NDP4050 [FAIRCHILD]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
NDP4050
型号: NDP4050
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总6页 (文件大小:69K)
中文:  中文翻译
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July 1996  
NDP4050 / NDB4050  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild's proprietary,  
high cell density, DMOS technology. This very high  
density process has been especially tailored to minimize  
on-state resistance, provide superior switching  
performance, and withstand high energy pulses in the  
avalanche and commutation modes. These devices are  
particularly suited for low voltage applications such as  
automotive, DC/DC converters, PWM motor controls, and  
other battery powered circuits where fast switching, low  
in-line power loss, and resistance to transients are  
needed.  
15A, 50V. RDS(ON) = 0.10W @ VGS=10V.  
Critical DC electrical parameters specified at elevated  
temperature.  
Rugged internal source-drain diode can eliminate the need  
for an external Zener diode transient suppressor.  
175°C maximum junction temperature rating.  
High density cell design for extremely low RDS(ON)  
.
TO-220 and TO-263 (D2PAK) package for both through hole  
and surface mount applications.  
____________________________________________________________________________________________  
D
G
S
Absolute Maximum Ratings  
Symbol Parameter  
TC = 25°C unless otherwise noted  
NDP4050  
NDB4050  
Units  
V
VDSS  
VDGR  
Drain-Source Voltage  
50  
50  
V
Drain-Gate Voltage (RGS < 1 MW)  
Gate-Source Voltage - Continuous  
± 20  
± 40  
V
VGSS  
- Nonrepetitive (tP < 50 µs)  
Drain Current - Continuous  
ID  
± 15  
A
- Pulsed  
± 45  
PD  
Total Power Dissipation  
50  
W
W/°C  
°C  
Derate above 25°C  
0.33  
TJ,TSTG  
TL  
Operating and Storage Temperature Range  
-65 to 175  
275  
Maximum lead temperature for soldering purposes,  
1/8" from case for 5 seconds  
°C  
NDP4050 Rev. B  
© 1997 Fairchild Semiconductor Corporation  
Electrical Characteristics (TC = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
DRAIN-SOURCE AVALANCHE RATINGS (Note 1)  
WDSS  
IAR  
Single Pulse Drain-Source Avalanche  
Energy  
VDD = 25 V, ID = 15 A  
40  
15  
mJ  
A
Maximum Drain-Source Avalanche Current  
OFF CHARACTERISTICS  
Drain-Source Breakdown Voltage  
50  
V
BVDSS  
IDSS  
VGS = 0 V, ID = 250 µA  
VDS = 50 V, VGS = 0 V  
Zero Gate Voltage Drain Current  
250  
1
µA  
mA  
nA  
nA  
TJ= 125°C  
Gate - Body Leakage, Forward  
Gate - Body Leakage, Reverse  
100  
-100  
IGSSF  
IGSSR  
VGS = 20 V, VDS = 0 V  
VGS = -20 V, VDS= 0 V  
ON CHARACTERISTICS (Note 1)  
Gate Threshold Voltage  
2
3
4
3.6  
V
VGS(th)  
VDS = VGS, ID = 250 µA  
VGS = 10 V, ID = 7.5 A  
1.4  
2.4  
TJ= 125°C  
TJ= 125°C  
RDS(ON)  
Static Drain-Source On-Resistance  
0.078  
0.12  
0.1  
W
0.165  
On-State Drain Current  
15  
3
A
S
ID(on)  
gFS  
VGS = 10 V, VDS = 10 V  
VDS = 10 V, ID = 7.5 A  
Forward Transconductance  
5.7  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
370  
165  
50  
450  
200  
100  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
VDS = 25, VGS = 0 V,  
f = 1.0 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
SWITCHING CHARACTERISTICS (Note 1)  
tD(on)  
tr  
tD(off)  
tf  
Turn - On Delay Time  
Turn - On Rise Time  
Turn - Off Delay Time  
Turn - Off Fall Time  
Total Gate Charge  
VDD = 30 V, ID = 15 A  
VGS = 10 V, RGEN = 25 W  
8
70  
18  
37  
12.7  
3.2  
7
20  
100  
30  
ns  
ns  
ns  
50  
ns  
Qg  
Qgs  
Qgd  
VDS = 48 V  
ID = 15 A, VGS = 10 V  
17  
nC  
nC  
nC  
Gate-Source Charge  
Gate-Drain Charge  
NDP4050 Rev. B  
Electrical Characteristics (TC = 25°C unless otherwise noted)  
Symbol Parameter Conditions  
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS  
Min  
Typ  
Max  
Units  
IS  
Maximum Continuos Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
15  
45  
A
A
V
ISM  
VSD  
Source-Drain Diode Forward Voltage  
VGS = 0 V, IS = 7.5 A (Note 1)  
0.95  
0.88  
46  
1.3  
1.2  
100  
TJ= 125°C  
Reverse Recovery Time  
VGS = 0 V, IF = 15 A,  
dIF/dt = 100 A/µs  
25  
ns  
A
trr  
Irr  
Reverse Recovery Current  
1.5  
3.4  
7
THERMAL CHARACTERISTICS  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
3
°C/W  
°C/W  
R
JC  
q
62.5  
R
JA  
q
Note:  
1. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.  
NDP4050 Rev. B  
Typical Electrical Characteristics  
30  
2
1.8  
1.6  
1.4  
1.2  
1
VGS = 20V  
VGS = 6.0V  
12  
10  
9.0  
25  
20  
15  
10  
5
7.0  
8.0  
8.0  
9.0  
7.0  
10  
6.0  
12  
20  
0.8  
0.6  
5.0  
0
0
5
10  
15  
20  
25  
30  
0
1
2
3
4
5
V
, DRAIN-SOURCE VOLTAGE (V)  
I
, DRAIN CURRENT (A)  
DS  
D
Figure 2. On-Resistance Variation with Gate  
Voltage and Drain Current.  
Figure 1. On-Region Characteristics.  
2.2  
3
ID = 7.5 A  
VGS = 10 V  
2
VGS = 10 V  
2.5  
2
1.8  
1.6  
1.4  
1.2  
1
T
= 125°C  
J
1.5  
1
25°C  
-55°C  
0.8  
0.6  
0.5  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
175  
0
5
10  
15  
20  
25  
30  
I
, DRAIN CURRENT (A)  
T
, JUNCTION TEMPERATURE (°C)  
J
D
Figure 4. On-Resistance Variation with Drain  
Current and Temperature.  
Figure 3. On-Resistance Variation  
with Temperature.  
20  
15  
10  
5
1.2  
T
= -55°C  
VDS = 10V  
25°C  
J
125°C  
VDS = VGS  
1.1  
1
ID = 250µA  
0.9  
0.8  
0.7  
0.6  
0
2
4
6
8
10  
-50  
-25  
0
25  
T , JUNCTION TEMPERATURE (°C)  
J
50  
75  
100  
125  
150  
175  
V
, GATE TO SOURCE VOLTAGE (V)  
GS  
Figure 6. Gate Threshold Variation with  
Temperature.  
Figure 5. Drain Current Variation with Gate  
Voltage and Temperature.  
NDP4050 Rev. B  
Typical Electrical Characteristics (continued)  
20  
10  
5
1.15  
VGS = 0V  
I D = 250µA  
1.1  
1.05  
1
T
= 125°C  
J
25°C  
2
1
-55°C  
0.5  
0.95  
0.9  
0.2  
0.1  
0.4  
0.6  
V
0.8  
1
1.2  
1.4  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
175  
, BODY DIODE FORWARD VOLTAGE (V)  
T
, JUNCTION TEMPERATURE (°C)  
SD  
J
Figure 7. Breakdown Voltage Variation with  
Temperature.  
Figure 8. Body Diode Forward Voltage Variation  
with Current and Temperature.  
700  
500  
20  
ID = 15A  
C
iss  
VDS = 12V  
15  
24V  
300  
200  
48V  
C
oss  
10  
5
100  
f = 1 MHz  
VGS = 0V  
50  
30  
C
rss  
0
1
2
3
5
10  
20  
30  
60  
0
5
10  
, GATE CHARGE (nC)  
15  
20  
V
, DRAIN TO SOURCE VOLTAGE (V)  
Q
DS  
g
Figure 9. Capacitance Characteristics.  
Figure 10. Gate Charge Characteristics.  
ton  
toff  
VDD  
td(off)  
t d(on)  
tr  
tf  
RL  
VIN  
90%  
90%  
D
VOUT  
V
OUT  
VGS  
10%  
10%  
90%  
RGEN  
INVERTED  
DUT  
G
V
50%  
50%  
IN  
S
10%  
PULSE WIDTH  
Figure 12. Switching Waveforms.  
Figure 11. Switching Test Circuit.  
NDP4050 Rev. B  
Typical Electrical Characteristics (continued)  
8
70  
50  
T
= -55°C  
J
VDS = 15V  
25°C  
6
4
2
0
20  
10  
125°C  
VGS = 20V  
2
1
SINGLE PULSE  
R
JC = 3 o C/W  
q
TC = 25°C  
0.5  
0
2
4
6
8
10  
1
2
5
10  
30  
50  
70  
I
, DRAIN CURRENT (A)  
V
, DRAIN-SOURCE VOLTAGE (V)  
D
DS  
Figure 13. Transconductance Variation with  
Figure 14. Maximum Safe Operating Area.  
Drain Current and Temperature.  
1
D = 0.5  
0.5  
0.3  
0.2  
0.2  
R
(t) = r(t) * R  
JC  
q
JC  
q
R
= 3.0 °C/W  
JC  
q
0.1  
0.1  
P(pk)  
0.05  
0.05  
0.02  
t1  
t2  
0.03  
T
- T = P * R  
(t)  
0.01  
J
C
q
JC  
0.02  
Duty Cycle, D = t1 /t2  
Single Pulse  
0.05  
0.01  
0.01  
0.1  
0.5  
1
5
10  
50  
100  
500  
1000  
t1 , TIME (ms)  
Figure 15. Transient Thermal Response Curve.  
NDP4050 Rev. B  

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