
TINYOPTO™
MSXPro™
OCX™
TruTranslation™
UHC™
i-Lo™
ImpliedDisconnect™
OCXPro™
OPTOLOGIC
FACT Quiet Series™
UltraFET
SILENT SWITCHER VCX™
SMART START™
SPM™
OPTOPLANAR™
PACMAN™
POP™
Across the board. Around the world.™
The Power Franchise
ProgrammableActive Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I13
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