NDS9925AF011 [FAIRCHILD]

Power Field-Effect Transistor, 4.5A I(D), 20V, 0.06ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, SOIC-8;
NDS9925AF011
型号: NDS9925AF011
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Power Field-Effect Transistor, 4.5A I(D), 20V, 0.06ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, SOIC-8

开关 脉冲 光电二极管 晶体管
文件: 总6页 (文件大小:194K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
May 1998  
NDS9925A  
Dual N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
SO-8 N-Channel enhancement mode power field effect  
transistors are produced using Fairchild's proprietary,  
high cell density, DMOS technology. This very high  
density process is especially tailored to minimize  
on-state resistance and provide superior switching  
performance. These devices are particularly suited for  
low voltage applications such as notebook computer  
power management and other battery powered circuits  
where fast switching, low in-line power loss, and  
resistance to transients are needed.  
4.5 A, 20 V. RDS(ON) = 0.060 W @ VGS = 4.5 V  
RDS(ON) = 0.075 W @ VGS = 2.7 V.  
High density cell design for extremely low RDS(ON)  
.
High power and current handling capability in a widely  
used surface mount package.  
Dual MOSFET in surface mount package.  
SuperSOTTM-6  
SOT-223  
SOIC-16  
SuperSOTTM-8  
SO-8  
SOT-23  
D2  
D2  
5
6
7
8
4
D1  
D1  
3
2
G2  
S2  
1
G1  
pin 1  
SO-8  
S1  
Absolute Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDSS  
VGSS  
ID  
Parameter  
NDS9925A  
Units  
V
Drain-Source Voltage  
Gate-Source Voltage  
20  
±8  
V
Drain Current  
- Continuous  
- Pulsed  
(Note 1a)  
4.5  
A
15  
PD  
Power Dissipation for Dual Operation  
Power Dissipation for Single Operation  
2
1.6  
W
(Note 1a)  
(Note 1b)  
(Note 1c)  
1
0.9  
TJ,TSTG  
Operating and Storage Temperature Range  
-55 to 150  
°C  
THERMAL CHARACTERISTICS  
RqJA  
RqJC  
Thermal Resistance, Junction-to-Ambient (Note 1a)  
Thermal Resistance, Junction-to-Case  
78  
40  
°C/W  
°C/W  
(Note 1)  
NDS9925A Rev. A  
© 1998 Fairchild Semiconductor Corporation  
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
OFF CHARACTERISTICS  
BVDSS  
IDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = 250 µA  
VDS = 16 V, VGS = 0 V  
VGS = 8 V, VDS = 0 V  
VGS = -8 V, VDS= 0 V  
20  
V
Zero Gate Voltage Drain Current  
Gate - Body Leakage, Forward  
Gate - Body Leakage, Reverse  
1
µA  
nA  
nA  
IGSSF  
IGSSR  
100  
-100  
ON CHARACTERISTICS (Note 2)  
VGS(th)  
Gate Threshold Voltage  
VDS = VGS, ID = 250 µA  
VGS = 4.5 V, ID = 4.5 A  
VGS = 2.7 V, ID = 4 A  
VGS = 4.5 V, VDS = 5 V  
0.4  
15  
1
V
RDS(ON)  
Static Drain-Source On-Resistance  
0.06  
0.075  
W
ID(on)  
On-State Drain Current  
A
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Drain-Source Diode Forward Voltage  
1.3  
1.2  
A
V
VSD  
VGS = 0 V, IS = 1.3 A (Note 2)  
Notes :  
1. Rq is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. Rq is  
JA  
JC  
guaranteed by design while RqCA is determined by the user's board design.  
a. 78OC/W on a 0.5 in2  
pad of 2oz copper.  
c. 135OC/W on a 0.003 in2  
pad of 2oz copper.  
b. 125OC/W on a 0.02 in2  
pad of 2oz copper.  
Scale 1 : 1 on letter size paper  
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.  
NDS9925A Rev. A  
SO-8 Tape and Reel Data and Package Dimensions  
SOIC(8lds) Packaging  
Configuration: Figure 1.0  
Packaging Description:  
SOIC-8 parts are shipped in tape. The carrier tape is  
ELECTROSTATIC  
SENSITIVE DEVICES  
DO NO  
ELECTRO  
T
SHI  
P
OR STO  
RE  
N
E
AR STRO NG ELECTROS  
T
FI  
ATIC  
ELD S  
made from dissipative (carbon filled) polycarbonate  
a
M
AGN  
E
TI  
C,  
M
AG NETIC  
O
R
R
ADIO ACTIVE  
TNR DATE  
PT NUMB E  
resin. The cover tape is a multilayer film (Heat Activated  
Adhesive in nature) primarily composed of polyester film,  
adhesive layer, sealant, and anti-static sprayed agent.  
These reeled parts in standard option are shipped with  
2,500 units per 13" or 330cm diameter reel. The reels are  
dark blue in color and is made of polystyrene plastic (anti-  
static coated). Other option comes in 500 units per 7" or  
177cm diameter reel. This and some other options are  
further described in the Packaging Information table.  
R
PEEL STRENGTH MIN ______________gms  
MAX _____________gms  
Antistatic Cover Tape  
ESD Label  
These full reels are individually barcode labeled and  
placed inside  
a standard intermediate box (illustrated in  
figure 1.0) made of recyclable corrugated brown paper.  
One box contains two reels maximum. And these boxes  
are placed inside  
comes in different sizes depending on the number of parts  
shipped.  
a barcode labeled shipping box which  
Static Dissipative  
Embossed Carrier Tape  
F63TNR  
Label  
F
NDS  
9959  
852  
Customized  
Label  
F
F
F
F
Pin 1  
SOIC (8lds) Packaging Information  
Standard  
L86Z  
F011  
D84Z  
Packaging Option  
(no flow code)  
SOIC-8 Unit Orientation  
Packaging type  
TNR  
2,500  
Rail/Tube  
TNR  
4,000  
TNR  
500  
Qty per Reel/Tube/Bag  
Reel Size  
95  
-
13" Dia  
13" Dia  
7" Dia  
Box Dimension (mm)  
Max qty per Box  
343x64x343 530x130x83 343x64x343 184x187x47  
5,000  
0.0774  
0.6060  
30,000  
0.0774  
-
8,000  
0.0774  
0.9696  
1,000  
0.0774  
0.1182  
Weight per unit (gm)  
Weight per Reel (kg)  
Note/Comments  
343mm x 342mm x 64mm  
Standard Intermediate box  
ESD Label  
F63TNR Label sample  
F63TNLabel  
ESD Label  
F63TN Label  
LOT: CBVK741B019  
FSID: FDS9953A  
QTY: 2500  
SPEC:  
D/C1: D9842  
D/C2:  
QTY1:  
QTY2:  
SPEC REV:  
CPN:  
N/F: F  
(F63TNR)3  
SOIC(8lds) Tape Leader and Trailer  
Configuration: Figure 2.0  
Carrier Tape  
Cover Tape  
Components  
Trailer Tape  
Leader Tape  
640mm minimum or  
80 empty pockets  
1680mm minimum or  
210 empty pockets  
July 1999, Rev. B  
SO-8 Tape and Reel Data and Package Dimensions, continued  
SOIC(8lds) Embossed Carrier Tape  
Configuration: Figure 3.0  
P0  
D0  
T
E1  
E2  
F
W
K0  
Wc  
B0  
Tc  
A0  
D1  
P1  
User Direction of Feed  
Dimensions are in millimeter  
A0  
B0  
W
D0  
D1  
E1  
E2  
F
P1  
P0  
K0  
T
Wc  
Tc  
Pkg type  
0.450  
+/-  
0.150  
(8lds)  
SOIC  
(12mm)  
6.50  
+/-0.10  
5.30  
+/-0.10  
12.0  
+/-0.3  
1.55  
+/-0.05  
1.60  
+/-0.10  
1.75  
+/-0.10  
10.25  
min  
5.50  
+/-0.05  
8.0  
+/-0.1  
4.0  
+/-0.1  
2.1  
+/-0.10  
9.2  
+/-0.3  
0.06  
+/-0.02  
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481  
rotational and lateral movement requirements (see sketches A, B, and C).  
0.5mm  
maximum  
20 deg maximum  
Typical  
component  
cavity  
center line  
0.5mm  
maximum  
B0  
20 deg maximum component rotation  
Typical  
component  
center line  
Sketch A (Side or Front Sectional View)  
Component Rotation  
Sketch C (Top View)  
Component lateral movement  
A0  
Sketch B (Top View)  
Component Rotation  
SOIC(8lds) Reel Configuration: Figure 4.0  
W1 Measured at Hub  
Dim A  
Max  
Dim A  
max  
See detail AA  
Dim N  
7"Diameter Option  
B Min  
Dim C  
See detail AA  
Dim D  
min  
W3  
13" Diameter Option  
W2 max Measured at Hub  
DETAIL AA  
Dim W2  
Dimensions are in inches and millimeters  
Reel  
Option  
Tape Size  
12mm  
Dim A  
Dim B  
Dim C  
Dim D  
Dim N  
Dim W1  
Dim W3 (LSL-USL)  
7.00  
177.8  
0.059  
1.5  
512 +0.020/-0.008  
13 +0.5/-0.2  
0.795  
20.2  
2.165  
55  
0.488 +0.078/-0.000  
12.4 +2/0  
0.724  
18.4  
0.469 – 0.606  
11.9 – 15.4  
7" Dia  
13.00  
330  
0.059  
1.5  
512 +0.020/-0.008  
13 +0.5/-0.2  
0.795  
20.2  
7.00  
178  
0.488 +0.078/-0.000  
12.4 +2/0  
0.724  
18.4  
0.469 – 0.606  
11.9 – 15.4  
12mm  
13" Dia  
July 1999, Rev. B  
SO-8 Tape and Reel Data and Package Dimensions, continued  
SOIC-8 (FS PKG Code S1)  
1 : 1  
Scale 1:1 on letter size paper  
Dimensions shown below are in:  
inches [millimeters]  
Part Weight per unit (gram): 0.0774  
9
September 1998, Rev. A  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
ACEx™  
CoolFET™  
ISOPLANAR™  
MICROWIRE™  
POP™  
PowerTrench™  
QFET™  
TinyLogic™  
UHC™  
VCX™  
CROSSVOLT™  
E2CMOSTM  
FACT™  
FACT Quiet Series™  
QS™  
FAST®  
Quiet Series™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
FASTr™  
GTO™  
HiSeC™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD  
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  

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