MPSA92_J22Z [FAIRCHILD]
Transistor;型号: | MPSA92_J22Z |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Transistor |
文件: | 总7页 (文件大小:261K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
March 2014
MMBTA92 / PZTA92
PNP High-Voltage Amplifier
Description
This device is designed for high-voltage driver applica-
tions. Sourced from process 76.
C
C
E
E
C
B
SOT-223
SOT-23
B
Mark: 2D
Figure 1. MMBTA92 Device Package
Figure 2. PZTA92 Device Package
Ordering Information
Part Number
MMBTA92
PZTA92
Top Mark
2D
Package
SOT-23 3L
SOT-223 4L
Packing Method
Tape and Reel
Tape and Reel
A92
Absolute Maximum Ratings(1),(2)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
VCEO
VCBO
VEBO
IC
Parameter
Value
-300
Unit
V
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
-300
V
-5
V
Collector Current - Continuous
-500
mA
°C
TJ, TSTG Operating and Storage Junction Temperature Range
Notes:
1. These ratings are based on a maximum junction temperature of 150°C.
-55 to +150
2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or
low-duty-cycle operations.
© 1997 Fairchild Semiconductor Corporation
MMBTA92 / PZTA92 Rev. 1.1.0
www.fairchildsemi.com
1
Thermal Characteristics
Values are at TA = 25°C unless otherwise noted.
Max.
Symbol
Parameter
Unit
MMBTA92(3) PZTA92(4)
Total Device Dissipation
350
2.8
1000
8.0
mW
mW/°C
°C/W
PD
Derate Above 25°C
RθJA
Thermal Resistance, Junction to Ambient
357
125
Notes:
3. Device is mounted on FR-4 PCB 1.6 inch x 1.6 inch x 0.06 inch.
4. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Conditions
Min.
Max.
Unit
Collector-Emitter Breakdown
Voltage(5)
V(BR)CEO
IC = -1.0 mA, IB = 0
-300
V
V(BR)CBO Collector-Base Breakdown Voltage
V(BR)EBO Emitter-Base Breakdown Voltage
IC = -100 μA, IE = 0
-300
-5.0
V
V
IE = -100 μA, IC = 0
ICBO
IEBO
Collector Cut-Off Current
Emitter Cut-Off Current
VCB = -200 V, IE = 0
VEB = -3.0 V, IC = 0
-0.25
-0.1
μA
μA
IC = -1.0 mA, VCE = -10 V
IC = -10 mA, VCE = -10 V
IC = -30 mA, VCE = -10 V
25
40
25
hFE
DC Current Gain(5)
250
Collector-Emitter Saturation
Voltage(5)
BE(sat) Base-Emitter Saturation Voltage(5)
VCE(sat)
IC = -20 mA, IB = -2.0 mA
-0.5
-0.9
V
V
V
IC = -20 mA, IB = -2.0 mA
IC = -10 mA, VCE = -20 V,
f = 100 MHz
fT
Current Gain - Bandwidth Product
Collector-Base Capacitance
50
MHz
VCB = -20 V, IE = 0,
Ccb
6.0
pF
f = 1.0 MHz
Note:
5. Pulse test: pulse width ≤ 300 μs, duty cycle ≤ 2.0%.
© 1997 Fairchild Semiconductor Corporation
MMBTA92 / PZTA92 Rev. 1.1.0
www.fairchildsemi.com
2
Typical Performance Characteristics
β = 1 0
140
0.6
0.4
0.2
120
125 °C
100
80
25 °C
60
125 °C
- 40 °C
40
25 °C
VCE = 5V
20
- 40 °C
0
0.1
1
10
100
0.1
1
10
100
I C - COLLECTOR CURRENT (mA)
I C - COLLECTOR CURRENT (mA)
Figure 4. Collector-Emitter Saturation Voltage vs.
Collector Current
Figure 3. Typical Pulsed Current Gain vs.
Collector Current
1
1
0.9
0.8
0.8
- 4 0 °C
- 40 °C
0.7
0.6
0.4
0.2
25 °C
25 °C
0.6
125 °C
125 °C
0.5
β = 10
VCE = 5V
0.4
0.3
1
10
I C - COLLECTOR CURRENT (mA)
100
1
10
100
I
C - COLLECTOR CURRENT (mA)
Figure 6. Base-Emitter On Voltage vs.
Collector Current
Figure 5. Base-Emitter Saturation Voltage
vs. Collector Current
10
1
100
f = 1.0 MHz
VCB= 150V
C
ib
10
1
C
ob
0.1
0.1
0.1
1
10
100
25
50
75
100
125
°
150
V
- REVERSE VOLTAGE (V)
T A - AMBIENT TEMPERATURE ( C)
R
Figure 8. Junction Capacitance vs.
Reverse-Bias Voltage
Figure 7. Collector Cut-Off Current vs.
Ambient Temperature
© 1997 Fairchild Semiconductor Corporation
MMBTA92 / PZTA92 Rev. 1.1.0
www.fairchildsemi.com
3
Typical Performance Characteristics (Continued)
100
1
0.75
0.5
V
= 50V
CE
80
60
40
20
0
SOT-223
TO-92
V
= 15V
CE
SOT-23
0.25
0
0
25
50
75
100
125
150
1
10
20
50
100
TEMPERATURE (oC)
IC - COLLECTOR CURRENT (mA)
Figure 10. Power Dissipation vs.
Ambient Temperature
Figure 9. Gain Bandwidth Product vs.
Collector Current
© 1997 Fairchild Semiconductor Corporation
MMBTA92 / PZTA92 Rev. 1.1.0
www.fairchildsemi.com
4
Physical Dimensions
SOT-23
0.95
2.92 0.20
3
1.40
+0.20
-0.15
1.30
2.20
1.00
1
2
0.60
0.37
(0.29)
0.95
1.90
0.20
A B
1.90
LAND PATTERN
RECOMMENDATION
SEE DETAIL A
1.20 MAX
(0.93)
0.10
0.00
0.10
C
C
2.40 0.30
NOTES: UNLESS OTHERWISE SPECIFIED
GAGE PLANE
A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M - 1994.
0.23
0.08
0.25
0.20 MIN
E) DRAWING FILE NAME: MA03DREV10
SEATING
PLANE
(0.55)
SCALE: 2X
Figure 11. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/MA/MA03D.pdf.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-MA03D.pdf.
© 1997 Fairchild Semiconductor Corporation
MMBTA92 / PZTA92 Rev. 1.1.0
www.fairchildsemi.com
5
Physical Dimensions (Continued)
SOT-223
Figure 12. MOLDED PACKAGING, SOT-223, 4-LEAD (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/MA/MA04A.pdf.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-MA04A_BK.pdf.
© 1997 Fairchild Semiconductor Corporation
MMBTA92 / PZTA92 Rev. 1.1.0
www.fairchildsemi.com
6
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPowerA
AX-CAP®*
F-PFSA
®*
FRFET®
®
Global Power ResourceSM
GreenBridgeA
Green FPSA
Green FPSA e-SeriesA
GmaxA
TinyBoost®
TinyBuck®
TinyCalcA
TinyLogic®
TINYOPTOA
TinyPowerA
TinyPWMA
TinyWireA
TranSiCA
PowerTrench®
PowerXS™
Programmable Active DroopA
QFET®
BitSiCA
Build it NowA
CorePLUSA
CorePOWERA
CROSSVOLTA
CTLA
QSA
GTOA
IntelliMAXA
Quiet SeriesA
RapidConfigureA
A
Current Transfer LogicA
DEUXPEED®
Dual Cool™
EcoSPARK®
EfficientMaxA
ISOPLANARA
Making Small Speakers Sound Louder
and Better™
Saving our world, 1mW/W/kW at a time™
SignalWiseA
SmartMaxA
TriFault DetectA
TRUECURRENT®*
ꢀSerDesA
MegaBuckA
ESBCA
MICROCOUPLERA
MicroFETA
SMART STARTA
Solutions for Your SuccessA
SPM®
®
MicroPakA
Fairchild®
UHC®
MicroPak2A
Fairchild Semiconductor®
FACT Quiet SeriesA
FACT®
STEALTHA
MillerDriveA
Ultra FRFETA
UniFETA
VCXA
VisualMaxA
VoltagePlusA
XS™
SuperFET®
MotionMaxA
mWSaver®
SuperSOTA-3
FAST®
SuperSOTA-6
SuperSOTA-8
SupreMOS®
OptoHiTA
FastvCoreA
FETBenchA
FPSA
OPTOLOGIC®
OPTOPLANAR®
SyncFETA
Sync-Lock™
❺™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain
life, and (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
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proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
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Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Advance Information
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Preliminary
No Identification Needed
Obsolete
First Production
Full Production
Not In Production
Rev. I68
© Fairchild Semiconductor Corporation
www.fairchildsemi.com
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