NC7SV17P5X_10 [FAIRCHILD]
TinyLogic® ULP-A Single Buffer with Schmitt Trigger Input;型号: | NC7SV17P5X_10 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | TinyLogic® ULP-A Single Buffer with Schmitt Trigger Input |
文件: | 总11页 (文件大小:553K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
December 2010
NC7SV17
TinyLogic® ULP-A Single Buffer with Schmitt Trigger Input
Features
Description
The NC7SV17 is a single buffer with Schmitt trigger
input from Fairchild's Ultra-Low Power (ULP-A) Series
of TinyLogic®. ULP-A is ideal for applications that
require extreme high speed, high drive, and low power.
This product is designed for a wide low-voltage
operating range (0.9V to 3.6V VCC) and applications that
require more drive and speed than the TinyLogic® ULP
series, but still offer best-in-class, low-power operation.
0.9V to 3.6V VCC Supply Operation
3.6V Over-Voltage Tolerant I/Os at VCC from
0.9V to 3.6V
Extremely High Speed tPD
- 1.5ns: Typical for 2.7V to 3.6V VCC
- 1.8ns: Typical for 2.3V to 2.7V VCC
- 2.0ns: Typical for 1.65V to 1.95V VCC
- 3.2ns: Typical for 1.4V to 1.6V VCC
- 5.9ns: Typical for 1.1V to 1.3V VCC
- 12.0ns: Typical for 0.9V VCC
The NC7SV17 is uniquely designed for optimized power
and speed and is fabricated with an advanced CMOS
technology to achieve high-speed operation while
maintaining low CMOS power dissipation.
Power-Off High-Impedance Inputs and Outputs
High Static Drive (IOH/IOL
- ±24mA at 3.00V VCC
- ±18mA at 2.30V VCC
- ±6mA at 1.65V VCC
- ±4mA at 1.4V VCC
- ±2mA at 1.1V VCC
- ±0.1mA at 0.9V VCC
)
Uses Proprietary Quiet Series™ Noise/EMI
Reduction Circuitry
Ultra-Small MicroPak™ Packages
Ultra-Low Dynamic Power
Ordering Information
Part Number
Top Mark
Package
Packing Method
3000 Units on
Tape & Reel
NC7SV17P5X
V17
G5
5-Lead SC70, EIAJ SC-88a, 1.25mm Wide
5000 Units on
Tape & Reel
NC7SV17L6X
NC7SV17FHX
6-Lead MicroPak™, 1.00mm Wide
5000 Units on
Tape & Reel
G5
6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch
TinyLogic® is a registered trademark of Fairchild Semiconductor Corporation.
MicroPak™ and Quiet Series™ are trademarks of Fairchild Semiconductor Corporation.
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
Battery Life
700
600
500
400
300
200
100
0
ULP (SP)
Battery Life
(Days)
ULP-A (SV)
UHS (SZ)
0.9 1.2 1.5 1.8
2.5 3.3 5.0
VCC Supply Voltage
Figure 1. Battery Life vs. VCC Supply Voltage
Notes:
1. TinyLogic® ULP and ULP-A with up to 50% less power consumption can extend battery life significantly.
Battery Life = (Vbattery•Ibattery•.9)/(Pdevice)/24hrs/day
where, Pdevice = (ICC • VCC) + (CPD + CL) • VCC2 • f.
2. Assumes ideal 3.6V Lithium Ion battery with current rating of 900mAH and derated 90% and device frequency at
10MHz, with CL=15pF load.
Connection Diagram
IEEE/IEC
Y
A
1
Figure 2. Logic Symbol
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
2
Pin Configurations
1
5
4
NC
VCC
1
2
3
6
5
4
NC
A
VCC
NC
Y
2
A
GND
3
GND
Y
Figure 3. SC70 (Top View)
Figure 4. MicroPak™ (Top Through View)
Pin Definitions
Pin # SC70
Pin # MicroPak
Name
NC
A
Description
No Connect
1
2
3
4
5
1
2
3
4
6
5
Input
GND
Y
Ground
Output
VCC
NC
Supply Voltage
No Connect
Function Table
Inputs
Output
A
L
Y
L
H
H
H=HIGH Logic Level
L=LOW Logic Level
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Min.
-0.5
-0.5
-0.5
-0.5
Max.
4.6
Unit
V
Supply Voltage
VIN
DC Input Voltage
4.6
V
HIGH or LOW State(3)
VCC + 0.5
4.6
VOUT
IIK
DC Output Voltage
V
VCC=0V
DC Input Diode Current
DC Output Diode Current
DC Output Source/Sink Current
VIN < 0V
-50
mA
mA
VOUT < 0V
VOUT > VCC
-50
IOK
+50
IOH/ OL
I
±50
mA
mA
°C
ICC or IGND
DC VCC or Ground Current per Supply Pin
Storage Temperature Range
±50
TSTG
TJ
-65
+150
+150
+260
150
Junction Temperature Under Bias
Junction Lead Temperature, Soldering 10 Seconds
SC70-5
°C
TL
°C
PD
Power Dissipation at +85°C
MicroPak™-6
MicroPak2™-6
130
mW
V
120
Human Body Model, JEDEC:JESD22-A114
Charge Device Model, JEDEC:JESD22-C101
4000
2000
ESD
Note:
3. IO absolute maximum rating must be observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VCC
Parameter
Supply Voltage
Conditions
Min.
0.9
0
Max.
3.6
3.6
3.6
VCC
±24
±18
±6
Unit
V
VIN
Input Voltage
V
VCC=0V
HIGH or LOW State
CC=3.0V to 3.6V
0
VOUT
Output Voltage
V
0
V
VCC=2.3V to 3.6V
VCC=1.65V to 1.95V
VCC=1.4V to 1.6V
VCC=1.1V to 1.3V
VCC=0.9V
IOH/IOL
Output Current in IOH/IOL
mA
±4
±2
±0.1
TA
Operating Temperature, Free Air
Minimum Input Edge Rate
-40
+85
°C
VIN=0.8V to 2.0, VCC=3.0V
SC70-5
10
ns/V
Δt/ΔV
425
500
560
Thermal Resistance
MicroPak™-6
°C/W
θJA
MicroPak2™-6
Note:
4. Unused inputs must be held HIGH or LOW. They may not float.
© 1996 Fairchild Semiconductor Corporation
www.fairchildsemi.com
NC7SV17 • Rev. 1.0.6
4
DC Electrical Characteristics
TA=25°C
TA=-40 to 85°C
Symbol Parameter
VCC
Conditions
Units
Min.
Max.
Min.
Max.
0.90
1.10
0.30
0.40
0.50
0.70
1.00
1.50
0.10
0.15
0.20
0.25
0.40
0.60
0.07
0.08
0.09
0.15
0.25
0.60
VCC-0.1
0.70
1.00
1.40
1.50
1.80
2.20
0.60
0.70
0.80
0.90
1.15
1.50
0.50
0.60
0.80
1.00
1.10
1.20
0.30
0.40
0.70
1.00
1.40
1.50
1.80
2.20
0.60
0.70
0.80
0.90
1.15
1.50
0.50
0.60
0.80
1.00
1.10
1.20
Positive
1.40
0.50
VP
VN
VH
Threshold
Voltage
V
1.65
0.70
2.30
1.00
2.70
1.50
0.90
0.10
1.10
0.15
Negative
Threshold
Voltage
1.40
0.20
V
1.65
0.25
2.30
0.40
2.70
0.60
0.90
0.07
1.10
0.08
1.40
0.09
Hysteresis
Voltage
V
1.65
0.15
2.30
0.25
2.70
0.60
0.90
VCC-0.1
VCC-0.1
VCC-0.2
VCC-0.2
VCC-0.2
VCC-0.2
.75 x VCC
.75 x VCC
1.25
V
V
V
V
V
CC-0.1
CC-0.2
CC-0.2
CC-0.2
CC-0.2
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.30 ≤ VCC ≤ 2.70
2.70≤ VCC ≤ 3.60
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
2.70 ≤ VCC ≤ 3.60
IOH=-100µA
I
I
I
OH=-2mA
OH=-4mA
OH=-6mA
.75 x VCC
.75 x VCC
1.25
2.0
HIGH Level
Output Voltage
VOH
V
2.0
I
I
I
OH=-12mA
OH=-18mA
OH=-24mA
1.8
1.8
2.2
2.2
1.7
1.7
2.4
2.4
2.2
2.2
Continued on following page…
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
5
DC Electrical Characteristics (Continued)
TA=25°C
TA=-40 to 85°C
Symbol
Parameter
VCC
Conditions
Units
Min.
Max.
0.10
0.10
0.20
0.20
0.20
0.20
Min.
Max.
0.10
0.90
0.10
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
2.30≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
2.70 ≤ VCC ≤ 3.60
0.20
I
OL=100µA
0.20
0.20
0.20
I
I
I
OL=2mA
OL=4mA
OL=6mA
0.25 x VCC
0.25 x VCC
0.30
0.25 x VCC
0.25 x VCC
0.30
LOW Level
Output Voltage
VOL
V
0.40
0.40
IOL=12mA
0.40
0.40
0.60
0.60
I
I
OL=18mA
OL=24mA
0.40
0.40
0.55
0.55
Input Leakage
Current
IIN
0.90 to 3.60
±0.1
±0.5
0.5
µA
µA
0 ≤ VIN ≤ 3.60
Power Off
Leakage
Current
IOFF
0
0.5
0.9
0 ≤ (VIN, vO) ≤ 3.60
VIN=VCC, or GND
0.9
Quiescent
Supply Current
ICC
0.90 to 3.60
µA
±0.9
VCC ≤ VIN ≤ 3.6V
AC Electrical Characteristics
TA=25°C
TA=-40 to 85°C
Symbol Parameter
VCC
Conditions
Units Figure
Min. Typ. Max. Min.
Max.
CL=15pF,
RL=1MΩ
0.90
12
2.0
1.0
1.0
0.8
0.7
5.9
3.2
2.0
1.8
1.5
10.0
6.1
5.2
3.7
3.3
1.0
0.9
0.7
0.6
0.5
14.9
7.0
6.2
4.4
3.8
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
CL=15pF,
RL=2kΩ
Propagation
tPHL, tPLH
Figure 5
ns
Delay
Figure 6
CL=30pF,
RL=500Ω
Input
CIN
0
2
pF
pF
Capacitance
Power
VIN=0V or VCC
f=10MHz
,
CPD
Dissipation
0.90 to 3.60
10
Capacitance
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
6
AC Loadings and Waveforms
VCC
TEST
SIGNAL
DUT
CL pF
RL
Figure 5. AC Test Circuit
Figure 6. AC Waveforms
VCC
2.5V ± 0.2V 1.8V ± 0.15V 1.5V ± 0.1V
Symbol
3.3V ± 0.3V
1.5V
1.2V ± 0.1V
VCC/2
0.9V
VCC/2
VCC/2
Vmi
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
Vmo
1.5V
VCC/2
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
7
Physical Dimensions
Figure 7. 5-Lead, SC70, EIAJ SC-88a, 1.25mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specification
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/products/analog/pdf/sc70-5_tr.pdf.
Package Designator
Tape Section
Leader (Start End)
Carrier
Cavity Number
125 (Typical)
3000
Cavity Status Cover Type Status
Empty
Filled
Sealed
Sealed
Sealed
P5X
Trailer (Hub End)
75 (Typical)
Empty
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
8
Physical Dimensions
2X
0.05 C
1.45
B
(1)
2X
0.05 C
(0.49)
5X
(0.254)
1.00
(0.75)
(0.52)
1X
TOP VIEW
A
PIN 1 IDENTIFIER
5
0.55MAX
(0.30)
6X
PIN 1
0.05 C
0.05
0.00
RECOMMENED
LAND PATTERN
0.05 C
C
0.45
0.35
0.10
6X
0.00
0.25
6X
0.15
1.0
DETAIL A
0.10
C B A
0.40
0.30
0.05
C
0.35
0.25
5X
5X
0.40
0.30
DETAIL A
PIN 1 TERMINAL
0.075 X 45
CHAMFER
0.5
BOTTOM VIEW
(0.05)
6X
(0.13)
4X
Notes:
1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD
2. DIMENSIONS ARE IN MILLIMETERS
3. DRAWING CONFORMS TO ASME Y14.5M-1994
4. FILENAME AND REVISION: MAC06AREV4
5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY
OTHER LINE IN THE MARK CODE LAYOUT.
Figure 8. 6-Lead, MicroPak™, 1.0mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specification
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package Designator
Tape Section
Leader (Start End)
Carrier
Cavity Number
125 (Typical)
5000
Cavity Status Cover Type Status
Empty
Filled
Sealed
Sealed
Sealed
L6X
Trailer (Hub End)
75 (Typical)
Empty
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
9
Physical Dimensions
0.89
0.35
0.05 C
2X
1.00
B
A
5X 0.40
1X 0.45
PIN 1
0.66
MIN 250uM
1.00
6X 0.19
0.05 C
TOP VIEW
RECOMMENDED LAND PATTERN
FOR SPACE CONSTRAINED PCB
2X
0.90
0.35
0.05 C
0.55MAX
C
5X 0.52
SIDE VIEW
0.73
0.57
1X
(0.08) 4X
0.09
0.19
6X
DETAIL A
1
2
3
0.20 6X
ALTERNATIVE LAND PATTERN
FOR UNIVERSAL APPLICATION
(0.05) 6X
0.35
5X
0.25
0.60
6
5
4
0.10
.05 C
C B A
0.40
0.30
0.35
(0.08)
4X
BOTTOM VIEW
NOTES:
A. COMPLIES TO JEDEC MO-252 STANDARD
B. DIMENSIONS ARE IN MILLIMETERS.
0.075X45°
CHAMFER
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
D. LANDPATTERN RECOMMENDATION IS BASED ON FSC
DESIGN.
DETAIL A
PIN 1 LEAD SCALE: 2X
E. DRAWING FILENAME AND REVISION: MGF06AREV3
Figure 9. 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specification
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf.
Package Designator
Tape Section
Leader (Start End)
Carrier
Cavity Number
125 (Typical)
5000
Cavity Status Cover Type Status
Empty
Filled
Sealed
Sealed
Sealed
FHX
Trailer (Hub End)
75 (Typical)
Empty
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
10
© 1996 Fairchild Semiconductor Corporation
NC7SV17 • Rev. 1.0.6
www.fairchildsemi.com
11
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