MPSA92_J22Z [FAIRCHILD]

Transistor;
MPSA92_J22Z
型号: MPSA92_J22Z
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Transistor

文件: 总7页 (文件大小:261K)
中文:  中文翻译
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March 2014  
MMBTA92 / PZTA92  
PNP High-Voltage Amplifier  
Description  
This device is designed for high-voltage driver applica-  
tions. Sourced from process 76.  
C
C
E
E
C
B
SOT-223  
SOT-23  
B
Mark: 2D  
Figure 1. MMBTA92 Device Package  
Figure 2. PZTA92 Device Package  
Ordering Information  
Part Number  
MMBTA92  
PZTA92  
Top Mark  
2D  
Package  
SOT-23 3L  
SOT-223 4L  
Packing Method  
Tape and Reel  
Tape and Reel  
A92  
Absolute Maximum Ratings(1),(2)  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-  
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-  
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The  
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.  
Symbol  
VCEO  
VCBO  
VEBO  
IC  
Parameter  
Value  
-300  
Unit  
V
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
-300  
V
-5  
V
Collector Current - Continuous  
-500  
mA  
°C  
TJ, TSTG Operating and Storage Junction Temperature Range  
Notes:  
1. These ratings are based on a maximum junction temperature of 150°C.  
-55 to +150  
2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or  
low-duty-cycle operations.  
© 1997 Fairchild Semiconductor Corporation  
MMBTA92 / PZTA92 Rev. 1.1.0  
www.fairchildsemi.com  
1
Thermal Characteristics  
Values are at TA = 25°C unless otherwise noted.  
Max.  
Symbol  
Parameter  
Unit  
MMBTA92(3) PZTA92(4)  
Total Device Dissipation  
350  
2.8  
1000  
8.0  
mW  
mW/°C  
°C/W  
PD  
Derate Above 25°C  
RθJA  
Thermal Resistance, Junction to Ambient  
357  
125  
Notes:  
3. Device is mounted on FR-4 PCB 1.6 inch x 1.6 inch x 0.06 inch.  
4. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.  
Electrical Characteristics  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min.  
Max.  
Unit  
Collector-Emitter Breakdown  
Voltage(5)  
V(BR)CEO  
IC = -1.0 mA, IB = 0  
-300  
V
V(BR)CBO Collector-Base Breakdown Voltage  
V(BR)EBO Emitter-Base Breakdown Voltage  
IC = -100 μA, IE = 0  
-300  
-5.0  
V
V
IE = -100 μA, IC = 0  
ICBO  
IEBO  
Collector Cut-Off Current  
Emitter Cut-Off Current  
VCB = -200 V, IE = 0  
VEB = -3.0 V, IC = 0  
-0.25  
-0.1  
μA  
μA  
IC = -1.0 mA, VCE = -10 V  
IC = -10 mA, VCE = -10 V  
IC = -30 mA, VCE = -10 V  
25  
40  
25  
hFE  
DC Current Gain(5)  
250  
Collector-Emitter Saturation  
Voltage(5)  
BE(sat) Base-Emitter Saturation Voltage(5)  
VCE(sat)  
IC = -20 mA, IB = -2.0 mA  
-0.5  
-0.9  
V
V
V
IC = -20 mA, IB = -2.0 mA  
IC = -10 mA, VCE = -20 V,  
f = 100 MHz  
fT  
Current Gain - Bandwidth Product  
Collector-Base Capacitance  
50  
MHz  
VCB = -20 V, IE = 0,  
Ccb  
6.0  
pF  
f = 1.0 MHz  
Note:  
5. Pulse test: pulse width 300 μs, duty cycle 2.0%.  
© 1997 Fairchild Semiconductor Corporation  
MMBTA92 / PZTA92 Rev. 1.1.0  
www.fairchildsemi.com  
2
Typical Performance Characteristics  
β = 1 0  
140  
0.6  
0.4  
0.2  
120  
125 °C  
100  
80  
25 °C  
60  
125 °C  
- 40 °C  
40  
25 °C  
VCE = 5V  
20  
- 40 °C  
0
0.1  
1
10  
100  
0.1  
1
10  
100  
I C - COLLECTOR CURRENT (mA)  
I C - COLLECTOR CURRENT (mA)  
Figure 4. Collector-Emitter Saturation Voltage vs.  
Collector Current  
Figure 3. Typical Pulsed Current Gain vs.  
Collector Current  
1
1
0.9  
0.8  
0.8  
- 4 0 °C  
- 40 °C  
0.7  
0.6  
0.4  
0.2  
25 °C  
25 °C  
0.6  
125 °C  
125 °C  
0.5  
β = 10  
VCE = 5V  
0.4  
0.3  
1
10  
I C - COLLECTOR CURRENT (mA)  
100  
1
10  
100  
I
C - COLLECTOR CURRENT (mA)  
Figure 6. Base-Emitter On Voltage vs.  
Collector Current  
Figure 5. Base-Emitter Saturation Voltage  
vs. Collector Current  
10  
1
100  
f = 1.0 MHz  
VCB= 150V  
C
ib  
10  
1
C
ob  
0.1  
0.1  
0.1  
1
10  
100  
25  
50  
75  
100  
125  
°
150  
V
- REVERSE VOLTAGE (V)  
T A - AMBIENT TEMPERATURE ( C)  
R
Figure 8. Junction Capacitance vs.  
Reverse-Bias Voltage  
Figure 7. Collector Cut-Off Current vs.  
Ambient Temperature  
© 1997 Fairchild Semiconductor Corporation  
MMBTA92 / PZTA92 Rev. 1.1.0  
www.fairchildsemi.com  
3
Typical Performance Characteristics (Continued)  
100  
1
0.75  
0.5  
V
= 50V  
CE  
80  
60  
40  
20  
0
SOT-223  
TO-92  
V
= 15V  
CE  
SOT-23  
0.25  
0
0
25  
50  
75  
100  
125  
150  
1
10  
20  
50  
100  
TEMPERATURE (oC)  
IC - COLLECTOR CURRENT (mA)  
Figure 10. Power Dissipation vs.  
Ambient Temperature  
Figure 9. Gain Bandwidth Product vs.  
Collector Current  
© 1997 Fairchild Semiconductor Corporation  
MMBTA92 / PZTA92 Rev. 1.1.0  
www.fairchildsemi.com  
4
Physical Dimensions  
SOT-23  
0.95  
2.92 0.20  
3
1.40  
+0.20  
-0.15  
1.30  
2.20  
1.00  
1
2
0.60  
0.37  
(0.29)  
0.95  
1.90  
0.20  
A B  
1.90  
LAND PATTERN  
RECOMMENDATION  
SEE DETAIL A  
1.20 MAX  
(0.93)  
0.10  
0.00  
0.10  
C
C
2.40 0.30  
NOTES: UNLESS OTHERWISE SPECIFIED  
GAGE PLANE  
A) REFERENCE JEDEC REGISTRATION  
TO-236, VARIATION AB, ISSUE H.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS ARE INCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR EXTRUSIONS.  
D) DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M - 1994.  
0.23  
0.08  
0.25  
0.20 MIN  
E) DRAWING FILE NAME: MA03DREV10  
SEATING  
PLANE  
(0.55)  
SCALE: 2X  
Figure 11. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/dwg/MA/MA03D.pdf.  
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:  
http://www.fairchildsemi.com/packing_dwg/PKG-MA03D.pdf.  
© 1997 Fairchild Semiconductor Corporation  
MMBTA92 / PZTA92 Rev. 1.1.0  
www.fairchildsemi.com  
5
Physical Dimensions (Continued)  
SOT-223  
Figure 12. MOLDED PACKAGING, SOT-223, 4-LEAD (ACTIVE)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/dwg/MA/MA04A.pdf.  
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:  
http://www.fairchildsemi.com/packing_dwg/PKG-MA04A_BK.pdf.  
© 1997 Fairchild Semiconductor Corporation  
MMBTA92 / PZTA92 Rev. 1.1.0  
www.fairchildsemi.com  
6
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
AccuPowerA  
AX-CAP®*  
F-PFSA  
®*  
FRFET®  
®
Global Power ResourceSM  
GreenBridgeA  
Green FPSA  
Green FPSA e-SeriesA  
GmaxA  
TinyBoost®  
TinyBuck®  
TinyCalcA  
TinyLogic®  
TINYOPTOA  
TinyPowerA  
TinyPWMA  
TinyWireA  
TranSiCA  
PowerTrench®  
PowerXS™  
Programmable Active DroopA  
QFET®  
BitSiCA  
Build it NowA  
CorePLUSA  
CorePOWERA  
CROSSVOLTA  
CTLA  
QSA  
GTOA  
IntelliMAXA  
Quiet SeriesA  
RapidConfigureA  
A
Current Transfer LogicA  
DEUXPEED®  
Dual Cool™  
EcoSPARK®  
EfficientMaxA  
ISOPLANARA  
Making Small Speakers Sound Louder  
and Better™  
Saving our world, 1mW/W/kW at a time™  
SignalWiseA  
SmartMaxA  
TriFault DetectA  
TRUECURRENT®*  
SerDesA  
MegaBuckA  
ESBCA  
MICROCOUPLERA  
MicroFETA  
SMART STARTA  
Solutions for Your SuccessA  
SPM®  
®
MicroPakA  
Fairchild®  
UHC®  
MicroPak2A  
Fairchild Semiconductor®  
FACT Quiet SeriesA  
FACT®  
STEALTHA  
MillerDriveA  
Ultra FRFETA  
UniFETA  
VCXA  
VisualMaxA  
VoltagePlusA  
XS™  
SuperFET®  
MotionMaxA  
mWSaver®  
SuperSOTA-3  
FAST®  
SuperSOTA-6  
SuperSOTA-8  
SupreMOS®  
OptoHiTA  
FastvCoreA  
FETBenchA  
FPSA  
OPTOLOGIC®  
OPTOPLANAR®  
SyncFETA  
Sync-Lock™  
௝❺™  
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE  
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,  
WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain  
life, and (c) whose failure to perform when properly used in  
accordance with instructions for use provided in the labeling, can be  
reasonably expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to  
cause the failure of the life support device or system, or to affect its  
safety or effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,  
under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their  
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed  
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the  
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild  
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors  
are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical  
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.  
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global  
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications may change  
in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild  
Semiconductor reserves the right to make changes at any time without notice to improve design.  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make  
changes at any time without notice to improve the design.  
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.  
The datasheet is for reference information only.  
Preliminary  
No Identification Needed  
Obsolete  
First Production  
Full Production  
Not In Production  
Rev. I68  
© Fairchild Semiconductor Corporation  
www.fairchildsemi.com  

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