NDP7052 [FAIRCHILD]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
NDP7052
型号: NDP7052
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总6页 (文件大小:60K)
中文:  中文翻译
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June 1997  
NDP7052 / NDB7052  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
75 A, 50 V. RDS(ON) = 0.01 W @ VGS= 10 V.  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild's proprietary, high cell  
density, DMOS technology. This very high density process has  
been especially tailored to minimize on-state resistance,  
provide superior switching performance, and withstand high  
energy pulses in the avalanche and commutation modes.  
These devices are particularly suited for low voltage  
applications such as automotive, DC/DC converters, PWM  
motor controls, and other battery powered circuits where fast  
switching, low in-line power loss, and resistance to transients  
are needed.  
Critical DC electrical parameters specified at elevated  
temperature.  
Rugged internal source-drain diode can eliminate the need  
for an external Zener diode transient suppressor.  
175°C maximum junction temperature rating.  
High density cell design for extremely low RDS(ON)  
.
TO-220 and TO-263 (D2PAK) package for both through hole  
and surface mount applications.  
________________________________________________________________________________  
D
G
S
Absolute Maximum Ratings TC = 25°C unless otherwise noted  
Symbol Parameter  
NDP7052  
NDB7052  
Units  
V
VDSS  
VDGR  
Drain-Source Voltage  
50  
50  
V
Drain-Gate Voltage (RGS < 1 MW)  
Gate-Source Voltage - Continuous  
±20  
±40  
V
VGSS  
- Nonrepetitive (tP < 50 µs)  
Drain Current - Continuous  
- Pulsed  
ID  
75  
A
225  
150  
W
W/°C  
°C  
PD  
Total Power Dissipation @ TC = 25°C  
Derate above 25°C  
1
TJ,TSTG  
Operating and Storage Temperature Range  
-65 to 175  
THERMAL CHARACTERISTICS  
RqJC  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
1
°C/W  
°C/W  
Rq JA  
62.5  
© 1997 Fairchild Semiconductor Corporation  
NDP7052 Rev.B1  
Electrical Characteristics (TC = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
DRAIN-SOURCE AVALANCHE RATINGS (Note)  
WDSS  
IAR  
Single Pulse Drain-Source Avalanche Energy  
Maximum Drain-Source Avalanche Current  
VDD = 25 V, ID = 75 A  
550  
75  
mJ  
A
OFF CHARACTERISTICS  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = 250 µA  
50  
V
ID = 250 µA, Referenced to 25 o C  
mV/oC  
Breakdown Voltage Temp. Coefficient  
Zero Gate Voltage Drain Current  
57  
DBVDSS/DTJ  
IDSS  
10  
1
µA  
mA  
nA  
nA  
VDS = 40 V, VGS = 0 V  
TJ = 125°C  
Gate - Body Leakage, Forward  
Gate - Body Leakage, Reverse  
100  
-100  
IGSSF  
IGSSR  
VGS = 20 V, VDS = 0 V  
VGS = -20 V, VDS = 0 V  
ON CHARACTERISTICS (Note)  
ID = 250 µA, Referenced to 25 o C  
mV/oC  
V
Gate Threshold VoltageTemp. Coefficient  
-5.2  
DVGS(th)/DTJ  
Gate Threshold Voltage  
2
2.2  
1.55  
0.008  
3
VGS(th)  
VDS = VGS, ID = 250 µA  
TJ = 125°C  
1.4  
2.4  
Static Drain-Source On-Resistance  
0.01  
RDS(ON)  
VGS = 10 V, ID = 37.5 A  
TJ = 125°C  
W
0.011 0.018  
52  
ID(on)  
gFS  
On-State Drain Current  
VGS = 10 V, VDS= 10 V  
VDS = 10 V, ID = 37.5 A  
60  
A
S
Forward Transconductance  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
Ciss  
3400  
1300  
460  
pF  
pF  
pF  
VDS = 25 V, VGS = 0 V,  
f = 1.0 MHz  
Output Capacitance  
Coss  
Crss  
Reverse Transfer Capacitance  
SWITCHING CHARACTERISTICS (Note)  
Turn - On Delay Time  
Turn - On Rise Time  
15  
30  
nS  
nS  
tD(on)  
VDD = 30 V, ID = 75 A,  
VGS = 10 V, RGEN = 5 W  
147  
250  
tr  
Turn - Off Delay Time  
Turn - Off Fall Time  
85  
150  
300  
nS  
nS  
tD(off)  
165  
t
f
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
117  
12  
160  
nC  
nC  
nC  
Qg  
VDS = 24 V,  
ID = 37.5 A, VGS = 10 V  
Qgs  
Qgd  
46  
DRAIN-SOURCE DIODE CHARACTERISTICS  
IS  
Maximum Continuos Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
75  
225  
1.3  
150  
10  
A
A
ISM  
VSD  
trr  
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0 V, IS = 13 A (Note)  
VGS = 0 V, IF = 37.5 A,  
dIF/dt = 100 A/µs  
0.9  
75  
4
V
ns  
A
Irr  
Reverse Recovery Current  
Note: Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.  
NDP7052 Rev.B1  
Typical Electrical Characteristics  
100  
2.5  
2
V
= 10V  
6.0  
5.5  
GS  
7.0  
V
=4.0V  
GS  
5.0  
80  
60  
40  
20  
0
4.5  
4.5  
5.0  
5.5  
1.5  
1
6.0  
4.0  
6.5  
7.0  
8.0  
80  
10.0  
3.5  
0.5  
0
0.5  
1
1.5  
2
2.5  
3
0
20  
40  
60  
100  
V
, DRAIN-SOURCE VOLTAGE (V)  
I
, DRAIN CURRENT (A)  
DS  
D
Figure 1. On-Region Characteristics.  
Figure 2. On-Resistance Variation  
with Drain Current and Gate Voltage.  
0.05  
0.04  
0.03  
0.02  
0.01  
0
2
I
=37.5A  
ID=37.5A  
D
1.8  
1.6  
1.4  
1.2  
1
V
= 10V  
GS  
125°C  
0.8  
0.6  
0.4  
25°C  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
175  
2
4
6
8
10  
T , JUNCTION TEMPERATURE (°C)  
J
V
, GATE TO SOURCE VOLTAGE (V)  
GS  
Figure 3. On-Resistance Variation  
Figure 4. On Resistance Variation with  
Gate-To- Source Voltage.  
with Temperature.  
60  
50  
40  
30  
20  
10  
0
60  
V
=0V  
GS  
V
= 10V  
DS  
10  
5
T = 125°C  
J
1
0.5  
25°C  
-55°C  
0.1  
0.01  
T = -55°C  
J
0.001  
0.0001  
25°C  
125°C  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
V
, GATE TO SOURCE VOLTAGE (V)  
V
, BODY DIODE FORWARD VOLTAGE (V)  
GS  
SD  
Figure 6. Body Diode Forward Voltage  
Variation with Source Current and Temperature.  
Figure 5. Transfer Characteristics.  
NDP7052 Rev.B1  
Typical Electrical Characteristics (continued)  
10  
6000  
ID = 37.5A  
VDS = 12V  
24V  
C
iss  
8
6
4
2
0
48V  
2000  
1000  
500  
C
oss  
C
rss  
f = 1 MHz  
= 0V  
V
GS  
200  
1
5
10  
20  
50  
0
20  
40  
60  
80  
100  
120  
140  
V
DS  
, DRAIN TO SOURCE VOLTAGE (V)  
Q
, GATE CHARGE (nC)  
g
Figure 8.Capacitance Characteristics.  
Figure 7. Gate Charge Characteristics.  
2000  
400  
200  
100  
50  
SINGLE PULSE  
1500  
1000  
500  
0
Rq  
=1° C/W  
JC  
TC = 25°C  
20  
10  
5
VGS = 10V  
SINGLE PULSE  
RqJC= 1oC/W  
TC = 25 °C  
2
1
0.5  
0.5  
0.1  
0.3  
1
3
10  
30  
100  
300  
1,000  
1
3
5
10  
20 30  
80  
SINGLE PULSE TIME (mS)  
V
, DRAIN-SOURCE VOLTAGE (V))  
DS  
Figure 10. Single Pulse Maximum  
Power Dissipation.  
Figure 9. Maximum Safe Operating Area.  
1
D = 0.5  
0.5  
0.3  
0.2  
0.2  
R
(t) = r(t) * R  
JC  
q
JC  
R
q
= 1°C/W  
JC  
q
0.1  
0.1  
P(pk)  
0.05  
0.05  
0.02  
t
1
t
2
0.03  
0.01  
T - T = P * R  
JC  
q
Duty Cycle, D = t /t  
(t)  
J
C
0.02  
1
2
Single Pulse  
0.01  
0.01  
0.05  
0.1  
0.5  
1
5
10  
50  
100  
500  
1000  
t
,TIME (ms)  
1
Figure 11. Transient Thermal Response Curve.  
NDP7052 Rev.B1  
NDP7052 Rev.B1  
NDP7052 Rev.B1  

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