NM25C020LZEMT8 [FAIRCHILD]

EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8;
NM25C020LZEMT8
型号: NM25C020LZEMT8
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路
文件: 总12页 (文件大小:121K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
June 1997  
NM25C020  
2048-Bit Serial CMOS EEPROM (Serial Peripheral  
Interface (SPI ) Synchronous Bus)  
General Description  
Features  
n 2.1 MHz clock rate  
n 2048-bits organized as 256 x 8  
The NM25C020 is a 2048-bit CMOS EEPROM with a SPI  
compatible serial interface. The NM25C020 is designed for  
data storage in applications requiring both nonvolatile  
memory and in-system data updates. This EEPROM is well  
suited for applications using the 68HC11 series of microcon-  
trollers that support the SPI interface for high speed commu-  
nication with peripheral devices via a serial bus to reduce pin  
count. The NM25C020 is implemented in Fairchild Semicon-  
ductor’s floating gate CMOS process that provides superior  
endurance and data retention.  
n Multiple chips on the same 3-wire bus with separate  
chip select lines  
n Self-timed programming cycle  
n Simultaneous programming of 1 to 4 bytes at a time  
n Status register can be polled during programming to  
monitor READY/BUSY  
n Write Protect (WP ) pin and write disable instruction for  
both hardware and software write protection  
n Block write protect feature to protect against accidental  
writes  
n Endurance: 106 data changes  
n Data retention greater than 40 years  
n Packages available: 8-Pin DIP, 8-Pin SO or 8-Pin  
TSSOP  
The serial data transmission of this device requires four sig-  
nal lines to control the device operation: Chip Select (CS ),  
Clock (SCK), Serial Data In (SI), and Serial Data Out (SO).  
All programming cycles are completely self-timed and do not  
require an erase before WRITE.  
BLOCK WRITE protection is provided by programming the  
STATUS REGISTER with one of four levels of write protec-  
tion. Additionally, separate write enable and write disable in-  
structions are provided for data protection.  
Hardware data protection is provided by the WP pin to pro-  
tect against accidental data changes. The HOLD pin allows  
the serial communication to be suspended without resetting  
the serial sequence.  
Block Diagram  
DS012400-1  
SPI is a trademark of Motorola, Inc.  
© 1997 Fairchild Semiconductor Corporation  
DS012400  
www.fairchildsemi.com  
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Connection Diagram  
Dual-In-Line Package (N)  
SO Package (M8) and  
TSSOP Package (MT8)  
DS012400-2  
Top View  
See Package Number  
N08E (N), M08A (M8) and MTC08 (MT8)  
Pin Names  
CS  
Chip Select Input  
Serial Data Output  
Write Protect  
SO  
WP  
VSS  
SI  
Ground  
Serial Data Input  
Serial Clock Input  
Suspends Serial Input  
Power Supply  
SCK  
HOLD  
VCC  
Ordering Information  
Commercial Temperature Range (0˚C to +70˚C)  
Order Number  
NM25C020N/LN/LZN  
NM25C020M8/LM8/LZM8  
NM25C020MT8/LMT8/LZMT8  
Extended Temperature Range (−40˚C to +85˚C)  
Order Number  
NM25C020EN/LEN/LZEN  
NM25C020EM8/LEM8/LZEM8  
NM25C020EMT8/LEMT8/LZEMT8  
Automotive Temperature Range (−40˚C to +125˚C)  
Order Number  
NM25C020VN/LVN/LZVN  
NM25C020VM8/LVM8/LZVM8  
NM25C020VMT8/LVMT8/LZVMT8  
www.fairchildsemi.com  
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Standard Voltage 4.5V VCC  
ESD Rating  
2000V  
5.5V Specifications  
Operating Conditions  
Absolute Maximum Ratings (Note 1)  
Ambient Operating Temperature  
NM25C020  
0˚C to +70˚C  
−40˚C to +85˚C  
−40˚C to +125˚C  
4.5V–5.5V  
Ambient Storage Temperature  
All Input or Output Voltages  
with Respect to Ground  
Lead Temperature  
−65˚C to +150˚C  
NM25C020E  
NM25C020V  
+6.5V to −0.3V  
+300˚C  
Power Supply (VCC  
)
(Soldering, 10 seconds)  
DC and AC Electrical Characteristics  
Symbol  
Parameter  
Operating Current  
Standby Current  
Input Leakage  
Part Number  
Conditions  
Min  
Max  
Units  
mA  
µA  
µA  
µA  
V
=
ICC  
CS VIL  
3
50  
1
=
CS VCC  
ICCSB  
IIL  
=
VIN 0 to VCC  
−1  
−1  
=
IOL  
Output Leakage  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
SCK Frequency  
VOUT GND to VCC  
+1  
*
VIL  
−0.3  
VCC 0.3  
*
VIH  
0.7 VCC  
VCC + 0.3  
0.4  
V
=
VOL  
VOH  
fOP  
IOL 1.6 mA  
V
=
IOH −0.8 mA  
VCC − 0.8  
V
NM25C020  
2.1  
2.0  
2.0  
MHz  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
tRI  
Input Rise Time  
tFI  
Input Fall Time  
tCLH  
tCLL  
tCSH  
tCSS  
tDIS  
tHDS  
tCSN  
tDIN  
tHDN  
tPD  
Clock High Time  
Clock Low Time  
Minimum CS High Time  
CS Setup Time  
NM25C020  
NM25C020  
NM25C020  
NM25C020  
(Note 2)  
(Note 2)  
(Note 3)  
190  
190  
240  
240  
100  
90  
Data Setup Time  
HOLD Setup Time  
CS Hold Time  
NM25C020  
NM25C020  
240  
100  
90  
Data Hold Time  
HOLD Hold Time  
Output Delay  
=
NM25C020  
NM25C020  
NM25C020  
NM25C020  
CL 200 pF  
240  
100  
240  
100  
10  
tLZ  
HOLD Output Low Z  
Output Disable Time  
HOLD to Output High Z  
Write Cycle Time  
=
tDF  
CL 200 pF  
tHZ  
tWP  
1–4 Bytes  
Capacitance  
AC Test Conditions  
Output Load  
=
=
TA 25˚C, f 1 MHz  
=
CL 200 pF  
Symbol  
COUT  
CIN  
Test  
Type Max  
Units  
pF  
pF  
* *  
0.1 VCC – 0.9 VCC  
Input Pulse Levels  
Timing Measurement  
Reference Level  
Output Capacitance  
Input Capacitance  
3
2
8
6
*
*
0.3 VCC – 0.7 VCC  
Note 1: Stress above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional op-  
eration of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maxi-  
mum rating conditions for extended periods may affect device reliability.  
Note 2: The SCK frequency specification specifies a minimum clock period of 476 ns; therefore, in a SCK clock cycle, t  
CLH  
+ t  
must be 476 ns. For example,  
CLL  
=
=
if t  
190 ns, then the minimum t  
CLH  
286 ns in order to meet the SCK frequency specification.  
CLL  
Note 3: CS must be brought high for a minimum of 240 ns (t ) between consecutive instruction cycles.  
CSH  
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Low Voltage 2.7V VCC 5.5V  
ESD Rating  
2000V  
Specifications  
Operating Conditions  
Absolute Maximum Ratings (Note 4)  
Ambient Operating Temperature  
NM25C020L/LZ  
0˚C to +70˚C  
−40˚C to +85˚C  
−40˚C to +125˚C  
2.7V–5.5V  
Ambient Storage Temperature  
All Input or Output Voltages  
with Respect to Ground  
Lead Temperature  
−65˚C to +150˚C  
NM25C020LE/LZE  
NM25C020LV/LZV  
+6.5V to −0.3V  
+300˚C  
Power Supply (VCC  
)
(Soldering, 10 seconds)  
DC and AC Electrical Characteristics  
Symbol  
ICC  
Parameter  
Operating Current  
Standby Current  
Part Number  
Conditions  
Min  
Max  
Units  
=
CS VIL  
3
mA  
=
ICCSB  
Z
CS VCC  
10  
1
µA  
LZ  
=
IIL  
Input Leakage  
VIN 0 to VCC  
−1  
+1  
+1  
µA  
µA  
V
=
VOUT GND to VCC  
IOL  
Output Leakage  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
SCK Frequency  
*
VIL  
−0.3  
0.3 VCC  
*
VIH  
VOL  
VOH  
fOP  
tRI  
0.7 VCC  
VCC + 0.3  
0.4  
V
=
IOL 0.8 mA  
V
=
IOH −0.4 mA  
VCC − 0.8  
V
1
MHz  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
Input Rise Time  
2.0  
2.0  
tFI  
Input Fall Time  
tCLH  
tCLL  
tCSH  
tCSS  
tDIS  
tHDS  
tCSN  
tDIN  
tHDN  
tPD  
Clock High Time  
Clock Low Time  
Minimum CS High Time  
CS Setup Time  
(Note 5)  
(Note 5)  
(Note 6)  
410  
410  
500  
500  
100  
240  
500  
100  
240  
Data Setup Time  
HOLD Setup Time  
CS Hold Time  
Data Hold Time  
HOLD Hold Time  
Output Delay  
=
CL 200 pF  
500  
240  
500  
240  
10  
tLZ  
HOLD Output Low Z  
Output Disable Time  
HOLD to Output High Z  
Write Cycle Time  
=
tDF  
CL 200 pF  
tHZ  
tWP  
1–4 Bytes  
Capacitance  
AC Test Conditions  
Output Load  
=
=
TA 25˚C, f 1 MHz  
=
CL 200 pF  
Symbol  
COUT  
CIN  
Test  
Type Max  
Units  
pF  
pF  
* *  
0.1 VCC − 0.9 VCC  
Input Pulse Levels  
Timing Measurement  
Reference Level  
Output Capacitance  
Input Capacitance  
3
2
8
6
*
*
0.3 VCC – 0.7 VCC  
Note 4: Stress above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional op-  
eration of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maxi-  
mum rating conditions for extended periods may affect device reliability.  
Note 5: The SCK frequency specification specifies a minimum clock period of 476 ns; therefore, in a SCK clock cycle, t  
CLH  
+ t  
must be 476 ns. For example,  
CLL  
=
=
if t  
190 ns, then the minimum t  
CLH  
286 ns in order to meet the SCK frequency specification.  
CLL  
Note 6: CS must be brought high for a minimum of 240 ns (t  
) between consecutive instruction cycles.  
CSH  
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AC Test Conditions (Continued)  
DS012400-3  
FIGURE 1. Synchronous Data Timing Diagram  
DS012400-4  
Note: When connected to the SPI port of a 68HC11 microcontroller, the NM25C020 accepts a clock phase of 0 and a clock parity of 0.  
FIGURE 2. SPI Serial Interface  
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PROTOCOL: When connected to the SPI port of a 68HC11  
microcontroller, the NM25C020 accepts a clock phase of 0  
and a clock polarity of 0. The SPI protocol for this device de-  
fines the byte transmitted on the SI and SO data lines for  
proper chip operation. See Figure 3.  
Functional Description  
MASTER: The device that generates the serial clock is des-  
ignated as the master. The NM25C020 can never function as  
a master.  
SLAVE: The NM25C020 always operates as a slave as the  
serial clock pin is always an input.  
HOLD: The HOLD pin is used in conjunction with the CS to  
select the device. Once the device is selected and a serial  
sequence is underway, HOLD may be forced low to suspend  
further serial communication with the device without reset-  
ting the serial sequences. Note that HOLD must be brought  
low while the SCK pin is low. The device must remain se-  
lected during this sequence. To resume serial communica-  
tion HOLD is brought high while the SCK pin is low. Pins SI,  
SCK and SO are at a high impedance state during HOLD .  
See Figure 4.  
TRANSMITTER/RECEIVER: The NM25C020 has separate  
pins for data transmission (SO) and reception (SI).  
MSB: The Most Significant Bit is the first bit transmitted and  
received.  
CHIP SELECT: The chip is selected when pin CS is low.  
When the chip is not selected, data will not be accepted from  
pin SI, and the output pin SO is in high impedance.  
SERIAL OP-CODE: The first byte transmitted after the chip  
is selected with CS going low contains the op-code that de-  
fines the operation to be performed.  
DS012400-5  
FIGURE 3. SPI Protocol  
DS012400-6  
FIGURE 4. HOLD Timing  
TABLE 1.  
Instruction Instruction  
Operation  
Name  
WREN  
Format  
00000110  
00000100  
00000101  
00000001  
00000011  
Set Write Enable Latch  
Reset Write Enable Latch  
Read Status Register  
Write Status Register  
WRDI  
RDSR  
WRSR  
READ  
DS012400-7  
Read Data from Memory  
Array  
FIGURE 5. Invalid Op-Code  
WRITE  
00000010  
Write Data to Memory Array  
READ SEQUENCE (One or More Bytes): Reading the  
memory via the SPI link requires the following sequence.  
The CS line is pulled low to select the device. The READ  
op-code is transmitted on the SI line followed by the byte ad-  
dress (A7–A0) to be read. After this is done, data on the SI  
line becomes don’t care. The data (D7–D0) at the address  
specified is then shifted out on the SO line. If only one byte  
INVALID OP-CODE: After an invalid code is received, no  
data is shifted into the NM25C020, and the SO data output  
pin remains high impedance until a new CS falling edge  
re-initializes the serial communication. See Figure 5.  
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=
Status register Bit 0 0 (RDY ) indicates that the device is  
Functional Description (Continued)  
=
READY; Bit 0  
1 indicates that a program cycle is in  
=
is to be read, the CS line can be pulled back to the high level.  
It is possible to continue the READ sequence as the byte ad-  
dress is automatically incremented and data will continue to  
be shifted out. When the highest address is reached (FF),  
the address counter rolls over to lowest address (000) allow-  
ing the entire memory to be read in one continuous READ  
cycle. See Figure 6.  
progress. Bit 1 0 (WEN) indicates that the device is not  
=
WRITE ENABLED. Bit 1  
1 indicates that the device is  
WRITE ENABLED. Non-volatile status register Bits 2 and 3  
(BP0 and BP1) indicate the level of BLOCK WRITE PRO-  
TECTION selected. The block write protection levels and  
corresponding status register control bits are shown in Table  
III. Note that if a RDSR instruction is executed during a pro-  
gramming cycle only the RDY bit is valid. All other bits are  
1s. See Figure 7.  
READ STATUS REGISTER (RDSR): The Read Status Reg-  
ister (RDSR) instruction provides access to the status regis-  
ter which is used to interrogate the READY/BUSY and  
WRITE ENABLE status of the chip. Two nonvolatile status  
register bits are used to select one of four levels of BLOCK  
WRITE PROTECTION. The status register format is shown  
in Table 2.  
TABLE 3. Block Write Protection Levels  
Status Register Bits  
Array  
Addresses  
Protected  
None  
Level  
BP1  
BP0  
TABLE 2. Status Register Format  
0
1
2
3
0
0
1
1
0
1
0
1
C0–FF  
Bit  
7
Bit  
6
Bit  
5
Bit  
4
Bit  
3
Bit  
2
Bit  
1
Bit  
0
80–FF  
00–FF  
1
1
1
1
BP1 BP0 WEN RDY  
DS012400-8  
FIGURE 6. Read Sequence  
DS012400-9  
FIGURE 7. Read Status  
WRITE ENABLE (WREN): When VCC is applied to the chip,  
it “powers up” in the write disable state. Therefore, all pro-  
gramming modes must be preceded by a WRITE ENABLE  
(WREN) instruction. Additionally the WP pin must be held  
high during a WRITE ENABLE instruction. At the completion  
of a WRITE or WRSR cycle the device is automatically re-  
turned to the write disable state. Note that a WRITE DIS-  
ABLE (WRDI) instruction or forcing the WP pin low will also  
return the device to the write disable state. See Figure 8.  
DS012400-10  
FIGURE 8. Write Enable  
WRITE DISABLE (WRDI): To protect against accidental  
data disturbance the WRITE DISABLE (WRDI) instruction  
disables all programming modes. See Figure 9.  
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written. Programming will start after the CS pin is forced  
back to a high level. Note that the LOW to HIGH transition of  
the CS pin must occur during the SCK low time immediately  
after clocking in the D0 data bit. See Figure 10.  
Functional Description (Continued)  
The READY/BUSY status of the device can be determined  
by executing a READ STATUS REGISTER (RDSR) instruc-  
=
tion. Bit 0  
1 indicates that the WRITE cycle is still in  
=
progress and Bit 0 0 indicates that the WRITE cycle has  
=
ended. During the WRITE programming cycle (Bit 0 1) only  
the READ STATUS REGISTER instruction is enabled.  
The NM25C020 is capable of a 4 byte PAGE WRITE opera-  
tion. After receipt of each byte of data the two low order ad-  
dress bits are internally incremented by one. The seven high  
order bits of the address will remain constant. If the master  
should transmit more than 4 bytes of data, the address  
counter will “roll over”, and the previously loaded data will be  
reloaded.  
DS012400-11  
FIGURE 9. Write Disable  
WRITE SEQUENCE: To program the device the WRITE  
PROTECT (WP ) pin must be held high and two separate in-  
structions must be executed. The chip must first be write en-  
abled via the WRITE ENABLE instruction and then a WRITE  
instruction must be executed. Moreover, the address of the  
memory location(s) to be programmed must be outside the  
protected address field selected by the Block Write Protec-  
tion Level. See Table 3.  
At the completion of a WRITE cycle the device is automati-  
cally returned to the write disable state.  
If the WP pin is forced low or the device is not WRITE en-  
abled, the device will ignore the WRITE instruction and re-  
turn to the standby state when CS is forced high. A new CS  
falling edge is required to re-initialize the serial communica-  
tion. See Figure 11.  
A WRITE command requires the following sequence. The  
CS line is pulled low to select the device, then the WRITE  
op-code is transmitted on the SI line followed by the byte ad-  
dress (A7–A0) and the corresponding data (D7–D0) to be  
DS012400-12  
FIGURE 10. Write Sequence  
DS012400-13  
FIGURE 11. Start Write Condition  
WRITE STATUS REGISTER (WRSR): The WRITE STATUS  
REGISTER (WRSR) instruction is used to program the  
non-volatile status register Bits 2 and 3 (BP0 and BP1). The  
WRITE PROTECT (WP ) pin must be held high and two  
separate instructions must be executed. The chip must first  
be write enabled via the WRITE ENABLE instruction and  
then a WRSR instruction must be executed.  
Note that the first four bits are don’t care bits followed by BP1  
and BP0 then two additional dont’care bits. Programming will  
start after the CS pin is forced back to a high level. As in the  
WRITE instruction the LOW to HIGH transition of the CS pin  
must occur during the SCK low time immediately after clock-  
ing the last don’t care bit. See Figure 13.  
The READY/BUSY status of the device can be determined  
by executing a READ STATUS REGISTER (RDSR) instruc-  
The WRSR command requires the following sequence. The  
CS line is pulled low to select the device and then the WRSR  
op-code is transmitted on the SI line followed by the data to  
be programmed. See Figure 12.  
=
tion. Bit 0  
1 indicates that the WRSR cycle is still in  
=
progress and Bit 0 0 indicates that the WRSR cycle has  
ended.  
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Functional Description (Continued)  
At the completion of a WRSR cycle the device is automati-  
cally returned to the write disable state.  
DS012400-14  
FIGURE 12. Write Status Register  
DS012400-15  
FIGURE 13. Start WRSR Condition  
Book  
Extract  
End  
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Physical Dimensions inches (millimeters) unless otherwise noted  
Molded Small Outline Package (M8)  
Package Number M08A  
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
8-Pin Molded TSSOP, JEDEC (MT8)  
Package Number MTC08  
11  
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11  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
Molded Dual-In-Line Package (N)  
Package Number N08E  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-  
VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMI-  
CONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or sys-  
tems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, and (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
Fairchild  
Corporation  
Fairchild  
Europe  
Fairchild  
Hong Kong Ltd.  
National Semiconductor  
Japan Ltd.  
Americas  
Customer Response Center  
Tel: 1-888-522-5372  
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Email: europe.support@nsc.com  
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Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
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相关型号:

NM25C020LZEMT8X

EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8
ROCHESTER

NM25C020LZEN

SPI Serial EEPROM
FAIRCHILD

NM25C020LZM8

EEPROM, 256X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8
ROCHESTER

NM25C020LZM8X

EEPROM, 256X8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOIC-8
FAIRCHILD

NM25C020LZMT8

SPI Serial EEPROM
FAIRCHILD

NM25C020LZMT8

IC 256 X 8 SPI BUS SERIAL EEPROM, PDSO8, PLASTIC, TSSOP-8, Programmable ROM
NSC

NM25C020LZMT8X

EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8
FAIRCHILD

NM25C020LZN

IC 256 X 8 SPI BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8, Programmable ROM
NSC

NM25C020LZVM8

SPI Serial EEPROM
FAIRCHILD

NM25C020LZVM8

IC 256 X 8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8, Programmable ROM
NSC

NM25C020LZVM8X

256X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8
TI

NM25C020LZVMT8

IC 256 X 8 SPI BUS SERIAL EEPROM, PDSO8, PLASTIC, TSSOP-8, Programmable ROM
NSC